KR100851068B1 - Stamper and PCB manufacturing method using thereof - Google Patents

Abstract

A stamper and a method of manufacturing a printed circuit board using the same are disclosed. A stamper comprising a stamper body portion and an embossed pattern formed on the surface of the stamper body portion, wherein the stamper has an uneven portion formed on the surface of the embossed pattern to widen the surface area of the embossed pattern to facilitate plating. do.

Stamper, irregularities, embossed pattern, fine particles

Description

Stamper and printed circuit board manufacturing method using same

1 is a cross-sectional view of a stamper according to a first preferred embodiment of the present invention.

Figure 2 is a flow chart of a manufacturing method of a printed circuit board using a stamper according to a second embodiment of the present invention.

3 is a manufacturing process diagram of a printed circuit board using a stamper according to a second embodiment of the present invention.

4 is a cross-sectional view of a stamper according to a third preferred embodiment of the present invention.

5 is a manufacturing flowchart of a printed circuit board using a stamper according to a fourth embodiment of the present invention.

6 is a manufacturing process diagram of a printed circuit board using a stamper according to a fourth embodiment of the present invention.

7 is a sectional view of a stamper according to a fifth preferred embodiment of the present invention.

8 is a manufacturing flowchart of a printed circuit board using a stamper according to a sixth embodiment of the present invention.

9 is a manufacturing process diagram of a printed circuit board using a stamper according to a sixth embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: stamper 11: embossed pattern

11a: uneven portion 12: stamper body portion

The present invention relates to a stamper and a method of manufacturing a printed circuit board using the same.

Today, electronic and electric technology is rapidly developing to store more capacity, faster information processing and transmission, and simpler information communication network to keep pace with the 21st century high information and communication society. In particular, under the condition of the transmission rate finiteness of a given information, as a way to satisfy such a requirement, a method for implementing the component as small as possible and increasing reliability and providing new functionality has been proposed.

As described above, in accordance with the trend of light and short sized electronic products, fine patterns, miniaturization, and packaging are also progressed at the same time, thereby realizing a circuit having excellent signal processing capability in a smaller area. For this purpose, there is a need for manufacturing high density substrates (line / space ≦ 10 μm / 10 μm, Microvia <30 μm).

One of the most widely used microstructure fabrication techniques so far is UV lithography, a method of forming a circuit pattern by injecting ultraviolet rays onto a substrate coated with a photoresist thin film. However, when manufacturing the substrate using the UV lithography method, there is a limitation that the copper foil used as the circuit must be thick and the wet etching method is used, so that the reliability of the product when forming a fine line width of 10 μm or less with UV lithography This has the problem of falling.

In recent years, the degree of integration of printed circuit boards has been increasing and researches on how to form fine patterns have become more active. As a substitute method of the above-described UV lithography, a high-density substrate using a stamper for forming a circuit pattern is used. Attempts to prepare the product have attracted attention.

The present invention is to provide a stamper and a method of manufacturing a printed circuit board using the same to reduce the imprint process step.

According to an aspect of the present invention, a stamper including a stamper body portion and an embossed pattern formed on the surface of the stamper body portion, the surface of the embossed pattern is provided with a stamper characterized in that the uneven portion is formed. This stamper increases the surface area of the relief pattern, thereby facilitating plating. It is preferable that the uneven part is sawtooth-shaped.

According to another aspect of the present invention, (a) preparing a stamper having a first uneven portion formed in the embossed pattern, (b) imprinting the stamper on the insulating layer to form a negative pattern corresponding to the embossed pattern and the first uneven portion; Provided are a method of manufacturing a printed circuit board using a stamper, comprising: forming an uneven portion in the insulating layer, and (c) plating the intaglio pattern to form a circuit pattern in the insulating layer.

In step (c), (c1) laminating a seed layer on the surface of the insulating layer, (c2) laminating a plating layer on the seed layer, and (c3) removing a portion of the plating layer so that the surface of the insulating layer is exposed. It can be done including the step.

Another aspect of the present invention is a stamper comprising a stamper body portion and an embossed pattern formed on the surface of the stamper body portion, wherein the embossed pattern is provided with a stamper having magnetic properties.

According to another aspect of the present invention, (a) preparing a stamper having a magnetic relief pattern is formed, (b) a stamper to the insulating layer containing a conductive particle having a magnetic opposite to the magnetism of the relief pattern A method of manufacturing a printed circuit board using a stamper, comprising: imprinting a negative pattern on the insulating layer to expose the surface of the fine particles, and (c) plating the negative pattern to form a circuit pattern on the insulating layer. Is provided. On the other hand, the insulating layer is fluid, the step (b) may include the step of curing the insulating layer when the fine particles are moved to the surface of the insulating layer by magnetic force.

Another aspect of the present invention is a stamper comprising a stamper body portion and an embossed pattern formed on the surface of the stamper body portion, wherein the stamper is characterized in that the high temperature portion is formed on the embossed pattern. The low temperature portion may be formed on the surface of the body portion.

According to another aspect of the present invention, in (a) a stamper having an embossed pattern, the step of maintaining the embossed pattern at a high temperature, (b) imprinting the stamper on an insulating layer including the fine particles, the fine layer melts and aggregates the functional layer There is provided a method of manufacturing a printed circuit board using a stamper, the method comprising: forming an intaglio pattern formed on the surface of the insulation layer, and (c) plating the intaglio pattern to form a circuit pattern on the insulation layer.

Hereinafter, with reference to the accompanying drawings will be described in more detail with respect to an embodiment of a preferred stamper according to the present invention and a method of manufacturing a printed circuit board using the same, regardless of the reference numerals in the description with reference to the accompanying drawings. The same or corresponding components are given the same reference numerals and redundant description thereof will be omitted.

1 is a cross-sectional view of a stamper according to a first preferred embodiment of the present invention. Referring to FIG. 1, an embossed pattern 11, an uneven portion 11a, a stamper body portion 12, and a stamper 10 are illustrated.

The stamper 10 is a member used in an imprint process and can be used repeatedly. The stamper 10 includes a plate-shaped stamper body part 12 and an embossed pattern 11. In this embodiment, the uneven part 11a is formed on the surface of the embossed pattern 11. Although the stamper body part 12 and the embossed pattern 11 are generally formed integrally, the stamper body part 12 and the embossed pattern 11 may be formed by plating or the like.

The uneven portion 11a formed on the surface of the relief pattern 11 serves to widen the surface area of the relief pattern 11. Advantages when the surface area of the relief pattern 11 is wide will be described in detail with reference to FIG. 3. The uneven portion 11a may be integrally formed when the relief pattern 11 is formed, or may be combined after the relief pattern 11 is formed. The concave-convex portion 11a of the present embodiment can have various shapes as long as it has a sawtooth shape or a shape that can widen the surface area of the relief pattern 11.

2 is a flowchart illustrating a method of manufacturing a printed circuit board using a stamper according to a second exemplary embodiment of the present invention, and FIG. 3 is a manufacturing process diagram of a printed circuit board using a stamper according to a second exemplary embodiment of the present invention. . Referring to FIG. 3, an embossed pattern 31, a first uneven portion 31a, a stamper body portion 32, an insulating layer 33, an intaglio pattern 33a, a second uneven portion 33b, a substrate ( 34), the plating layer 35, the circuit pattern 36, the stamper 30, and the printed circuit board 300 are illustrated.

S21 of FIG. 2 is a step of preparing the stamper 30 having the first uneven portion 31a formed on the relief pattern 31. The stamper 30 of FIG. 3A is a metallic material, and the manufacturing method is made of nickel electroplating on a silicon substrate having a shape corresponding to the embossed pattern 31 and the first uneven portion 31a.

S22 of FIG. 2 imprints the stamper 30 on the insulating layer 33 to form the intaglio pattern 33a and the second uneven portion 33b corresponding to the embossed pattern 31 and the first uneven portion 31a. As a step of forming the insulating layer 33, (a), (b), (c) of Figure 3 is a corresponding process.

First, as shown in FIG. 3A, the insulating layer 33 and the stamper 30 are aligned. At this time, the insulating layer 33 is preferably aligned in a stacked state on the flat substrate 34. Since the insulating layer 33 is soft, a hard substrate 34 to support it is required.

The stamper 30 may be aligned so that the relief pattern 31 faces the insulating layer 33. This is because the imprint process is a process of transferring the embossed pattern 31 of the stamper 30 to the insulating layer 33.

FIG. 3B is a step of pressing the stamper 30 against the insulating layer 33, and FIG. 3C is a step of releasing. When the process is completed, the intaglio pattern 33a and the second uneven portion 33b are formed. The intaglio pattern 33a and the second uneven portion 33a are portions in which the plating layer 35 is to be stacked, and ultimately, portions in which metal to be the circuit pattern 36 in the process are stacked. In particular, the second uneven portion 33b increases the inner surface area of the intaglio pattern 33a to increase the contact area with the plating layer 35 formed during the plating process, thereby increasing the adhesive strength.

S23 of FIG. 2 is a step of forming the circuit pattern 36 on the insulating layer 33 by plating the intaglio pattern 33a, and FIGS. 3D and 3E correspond to the same. As shown in FIG. 3D, the plating layer 35 is laminated on the insulating layer 33. The plating layer 35 is preferably laminated on the surface of the insulating layer 33. At this time, for the smooth plating process, it is preferable to laminate the seed layer 35a on the surface of the insulating layer 33 in advance. When the polishing process is performed after the plating process, the surface of the insulating layer 33 is exposed and the printed circuit board 300 on which the circuit pattern 36 is formed is completed.

4 is a sectional view of a stamper according to a third preferred embodiment of the present invention. Referring to FIG. 4, an embossed pattern 41, a stamper body 42, and a stamper 40 are illustrated.

The embossed pattern 41 of the stamper 40 is magnetic. The stamper body portion 42 is in the form of a flat plate. The embossed pattern 41 may be formed by coupling a magnetic object to the stamper body part 42, and after the stamper body part 42 and the embossed pattern 41 are integrally formed, Only the embossed pattern 41 may be selectively magnetized. How to use the stamper 40 will be described in detail through the manufacturing process of FIG.

5 is a manufacturing flowchart of a printed circuit board using a stamper according to a fourth exemplary embodiment of the present invention, and FIG. 6 is a manufacturing process diagram of a printed circuit board using a stamper according to a fourth exemplary embodiment of the present invention. Referring to FIG. 6, an embossed pattern 61, a stamper body part 62, an insulating layer 63, an intaglio pattern 63a, fine particles 63b, a substrate 64, a circuit pattern 66, and a stamper 60, printed circuit board 600 is shown.

S51 of FIG. 5 is a step of preparing a stamper 60 on which a magnetic relief pattern 61 is formed, as described above in the embodiment of FIG. 4.

In FIG. 5, S52 is an intaglio in which the fine particles 63b are exposed on the surface by imprinting the stamper 60 on the insulating layer 63 including the fine particles 63b having magnets opposite to those of the relief pattern 61. As a step of forming the pattern 63a in the insulating layer 63, (a), (b) and (c) of FIG. 6 are corresponding processes.

First, the stamper 60 and the insulating layer 63 are aligned as shown in FIG. The embossed pattern 61 of the stamper 60 has magnetic properties. The inside of the insulating layer 60 includes fine particles 63b having magnetism opposite to that of the relief pattern 61. The fine particles 63b are preferably nano-sized metals and preferably electrically conductive. On the other hand, it is preferable that the insulating layer 63 maintain a low viscosity so that the fine particles 63b can easily flow. In addition, in order to maintain the shape of the insulating layer 63, the flat substrate 64 is preferably placed on the lower surface of the insulating layer 63.

6B illustrates a step of pressing the stamper 60 against the insulating layer 63, and the embossed pattern 61 of the stamper 60 is impregnated into the insulating layer 63. In this case, the fine particles 63b included in the insulating layer 63 may act on the magnetic relief pattern 61 and the attraction force, and thus are located at the boundary surface of the relief pattern 61. Thereafter, when the insulating layer 63 is cured, the fine particles 63b are fixed.

6C illustrates a release process of the stamper 60 and the insulating layer 63. When the stamper 60 is released, the intaglio pattern 63a of the shape corresponding to the embossed pattern 61 is insulated from the insulating layer. It is formed at 63. At this time, the fine particles (63b) is located on the surface of the intaglio pattern (63a).

S53 of FIG. 5 is a step of forming the circuit pattern 66 on the insulating layer 63 by plating the intaglio pattern 63a, and FIGS. 6D and 6E correspond to the corresponding processes. Since the inner surface of the intaglio pattern 63a is filled with the conductive fine particles 63b, plating can be performed without forming a separate seed layer. After the plating process, it becomes as shown in FIG. At this time, since the plating is formed only on the intaglio pattern 63a, the circuit pattern 66 can be formed without requiring a separate polishing process. Thereafter, when the substrate 64 is removed, the printed circuit board 600 is formed.

7 is a sectional view of a stamper according to a fifth preferred embodiment of the present invention. Referring to FIG. 7, an embossed pattern 71, a stamper body portion 72, a high temperature portion 73a, a low temperature portion 73b, and a stamper 70 are illustrated.

In the present embodiment, the stamper 70 forms a high temperature portion 73a on the embossed pattern 71 to control the temperature, and a low temperature portion on the surface of the stamper body portion 72 on which the embossed pattern 71 is not formed. (73b) is formed. The high temperature unit 73a may have a built-in device for converting electrical energy into thermal energy, and may be supplied with heat from the outside to maintain high temperature. In the case of the low temperature portion 73b, it is preferable to maintain the low temperature by a method of conduction by a low temperature object located outside. The use of the high temperature portion 73a and the low temperature portion 73b will be described in detail in the following embodiments.

8 is a manufacturing flowchart of a printed circuit board using a stamper according to a sixth exemplary embodiment of the present invention, and FIG. 9 is a manufacturing process diagram of a printed circuit board using a stamper according to a sixth exemplary embodiment of the present invention. . 9, an embossed pattern 91, a stamper body 92, an insulating layer 93, an intaglio pattern 93a, fine particles 93b, a substrate 94, a high temperature portion 95a, and a low temperature portion 95b. ), A circuit pattern 96, a functional layer 98, a plating layer 99, a seed layer 99a, and a stamper 90 are shown.

S81 of FIG. 8 is a step of maintaining the relief pattern 91 at a high temperature in the stamper 90 having the relief pattern 91 formed thereon. The high temperature portion 95a is formed in the relief pattern 91 to adjust the temperature of the relief pattern 91. Meanwhile, a low temperature portion 95b may be formed on the surface of the stamper body portion 92 on which the relief pattern 91 is not formed, so that the temperature difference with the relief pattern 91 may be clear. The structure of the stamper 90 is as described in the embodiment of FIG.

S82 of FIG. 8 shows the intaglio pattern 93a having the functional layer 98 formed on the surface by imprinting the stamper 90 on the insulating layer 93 including the fine particles 93b. As a step of forming in (93), (a), (b), (c) of Fig. 9 is a corresponding process.

FIG. 9A illustrates a process of aligning the stamper 90 on which the relief pattern 91 is maintained at a high temperature with an upper surface of the insulating layer 93. The inside of the insulating layer 93 includes fine particles 93b. Doing. Herein, the fine particles 93b are materials having a lower melting point than those of the remaining insulating layer 93. Therefore, when the fine particles 93b come into contact with the high-temperature relief pattern 91, they are melted and aggregated. It is preferable to form a low temperature portion 95b on the surface of the stamper body portion 92 or to attach a heat insulating material so that the fine particles 93b in portions other than the relief pattern 91 do not melt. The fact that the relief pattern 91 is maintained at "high temperature" means a temperature at which the fine particles 93b are melted. Since the melting point of the fine particles 93b is different for each material, it is difficult to specify precisely.

The fine particles 93b may be a material having good adhesion to the electroless plating as a functional material, a material that is easy to release from the stamper 90, and the like.

FIG. 9B illustrates a step of pressing the stamper 90 against the insulating layer 93, and the fine layer 93b is melted and aggregated and cured at the boundary surface of the high-temperature relief pattern 91. Is formed.

9C is a step of releasing the stamper 90 from the insulating layer 93. When the stamper 90 is released, an intaglio pattern 93a having a shape corresponding to the embossed pattern 91 is formed in the insulating layer 93. If the functional layer 98 has a property of easy release, the release process will be smooth at this stage. If the functional layer 98 is for the purpose of facilitating the plating process, the adhesion with the seed layer 99a in the subsequent process will be good. On the other hand, the functional layer 98 of the present embodiment has a property of improving the adhesion to the seed layer (99a). Therefore, subsequent processes will be described based on this.

S83 of FIG. 8 is a step of forming a circuit pattern 96 on the insulating layer 93 by plating the intaglio pattern 93a, and FIGS. 9D, 9E, and 9F are corresponding processes. .

9D is a step of forming the plating layer 99. The functional layer 98 is formed on the surface of the intaglio pattern 93a. In order to form the plating layer 99, first, a seed layer 99a is stacked on the surface of the insulating layer 93, and the seed layer 99a is easy to form the plating layer 99 by electroplating. How well the seed layer 99a is formed on the surface of the intaglio pattern 93a determines the adhesion between the plating layer 99 and the insulating layer 93, and determines whether the smooth plating process proceeds. Since the functional layer 98 of the present embodiment increases the adhesive strength with the seed layer 99a, the plating process is smoothly performed.

9E is a step of forming the circuit pattern 96 on the insulating layer 93 by polishing the plating layer 99. Polishing is performed until the surface of the insulating layer 93 is exposed, which is the portion where the functional layer 98 is not formed. Therefore, the adhesion between the seed layer 99a and the insulating layer 93 is weak. As a result, it can be easily polished.

9F illustrates a process of manufacturing the printed circuit board 900 by removing the substrate 94.

Although the preferred embodiments of the present invention have been described above, those skilled in the art may variously modify and modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. It will be appreciated that it can be changed.

According to the preferred embodiment of the present invention as described above, by forming the irregularities in the embossed pattern of the stamper to increase the adhesive strength by widening the adhesive area with the plating layer.

In addition, a circuit pattern is formed without forming a seed layer by imparting magnetism to the embossed pattern of the stamper and distributing fine particles having conductivity on the surface of the engraved pattern of the insulating layer and having magnetism opposite to that of the embossed pattern. can do.

In addition, by forming a high temperature portion in the embossed pattern of the stamper to aggregate the fine particles on the surface of the intaglio pattern of the insulating layer, thereby increasing the adhesive force with the seed layer or the releasability with the stamper.

Claims (10)

delete delete (a) preparing a stamper having a first uneven portion formed on an embossed pattern; (b) imprinting the stamper on an insulating layer to form an intaglio pattern and a second uneven portion corresponding to the embossed pattern and the first uneven portion in the insulating layer; And (c) forming a circuit pattern on the insulating layer by plating the intaglio pattern; Step (c) is, (c1) depositing a seed layer on the surface of the insulating layer; (c2) depositing a plating layer on the seed layer; (c3) removing the portion of the plating layer to expose the surface of the insulating layer. delete A stamper body portion; In the stamper comprising an embossed pattern formed on the surface of the stamper body portion, Stamper, characterized in that the embossed pattern has a magnetic. (a) preparing a stamper having a magnetic relief pattern formed thereon; (b) imprinting the stamper on an insulating layer including conductive particles having magnetic properties opposite to that of the embossed pattern, thereby forming a negative pattern on the surface of which the fine particles are exposed; And (C) a method of manufacturing a printed circuit board using a stamper comprising the step of plating the intaglio pattern to form a circuit pattern on the insulating layer. The method of claim 6, The insulating layer is fluid, The step (b) is a manufacturing method of a printed circuit board using a stamper comprising the step of curing the insulating layer when the fine particles are moved to the surface of the insulating layer by a magnetic force. A stamper body portion; In the stamper comprising an embossed pattern formed on the surface of the stamper body portion, Stamper, characterized in that the high temperature portion is formed in the embossed pattern. The method of claim 8, Stamper, characterized in that the low temperature portion is formed on the body portion surface. (a) a stamper having an embossed pattern, comprising: maintaining the embossed pattern at a high temperature; (b) imprinting the stamper on an insulating layer including fine particles to form an intaglio pattern on the surface of which the fine layer is formed by melting the fine particles; And (c) forming a circuit pattern on an insulating layer by plating the intaglio pattern.

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