KR100862704B1 - Apparatus and method for treating waste liquid - Google Patents

Abstract

The present invention relates to an apparatus and a method for treating waste liquid. The present invention cools the treatment liquid (waste liquid) used in the apparatus for treating a substrate to a temperature below a predetermined temperature and drains it to the main drain line. Particularly, the present invention recovers the high temperature waste liquid into a container provided with a cooling line, which cools and condenses the gaseous waste liquid vaporized from the waste liquid while simultaneously cooling the liquid waste liquid in the container. The present invention prevents the contamination of the facility by the fume generated during the waste liquid treatment and improves the recovery rate of the waste liquid.

Semiconductor, processing liquid, waste liquid, recovery, regeneration, cooling, heat exchange, drainage, exhaust

Description

Waste liquid treatment apparatus and its method {APPARATUS AND METHOD FOR TREATING WASTE LIQUID}

1 is a view showing the configuration of the waste liquid treatment apparatus according to the present invention.

FIG. 2 is a perspective view of the plate shown in FIG. 1. FIG.

3 is a perspective view showing a modified example of the plate shown in FIG.

4 is a view showing the configuration of the waste liquid treatment apparatus according to another embodiment of the present invention.

FIG. 5 is a perspective view of the plate shown in FIG. 4. FIG.

6 is a perspective view showing a modified example of the plate shown in FIG.

FIG. 7 is a perspective view illustrating another modified example of the plate illustrated in FIG. 5.

* Description of symbols on the main parts of the drawings *

1: semiconductor manufacturing equipment 200: cooling member

10: substrate processing apparatus 210: cooling line

20: waste liquid treatment device 220: auxiliary heat exchange member

100: container 300: plate

102: receiver

104: recovery unit

106: exhaust

The present invention relates to a waste liquid treatment apparatus and method, and more particularly, to an apparatus and method for treating waste liquid generated in the process of processing substrates such as wafers for manufacturing semiconductor integrated circuit chips and glass for manufacturing flat panel displays.

In the general semiconductor and flat panel display manufacturing field, various processing liquids are used to process the substrate. For example, various kinds of chemicals are used in the cleaning process for cleaning the substrate and the etching process for etching foreign substances on the surface of the substrate. In the wet process, the waste liquid treatment apparatus for treating the treatment liquids (hereinafter, referred to as "waste liquid") used in the process is provided. A general waste liquid treatment apparatus recovers waste liquid from a substrate processing apparatus to recycle or drain waste liquid for reuse.

However, the general waste liquid treatment apparatus has the following problems.

First, the general waste liquid treatment apparatus did not effectively treat the fume generated from the waste liquid. For example, when the substrate processing apparatus uses a high temperature chemical, a large amount of fume is generated from the high temperature waste liquid recovered by the waste liquid processing apparatus. However, the general waste liquid treatment apparatus is not provided with a means for efficiently reducing the generation of the fume, there was a problem that the fumes generated during waste liquid treatment is re-introduced into the substrate processing apparatus to contaminate the equipment. In particular, in the process of treating the hot waste liquid, a large amount of the waste liquid is vaporized and discharged in a gaseous state, thereby reducing the recovery rate of the waste liquid.

Second, a general waste liquid treatment apparatus recovers waste liquid from each of a plurality of substrate processing apparatuses, and regenerates or drains it. To this end, the waste liquid processing apparatus recovers the waste liquid from the drainage line connected with the respective substrate processing apparatuses. The waste liquid treatment apparatus of this structure can affect all the substrate treatment apparatuses to which the drain line is connected, even in the waste liquid treatment of one substrate treatment apparatus. For example, the fume generated during the waste liquid treatment of one substrate processing apparatus may be re-introduced into another substrate processing apparatus through a drain line to contaminate all the substrate processing apparatuses to which the drain line is connected.

Third, the general waste liquid treatment apparatus did not efficiently process the hot waste liquid. That is, the general waste liquid treatment apparatus simply recovers the waste liquid from the substrate processing apparatuses and then drains it to the main drain line. However, when the waste liquid treatment apparatus processes the waste liquid of high temperature, since the waste liquid directly drains to the main drain line without cooling the waste liquid of high temperature, damage of the drain lines may occur due to the treatment of the waste liquid of high temperature.

In order to solve the above problems, an object of the present invention is to provide a waste liquid treatment apparatus and method for efficiently treating waste liquid.

In addition, an object of the present invention is to provide a waste liquid treatment apparatus and method for preventing the fumes generated from the waste liquid during the waste liquid treatment to be re-introduced into the substrate processing apparatus.

It is also an object of the present invention to provide a waste liquid treatment apparatus and method for preventing contamination of equipment by waste liquid during waste liquid treatment.

Moreover, an object of this invention is to provide the waste liquid processing apparatus and method which improve the recovery rate of waste liquid.

Waste liquid processing apparatus according to the present invention for achieving the above object is a recovery line for recovering the waste liquid from the apparatus, a container for receiving the waste liquid recovered from the recovery line, and the waste liquid recovered to the container, and And a cooling member for condensing the waste liquid vaporized from the waste liquid recovered in the container.

According to an embodiment of the present invention, the container is provided with an accommodating portion for receiving the waste liquid recovered from the recovery line, a recovery portion provided on an upper side of the accommodating portion to communicate with the accommodating portion and recovering the waste liquid from the recovery line. The cooling member includes a first cooling line in which a cooling fluid flows and is located in the recovery part.

According to an embodiment of the present invention, the waste liquid treatment apparatus further includes an exhaust line connected to the container to exhaust the air in the container, wherein the container is provided on the other upper part of the container to communicate with the receiving portion, And an exhaust portion for exhausting the air in the vessel to the exhaust line, wherein the cooling member further includes a second cooling line through which a cooling fluid flows and located inside the exhaust portion.

According to an embodiment of the present invention, the waste liquid treatment apparatus further includes a drain line connected to the receiving portion to drain the waste liquid, wherein the drain line is positioned closer to the exhaust portion than the recovery portion.

According to an embodiment of the present invention, the cooling member further includes a third cooling line in which a cooling fluid flows and is installed along the upper wall of the receiving portion of the container.

According to an embodiment of the present invention, the cooling member further includes a fourth cooling line installed along the lower wall of the accommodating part so that a cooling fluid flows therein and cools the waste liquid in the accommodating part.

According to an embodiment of the present invention, the first to fourth cooling lines are provided as one line.

According to an embodiment of the present invention, the waste liquid treatment apparatus further includes a plate for adjusting the flow rate of the fluid moved from the recovery portion to the exhaust portion.

According to an embodiment of the present invention, the plate extends downward from the upper wall of the receiving portion of the container, and at least one first hole through which air in the container moved from the recovery part to the exhaust part is formed. It includes a body.

According to an embodiment of the present invention, the plate extends downward from the upper wall of the receiving portion of the container, and at least one first hole through which air in the container moved from the recovery part to the exhaust part is formed. And a second body extending downward from a lower end of the first body and having at least one second hole for passing waste liquid in the container from the recovery portion to the drain base.

According to an embodiment of the present invention, the first body and the second body are integrally provided.

The waste liquid treatment method according to the present invention for achieving the above object is to recover the waste liquid from the apparatus for processing the substrate and to drain the waste liquid by providing a cooling line inside the container for recovering the waste liquid.

According to an embodiment of the present invention, the gaseous waste liquid vaporized from the waste liquid recovered into the vessel is cooled by the cooling line and condensed.

According to an embodiment of the present invention, the container is provided with a recovery part for recovering the waste liquid, an accommodating part for receiving the waste liquid recovered from the recovering part, and an exhaust part for exhausting the air in the accommodating part. The waste liquid is condensed by the cooling line provided in the recovery part, the accommodating part, and the exhaust part.

According to an embodiment of the present invention, the gaseous waste liquid condensation of the accommodating part is performed by a cooling line installed in the accommodating part.

According to an embodiment of the present invention, the liquid waste liquid in the accommodating part is cooled by a cooling line installed in the accommodating part.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure will be thorough and complete, and will fully convey the spirit of the invention to those skilled in the art. In addition, in the present embodiment, the apparatus for wet cleaning the semiconductor substrate has been described as an example, but the present invention can be applied to any substrate processing apparatus for treating the substrate using the processing liquid.

Example 1

1 is a view showing the configuration of a semiconductor manufacturing facility equipped with a waste liquid treatment apparatus according to the present invention. 1 and 2, a semiconductor treating facility 1 according to the present invention may include an apparatus for treating substrate 10 and an apparatus for treating waste liquid 20. ).

The substrate processing apparatus 10 performs a process of processing a substrate. The substrate processing apparatus 10 is a device for wet processing a wafer for semiconductor integrated circuit chip manufacturing. For example, the substrate processing apparatus 10 may be a wet cleaning apparatus for cleaning a substrate using various kinds of chemicals and ultrapure water, and an etching process apparatus for removing foreign substances such as unnecessary thin films on the surface of the substrate. In the present embodiment, the substrate processing apparatus 10 has been described as an example for manufacturing a semiconductor integrated circuit chip, but the substrate processing apparatus 10 may be an apparatus for processing a glass substrate for manufacturing a flat panel display.

The waste liquid processing apparatus 20 processes a processing liquid (hereinafter referred to as "waste liquid") used in the substrate processing apparatus 10. The waste liquid treatment apparatus 20 includes a collect line 22, an exhaust line 24, a drain line 26, a main drain line 28, A vessel 100, a cooling member 200, and a plate 300 are included.

The recovery line 22 recovers the waste liquid from the substrate processing apparatus 10 to the container 100. The recovery line 22 is connected to the recovery part 104 provided on one side of the upper wall of the container 100. In this embodiment, the recovery line 22 recovers the waste liquid from one substrate processing apparatus 10 as an example, but the recovery line 22 may recover the waste liquids from each of the plurality of substrate processing apparatuses 10. have.

The exhaust line 24 exhausts the air in the container 100. The exhaust line 24 is connected to the exhaust unit 106 provided on the other side of the upper wall of the container 100. Therefore, the air in the container 100 is exhausted out of the semiconductor manufacturing facility 1 through the exhaust line 24.

Drainage line 26 drains waste liquid from vessel 100 to main drainage line 28. At this time, the waste liquid drained to the main drain line 28 through the drain line 26 is the waste liquid cooled to a predetermined temperature or less by the cooling member 200. The main drain line 28 receives the cooled waste liquid from the drain line 26 and moves it to a waste water treatment chamber (not shown).

The vessel 100 has a storage member 102, a collect member 104, and an exhaust member 106. The receiving unit 102 stores the waste liquid recovered from the recovery line 22. The recovery part 104 is provided on the upper one side of the receiving part 102. The recovery unit 104 receives the waste liquid from the recovery line 22. The exhaust part 106 is provided on the other side of the upper part of the receiving part 102. The exhaust unit 106 exhausts the air in the container 100 to the outside. Here, the arrangement of the recovery unit 104 and the exhaust unit 106 may be provided at various positions of the container 100, but it is preferable that the recovery unit 104 and the exhaust unit 106 are installed as far apart as possible. . This is because the cooling member 200 increases the moving distance of the waste liquid that is moved from the recovery unit 104 to the exhaust unit 106, thereby increasing the time that the waste liquid is cooled by the cooling member 200.

The cooling member 200 cools the waste liquid recovered to the container 100. In addition, the cooling member 200 cools and condenses the gaseous waste liquid vaporized from the waste liquid in the container 100. The cooling member 200 includes a cooling line 210 and a cooling fluid circulation line 220.

The cooling line 210 is provided inside the container 100. A passage through which a cooling fluid flows is formed in the cooling line 210. The cooling line 210 includes first to fourth cooling lines 212, 214, 216, and 218.

The first cooling line 212 is provided inside the recovery unit 104. The first cooling line 212 cools the waste liquid by contacting the waste liquid recovered by the recovery unit 104. The first cooling line 212 preferably has a shape that is wound several times to increase the contact area with the waste liquid.

The second cooling line 214 is provided inside the exhaust 106. The second cooling line 214 cools and condenses the waste liquid in the vaporized state of the air exhausted to the exhaust unit 106. The second cooling line 214 preferably has a shape that is wound several times to increase the contact area with the gaseous waste liquid.

The third cooling line 216 cools and condenses the waste liquid in the vaporized state in the receiving portion 102. The third cooling line 216 is provided inside the receiving portion 102. The third cooling line 216 is installed along the upper wall 108 of the receiving portion 102. One end of the third cooling line 216 is connected to the first cooling line 212, and the other end of the third cooling line 216 is connected to the second cooling line 214. The third cooling line 216 preferably has a shape wound several times at the same height so as to be disposed throughout the upper wall 108.

The fourth cooling line 218 cools the waste liquid accommodated in the accommodation unit 102. The fourth cooling line 218 is disposed along the lower wall 109 of the receiving portion 102. The fourth cooling line 218 preferably has a shape that is wound several times at the same height so as to be disposed throughout the lower wall 109. The fourth cooling line 218 directly cools the waste liquid contained in the accommodating part 102 to cool the waste liquid to a predetermined temperature or less.

Here, the above-described first to fourth cooling lines 212, 214, 216, 218 is composed of one line. Accordingly, the cooling fluid is sequentially moved from the first cooling line 212 to the third cooling line 216, the second cooling line 214, and the fourth cooling line 218, and the waste liquid in the container 100. Cool down.

The cooling fluid circulation line 220 includes a cooling fluid supply line 222 and a cooling fluid collect line 224. The cooling fluid supply pipe 222 supplies the cooling fluid from the cooling fluid supply source (not shown) to one end of the first cooling line 212, and the cooling fluid recovery pipe 224 is provided from one end of the fourth cooling line 218. Recover the cooling fluid to the cooling fluid source. Here, cooling water is used as the cooling fluid. For example, ultrapure water maintained at a constant temperature may be used as the cooling fluid. Alternatively, a cooling gas may be used as the cooling fluid.

In the present embodiment, the case in which the first to fourth cooling lines 212, 214, 216, and 218 are provided as one line has been described as an example. However, the first to fourth cooling lines 212, 214, 216, and 218 are provided. At least one of these may be provided as a separate line. In addition, in the present exemplary embodiment, the first to fourth cooling lines 212, 214, 216, and 218 have a shape in which the first to fourth cooling lines 212, 214, 216, and 218 are wound a plurality of times. The shape of the 218 can be variously changed.

The plate 300 regulates the flow of the gaseous waste liquid moved from the recovery unit 104 to the exhaust unit 106. The plate 300 has a plate-shaped body 310. The body 310 extends downwardly from the top wall 108 of the receptacle 102. At this time, the height of the lower end 314 of the body 310 is installed to be higher than the surface of the waste liquid in the receiving portion (102). The body 310 is formed with a hole 312 through which gaseous waste liquid passes. The hole 312 has one slit shape, as shown in FIG. 2. Alternatively, as illustrated in FIG. 3, a plurality of holes 312 ′ may be provided in a circular shape. The shape and number of holes provided in the plate 300 or 300 ′ may be variously changed and modified.

Hereinafter, the waste liquid cooling process of the waste liquid treatment apparatus 20 described above will be described in detail. The processing liquid (waste liquid) used in the substrate processing apparatus 10 is recovered to the recovery part 104 of the container 100 through the recovery line 22. The waste liquid recovered by the recovery part 104 is first cooled by the first cooling line 212 and then received in the receiving part 102. The waste liquid received by the receiver 102 is cooled by the fourth cooling line 218. The cooled waste liquid is discharged from the vessel 100 through the drain line 26 and drained to the main drain line 28.

In addition, the gaseous waste liquid vaporized from the waste liquid in the container 100 and moved from the recovery unit 104 to the exhaust unit 106 is condensed by the third cooling line 216 and recovered to the receiving unit 102 again. After the drain line 26 is drained. At this time, the plate 300 delays the flow of air that is moved from the recovery unit 104 to the exhaust unit 106, thereby increasing the time for the gaseous waste liquid is cooled by the cooling line 210. Therefore, the plate 300 improves the recovery rate of the waste liquid by effectively cooling and condensing the gaseous waste liquid. In addition, the air in the container 100 is discharged to the outside of the container 100 through the exhaust 106. At this time, the second cooling line 214 cools the waste liquid in a gaseous state in the air exhausted through the exhaust unit 106. Therefore, the air discharged to the exhaust part 106 does not contain the gaseous waste liquid.

The above-described waste liquid processing apparatus 20 recovers the waste liquid from the substrate processing apparatus 10, effectively cools it, and then drains it. In addition, the waste liquid treatment apparatus 20 effectively condenses the fume (waste liquid in a gaseous state) generated during the waste liquid treatment to improve the recovery rate of the waste liquid.

Example 2

Hereinafter, the waste liquid processing apparatus 20 'according to another embodiment of the present invention will be described in detail. 4 is a view showing the configuration of the waste liquid treatment apparatus according to another embodiment of the present invention, Figure 5 is a perspective view of the plate shown in FIG. 6 is a perspective view illustrating a modified example of the plate illustrated in FIG. 5, and FIG. 7 is a perspective view illustrating another modified example of the plate illustrated in FIG. 5.

The cooling member 200 of the waste liquid processing apparatus 20 according to the embodiment of the present invention cools the waste liquid in the container 100 by providing a cooling line 210 inside the container 100. However, the first cooling line 212 and the second cooling line 214 of the cooling line 210 are simply provided with a shape wound multiple times inside the recovery section 104 and the exhaust section 106 to cool the waste liquid. Since it is provided to, the cooling efficiency of the cooling line 210 may be low. For example, the waste liquid recovered by the recovery unit 104 is heat-exchanged with the cooling fluid flowing along the inside of the first cooling line 212 while passing through the first cooling line 212, so as to improve the cooling efficiency of the waste liquid. 1 It is necessary to increase the contact area and the contact time of the cooling line 212.

In addition, the plate 300 according to the above-described embodiment is provided to control only the flow of air moved from the recovery unit 104 to the exhaust unit 106. However, since the waste liquid (especially the surface of the waste liquid) contained in the receiving portion 102 is continuously evaporated, when the waste liquid recovered to the receiving portion 102 is moved to the exhaust portion 106 without being sufficiently cooled, the exhaust portion ( The amount of gaseous waste liquid to be condensed by the second cooling line 214 installed in 106 increases. Therefore, it is necessary to adjust the flow so that the waste liquid in the receiving portion 102 is sufficiently cooled by the cooling line 210 before moving from the recovery portion 104 side to the exhaust portion 106 side.

Therefore, the cooling member 200 ′ of the semiconductor manufacturing facility 1 ′ according to another embodiment of the present invention further includes a plate 300 a and an auxiliary heat exchange member 400. 4 and 5, the plate 300a controls the flow of the waste liquid in the liquid state and the gaseous waste liquid in the container 100 together. In addition, the auxiliary heat exchange member 400 increases the contact area and the contact time between the first cooling line 212 and the second cooling line 214 and the waste liquid.

The plate 300a has a plate-shaped body extending downward from the upper wall 108 of the receiving portion 102 of the container 100. The interior of the receiving portion 102 of the container 100 is partitioned by a plate 300a into a first region 102a adjacent to the recovery portion 104 and a second region 102b adjacent to the exhaust portion 106. . The body has a first body 310a and a second body 320a. The first body 310a has the same structure as the body 310 of the plate 300 according to an embodiment of the present invention. The second body 320a extends downward from the lower end of the first body 310a. A hole 322a having the same shape as the first hole 312a formed in the first body 310a is formed in the second body 320a. The hole 322a is provided to allow the waste liquid to be moved from the first region 102a to the second region 102b. At this time, the portion (c) to which the first body (310a) and the second body (320a) is connected to correspond to the surface of the waste liquid accommodated in the receiving portion (102).

In the present exemplary embodiment, holes having the same shape are formed in the first body 310a and the second body 320a, but the holes formed in the first body 310a and the second body 320a are various. Changes and variations are possible. For example, as shown in FIG. 6, a plurality of circular holes 312a 'and 322a' may be formed in the first body 310a 'and the second body 320a' of the plate 300a '. Alternatively, as shown in FIG. 7, the shape of the hole 312a ″ provided in the first body 310a ″ of the plate 300a ″ and the hole provided in the second body 320a ″ 322a '' may be different from one another.

The plate 300a having the above-described structure delays the flow of the gaseous waste liquid, in which the first body 310a is moved from the first region 102a to the second region 102b, and the second body 320a The flow of the waste liquid in the liquid state moved from the first region 102a to the second region 102b is delayed. In particular, the connecting portion (c) of the first body (310a) and the second body (320a) blocks the flow of the surface portion of the waste liquid moved from the first region (102a) to the second region (102b). Therefore, the plate 300a regulates the flow of the waste liquid in the liquid state together with the control of the flow of the gas waste liquid in the container 100 so that the waste liquid is moved from the first region 102a to the second region 102b. Before the waste liquid is sufficiently cooled by the first cooling line 212 and the third cooling line 216 to reduce the burden on the exhaust 106. In particular, the plate 300a prevents the water portion of the waste liquid having a high vaporization rate of the waste liquid from moving from the first region 102a to the second region 102b to reduce the amount of waste liquid vaporized to the exhaust portion 106. You can.

The auxiliary heat exchange member 400 includes a first heat exchange member 410 and a second heat exchange member 420. The first heat exchange member 410 is installed inside the recovery unit 104, and the second heat exchange member 420 is installed inside the exhaust unit 106. The first heat exchange member 410 and the second heat exchange member 420 generally have the same configuration, structure, and function. Therefore, the configurations of the first heat exchange member 410 will be described, and a detailed description of the second heat exchange member 420 will be omitted.

The first heat exchange member 410 has a flow delay plate 412 and a heat exchange line 414. The flow delay plate 412 delays the flow of the waste liquid moved from the recovery unit 104 to the receiving unit 102. Flow delay plate 412 is composed of a plurality of diaphragm, each of the diaphragm may be shaped to be corrugated. In the process, the waste liquid recovered to the recovery unit 104 through the recovery line 22 is delayed in the flow of the waste liquid to the receiving unit 102 by the flow delay plate 412, thereby exchanging heat with the first cooling line 212. Increase time The heat exchange line 414 is provided inside the flow delay plate 412.

The heat exchange line 414 has a shape that is wound in a plurality of times inside the flow delay plate 412. In addition, the heat exchange line 414 is disposed adjacent to the first cooling line 212. The heat exchange line 414 is made of a metal tube and is cooled by the first cooling line 212. Therefore, the heat exchange line 414 is cooled to a constant temperature by the first cooling line 212, and cools the waste liquid passing through the recovery unit 104 during the process.

In the present embodiment, the flow delay plate 412 having a plurality of diaphragms has been described as an example, but the flow delay plate 412 is a flow of the waste liquid to increase the heat exchange time of the waste liquid with the first cooling line 212. By delaying, the structure of the flow delay plate 412 can be variously changed and modified. The structure of the auxiliary heat exchange member 400 is generally similar to the structure of the dehumidifier provided in the air conditioner, and the technology for such a dehumidifier is generally widely recognized and used, so a detailed description thereof will be omitted.

In the above-described waste liquid processing apparatus 20 ′, the plate 300a controls the flow of the liquid waste liquid and the gaseous waste liquid in the container 100 so that the waste liquid in the container 100 is transferred to the cooling line 210. The cooling time of the waste liquid is efficiently increased by increasing the cooling time. In addition, the waste liquid treatment apparatus 20 ′ includes the auxiliary heat exchange member 400 that increases the contact area and the contact time between the first cooling line 212 and the second cooling line 214 and the waste liquid. The waste liquid is cooled efficiently. Therefore, the waste liquid treating apparatus 20 'improves the cooling efficiency of the waste liquid compared to the waste liquid treating apparatus 20 according to one embodiment, thereby increasing the recovery rate of the waste liquid.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments illustrate the best state for implementing the technical idea of the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the invention. Various changes required are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described above, the waste liquid treatment apparatus and method according to the present invention efficiently treat the waste liquid. In particular, the present invention effectively cools the hot waste liquid to prevent the contamination and damage of the facility by the fume generated from the waste liquid, and improves the recovery rate of the waste liquid.

Claims (16)

delete In the apparatus for treating waste liquid, A recovery line for recovering the waste liquid from the apparatus for processing the substrate; A container for receiving the waste liquid recovered from the recovery line; A cooling member for cooling the waste liquid recovered to the vessel and for condensing the waste liquid vaporized from the waste liquid recovered into the vessel; In the container, Receiving unit for receiving the waste liquid recovered from the recovery line; A recovery part provided at an upper side of the accommodation part so as to communicate with the accommodation part, and having a waste liquid recovered from the recovery line, The cooling member, And a first cooling line through which a cooling fluid flows, and positioned inside the recovery unit. The method of claim 2, The waste liquid treatment device, And an exhaust line connected to the vessel to exhaust air in the vessel, The container, Further provided is an exhaust portion provided on the other upper side of the vessel to communicate with the receiving portion, and for exhausting the air in the vessel to the exhaust line, The cooling member, And a second cooling line through which a cooling fluid flows and located inside the exhaust unit. The method of claim 3, wherein The waste liquid treatment device, Further comprising a drain line connected to the receiving portion for draining the waste liquid, The drain line, And a waste liquid processing apparatus, wherein the waste liquid is located closer to the exhaust portion than the recovery portion. The method of claim 4, wherein The cooling member, And a third cooling line through which a cooling fluid flows, and installed along the upper wall of the receiving portion of the container. The method of claim 5, wherein The cooling member, And a fourth cooling line in which a cooling fluid flows and is installed along the lower wall of the accommodation portion to cool the waste liquid in the accommodation portion. The method of claim 6, The first to fourth cooling line, Waste liquid processing apparatus characterized in that provided in one line. The method according to any one of claims 4 to 7, The waste liquid treatment device, And a plate for adjusting a flow rate of the fluid moving from the recovery part to the exhaust part. The method of claim 8, The plate, And a body extending downward from an upper wall of the receiving portion of the container and having at least one first hole through which air in the container is moved from the recovery portion to the exhaust portion. . The method of claim 8, The plate, A first body extending downward from an upper wall of the receiving portion of the container and having at least one first hole through which air in the container is moved from the recovery portion to the exhaust portion; and And a second body extending downward from a lower end of the first body and having at least one second hole through which the waste liquid in the container passes from the recovery part to the exhaust part. The method of claim 10, The first body and the second body, Waste liquid processing apparatus characterized in that it is provided integrally. delete delete The waste liquid is collected and drained from the apparatus for treating the substrate, and a cooling line is provided inside the container for recovering the waste liquid to cool the waste liquid, and the gaseous waste liquid vaporized from the waste liquid recovered into the container is the cooling line. Cooled by and condensed; In the container, A recovery unit for recovering the waste liquid; An accommodation part for receiving the waste liquid recovered from the recovery part; An exhaust portion for exhausting air in the accommodation portion is provided, The gaseous waste liquid, And a cooling line provided to the recovery unit, the accommodation unit, and the exhaust unit. The method of claim 14, The gaseous waste liquid condensation of the accommodation portion, Waste liquid treatment method comprising a cooling line installed in the receiving portion. The method of claim 14, The waste liquid in the liquid state in the receiving portion, Waste liquid treatment method characterized in that the cooling by the cooling line installed in the receiving portion.

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