KR100888669B1 - High-luminance power led light - Google Patents

High-luminance power led light Download PDF

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Publication number
KR100888669B1
KR100888669B1 KR1020080021701A KR20080021701A KR100888669B1 KR 100888669 B1 KR100888669 B1 KR 100888669B1 KR 1020080021701 A KR1020080021701 A KR 1020080021701A KR 20080021701 A KR20080021701 A KR 20080021701A KR 100888669 B1 KR100888669 B1 KR 100888669B1
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South Korea
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upper cover
led light
light emitting
led
delete delete
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KR1020080021701A
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Korean (ko)
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박수용
박종철
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주식회사 아이룩스
주식회사 월드조명
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/015—Devices for covering joints between adjacent lighting devices; End coverings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements

Abstract

A high-luminance power led light is provided to apply external power to emitting par of a LED by covering a cap having an electrode terminal on the top cover and open bottom cover. An LED lighting-emitting area(10) radiates when an external power is supplied to the device. The LED lighting-emitting area is mounted on a mounting groove of the top cover(20). The LED lighting-emitting area induces heat generated from the LED lighting-emitting area. The LED lighting-emitting area has a semi-cylindrical, and the bottom cover(30) is combined with the top cover so that it is separated. The bottom cover has the cross section of semicircular arc, and the bottom cover disperses the light emitted from the LED lighting-emitting area.

Description

고휘도 파워 엘이디등{high-luminance power LED light}High-luminance power LED light

본 발명은 고휘도 파워 엘이디등에 관한 것으로서, 더욱 상세하게는 고휘도용 엘이디발광부를 장착한 상부커버의 둘레면에 히트싱크와 같은 방열부재를 형성함으로써 엘이디발광부에서 발생하는 열기를 상부커버를 통해 발산시 방열부재로 인해 방열시간을 단축시킴에 따라 엘이디발광부의 과부하를 방지할 수 있도록 하고, 상부커버에 하부커버를 슬라이드 결합함에 따라 조립성을 향상시킴과 아울러 상부커버와 하부커버의 개방된 측면에 전극단자를 갖는 캡을 씌움으로써 엘이디발광부를 외부로부터 보호하면서 전극단자를 통해 외부 전원을 엘이디발광부에 인가할 수 있도록 하는 간단한 구조의 고휘도 파워 엘이디등에 관한 것이다.The present invention relates to a high-brightness power LED, and more particularly, by forming a heat-dissipating member such as a heat sink on the circumferential surface of the upper cover equipped with a high-brightness LED light emitting unit when the heat generated from the LED light emitting unit through the upper cover Due to the heat dissipation member, the heat dissipation time can be shortened to prevent overload of the LED light-emitting unit, and the lower cover slides to the upper cover to improve the assemblability and the electrodes on the open side of the upper cover and the lower cover. The present invention relates to a high-brightness power LED having a simple structure such that an external power source can be applied to an LED light emitting part through an electrode terminal while protecting the LED light emitting part from the outside by covering a cap having a terminal.

조명을 위해 사용되는 일반적인 전구는 형광등, 백열등 또는 산업용으로 사용하는 메탈 네온등으로 대별되며, 이들 전구들은 대부분이 유리관 안에 가스를 주입하여 사용하는 가스 방전관 구성이다.Common bulbs used for lighting are generally classified into fluorescent, incandescent, or metallic neon lamps used for industrial purposes, and most of these bulbs are gas discharge tube configurations in which gas is injected into glass tubes.

상기한 일반적인 전구의 경우 유리관의 소손으로 인한 가스 유출시 대기 오 염의 원인이 될 수 있으며, 휘도를 밝게 하고자 할 시에는 그에 따른 소비 전력이 상승하게 되고, 그에 알맞은 전력선 공사 등을 행해야 하므로 시설비용과 유지 관리비용이 과도하게 소요되는 등의 문제점이 있었다.In the case of the general light bulbs described above, it may cause air pollution when the gas leaks due to burnout of the glass tube, and when the brightness is to be brightened, the power consumption increases accordingly, and power line construction must be performed accordingly, so There were problems such as excessive maintenance costs.

한편 상기한 전구의 문제점을 해소할 대안으로 근자에는 소비전력이 낮은 LED를 이용한 조명등 개발이 제안되고 있다.On the other hand, as an alternative to solve the problem of the above-mentioned bulbs, in recent years, the development of a lamp using a low power LED has been proposed.

기존 제안된 바 있는 LED를 이용한 조명등들은 LDE가 전기적으로 연결된 기판과, 기판이 고정되는 방열수단으로 구성되어 있으나, 이러한 구성의 경우 기판과 방열판이 별개의 부품으로 구성되어 있어 방열 효과가 저하되므로 충분한 방열효과를 득할 수 없는 어려움이 있었다.The conventionally proposed lamps using LEDs are composed of a substrate to which the LDE is electrically connected, and a heat dissipation means to which the substrate is fixed. There was a difficulty in obtaining the heat dissipation effect.

본 발명은 상기한 종래 기술의 문제점을 개선하기 위하여 안출된 것으로서, 고휘도용 엘이디발광부를 상부커버에 장착함과 더불어 이 상부커버의 둘레면에 외부 공기와의 접촉면적을 늘리도록 방열부재를 형성함으로써 방열시간을 단축시키게 되고, 이에 따라 엘이디발광부의 과부하를 방지할 수 있으며, 상부커버의 하측에 조사되는 빛의 분산용 하부커버를 슬라이드 삽입하면서 조립 작업을 용이하게 할 수 있을 뿐만 아니라, 상부커버와 하부커버의 개방된 측에 전극단자를 갖는 캡을 씌움으로써 간단한 구조로 외부 전원을 엘이디발광부에 인가하도록 한 고휘도 파워 엘이디등을 제공하는데 그 목적이 있다.The present invention has been made to improve the above problems of the prior art, by mounting a high brightness LED light emitting unit to the upper cover and by forming a heat dissipation member to increase the contact area with the outside air on the circumferential surface of the upper cover The heat dissipation time can be shortened, thereby preventing overload of the LED light emitting unit, and easily inserting a lower cover for dispersing light radiated to the lower side of the upper cover, thereby facilitating the assembling work. It is an object of the present invention to provide a high brightness power LED and the like to apply an external power source to the LED light emitting unit with a simple structure by covering a cap having an electrode terminal on the open side of the lower cover.

상기한 과제를 해결하기 위한 본 발명은 외부 전원의 공급시 발광하는 엘이디발광부, 상기 엘이디발광부를 장착하여 상기 엘이디발광부의 발열시 열기를 방출 유도하도록 금속재질로 형성된 상부커버, 상기 상부커버에 형성되어 상기 엘이디발광부에서 조사되는 빛을 통과시키며 분산하는 하부커버 및 상기 상부커버의 외측 둘레면에 형성되어 방열면적을 증가시키는 방열부재를 포함하여 이루어져, 상기 방열부재는 상기 상부커버의 둘레면에서 외부 공기와의 접촉 면적을 증가시킴으로써 상기 엘이디발광부의 발열 방출 시간을 단축시키는 고휘도 파워 엘이디등을 특징으로 한다.The present invention for solving the above problems is formed on the upper cover, the upper cover formed of a metal material to induce heat emission during heat generation of the LED light emitting unit, the LED light emitting unit, the LED light emitting unit to emit light when the external power supply And a heat dissipation member formed on an outer circumferential surface of the upper cover and dispersing the light radiated from the LED light emitting unit and increasing the heat dissipation area, wherein the heat dissipation member is formed on the circumferential surface of the upper cover. It is characterized by a high brightness power LED and the like for shortening the heat release time of the LED light emitting unit by increasing the contact area with the outside air.

상기와 같이 구성되는 본 발명에 의한 고휘도 파워 엘이디등은 고휘도용 엘이디발광부를 상부커버에 장착함과 더불어 이 상부커버의 둘레면에 외부 공기와의 접촉면적을 늘리도록 방열부재를 형성함으로써 방열시간을 단축시키게 되고, 이에 따라 엘이디발광부의 과부하를 방지할 수 있는 효과가 있다.The high brightness power LED according to the present invention configured as described above is equipped with a high brightness LED light emitting unit on the upper cover and heat radiation time by forming a heat radiation member to increase the contact area with the outside air on the circumferential surface of the upper cover It is shortened, and thus there is an effect that can prevent the overload of the LED light emitting unit.

그리고, 본 발명에 의한 고휘도 파워 엘이디등은 상부커버의 하측에 조사되는 빛의 분산용 하부커버를 슬라이드 삽입하면서 조립 작업을 용이하게 할 수 있는 효과가 있다.In addition, the high brightness power LED according to the present invention has an effect of facilitating the assembly operation while sliding the lower cover for dispersing light irradiated to the lower side of the upper cover.

또한, 본 발명에 의한 고휘도 파워 엘이디등은 상부커버와 하부커버의 개방 된 측에 전극단자를 갖는 캡을 씌움으로써 간단한 구조로 외부 전원을 엘이디발광부에 인가할 수 있는 효과가 있다.In addition, the high brightness power LED according to the present invention has an effect that can be applied to the LED light emitting unit with a simple structure by covering the cap having the electrode terminal on the open side of the upper cover and the lower cover.

이하, 본 발명의 실시예들을 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 사시도이고, 도 2는 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 내부도이며, 도 3은 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 단면도이다.1 is a perspective view of a high brightness power LED lamp according to an embodiment of the present invention, Figure 2 is an internal view of a high brightness power LED lamp according to an embodiment of the present invention, Figure 3 according to an embodiment of the present invention It is sectional drawing of high brightness power LED.

그리고, 도 4는 본 발명의 다른 실시예에 따른 고휘도 파워 엘이디등의 조립 상태도이다.4 is an assembled state diagram of a high brightness power LED according to another embodiment of the present invention.

도 1 내지 도 3에 도시된 바와 같이, 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등은 엘이디발광부(10), 상부커버(20), 하부커버(30), 방열부재(40)로 크게 형성된다.As shown in Figures 1 to 3, the high-brightness power LED according to an embodiment of the present invention is large as the LED light emitting unit 10, the upper cover 20, the lower cover 30, the heat dissipation member 40 Is formed.

상기 엘이디발광부(10)는 외부 전원 공급시 고휘도 발광하여 빛을 조사하는 역할을 한다.The LED light emitting unit 10 serves to irradiate light by emitting high brightness when external power is supplied.

특히, 상기 엘이디발광부(10)는 상부커버(20)에 장착 고정되어 외부 전원을 공급받게 된다.In particular, the LED light emitting unit 10 is fixed to the upper cover 20 is supplied with external power.

이때, 상기 엘이디발광부(10)는 보드(11), 절연층(12), 회로패턴(13), 엘이디(LED,14)로 이루어진다.In this case, the LED light emitting unit 10 includes a board 11, an insulating layer 12, a circuit pattern 13, and an LED 14.

여기서, 상기 엘이디(14)는 고휘도용 파워 엘이디로써 발광시 많은 열을 발 생시키게 된다.Here, the LED 14 generates a high heat when emitting light as a high brightness power LED.

그래서, 상기 보드(11)는 금속재질로 이루어져 엘이디(14)의 열기를 외부로 전달하는 역할을 한다.Thus, the board 11 is made of a metal material serves to transfer the heat of the LED 14 to the outside.

특히, 상기 보드(11)는 상부커버(20)의 내측에 고정 장착된다.In particular, the board 11 is fixedly mounted on the inner side of the upper cover 20.

이때, 상기 보드(11)는 하나 구비되어 모든 엘이디(14)를 형성할 수도 있고, 조각으로 형성되어 각각에 엘이디(14)를 형성할 수도 있다.In this case, one board 11 may be provided to form all the LEDs 14, or may be formed in pieces to form the LEDs 14 on each.

그리고, 상기 절연층(12)은 보드(11)의 외측 둘레면에 도포된다.The insulating layer 12 is applied to the outer circumferential surface of the board 11.

상기 절연층(12)은 엘이디(14)에 외부 전원을 공급하는 회로패턴(13)을 프린팅 등의 방식으로 형성하기 위해 보드(11)에 도포된다.The insulating layer 12 is applied to the board 11 to form a circuit pattern 13 for supplying external power to the LED 14 by printing or the like.

또한, 상기 절연층(12)은 엘이디(14)나 회로패턴(13)이 금속재질의 보드(11)에 직접적으로 접하는 것을 방지하는 절연 기능을 행한다.In addition, the insulating layer 12 performs an insulating function to prevent the LED 14 or the circuit pattern 13 from directly contacting the metal board 11.

이때, 상기 상부커버(20)와 직접적으로 접하는 보드(11)의 하측면에는 절연층(12)이 도포되지 않도록 한다.At this time, the insulating layer 12 is not applied to the lower surface of the board 11 in direct contact with the upper cover 20.

이는, 절연층(12)의 하측면에 절연층(12)이 도포되면 절연층(12)과 상부커버(20)의 직접적 접촉을 막아 방열을 위한 열전달성능을 저하시키기 때문이다.This is because when the insulating layer 12 is applied to the lower side of the insulating layer 12, the direct contact between the insulating layer 12 and the upper cover 20 is prevented, thereby lowering the heat transfer performance for heat dissipation.

특히, 상기 회로패턴(13)은 절연층(12)에 인쇄되어 외부 전원의 공급시 전류의 흐름을 안내하는 역할을 한다. In particular, the circuit pattern 13 is printed on the insulating layer 12 serves to guide the flow of current when the external power supply.

그리고, 상기 엘이디(14)는 회로패턴(13) 상에 해당되는 절연층(12)에 형성된다.In addition, the LED 14 is formed on the insulating layer 12 corresponding to the circuit pattern 13.

한편, 상기 상부커버(20)는 엘이디발광부(10)를 고정 장착하여 엘이디발광 부(10)의 발열시 열기를 방출 유도하도록 금속재질로 형성된다.On the other hand, the upper cover 20 is formed of a metal material so as to induce the heat emission during heat generation of the LED light emitting portion 10 by fixing the LED light emitting portion 10.

특히, 상기 상부커버(20)는 엘이디발광부(10)에 포함되는 엘이디(14)의 발열량이 많이 빛을 조사시 뜨겁기 때문에 이 열기를 외부로 방출시킬 수 있도록 전열성을 갖는 금속재질로 이루어짐이 바람직하다.In particular, the upper cover 20 is made of a metal material having heat conductivity so that the heat generated by the LED 14 included in the LED light emitting part 10 is hot when irradiated with a lot of light so as to emit this heat to the outside. desirable.

이때, 상기 보드(11)와 상부커버(20)는 엘이디(14)의 열기를 외부로 배출하도록 유도하는 역할을 함에 따라 모두 전열성을 갖는 재질로 형성됨이 바람직하다.At this time, the board 11 and the upper cover 20 is preferably formed of a material having all the heat as it serves to induce the heat of the LED 14 to discharge to the outside.

또한, 상기 상부커버(20)는 내측면에 안착홈(22)을 형성하여 엘이디발광부(10)를 고정 장착한다.In addition, the upper cover 20 is fixed to the LED light emitting unit 10 by forming a mounting groove 22 on the inner surface.

여기서, 상기 안착홈(22)은 엘이디발광부(10)를 매입하여 안착함으로써 엘이디(14)의 조사 각도를 좁혀 조사되는 빛의 밝기를 향상시키는 기능도 한다.Here, the seating groove 22 also has a function of improving the brightness of the light emitted by narrowing the irradiation angle of the LED 14 by embedding and seating the LED light emitting unit 10.

그리고, 상기 엘이디발광부(10)는 상부커버(20)의 안착홈(22)에 분리 가능하게 장착됨으로써 교체를 용이하게 할 수 있도록 함이 바람직하다.In addition, the LED light emitting unit 10 is preferably detachably mounted in the mounting groove 22 of the upper cover 20 to facilitate replacement.

더욱 상세히, 상기 상부커버(20)는 체결구(24) 특히, 상기 안착홈(22)은 바닥면에 체결구(24)를 함몰 형성된다.In more detail, the upper cover 20 is a fastener 24, in particular, the seating groove 22 is formed in the bottom recessed fastener 24.

그리고, 상기 엘이디발광부(10)의 보드(11)에는 체결부재(17)가 삽입되고, 이 체결부재(17)는 체결구(24)와 체결된다.The fastening member 17 is inserted into the board 11 of the LED light emitting part 10, and the fastening member 17 is fastened to the fastener 24.

이때, 상기 체결부재(17)는 볼트나 스크류와 같은 체결요소로 한다.At this time, the fastening member 17 is a fastening element such as a bolt or screw.

아울러, 상기 체결부재(17)는 보드(11)에만 삽입될 수도 있고, 보드(11) 및 절연층(12)에 함께 삽입되어 체결구(24)에 결속된다.In addition, the fastening member 17 may be inserted only in the board 11 or inserted into the board 11 and the insulating layer 12 to bind to the fastener 24.

이 경우, 상기 체결구(24)는, 도시하지 않았지만, 내측면에 탭을 형성함이 바람직하다.In this case, although the fastener 24 is not shown in figure, it is preferable to form a tab in an inner side surface.

그리고, 상기 체결부재(17)는 보드(11)에 인쇄된 회로패턴(13)에 손상을 주지 않도록 보드(11)에 구비된다.The fastening member 17 is provided on the board 11 so as not to damage the circuit pattern 13 printed on the board 11.

또한, 상기 하부커버(30)는 상부커버(20)의 하측에 형성되어 엘이디발광부(10)를 보호하는 역할을 한다.In addition, the lower cover 30 is formed on the lower side of the upper cover 20 serves to protect the LED light emitting unit 10.

이때, 상기 하부커버(30)는 엘이디발광부(10)의 엘이디(14)가 발광시 빛이 투과되도록 투명한 재질 또는 반투명한 재질로 형성된다.In this case, the lower cover 30 is formed of a transparent material or a translucent material so that light is transmitted when the LED 14 of the LED light emitting unit 10 emits light.

한편, 상기 하부커버(30)는 엘이디발광부(10)의 유지 보수를 위해 상부커버(20)에 분리 가능하게 결합됨이 바람직하다.On the other hand, the lower cover 30 is preferably detachably coupled to the upper cover 20 for maintenance of the LED light emitting unit 10.

더욱 상세히, 상기 하부커버(30)와 상부커버(20)는 적어도 서로 대칭되는 일측면을 개방한다.In more detail, the lower cover 30 and the upper cover 20 open at least one side symmetrical with each other.

편의상, 상기 하부커버(30)와 상부커버(20)는 양측을 개방한 호 형상 또는 타원호 형상으로 도시한다.For convenience, the lower cover 30 and the upper cover 20 are shown in an arc shape or an elliptical arc shape with both sides open.

그리고, 상기 하부커버(30)는 서로 마주하는 테두리에 슬라이드리브(52)를 내측 방향으로 연장 형성한다.The lower cover 30 extends in the inner direction of the slide ribs 52 at edges facing each other.

아울러, 상기 상부커버(20)는 슬라이드리브(52)를 슬라이드 안내하도록 슬라이드홈(56)을 갖는 돌부(54)를 돌출 형성한다.In addition, the upper cover 20 protrudes and forms a protrusion 54 having a slide groove 56 to guide the slide rib 52.

그래서, 상기 슬라이드리브(52)가 돌부(54)의 슬라이드홈(56)을 따라 슬라이드 됨으로써 하부커버(30)는 상부커버(20)에 슬라이드 결합 또는 분리 가능하게 된다.Thus, the slide rib 52 slides along the slide groove 56 of the protrusion 54 such that the lower cover 30 is slideable or detachable from the upper cover 20.

따라서, 상기 하부커버(30)와 상부커버(20)는 테두리의 접촉면적을 증가시키면서 슬라이드 조립되어 외부 물기나 이물질로부터 엘이디발광부(10)를 보호하게 된다.Therefore, the lower cover 30 and the upper cover 20 are slide assembled while increasing the contact area of the rim to protect the LED light emitting unit 10 from external moisture or foreign matter.

물론, 상기 상부커버(20)는 양쪽 외측면에 슬라이드홈(56)을 형성할 수도 있다.Of course, the upper cover 20 may form a slide groove 56 on both outer surfaces.

또한, 상기 방열부재(40)는 상부커버(20)의 외측 둘레면에 형성되어 방열면적을 증가시키는 역할을 한다.In addition, the heat dissipation member 40 is formed on the outer peripheral surface of the upper cover 20 serves to increase the heat dissipation area.

이때, 상기 방열부재(40)는 상부커버(20)의 둘레면에 연속되는 산과 골 형상이거나 또는 돌출되는 핀 형상으로 형성되어 외부 공기와의 접촉 면적을 증가시킴으로써 방열시간을 단축시킴에 따라 엘이디(14)를 포함한 엘이디발광부(10)의 과열을 방지하게 된다.At this time, the heat dissipation member 40 is formed in the shape of a peak and valleys or protruding fins on the circumferential surface of the upper cover 20 to increase the contact area with the outside air to shorten the heat dissipation time by the LED ( It is to prevent overheating of the LED light emitting unit 10 including 14).

한편, 상기 하부커버(30)와 상부커버(20)는 개방된 양측면을 캡(60a)으로 막음 처리함으로써 엘이디발광부(10)를 보호함이 바람직하다.On the other hand, the lower cover 30 and the upper cover 20 is preferably to protect the LED light emitting unit 10 by blocking the open both sides with a cap (60a).

이때, 상기 캡(60a)은 외부 전원을 인가받아 엘이디발광부(10)에 공급하도록 전극단자(72)를 형성함이 바람직하다.At this time, the cap 60a is preferably formed to the electrode terminal 72 to be supplied to the LED light emitting unit 10 by receiving an external power.

물론, 상기 전극단자(72)는 하부커버(30)와 상부커버(20)의 어느 일측을 막는 하나의 캡(60a)에만 한 쌍 형성되면 된다.Of course, the pair of electrode terminals 72 may be formed only in one cap 60a that blocks one side of the lower cover 30 and the upper cover 20.

여기서, 상기 전극단자(72)는 캡(60a)의 내·외측으로 돌출되고, 상기 엘이디발광부(10)는 전극단자(72)를 삽입하도록 커넥터(74)를 구비한다.Here, the electrode terminal 72 protrudes inward and outward of the cap 60a, and the LED light emitting unit 10 includes a connector 74 to insert the electrode terminal 72.

더욱 상세히, 상기 커넥터(74)는 엘이디발광부(10)의 회로패턴(13) 상에 형 성되어 각각의 엘이디(14)와 전기적으로 연결된다.In more detail, the connector 74 is formed on the circuit pattern 13 of the LED light emitting unit 10 and is electrically connected to each LED 14.

그리고, 상기 캡(60a)이 상부커버(20)와 하부커버(30)를 막음과 동시에 전극단자(72)는 해당되는 커넥터(74)에 삽입되어 전기적으로 접속된다.In addition, the cap 60a blocks the upper cover 20 and the lower cover 30, and the electrode terminal 72 is inserted into the corresponding connector 74 and electrically connected thereto.

그래서, 상기 전극단자(72)가 외부 전원을 공급받게 되면, 상기 엘이디(14)는 커넥터(74)와 회로패턴(13)을 통해 전기를 인가받아 빛을 조사하게 된다.Thus, when the electrode terminal 72 is supplied with an external power source, the LED 14 is irradiated with light by applying electricity through the connector 74 and the circuit pattern 13.

한편, 상기 캡(60a)은 상부커버(20)와 하부커버(30)에서 임의적으로 분리되지 않도록 함이 바람직하다.On the other hand, the cap (60a) is preferably not to be separated from the upper cover 20 and the lower cover (30) arbitrarily.

따라서, 상기 캡(60a)과 상부커버(20)는 결속부재(84)에 의해 서로 결속됨이 바람직하다.Therefore, the cap 60a and the upper cover 20 are preferably bound to each other by the binding member 84.

더욱 상세히, 상기 캡(60a)과 상부커버(20)는 홀 형상의 결속구(82)를 일직선상에 되는 위치에 형성하고, 상기 결속부재(84)는 이 결속구(82)에 끼워짐으로써 캡(60a)과 상부커버(20)를 결속하게 된다.In more detail, the cap 60a and the upper cover 20 form a hole-shaped binding hole 82 in a straight line, and the binding member 84 is fitted to the binding hole 82. The cap 60a and the upper cover 20 are bound together.

이때, 상기 하부커버(30)는 상부커버(20)와 결속된 캡(60a)에 의해 막혀있기 때문에 슬라이드 이탈되지 않게 된다.At this time, since the lower cover 30 is blocked by the cap 60a bound to the upper cover 20, the slide is not separated.

또한, 상기 결속부재(84)는 핀 등의 체결요소로 이루어진다.In addition, the binding member 84 is made of a fastening element such as a pin.

한편, 도 4에 도시된 바와 같이, 본 발명의 다른 실시예에 따른 고휘도 파워 엘이디등은 캡(60b)을 상부커버(20)의 일측에 일체로 형성함과 동시에 상부커버(20)의 일측에 대칭되는 하부커버(30)의 하측에 일체로 형성한다.On the other hand, as shown in Figure 4, the high-brightness power LED according to another embodiment of the present invention is formed on one side of the top cover 20 at the same time the cap (60b) integrally formed on one side of the top cover (20) It is formed integrally with the lower side of the lower cover 30 to be symmetrical.

즉, 상기 상부커버(20)와 하부커버(30)는 서로 반대되는 측면만을 개방하도록 형성된다.That is, the upper cover 20 and the lower cover 30 are formed to open only the side opposite to each other.

그래서, 상기 상부커버(20)와 하부커버(30)가 슬라이드 결합됨과 동시에 캡(60b)에 의해 해당 측면에 막히게 된다.Thus, the upper cover 20 and the lower cover 30 is coupled to the slide at the same time is blocked on the side by the cap (60b).

물론, 상기 상부커버(20)와 하부커버(30)가 슬라이드 결합됨과 동시에 전극단자(72)가 커넥터(74)에 접속된다.Of course, the upper cover 20 and the lower cover 30 is coupled to the slide at the same time the electrode terminal 72 is connected to the connector 74.

이 경우, 상기 캡(60b)이 상부커버(20) 및 하부커버(30)에 일체로 형성되기 때문에 상기의 결속구(82) 및 결속부재(84)는 불필요하게 된다.In this case, since the cap 60b is formed integrally with the upper cover 20 and the lower cover 30, the binding holes 82 and the binding member 84 are unnecessary.

미설명된 도면부호는 상술한 것으로 대체한다.Unexplained reference numerals are replaced with those described above.

본 발명은 도면에 도시된 실시예를 참고로 하여 설명되었으나, 이는 예시적인 것에 불과하며, 당해 기술이 속하는 분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art to which the art belongs can make various modifications and other equivalent embodiments therefrom. Will understand.

따라서, 본 발명의 진정한 기술적 보호범위는 아래의 특허청구범위에 의해서 정하여져야 할 것이다.Therefore, the true technical protection scope of the present invention will be defined by the claims below.

도 1은 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 사시도.1 is a perspective view of a high brightness power LED according to an embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 내부도.Figure 2 is an internal view of a high brightness power LED according to an embodiment of the present invention.

도 3은 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 단면도.3 is a cross-sectional view of a high brightness power LED, etc. according to an embodiment of the present invention.

도 4는 본 발명의 다른 실시예에 따른 고휘도 파워 엘이디등의 조립 상태도.Figure 4 is an assembled state diagram of a high brightness power LED according to another embodiment of the present invention.

<도면의 주요 부분에 관한 부호의 설명><Explanation of symbols on main parts of the drawings>

10: 엘이디발광부 11: 보드10: LED light emitting unit 11: board

12: 절연체 13: 회로패턴12: insulator 13: circuit pattern

14: 엘이디 17: 체결부재 14: LED 17: fastening member

20: 상부커버 30: 하부커버 20: upper cover 30: lower cover

40: 방열부재 52: 슬라이드리브 40: heat dissipation member 52: slide rib

54: 돌부 56: 슬라이드홈 54: protrusion 56: slide groove

60a,60b: 캡 72: 전극단자 60a, 60b: cap 72: electrode terminal

74: 커넥터 82: 결속구 74: connector 82: binding hole

84: 결속부재84: binding member

Claims (11)

외부 전원의 공급시 발광하는 엘이디발광부;LED light emitting unit for emitting light when the external power supply; 상기 엘이디발광부를 장착하여 상기 엘이디발광부의 발열시 열기를 방출 유도하도록 금속재질의 반원통 형상으로 형성되며, 상기 엘이디발광부를 안착하기 위해 안착홈을 구비하는 상부커버;An upper cover having a semi-cylindrical shape made of a metal material to mount the LED light emitting part to induce heat emission when the LED light emitting part is heated, and having a seating groove to seat the LED light emitting part; 상기 상부커버에 분리가능하게 결합되고, 반원호의 단면을 가지며, 상기 엘이디발광부에서 조사되는 빛을 통과시키며 분산하는 하부커버; 및A lower cover detachably coupled to the upper cover and having a cross section of a semi-circular arc and dispersing while passing light emitted from the LED light emitting unit; And 상기 상부커버의 외측 둘레면에 연속되는 산과 골 형상이거나 또는 돌출되는 핀 형상으로 형성되어 방열면적을 증가시킴으로써 상기 엘이디발광부의 발열 방출 시간을 단축시키는 방열부재를 포함하며,It includes a heat dissipation member formed on the outer circumferential surface of the upper cover in the form of a peak and a valley or protruding fin shape to increase the heat dissipation area to shorten the heat emission time of the LED light emitting portion, 상기 엘이디발광부는 상기 상부커버 내측에 접하며 체결부재에 의해 상기 상부커버에 분리가능하게 체결되는 금속재질 보드와, 상기 보드의 상기 상부커버에 접하는 면을 제외한 외측에 도포되는 절연층과, 상기 절연층에 인쇄되어 외부 전원의 공급시 전류의 흐름을 안내하는 회로패턴과, 상기 회로패턴에 연결되어 외부 전원의 공급시 발광하는 엘이디로 이루어지고,The LED light emitting part is in contact with the inner side of the upper cover and the metal board which is detachably fastened to the upper cover by a fastening member, an insulating layer applied to the outside except the surface in contact with the upper cover of the board, and the insulating layer A circuit pattern which is printed on and guides the flow of current when the external power is supplied, and an LED connected to the circuit pattern to emit light when the external power is supplied, 상기 하부커버와 상기 상부커버는 적어도 서로 대칭되는 일측면을 개방하고, 상기 하부커버와 상기 상부커버는 개방된 측면을 캡으로 막음 처리하며, 상기 하부커버는 서로 마주하는 테두리에 슬라이드리브를 형성하며, 상기 상부커버는 상기 슬라이드리브를 슬라이드 안내하도록 슬라이드홈을 갖는 돌부를 구비하여, 상기 하부커버와 상기 상부커버의 테두리 접촉면적을 증가시켜 상기 엘이디발광부를 외부로부터 보호하고,The lower cover and the upper cover open at least one side that is symmetrical to each other, the lower cover and the upper cover is capped the open side with a cap, the lower cover forms a slide rib on the border facing each other The upper cover includes a protrusion having a slide groove to slide the slide rib to increase the edge contact area of the lower cover and the upper cover to protect the LED light emitting part from the outside. 상기 캡은 외부 전원을 인가받아 상기 엘이디발광부에 공급하도록 전극단자를 형성하되, 상기 전극단자는 상기 캡의 내·외측으로 돌출되고, 상기 엘이디발광부는 상기 전극단자를 삽입하도록 커넥터를 구비하며, 상기 캡과 상기 상부커버는 일직선상에 위치하는 결속구를 형성하여, 상기 결속구는 결속부재에 의해 체결됨으로써 상기 캡과 상기 상부커버의 자연적 이탈을 방지하는 것을 특징으로 하는 고휘도 파워 엘이디등.The cap is provided with an external power source to form an electrode terminal to supply to the LED light emitting unit, the electrode terminal protrudes in and out of the cap, the LED light emitting unit is provided with a connector to insert the electrode terminal, The cap and the upper cover to form a binding sphere located in a straight line, the binding sphere is fastened by a binding member to prevent the natural separation of the cap and the upper cover high brightness power LED and the like. 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete
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