KR100801276B1 - Hybrid type geomagnetic sensor and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a hybrid geomagnetic sensor and a method of manufacturing the same, comprising: a first printed circuit board having a plurality of first and second bonding pads electrically connected to both surfaces thereof; A Z-axis sensor having one side attached to one surface of the first printed circuit board spaced apart from the first bonding pad by a predetermined distance; A third bonding pad formed on the other side facing the one side of the Z-axis sensor; A fourth bonding pad formed on one surface of the first printed circuit board spaced apart from the Z-axis sensor by a predetermined distance and electrically connected to the first bonding pad; Bonding wires electrically connecting the third bonding pads and the fourth bonding pads; A molding material formed on one surface of the first printed circuit board to protect the bonding wire and the Z-axis sensor; A second printed circuit board having a fifth bonding pad perpendicular to the second bonding pad formed on an upper surface thereof, wherein the fifth bonding pad is soldered to the second bonding pad; And a biaxial sensor formed on an upper surface of the second printed circuit board to detect a biaxial component of the geomagnetic vector parallel to the second printed circuit board. The present invention also provides a hybrid geomagnetic sensor comprising: It provides a method of manufacturing the hybrid geomagnetic sensor.

Hybrid, Geomagnetic Sensor, Vertical, Z-Axis Sensor, Printed Circuit Board

Description

Hybrid type geomagnetic sensor and manufacturing method thereof

1 is a view showing the arrangement of the X, Y, Z axis sensors in parallel to the general Cartesian coordinate system.

2 is a view for explaining the assembly method of the X-axis or Y-axis sensor using a common wire bonding process.

3 is a view for explaining a problem when assembling the Z-axis sensor using a general wire bonding process.

4 and 5 are a perspective view showing the structure of a hybrid type geomagnetic sensor according to an embodiment of the present invention.

6 is a bottom view of the molding structure including the Z-axis sensor shown in FIG.

7 is a bottom view of the molding structure including the Z-axis sensor shown in FIG.

8A to 8I are cross-sectional views sequentially illustrating the method of manufacturing the hybrid geomagnetic sensor shown in FIG. 4.

9A to 9J are cross-sectional views sequentially illustrating the method of manufacturing the hybrid geomagnetic sensor shown in FIG. 5.

<Description of Symbols for Main Parts of Drawings>

100: Y-axis sensor 110: wire

200: X axis sensor 300: Z axis sensor

310: first printed circuit board 350: molding material

410: second printed circuit board 500: solder

300a, 310a, 310b, 310c, 410a: bonding pads

X, Y, Z: sensing direction of X, Y, Z axis sensor

The present invention relates to a hybrid geomagnetic sensor and a method of manufacturing the same. More particularly, the present invention relates to a hybrid geomagnetic sensor and a method of manufacturing the same, which enables vertical assembly of a Z-axis sensor without developing a new process or equipment.

In general, the geomagnetic sensor may perform an electronic compass function that calculates an azimuth angle by measuring the strength of the earth's magnetic field. To realize the electronic compass function, two-axis geomagnetic sensors are required. If the two-axis geomagnetic sensor is placed horizontally on the ground, the azimuth angle can be calculated using the signal output from the two axes, that is, the X and Y axes. Geomagnetic strength is measured to calculate azimuth, and geomagnetism can be expressed as the sum of vectors of magnitude and direction.

By using the 2-axis geomagnetic sensor, only the X and Y-axis components of the geomagnetic vector can be measured, and it is possible to measure the total geomagnetic intensity only by measuring all three-dimensional components. In order to measure in three dimensions, three geomagnetic sensors must be arranged vertically so that each sensor axis can detect vector components of geomagnetic intensity. To do this, three sensors with the same sensitivity should be arranged parallel to the X, Y and Z axes of the Cartesian coordinate system. By assembling this, the geomagnetism in the three-dimensional space can be measured and expressed as a component of the X, Y and Z axes of the Cartesian coordinate system. Can be.

At present, two-axis geomagnetic sensors are mainly used as geomagnetic sensors used in mobile devices. This is because the space that can be employed is small due to the characteristics of the mobile device, and there is not enough space to mount the 3-axis geomagnetic sensor. Two-axis geomagnetic sensor is a sensor in which two-axis geomagnetic sensors are arranged perpendicular to each other in the X and Y planes, and there are various types of sensors such as fluxgate, magneto-resistance, and magneto-impedance (MI). . Since these sensors are also difficult to implement a three-axis sensor as a device (device), the module is configured as a hybrid sensor type to implement the three-axis.

The hybrid type solves the problem of implementing three-axis sensors by implementing two axes with the same sensor type and the other one with different types of sensors. For example, when a geomagnetic sensor is manufactured using MEMS technology, two axes of X and Y axes can be easily implemented on a silicon substrate. However, there are many technical difficulties in implementing the Z axis, and even if it is implemented, there are problems such as deterioration of characteristics compared to the other two axes. Moreover, when the three axes are implemented as a single device, there is a disadvantage that it is difficult to adopt the mobile device due to the problem of height increase.

As a device for solving such a problem, a hybrid geomagnetic sensor has attracted attention. In this case, when three axes of the same size are arranged to form a three-axis, a problem arises in commercialization due to the height of the Z-axis, the two-axis sensor uses a fluxgate type, the remaining one axis is MR sensor or hall sensor, etc. He has been researching ways to lower the height using.

On the other hand, since the geomagnetic sensor represents the earth magnetism present in the three-dimensional space as the sum of the vector components having the size and the direction, the direction in which the sensor is disposed and the direction in which the sensor actually senses must coincide. That is, in order to arrange one sensor in the Z-axis direction on Cartesian coordinates, the sensor should be assembled so that the sensing direction of the sensor becomes the Z-axis direction.

FIG. 1 is a diagram in which X, Y, and Z axis sensors are arranged parallel to a general rectangular coordinate system.

In general, in order to arrange the sensor in the Z-axis direction, as illustrated in FIG. 1, the Z-axis sensor 300 should be vertically assembled on the printed circuit board 410, in which case the Z-axis sensor 300 is assembled. It is difficult to establish itself, and it is also difficult to connect an electrical signal line between the Z-axis sensor 300 and the signal processing circuit unit 10. Reference numerals 100 and 200 which are not described in FIG. 1 represent X-axis sensors and Y-axis sensors, respectively, and X, Y, and Z shown by arrows in the sensors 100, 200, and 300 represent sensing directions.

2 is a view for explaining the assembly method of the X-axis or Y-axis sensor using a general wire bonding process.

As shown in FIG. 2, the general X-axis sensor 100 or the Y-axis sensor (not shown) is attached to the printed circuit board 410 by the bonding wire 110 in a state where it is attached to the printed circuit board 410. And are easily electrically connected. Reference numerals 100a and 410a not described in FIG. 2 denote bonding pads.

On the other hand, the Z-axis is most important to arrange the sensor vertically so that the geomagnetism in the Z-axis direction can be measured while minimizing the height, and is assembled using a short sensor in the sensing direction to reduce the height.

3 is a diagram illustrating a problem when assembling a Z-axis sensor using a general wire bonding process.

Similar to the X and Y axis sensors described above, when assembling the Z axis sensor 300 using the general bonding wire 110, as shown in FIG. 3, a bonding pad ( After the 300a is formed, the bonding pad 300a should be electrically connected to the bonding pad 410a formed on the printed circuit board 410 using the bonding wire 110. However, in order to apply this method, additional equipment is required in addition to the existing equipment, and when the wire bonding process is performed between the pads arranged substantially vertically, there is a problem that the operation is very complicated and the manufacturing process is difficult.

Therefore, the present invention has been made to solve the above problems, an object of the present invention, by simply performing a vertical assembly of the Z-axis sensor without the development of a new process or equipment, a process that occurs during the vertical assembly of the Z-axis sensor The present invention provides a hybrid geomagnetic sensor and a method of manufacturing the same, which overcome the above-mentioned difficulties.

Hybrid type geomagnetic sensor according to the present invention for achieving the above object, the first printed circuit board formed with a plurality of first and second bonding pads electrically connected to each other; A Z-axis sensor having one side attached to one surface of the first printed circuit board spaced apart from the first bonding pad by a predetermined distance; A third bonding pad formed on the other side facing the one side of the Z-axis sensor; A fourth bonding pad formed on one surface of the first printed circuit board spaced apart from the Z-axis sensor by a predetermined distance and electrically connected to the first bonding pad; Bonding wires electrically connecting the third bonding pads and the fourth bonding pads; A molding material formed on one surface of the first printed circuit board to protect the bonding wire and the Z-axis sensor; A second printed circuit board having a fifth bonding pad perpendicular to the second bonding pad formed on an upper surface thereof, wherein the fifth bonding pad is soldered to the second bonding pad; And a biaxial sensor formed on an upper surface of the second printed circuit board to detect a biaxial component of a geomagnetic vector parallel to the second printed circuit board.

The first and second bonding pads may be formed to contact one edge of the first printed circuit board.

In addition, another hybrid geomagnetic sensor according to the present invention for achieving the above object, the first printed circuit board having a plurality of vias; A Z-axis sensor having one side attached to one surface of the first printed circuit board spaced apart from the via by a predetermined distance; A first bonding pad formed on the other side facing the one side of the Z-axis sensor; A second bonding pad formed on one surface of the first printed circuit board spaced apart from the Z-axis sensor by a predetermined distance and electrically connected to the via; Bonding wires electrically connecting the first bonding pads to the second bonding pads; A molding material formed on one surface of the first printed circuit board to protect the bonding wire and the Z-axis sensor; A second printed circuit board perpendicular to the first printed circuit board and having a third bonding pad formed on an upper surface thereof soldered with the vias of the first printed circuit board; And a biaxial sensor formed on an upper surface of the second printed circuit board to detect a biaxial component of a geomagnetic vector parallel to the second printed circuit board.

Here, the via is formed in a semi-cylindrical shape in contact with one side edge of the first printed circuit board, characterized in that the quadrangular plane portion forming the semi-circular shape is in contact with the upper surface of the second printed circuit board.

In addition, a method of manufacturing a hybrid geomagnetic sensor according to the present invention for achieving the above object comprises the steps of providing a first printed circuit board having a plurality of first and second bonding pads electrically connected to each other; Attaching one side of a Z-axis sensor to one surface of the first printed circuit board spaced apart from the first bonding pad by a predetermined distance; Forming a third bonding pad on the other side facing the one side of the Z-axis sensor; Forming a fourth bonding pad electrically connected to the first bonding pad on one surface of the first printed circuit board spaced apart from the Z-axis sensor by a predetermined distance; Electrically connecting the third bonding pad and the fourth bonding pad using a bonding wire; Forming a molding material on one surface of the first printed circuit board to protect the bonding wire and the Z-axis sensor; Providing a second printed circuit board having a fifth bonding pad perpendicular to the second bonding pad of the first printed circuit board formed on an upper surface thereof; Soldering the fifth bonding pad and the second bonding pad to each other; And forming a biaxial sensor on an upper surface of the second printed circuit board to detect a biaxial component of a geomagnetic vector parallel to the second printed circuit board.

The first and second bonding pads may be formed to contact one edge of the first printed circuit board.

In addition, another hybrid geomagnetic sensor according to the present invention for achieving the above object comprises the steps of providing a first printed circuit board having a plurality of vias; Attaching one side of a Z-axis sensor to one surface of the first printed circuit board spaced apart from the via; Forming a first bonding pad on the other side facing the one side of the Z-axis sensor; Forming a second bonding pad electrically connected to the via on one surface of the first printed circuit board spaced apart from the Z-axis sensor by a predetermined distance; Electrically connecting the first bonding pad and the second bonding pad using a bonding wire; Forming a molding material on one surface of the first printed circuit board to protect the bonding wire and the Z-axis sensor; Providing a second printed circuit board on which a third bonding pad perpendicular to the first printed circuit board is formed on an upper surface thereof; Soldering the via of the first printed circuit board and the third bonding pad of the second printed circuit board; And forming a biaxial sensor on an upper surface of the second printed circuit board to detect a biaxial component of a geomagnetic vector parallel to the second printed circuit board.

The providing of the first printed circuit board on which the plurality of vias are formed may include: forming a plurality of via holes in the first printed circuit board and penetrating the first printed circuit board; Filling the via hole with a conductive material; And cutting the first printed circuit board along the centers of the plurality of via holes filled with the conductive material to form vias having a semi-cylindrical shape having a rectangular cut surface.

Matters concerning the operational effects including the technical configuration of the image sensor module of the present invention and the manufacturing method thereof will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

Hybrid Geomagnetic Sensor Structure

First, a hybrid geomagnetic sensor according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 4 to 7.

4 and 5 are perspective views showing the structure of a hybrid geomagnetic sensor according to an embodiment of the present invention.

Hybrid geomagnetic sensor according to an embodiment of the present invention, as shown in Figure 4, first, the Z-axis sensor 300 formed on one surface of the first printed circuit board 310 and the first printed circuit board 310 ), A bonding wire 110 that electrically connects the Z-axis sensor 300 and the first printed circuit board 310 to each other, and protects the Z-axis sensor 300 and the bonding wire 110. The molding material 350 is formed on one surface of the first printed circuit board 310.

A plurality of first bonding pads 310a and second bonding pads 310b are electrically formed on both surfaces of the first printed circuit board 310. Here, the second bonding pad 310b is in contact with the fifth bonding pad 410a formed on the second printed circuit board 410 to be described later, so that the first and second bonding pads 310a and 310b are Preferably, the first printed circuit board 310 is formed to be in contact with one edge of the first printed circuit board 310.

One side of the Z-axis sensor 300 is attached to one surface of the first printed circuit board 310 spaced apart from the first bonding pad 310a by a predetermined distance. That is, in the present invention, instead of attaching the bottom surface of the Z-axis sensor 300 to the first printed circuit board 310, one side of the Z-axis sensor 300 is attached to the first printed circuit board 310. It is.

A third bonding pad 300a is formed on the other side of the Z-axis sensor 300 attached to the first printed circuit board 310.

A fourth bonding pad 310c electrically connected to the first bonding pad 310a is formed on one surface of the first printed circuit board 310 spaced apart from the Z-axis sensor 300 by a predetermined distance. The fourth bonding pad 310c is electrically connected to the third bonding pad 300a formed on the Z-axis sensor 300 by a bonding wire 110.

A molding member 350 is formed on one surface of the first printed circuit board 310 to protect the bonding wire 110 and the Z-axis sensor 300.

In addition, the hybrid geomagnetic sensor according to the present invention further includes a second printed circuit board 410 perpendicular to the first printed circuit board 310 as described above. A fifth bonding pad 410a is formed on an upper surface of the second printed circuit board 410, and the fifth bonding pad 410a is a second bonding pad 310b of the first printed circuit board 310. It is soldered by the solder 500 while being perpendicular to the. Here, the second bonding pad 310b is formed to be in contact with one edge of the first printed circuit board 310 as described above to be in contact with the fifth bonding pad 410a.

FIG. 6 is a bottom view of the molding structure including the Z-axis sensor shown in FIG. 4. Referring to FIG. 6, first and second bonding pads 310a and 310b are formed on both surfaces of the first printed circuit board 310. It can be seen that it is formed. In particular, the first bonding pad 310a is not exposed to the outside by the molding material 350, but the second bonding pad 310b is exposed to the outside, so that the fifth of the second printed circuit board 410 is exposed. It may be soldered with the bonding pad 410a.

In addition, an upper surface of the second printed circuit board 410 may include a two-axis sensor that detects two-axis components X and Y of the geomagnetic vector parallel to the second printed circuit board 410. 200 and the Y-axis sensor 100 are formed.

The hybrid geomagnetic sensor according to the present invention has an effect that the vertical assembly of the Z-axis sensor can be performed very simply without developing a new process or equipment by applying an existing wire bonding process and a molding process. In addition, the printed circuit board has an advantage that it is competitive in terms of price.

On the other hand, the present invention, as shown in Figure 4, instead of forming the bonding pads (310a, 310b) on both sides of the first printed circuit board 310, as shown in Figure 5, the first printed circuit A plurality of vias 320a may be formed in the substrate 310. The via 320a may be made of a conductive material to perform a bonding pad function.

In addition, the via 320a may be formed in a semi-cylindrical shape in contact with one edge of the first printed circuit board 310 as shown in FIG. 5, and a portion of the quadrangular plane C forming the semi-cylindrical shape may be formed. It is preferable to contact the upper surface of the second printed circuit board 410.

FIG. 7 is a bottom view of the molding structure including the Z-axis sensor shown in FIG. 5. Referring to FIG. 7, a quadrangular plane C is formed on a surface of the first printed circuit board 310 in contact with the second printed circuit board 410. It can be seen that the via 320a is formed.

The first printed circuit board 310 having the via 320a formed thereon is second printed, compared to the first printed circuit board 310 having the bonding pads 310a and 310b formed on both surfaces of FIG. 6. Since the bonding pad that is in contact with the circuit board 410 has a larger area, the bonding pad may be more firmly attached to the second printed circuit board 410.

Manufacturing method of hybrid geomagnetic sensor

Hereinafter, a method of manufacturing a hybrid geomagnetic sensor according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 8A to 8I and 9A to 9J.

8A to 8I are cross-sectional views sequentially illustrating a method of manufacturing the hybrid geomagnetic sensor shown in FIG. 4, and FIGS. 9A to 9J are views illustrating a method of manufacturing the hybrid geomagnetic sensor shown in FIG. 5. In order to show the process cross-sectional view sequentially.

First, as shown in FIG. 8A, a plurality of first and second bonding pads 310a and 310b are electrically formed on both surfaces of the first printed circuit board 310. The first and second bonding pads 310a and 310b are electrically connected to each other by a conductive line (not shown) formed in the first printed circuit board 310. In addition, since the second bonding pads 310b are in contact with the fifth bonding pads 410a formed on the second printed circuit board 410 to be described later, the first and second bonding pads 310a and 310b are Preferably, the first printed circuit board 310 is formed to be in contact with one edge of the first printed circuit board 310.

Next, as shown in FIG. 8B, one side of the Z-axis sensor 300 is attached to one surface of the first printed circuit board 310 spaced apart from the first bonding pad 310a by a predetermined distance. Reference numeral Z in FIG. 8B denotes a sensing direction of the Z-axis sensor.

Next, as illustrated in FIG. 8C, a third bonding pad 300a is formed on the other side facing the one side of the Z-axis sensor 300 attached to the first printed circuit board 310. do.

Next, as illustrated in FIG. 8D, a fourth bonding pad 310c is formed on one surface of the first printed circuit board 310 spaced apart from the Z-axis sensor 300 by a predetermined distance. The fourth bonding pad 310c is electrically connected to the first bonding pad 310a by a conductive line (not shown) formed in the first printed circuit board 310.

Then, as illustrated in FIG. 8E, the third bonding pad 300a and the fourth bonding pad 310c are electrically connected by using the bonding wire 110. It is common to use gold (Au) wire as the bonding wire 110.

Next, as shown in FIG. 8F, a molding member 350 is formed on one surface of the first printed circuit board 310 to protect the bonding wire 110 and the Z-axis sensor 300.

Next, as illustrated in FIG. 8G, a second printed circuit board having a fifth bonding pad 410a perpendicular to the second bonding pad 310b of the first printed circuit board 310 formed on an upper surface thereof. 410 is provided.

Then, as illustrated in FIG. 8H, the fifth bonding pad 410a and the second bonding pad 310b are soldered using the solder 500.

Thereafter, as illustrated in FIG. 8I, biaxial components (X, Y) of the geomagnetic vector parallel to the second printed circuit board 410 are detected on an upper surface of the second printed circuit board 410. A two-axis sensor, that is, the X-axis sensor 200 and the Y-axis sensor 100 is formed. Thereby, the hybrid geomagnetic sensor according to the present invention is completed.

As described above, the hybrid geomagnetic sensor according to the present invention uses a wire bonding process, which is an assembly method of an existing X-axis or Y-axis sensor, as it is, and Z-axis on a first printed circuit board having bonding pads formed on both surfaces thereof. By attaching the sensor, molding it, and then soldering the resulting molding structure onto a separate second printed circuit board, it is very simple to vertically assemble the Z-axis sensor without developing new processes or equipment. It has an effect. In addition, the printed circuit board has an advantage that it is competitive in terms of price.

Meanwhile, instead of forming bonding pads 310a and 310b on both surfaces of the first printed circuit board 310, the plurality of vias may be formed on the first printed circuit board 310 as described above with reference to FIG. 5. 320a may be formed.

In this case, first, as shown in FIG. 9A, a plurality of via holes h penetrating the first printed circuit board 310 are formed in the first printed circuit board 310, and then the via holes h are formed. ) Is filled with a conductive material 320.

Next, as illustrated in FIG. 9B, the first printed circuit board 310 is cut along the centers of the plurality of via holes h filled with the conductive material 320, thereby cutting a rectangular cut surface. A semi-cylindrical via 320a having a square plane C is formed.

Next, as shown in FIG. 9C, one side of the Z-axis sensor 300 is attached to one surface of the first printed circuit board 310 spaced apart from the via 320a by a predetermined distance.

Next, as shown in FIG. 9D, the first bonding pad 300a is formed on the other side facing the one side of the Z-axis sensor 300.

Next, as shown in FIG. 9E, a second bonding pad 310c is formed on one surface of the first printed circuit board 310 spaced apart from the Z-axis sensor 300 by a predetermined distance. The second bonding pad 310c is electrically connected to the via 320a by a conductive line (not shown) formed in the first printed circuit board 310.

Next, as illustrated in FIG. 9F, the first bonding pad 300a of the Z-axis sensor 300 and the second bonding pad 310c of the first printed circuit board 310 may be bonded to the bonding wire 110. Electrically connect using

Next, as illustrated in FIG. 9G, a molding member 350 is formed on one surface of the first printed circuit board 310 to protect the bonding wire 110 and the Z-axis sensor 300.

Next, as shown in FIG. 9H, a second printed circuit board 410 having a third bonding pad 410a perpendicular to the first printed circuit board 310 is provided on the top surface thereof. At this time, the quadrangular plane C portion of the semi-cylindrical via 320a formed in the first printed circuit board 310 is attached to the second printed circuit board 410. The area of the square plane C of the via 320a that is in contact with the second printed circuit board 410 is that the double-sided bonding pads 310a and 310b shown in FIG. 6 are formed on the second printed circuit board 410. Since it is larger than the abutment area, there is an advantage that it can be attached much more firmly.

Next, as illustrated in FIG. 9I, the via 320a of the first printed circuit board 310 and the third bonding pad 410a of the second printed circuit board 410 are formed using the solder 500. Solder

Thereafter, as illustrated in FIG. 9J, biaxial components (X, Y) of the geomagnetic vector parallel to the second printed circuit board 410 are detected on an upper surface of the second printed circuit board 410. The two-axis sensor, that is, the X-axis sensor 200 and the Y-axis sensor 100 is formed.

Although the preferred embodiments of the present invention have been described in detail above, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the scope of the present invention is not limited to the disclosed embodiments, but various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims also belong to the scope of the present invention.

As described above, according to the hybrid geomagnetic sensor according to the present invention and a method for manufacturing the same, a first printed circuit having bonding pads formed on both surfaces by using a wire bonding process, which is an assembly method of an existing X-axis or Y-axis sensor, as it is. After attaching the Z-axis sensor on the substrate, molding it and soldering the resulting molding structure back onto a separate second printed circuit board, greatly improving the vertical assembly of the Z-axis sensor without developing new processes or equipment. It's simple to do. Therefore, the present invention can overcome the process difficulties that occur during the vertical assembly of the Z-axis sensor.

In addition, the present invention has an advantage that the price competitiveness of the hybrid geomagnetic sensor can be achieved by using a printed circuit board which is advantageous in terms of price.

In addition, according to the present invention, instead of forming bonding pads on both sides of the first printed circuit board, a plurality of vias that perform a bonding pad function are formed on the first printed circuit board, so that the first printed circuit board has a second printed circuit board. It can be made much more firmly attached to a printed circuit board.

Claims (8)

A first printed circuit board having a plurality of first and second bonding pads electrically connected to both sides thereof; A Z-axis sensor having one side attached to one surface of the first printed circuit board spaced apart from the first bonding pad by a predetermined distance; A third bonding pad formed on the other side facing the one side of the Z-axis sensor; A fourth bonding pad formed on one surface of the first printed circuit board spaced apart from the Z-axis sensor by a predetermined distance and electrically connected to the first bonding pad; Bonding wires electrically connecting the third bonding pads and the fourth bonding pads; A molding material formed on one surface of the first printed circuit board to protect the bonding wire and the Z-axis sensor; A second printed circuit board having a fifth bonding pad perpendicular to the second bonding pad formed on an upper surface thereof, wherein the fifth bonding pad is soldered to the second bonding pad; And And a biaxial sensor formed on an upper surface of the second printed circuit board to detect a biaxial component of the geomagnetic vector parallel to the second printed circuit board. The method of claim 1, And the first and second bonding pads are formed to contact one edge of the first printed circuit board. A first printed circuit board having a plurality of vias formed therein; A Z-axis sensor having one side attached to one surface of the first printed circuit board spaced apart from the via by a predetermined distance; A first bonding pad formed on the other side facing the one side of the Z-axis sensor; A second bonding pad formed on one surface of the first printed circuit board spaced apart from the Z-axis sensor by a predetermined distance and electrically connected to the via; Bonding wires electrically connecting the first bonding pads to the second bonding pads; A molding material formed on one surface of the first printed circuit board to protect the bonding wire and the Z-axis sensor; A second printed circuit board perpendicular to the first printed circuit board and having a third bonding pad formed on an upper surface thereof soldered with the vias of the first printed circuit board; And And a biaxial sensor formed on an upper surface of the second printed circuit board to detect a biaxial component of the geomagnetic vector parallel to the second printed circuit board. The method of claim 3, The via is formed in a semi-cylindrical shape in contact with one side edge of the first printed circuit board, a hybrid geomagnetic sensor, characterized in that the quadrangular plane portion forming the semi-circular shape is in contact with the upper surface of the second printed circuit board. Providing a first printed circuit board having a plurality of first and second bonding pads electrically connected to both surfaces thereof; Attaching one side of a Z-axis sensor to one surface of the first printed circuit board spaced apart from the first bonding pad by a predetermined distance; Forming a third bonding pad on the other side facing the one side of the Z-axis sensor; Forming a fourth bonding pad electrically connected to the first bonding pad on one surface of the first printed circuit board spaced apart from the Z-axis sensor by a predetermined distance; Electrically connecting the third bonding pad and the fourth bonding pad using a bonding wire; Forming a molding material on one surface of the first printed circuit board to protect the bonding wire and the Z-axis sensor; Providing a second printed circuit board having a fifth bonding pad perpendicular to the second bonding pad of the first printed circuit board formed on an upper surface thereof; Soldering the fifth bonding pad and the second bonding pad to each other; And And forming a biaxial sensor on an upper surface of the second printed circuit board to detect a biaxial component of the geomagnetic vector parallel to the second printed circuit board. The method of claim 5, And manufacturing the first and second bonding pads so as to be in contact with one side edge of the first printed circuit board. Providing a first printed circuit board having a plurality of vias formed thereon; Attaching one side of a Z-axis sensor to one surface of the first printed circuit board spaced apart from the via; Forming a first bonding pad on the other side facing the one side of the Z-axis sensor; Forming a second bonding pad electrically connected to the via on one surface of the first printed circuit board spaced apart from the Z-axis sensor by a predetermined distance; Electrically connecting the first bonding pad and the second bonding pad using a bonding wire; Forming a molding material on one surface of the first printed circuit board to protect the bonding wire and the Z-axis sensor; Providing a second printed circuit board on which a third bonding pad perpendicular to the first printed circuit board is formed on an upper surface thereof; Soldering the via of the first printed circuit board and the third bonding pad of the second printed circuit board; And And forming a biaxial sensor on an upper surface of the second printed circuit board to detect a biaxial component of a geomagnetic vector parallel to the second printed circuit board. The method of claim 7, wherein Providing a first printed circuit board having the plurality of vias formed thereon, Forming a plurality of via holes in the first printed circuit board and penetrating the first printed circuit board; Filling the via hole with a conductive material; And And cutting the first printed circuit board along a center of the plurality of via holes filled with the conductive material to form a semi-cylindrical via having a quadrangular cutting surface. Manufacturing method.

Images