KR100807352B1 - Electrode having projections on electrode pad, electronic apparatus including device mounting structure having the same and method of mounting device of electronic apparatus - Google Patents

Abstract

An electrode having a plurality of protrusions on an electrode pad, an electronic device having a component mounting structure including the same, and a method for mounting a component of the electronic device are provided. The electronic device having the component mounting structure includes a lower substrate having a lower electrode pad. An upper substrate having an upper electrode pad is positioned on a surface of the lower substrate facing the lower electrode pad. A plurality of protrusions are formed on an upper surface of the lower electrode pad or on an opposite surface facing the lower electrode pad of the upper electrode pad to electrically connect the lower electrode pad and the upper electrode pad.

Description

Electrode having projections on electrode pad, electronic apparatus including device mounting structure having the same and method of mounting device of electronic apparatus}

1A, 1B, 1C, and 1D are cross-sectional views illustrating a component mounting method according to an embodiment of the present invention.

2 to 8 are cross-sectional views illustrating an electrode structure and a component mounting structure according to other embodiments of the present invention.

9A and 9B are cross-sectional views illustrating an electrode structure, a component mounting structure, and a component mounting method according to another exemplary embodiment of the present invention.

10 to 13 are plan views illustrating the shape of protrusions according to embodiments of the present invention.

(Explanation of symbols for the main parts of the drawing)

10: lower substrate 15a: lower electrode pad

15c: lower protrusion AD: adhesive

20: upper substrate 25a: upper electrode pad

25b: bump 25c: upper projection

25a_g, 25b_g: depression

The present invention relates to a structure of an electrode for mounting, a component mounting structure and a component mounting method using the same, and more particularly, a structure of an electrode having a plurality of protrusions on the electrode pad, component mounting structure and component mounting method using the same It is about.

Module manufacturing processes and semiconductor package processes of flat panel display devices require component mounting processes for mounting components on circuit boards. Component mounting methods used in the component mounting process include a chip on glass (COG) method, a chip on film (COF) method, a chip on board (COB) method, a film on glass Film On Glass (FOG) method, Film On Film (FOF) method, and Film On Board (FOB) method.

In mounting the component (chip, film) on the circuit board (glass, film, board), the electrode of the component is electrically connected via an electrode of the circuit board and an anisotropic conductive adhesive (ACA). Can be connected.

The anisotropic conductive adhesive (ACA) includes an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste. The conductive particles are irregularly distributed in the adhesive resin and the adhesive resin. Is made of. The adhesive resin serves to mechanically couple the component and the circuit board, and the conductive particles are pressed between the electrode and the electrode to enable electrical connection.

However, in the case of electrical connection using such an anisotropic conductive adhesive, the electrical reliability can be secured by the conductive particles, but since the conductive particles are irregularly distributed, an irregular number of conductive particles are positioned on the plurality of electrodes. can do. Thus, a difference in electrical resistance between circuits connected to the electrodes may occur. In addition, as the pitch of the electrode becomes finer, adjacent electrodes are likely to be shorted due to the conductive particles. In addition, since the conductive particles are expensive materials, there is a disadvantage in that the unit cost of the product is increased.

Due to these problems of anisotropic conductive adhesives, studies are being actively conducted to apply non-conductive adhesives. However, in the case of applying a non-conductive adhesive, for the sake of reliable connection, the material of the electrode is limited to a material that can be melt-bonded in the bonding temperature range of the adhesive, such as a metal having low ductility and malleability such as gold, or a low melting point solder. There is this. In this case, however, the connection is not possible at all when the material of the electrode is ITO, such as when the flexible circuit board and the image display panel are connected.

The technical problem to be achieved by the present invention is to provide an electrode structure that can provide a reliable connection without limiting the electrode material, even when using a non-conductive adhesive, a component mounting structure and a component mounting method using the same.

In order to achieve the above technical problem, an embodiment of the present invention provides an electronic device having a component mounting structure. The component mounting structure has a lower substrate having a lower electrode pad. An upper substrate having an upper electrode pad is positioned on a surface of the lower substrate facing the lower electrode pad. A plurality of protrusions are formed on the lower electrode pad or the upper electrode pad to electrically connect the lower electrode pad and the upper electrode pad.

The protrusions may be a plurality of lower protrusions formed on the lower electrode pads, and a plurality of upper protrusions formed on the upper electrode pads. In this case, the upper protrusions and the lower protrusions may be in contact with each other, and the upper protrusions may be positioned between the lower protrusions to be engaged with each other.

The protrusions may be made of a conductive material having ductility and malleability. The protrusion may have two or more sublayers.

A bump formed on the upper electrode pad may be further provided. In this case, the protrusions may be located between the bump and the lower electrode pad. Alternatively, the protrusions may be protrusions around recesses formed in the bumps.

The protrusions may be protrusions around recesses formed in the lower electrode pad or the upper electrode pad.

A non-conductive adhesive may be further provided between the protrusions to bond the lower substrate and the upper substrate.

In order to achieve the above technical problem, another embodiment of the present invention provides an electrode. The electrode has an electrode pad. A plurality of conductive protrusions formed on the electrode pads are provided.

In order to achieve the above technical problem, another embodiment of the present invention provides a component mounting method of an electronic device. The component mounting method includes providing a lower substrate having a lower electrode pad. An upper substrate having an upper electrode pad is provided. A plurality of protrusions are formed on the lower electrode pad or the upper electrode pad. An adhesive is applied on the lower substrate. The upper substrate is positioned on the lower substrate to which the adhesive is applied so that the upper electrode pad faces the lower substrate, and then the upper substrate is electrically connected to the upper electrode pad and the lower electrode pad through the protrusions. The lower substrate is bonded.

The forming of the protrusions may be performed by forming a plurality of lower protrusions on the lower electrode pad and forming a plurality of upper protrusions on the upper electrode pad.

The upper substrate may further include bumps formed on the upper electrode pads. In this case, the protrusions may be protrusions defined by forming depressions in the bumps.

Alternatively, the protrusions may be protrusions defined by forming depressions in the lower electrode pad or the upper electrode pad.

The adhesive may be a nonconductive adhesive.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to describe the present invention in more detail. In the figures, where a layer is said to be "on" another layer or substrate, it may be formed directly on the other layer or substrate, or a third layer may be interposed therebetween. Like numbers refer to like elements throughout the specification.

1A, 1B, 1C, and 1D are cross-sectional views illustrating a component mounting method according to an embodiment of the present invention.

Referring to FIG. 1A, a lower substrate 10 having a lower electrode pad 15a is provided. The lower substrate 10 is a circuit board on which an electric circuit is formed, and may be a glass substrate or a plastic substrate such as a flat panel display panel, a flexible printed circuit film (FPC), or a printed circuit board (PCB). The lower electrode pad 15a is a terminal for inputting an electrical signal or outputting an electrical signal from the electrical circuit formed on the lower substrate 10. The lower electrode pad 15a is made of a conductive material. For example, a transparent electrode material such as indium tin oxide (ITO), gold, silver, copper, nickel, aluminum, tin, lead, platinum, bismuth, indium, etc. It may be made of a metal.

Referring to FIG. 1B, an upper substrate 20 having an upper electrode pad 25a is provided. The upper substrate 20 is an electric component to be mounted on the lower substrate 10, and may be a semiconductor chip or a flexible printed circuit film (FPC).

A plurality of protrusions 25c adjacent to each other are formed on the upper electrode pad 25a. The upper electrode pad 25c is exposed in a space between the plurality of protrusions 25c. Therefore, the area occupied by the plurality of protrusions 25c formed on one upper electrode pad 25a is smaller than the area of the upper electrode pad 25a. Preferably, the area occupied by the plurality of protrusions 25c is 10% to 90% of the area of the upper electrode pad 25a.

The protrusions 25c may be made of gold, silver, copper, nickel, aluminum, tin, lead, platinum, bismuth, indium, their respective alloys, or two or more thereof. In addition, the protrusions 25c may be made of the same material as the electrode on which the protrusions 25c are formed, that is, the same material as the upper electrode pad 25a or a different material. Forming these protrusions 25c may be performed using electroless / electrolytic plating, deposition, sputtering or screen printing.

On the other hand, the protrusions 25c may contain a conductive polymer. The conductive polymer may be an anisotropic conductive adhesive or an isotropic conductive adhesive. In this case, the protrusions 25c may be formed by applying the conductive adhesive on the upper substrate 20 and then patterning the same using a lithography method.

In addition, although the protrusions 25c are illustrated in a spherical shape, the protrusions 25c may have various shapes such as a rectangle, a triangle, a rhombus, and the like. Specifically, as shown in FIG. 10, a hemispherical shape, a hexahedron shape as shown in FIG. 11, the pad electrode 25a in a longitudinal direction as shown in FIG. 12, a pad as shown in FIG. The electrode 25a may be transversely crossed. The height of the protrusions 25c may be 0.5 μm to 50 μm from the surface on which the protrusions 25c are formed, that is, the upper electrode pad 25a.

Meanwhile, the protrusions 25c may be formed by stacking two or more layers of the above-described protrusion forming material.

Referring to FIG. 1C, an adhesive AD is applied onto the upper substrate 20 on which the lower substrate 10 and / or the protrusion 25c are formed. The adhesive AD may be an anisotropic conductive film, an anisotropic conductive paste, an isotropic conductive film, an isotropic conductive paste, a non-conductive film, or a non-conductive paste. However, the adhesive AD does not cause a short circuit between the electrode pads 25a adjacent to each other or the protrusions 25c formed on different electrode pads 25a even when the pitch of the electrode pad 25a is minimized. It is preferred that it is a non-conductive adhesive.

The nonconductive adhesive may be a thermosetting resin. The nonconductive adhesive may further contain a curing agent and nonconductive inorganic particles. The thermosetting resin may be an epoxy resin, the curing agent may be an imidazole derivative or an amine derivative, and the non-conductive inorganic particles may be silica, silicon carbide or alumina.

Referring to FIG. 1D, the upper substrate 20 is positioned on the lower substrate 10 to which the adhesive AD is applied so that the upper electrode pad 25a faces the lower substrate 10. The upper substrate 10 and the lower substrate 20 are bonded by applying a bonding pressure and a bonding heat to the upper substrate 20 and / or the lower substrate 10. The temperature range for applying the bonding heat may be 100 degrees or more, regardless of the material and melting point of the protrusions 25c. Specifically, the bonding may be performed using a thermo-compressing method, an ultrasonic method, an infrared ray (IR), a laser, or the like.

Through the bonding process described above, the upper protrusions 25c are connected to the lower electrode pads 15a, and the upper electrode pads 25a and the lower electrode pads 15a are connected through the upper protrusions 25c. Is electrically connected. As a result, a component mounting structure in which a predetermined component, that is, the upper substrate 20 is mounted on the circuit board, that is, the lower substrate 10, is completed. The name of the component mounting structure varies depending on the type of the upper substrate 20 and the lower substrate 10. Specifically, when the upper substrate 20 is a semiconductor chip, the lower substrate 20 may be a glass substrate, a flexible printed circuit film or a plastic substrate, a printed circuit board, the component mounting structure at this time, respectively, chip on glass (COG), chip on film (COF), and chip on board (COB). In addition, when the upper substrate 20 is a flexible printed circuit film, the lower substrate 20 may be a glass substrate, another flexible printed circuit film or a plastic substrate, a printed circuit board, the component mounting structure at this time, respectively Film on glass (FOG), film on film (FOF) and film on board (FOB).

In the bonding process, the bonding pressure may be concentrated on the protrusions 25c. This is because a plurality of protrusions 25c are formed on the upper electrode pad 25a, so that the area occupied by the protrusions 25c is smaller than the area of the upper electrode pad 25a. As a result, the protrusions 25c may be reliably connected to the lower electrode pad 15a.

In addition, the adhesive AD may flow into a space where the upper electrode pad 25c is exposed between the plurality of protrusions 25c formed on one electrode pad 25c during the bonding process. Thereafter, the curing agent (AD) shrinks while curing due to the heat of bonding. The contact area between the adhesive agent AD and the protrusions 25c is wider than when one protrusion is formed on the one electrode pad 25c. Therefore, the adhesive AD contracted by the curing may fix the protrusions 25c more strongly on the lower electrode pad 15a, and thus the lower electrode pad 15a and the protrusions ( The connection reliability between 25c) can be further improved.

As a result, excellent connection reliability between the protrusion and the electrode pad 15a can be secured regardless of the material of the protrusion 25c. In other words, when the protrusions 25c do not have ductility or malleability, and when the protrusions 25c are not melt-bonded, the electrode pads 15a can be reliably connected. In addition, there is no need to apply excessive pressure or heat to cause deformation or melting of the protrusion 25c, thereby reducing the risk of breakage of the substrates 10 and 20.

  In addition, as shown, when no additional bumps are formed on the upper electrode pad 15a, the upper electrode pad 25a and the lower electrode pad 15a may be formed of a non-conductive adhesive containing no conductive balls. Cannot be connected to each other. However, by forming the protrusions 25c, the upper electrode pads 25a and the lower electrode pads 15a can be reliably connected. Furthermore, compared with the case where the protrusion 25c is formed on the entire upper electrode pad 25a, the area where the protrusion 25c abuts on the lower electrode pad 15a is greatly reduced, so that the protrusion is the lower electrode. The so-called trace of pressing the pad 15a. It is easy to find the indentation, which makes the connection status very easy.

Referring back to FIG. 1D, an electrode structure and a component mounting structure according to an embodiment of the present invention will be described.

Referring to FIG. 1D, the lower substrate 10 including the lower electrode pad 15a is positioned. The upper substrate 20 having the upper electrode pad 25a is positioned on the surface facing the lower electrode pad 15a on the lower substrate 10. A plurality of protrusions 25c formed on the upper electrode pad 25a and electrically connecting the lower electrode pad 15a and the upper electrode pad 25a are positioned. In addition, an adhesive AD for bonding the lower substrate 10 and the upper substrate 20 is disposed between the lower substrate 10 and the upper substrate 20, particularly between the protrusions 25c. Preferably, the adhesive AD is a nonconductive adhesive.

In this case, the upper electrode pad 25a of the upper substrate 20 and the plurality of protrusions 25c formed on the upper electrode pad 25a form an electrode structure of the upper substrate 20.

2 is a cross-sectional view illustrating an electrode structure, a component mounting structure, and a component mounting method according to another exemplary embodiment of the present invention. This embodiment is the same as the electrode structure, the component mounting structure, and the component mounting method described with reference to FIG. 1D except for the following.

Referring to FIG. 2, a bump 25b is formed on the upper electrode pad 25a. At this time, the protrusions 25c are formed on the bump 25b, and the protrusions 25c formed on the bump 25b are connected to the lower electrode pad 15a by a bonding process. The bump 25b may be made of gold, silver, copper, nickel, aluminum, tin, lead, platinum, bismuth, indium, their respective alloys, or two or more of these alloys. As such, the bumps 25b may be made of a conductive material, and do not have to be ductile or malleable.

In this case, the electrode structure of the upper substrate 20 is formed on the upper electrode pad 25a provided on the upper substrate 20, the bump 25b formed on the upper electrode pad 25a and the bump 25b. It has a plurality of protrusions (25c) formed in.

3 is a cross-sectional view illustrating an electrode structure, a component mounting structure, and a component mounting method according to another exemplary embodiment of the present invention. This embodiment is the same as the electrode structure, the component mounting structure, and the component mounting method described with reference to FIGS. 1A to 1D except as described later.

Referring to FIG. 3, a bump 25b is formed on the upper electrode pad 25a. In this case, the lower protrusions 15c are formed on the lower electrode pad 15a. The protrusions 15c formed on the lower electrode pad 15a are connected to the bumps 25b formed on the upper electrode pad 25a by a bonding process.

4 is a cross-sectional view illustrating an electrode structure, a component mounting structure, and a component mounting method according to another exemplary embodiment of the present invention. This embodiment is the same as the electrode structure, the component mounting structure, and the component mounting method described with reference to FIGS. 1A to 1D except as described later.

Referring to FIG. 4, a bump 25b is formed on the upper electrode pad 25a. In this case, a plurality of upper protrusions 25c are formed on the bump 25b. In addition, a plurality of lower protrusions 15c are formed on the lower electrode pad 15a. The upper protrusions 25a and the lower protrusions 15c are formed to correspond to each other, so that the upper protrusions 25a and the lower protrusions 15c abut against each other by a bonding process.

5 is a cross-sectional view illustrating an electrode structure, a component mounting structure, and a component mounting method according to another exemplary embodiment of the present invention. This embodiment is the same as the electrode structure, the component mounting structure, and the component mounting method described with reference to FIG. 2 except that the cross section of the protrusion 25c is rectangular.

6 is a cross-sectional view illustrating an electrode structure, a component mounting structure, and a component mounting method according to another exemplary embodiment of the present invention. This embodiment is the same as the electrode structure, the component mounting structure, and the component mounting method described with reference to FIGS. 1A to 1D except as described later.

Referring to FIG. 6, a bump 25b is formed on the upper electrode pad 25a. In this case, a plurality of upper protrusions 25c are formed on the bump 25b. The cross-sectional shape of the upper protrusions 25c may be rectangular. In addition, a plurality of lower protrusions 15c are formed on the lower electrode pad 15a. At this time, the upper protrusions 25c are positioned between the lower protrusions 15c, and the upper protrusions 25c and the lower protrusions 15c are engaged with each other by a bonding process. At least one or more of the upper protrusions 25c and the lower protrusions 15c are connected to the lower electrode pad 15a and the upper electrode pad 25a, respectively.

7 is a cross-sectional view showing an electrode structure, a component mounting structure, and a component mounting method according to another embodiment of the present invention. This embodiment is the same as the electrode structure, the component mounting structure, and the component mounting method described with reference to FIGS. 1A to 1D except as described later.

Referring to FIG. 7, a bump 25b is formed on the upper electrode pad 25a. In this case, the protrusions 25c may be protrusions 25c around the depression 25b_g formed in the bump 25b. The protrusions 25c are connected to the lower electrode pad 15a by a bonding process. Forming the protrusions 25c may be performed by forming the depressions 25b_g in the bumps 25b. Such a depression 25b_g can be formed using a lithography method.

8 is a cross-sectional view illustrating an electrode structure, a component mounting structure, and a component mounting method according to another exemplary embodiment of the present invention. This embodiment is the same as the electrode structure, the component mounting structure, and the component mounting method described with reference to FIGS. 1A to 1D except as described later.

Referring to FIG. 8, the protrusions 25c may be protrusions 25c around the recessed portions 25a_g formed in the upper electrode pad 25a. The protrusions 25c are connected to the lower electrode pad 15a by a bonding process. Forming the protrusions 25c may be performed by forming the depressions 25a_g in the upper electrode pad 25a. Such a depression 25a_g can be formed using a lithography method.

Unlike the drawing, the protrusions 25c may be formed in the lower electrode pad 15a or both in the upper electrode pad 25a and the lower electrode pad 15a.

9A and 9B are cross-sectional views illustrating an electrode structure, a component mounting structure, and a component mounting method according to another exemplary embodiment of the present invention. This embodiment is the same as the electrode structure, the component mounting structure, and the component mounting method described with reference to FIGS. 1A to 1D except as described later.

Referring to FIG. 9A, a polymer core part 15c_1 is formed on the lower electrode pad 15a.

Referring to FIG. 9B, a conductive film 15c_2 is coated on the polymer core part 15c_1. As a result, the polymer core part 15c_1 and the conductive film 15c_2 form the protrusion part 15c. The protrusion 15c is connected to the upper electrode pad 25a by a bonding process. The conductive film 15c_2 may be a metal film.

On the other hand, unlike shown in the figure, the projection portion having the polymer core portion 15c_1 and the conductive film 15c_2 is formed on the upper electrode pad 25a, or the upper electrode pad 25a and the lower portion All may be formed on the electrode pad 15a.

According to the present invention as described above, first, by forming a plurality of projections on the electrode pad, the bonding pressure in the bonding process can be concentrated on the projections. Thus, the projections can be reliably connected on the opposite electrode pad even at a low pressure. In addition, an adhesive may flow between the plurality of protrusions formed on one electrode pad in the bonding process, and the curing agent shrinks while being cured due to the bonding heat, thereby more firmly fixing the protrusions on the opposite electrode pads. As a result, connection reliability between the opposite electrode pad and the protrusion may be further improved. As a result, excellent connection reliability between the protrusion and the opposite electrode pad can be ensured regardless of the material of the protrusion.

Second, even if no additional bumps are formed on the upper and lower electrode pads, it is possible to connect the upper and lower electrode pads using a non-conductive adhesive containing no conductive balls. Specifically, by forming protrusions on at least one electrode pad, the upper electrode pad and the lower electrode pad can be reliably connected.

Third, a plurality of protrusions are formed on one electrode pad so that the area of the protrusions contacting the opposite electrode pads is greatly reduced, compared to the case where the protrusions are formed on the entire electrode pads, and thus the protrusions pressed against the opposite electrode pads. So-called. It is easy to find the indentation, which makes the connection status very easy.

Fourth, conventionally, when using a non-conductive adhesive as an adhesive, the material of the electrode or bump is limited for reliable bonding, but according to the present invention, even when using the non-conductive adhesive, the reliability of the electrode or the bump is not limited. You can get a junction.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims (24)

A lower substrate having a lower electrode pad; An upper substrate positioned on the lower substrate and having an upper electrode pad on a surface facing the lower electrode pad; And And a plurality of protrusions formed on an upper surface of the lower electrode pad or on an opposite surface facing the lower electrode pad of the upper electrode pad to electrically connect the lower electrode pad and the upper electrode pad. Electronic device with component mounting structure. According to claim 1, The protrusions may include a plurality of lower protrusions formed on an upper surface of the lower electrode pad; and a plurality of upper protrusions formed on the opposite surface of the upper electrode pad. The method of claim 2, And the upper protrusions and the lower protrusions are in contact with each other. The method of claim 2, The upper protrusions are electronic devices having a component mounting structure, characterized in that positioned between the lower protrusions and to be engaged with each other. According to claim 1, The protrusion has an electronic device having a component mounting structure, characterized in that made of a conductive material having a flexible and malleable. According to claim 1, And the protrusion has two or more sublayers. According to claim 1, The projection part has an electronic device having a component mounting structure, characterized in that it comprises a polymer core and a conductive film located on the polymer core. According to claim 1, Further comprising a bump formed on the upper surface of the upper electrode pad, The protrusions are electronic devices having a component mounting structure, characterized in that located between the bump and the lower electrode pad. According to claim 1, A bump formed on the opposite surface of the upper electrode pad; And the protrusions are protrusions around recesses formed in the bumps. According to claim 1, And the protrusions are protrusions around recesses formed in the lower electrode pad or the upper electrode pad. According to claim 1, And a non-conductive adhesive positioned between the protrusions to bond the lower substrate and the upper substrate. Electrode pads; And And a plurality of conductive protrusions formed on an upper surface of the electrode pad and electrically connected to the electrode pad. The method of claim 12, And the protrusions are made of a conductive material having ductility and conductivity. The method of claim 12, And the protrusion has two or more sub-layers. The method of claim 12, The protrusion part comprises a polymer core and a conductive film positioned on the polymer core. The method of claim 12, Further comprising a bump formed on the upper surface of the electrode pad, And the protrusions are positioned on the bumps. The method of claim 12, Further comprising a bump formed on the upper surface of the electrode pad, And the protrusions are protrusions around recesses formed in the bumps. The method of claim 12, And the protrusions are protrusions around recesses formed in the electrode pad. Providing a lower substrate having a lower electrode pad, Providing an upper substrate having an upper electrode pad, Forming a plurality of protrusions on an upper surface of the lower electrode pad or an upper surface of the upper electrode pad, Applying an adhesive on the lower substrate, The upper substrate is positioned on the lower substrate to which the adhesive is applied so that the upper electrode pad faces the lower substrate, and then the upper substrate is electrically connected to the upper electrode pad and the lower electrode pad through the protrusions. The method of mounting a component of an electronic device, comprising bonding the lower substrate. The method of claim 19, Forming the protrusions Forming a plurality of lower protrusions on an upper surface of the lower electrode pad, And forming a plurality of upper protrusions on an upper surface of the upper electrode pad. The method of claim 19, The upper substrate further comprises a bump formed on the upper surface of the upper electrode pad. The method of claim 19, The upper substrate further includes bumps formed on an upper surface of the upper electrode pad, And wherein the protrusions are protrusions defined by forming depressions in the bumps. The method of claim 19, And the protrusions are protrusions defined by forming depressions in the lower electrode pad or the upper electrode pad. The method of claim 19, The adhesive is a component mounting method of the electronic device, characterized in that the non-conductive adhesive.

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