KR100790789B1 - Semiconductor manufacturing apparatus - Google Patents

Abstract

A semiconductor manufacturing apparatus is provided to reduce a process time and to enhance a throughput by forming a heating part and a cooling part in an inside of a buffer chamber. A wafer handler(25) is mounted in a transfer chamber(20). One or more process chamber(10) is connected with the transfer chamber. A transfer unit(30) includes a robot arm for transferring the wafer. A buffer chamber(50) is installed between the transfer unit and the transfer chamber. Both sides of the buffer chamber is opened or closed selectively to the transfer chamber and the transfer unit in order to load the wafer to be transferred to the transfer unit. A loading station(60) is installed in the inside of the buffer chamber. The wafer is loaded into the loading station. The loading station includes a first loading part for loading the processed wafers and a second loading part for loading the unprocessed wafers.

Description

Semiconductor Process Equipment {SEMICONDUCTOR MANUFACTURING APPARATUS}

1 is a schematic view showing a conventional general semiconductor processing apparatus;

2 is a block diagram of a semiconductor processing apparatus according to the present invention;

3 is a cross-sectional view and a plan view of a buffer chamber according to the embodiment shown in FIG.

4 is a cross-sectional view and a plan view of a buffer chamber according to another exemplary embodiment shown in FIG. 2.

* Description of the symbols for the main parts of the drawings *

10: process chamber 20: transfer chamber

25: wafer handler 30: transfer unit

31: robot arm 32, 33: load port

50: buffer chamber 51: elevating drive unit

55: heating unit

57 cooling unit 58 vacuum pump

59: pressurized venting pump 60: loading station

70: blocking film

P1, P2, P3: Process Station W: Wafer

D1: first door D2: second door

D3: 3rd Door D4: 4th Door

S1: first loading part S2: second loading part

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor processing apparatus, and more particularly, to a semiconductor processing apparatus which eliminates the need to convert the entire transfer chamber into vacuum and atmospheric pressure by providing a buffer chamber between the transfer section and the transfer chamber.

In general, in order to manufacture a semiconductor device, a wafer, which is an object, must be repeatedly performed several times to several tens of processes such as thin film deposition, etching, and cleaning. Each of these processes is performed in a semiconductor processing apparatus having an optimal environment.

1 is a configuration diagram schematically showing an example of the semiconductor processing apparatus described above.

Referring to the drawings, the semiconductor processing apparatus includes a flat polygonal transfer chamber 120, a plurality of process chambers 110 coupled to the side of the transfer chamber 120, and a wafer W as the transfer chamber 120. It includes a transfer unit 130 for carrying in and out.

The process chamber 110 generally performs various processes on the wafer W while maintaining a high vacuum state, and the transfer chamber 120 is processed by the wafer handler 125 located therein. The vacuum is also maintained as a space for transferring the wafer between 110 or between the process chamber 110 and the transfer chamber 120.

The transfer unit 130 is provided with a robot arm 131 for transferring the wafer W to be carried into the transfer chamber 120, and maintains the atmospheric pressure at all times.

Accordingly, in order to bring the wafer W into the process chamber 110 from the transfer unit 130, first, the inside of the transfer chamber 120 is pressurized with a pump before opening the fourth door D4 of the transfer chamber 120. Use (159) to switch to atmospheric pressure.

On the contrary, in order to load the wafer W from the transfer chamber 120 to the process chamber 110, after closing the fourth door D4, the inside of the transfer chamber 120 is vacuumed using the vacuum pump 158. You should switch to

However, the transfer chamber 120 is coupled to the plurality of process chambers 110 along the sidewalls, and the wafer handler 125 for transferring the wafer W to each process chamber 110 is mounted therein. It has a relatively large volume.

Therefore, when the transfer chamber 120 is directly connected to the transfer unit 130, the entire transfer chamber 120 should be switched between a vacuum state and an atmospheric pressure state, and thus, a relatively large capacity vacuum pump 158 and pressurized venting. Pump 159 is needed, and more time is required to switch to vacuum and atmospheric conditions.

In particular, when a plurality of process chambers 110 are provided to process a large amount of throughput of the wafer W, or when the wafer W is frequently loaded / exported, the waiting time increases accordingly. As a result, the total work time is increased, and thus there is a problem that productivity is lowered.

Accordingly, it is an object of the present invention, by switching only the buffer chamber having a relatively small space in vacuum and atmospheric pressure, without the need to switch the entire transfer chamber into a vacuum and atmospheric state when the wafer is brought into or taken out of the transfer chamber. The present invention provides a semiconductor processing apparatus capable of reducing the waiting time required for transition to vacuum and atmospheric pressure.

In order to achieve the above object, the present invention, the transfer chamber is embedded with a wafer handler; At least one process chamber connected to the transfer chamber to be opened and closed; A transfer unit having a robot arm for transferring a wafer; And a buffer chamber provided between the transfer unit and the transfer chamber, the both sides of which are selectively opened and closed to transfer the wafer transferred to the transfer unit.

The method may further include a vacuum pump and a pressure venting pump for converting the inside of the buffer chamber into a vacuum state and an atmospheric pressure state.

Preferably, the buffer chamber may be provided with a loading station in which the wafer transferred from the transfer unit is loaded.

The loading station may be divided into a first loading part in which a wafer processed in the process chamber is loaded and a second loading part in which an unprocessed wafer is loaded.

Preferably, the loading station is provided in a cassette type in which the wafer is loaded up and down, and the first loading portion and the second loading portion may be divided up and down.

Here, the wafer handler may further include a lifting and lowering driving unit for supporting the loading station to be able to lift up and down to selectively access the first loading portion and the second loading portion.

On the other hand, the loading station comprises a first loading portion in which the wafer processed in the process chamber is loaded, and a second loading portion in which the unprocessed wafer is loaded in parallel to one side of the first loading portion. It may be provided in two or more to be arranged side by side in the buffer chamber.

In this case, it is preferable that the wafer handler further comprises a horizontal driving unit for horizontally moving the buffer chamber from side to side so as to selectively access the first loading portion and the second loading portion.

The apparatus may further include an elevating driving unit configured to elevate the first and second loading units up and down.

Preferably, the apparatus may further include at least one of a heating unit and a cooling unit for heating the loading station.

Here, the heating unit and the cooling unit may heat / cool a portion of the loading station.

Preferably, the semiconductor device may further include a blocking layer provided between the first loading portion and the second loading portion to block the processed wafer from the unprocessed wafer.

More preferably, the barrier layer may include an insulating material.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 2, the semiconductor processing apparatus according to the present invention includes a transfer chamber 20 in which a wafer handler 25 is embedded, one or more process chambers 10 connected to the transfer chamber 20 to be opened and closed, and a wafer. Transfer unit 30 is provided with a robot arm 31 for transferring (W); And a buffer chamber provided between the transfer unit 30 and the transfer chamber 20, wherein both sides are selectively opened and closed in the transfer chamber 20 and the transfer unit 30 to load the wafer W transferred to the transfer unit 30. 50);

Here, the vacuum chamber 58 and the pressure venting pump 59 for converting the inside of the buffer chamber 50 into a vacuum state and an atmospheric pressure state may be further included.

The apparatus may further include at least one of an elevating driving unit 51 for raising and lowering the loading station 60 provided in the buffer chamber 50 in a vertical direction or a horizontal moving unit (not shown) for horizontally moving left and right. .

In addition, when the loading station 60 is divided into the first loading part S1 and the second loading part S2, an insulating material blocking film is formed between the first loading part S1 and the second loading part S2. 70 may further include.

Hereinafter, the configuration will be described in detail.

The transfer chamber 20 includes a wafer handler 25 therein, and communicates with the process chamber 10 and the buffer chamber 50 to transfer the wafer W from the buffer chamber 50 to each process chamber 10. It is prepared to be transported.

The transfer chamber 20 is provided with a separate vacuum pump (not shown) so as to maintain a vacuum inside, and the process chamber 10 is separated from the process chamber 10 by the third door D3 and the second chamber from the buffer chamber 50. It is connected by (D2).

The wafer handler 25 transfers the wafer W between the process chamber 10 and the transfer chamber 20 or between the buffer chamber 50 and the transfer chamber 20.

Here, the wafer handler 25 may be provided in various configurations, and as illustrated in FIG. 2, the wafer handler 25 may be provided in one piece, or may be provided in plural pieces with a single arm.

The process chamber 10 is provided to be opened and closed in the transfer chamber 20 so that the wafer W transferred by the wafer handler 25 is loaded to perform each process.

In general, semiconductor devices have to be manufactured in highly clean clean rooms because process defects are generated even by fine particles. For this purpose, the process chamber 10 is operated by a high vacuum pump (not shown). Maintaining a high vacuum eliminates the process impact of particles.

Therefore, the process chamber 10 is generally provided to perform a ball such as thin film deposition, etching, and cleaning on the wafer W while maintaining a high vacuum state.

Process chamber 10 may be provided in various numbers as needed.

When a plurality of process chambers 10 are provided, each process chamber 10 may be provided to perform the same process in parallel, or each process chamber 10 may be provided to sequentially perform different processes. have.

The transfer unit 30 is provided with a robot arm 31 for transferring the wafer W.

The transfer unit 30 is also referred to as an equipment fron end module (EFEM), and carries the unprocessed wafer W into the buffer chamber 50 through the robot arm 31 therein or externally processes the processed wafer W. To be taken out.

The transfer unit 30 maintains the atmospheric pressure at all times and is connected to the buffer chamber 50 with the first door D1 interposed therebetween.

One side of the transfer part 30 is provided with one or more load ports for temporarily transferring the transferred wafers W. The robot arm 31 moves from side to side with the wafers W from the load ports 32 and 33. ) Is transferred into the buffer chamber 50.

The buffer chamber 50 is provided between the transfer unit 30 and the transfer chamber 20, and both sides of the wafer W transferred by the transfer unit 30 are selectively opened and closed by the transfer chamber 20 and the transfer unit 30. Is loaded.

Here, the vacuum chamber 58 and the pressure venting pump 59 for converting the inside of the buffer chamber 50 into a vacuum state and an atmospheric pressure state may be further included.

Since the transfer chamber 20 is in a vacuum state and the transfer unit 30 is at atmospheric pressure, the buffer chamber 50 is provided between the transfer chamber 20 and the transfer unit 30 to serve as a buffer.

That is, when the wafer W is carried from the transfer unit 30, the pressure venting pump 59 is operated to switch the inside of the buffer chamber 50 to the atmospheric pressure state and then open the first door D1. The wafer W is loaded.

When the loaded wafer W is transferred to the process chamber 10, the first door D1 is closed and the vacuum pump 58 is driven to switch the inside of the buffer chamber 50 to a vacuum state. The second door D2 is opened to allow the wafer handler 25 to approach the loading station 60.

In this case, the buffer chamber 50 is provided with a relatively small size compared to the transfer chamber 20. That is, the transfer chamber 20 is because a plurality of process chambers 10 are coupled along the sidewall, and a wafer handler 25 for transferring the wafers W to each process chamber 10 is provided therein. .

Accordingly, in the case of the semiconductor processing apparatus having the buffer chamber 50 according to the present invention, only the buffer chamber 50 needs to be switched under vacuum and atmospheric pressure, and thus, the vacuum pump 58 and the pressure venting pump having a relatively small capacity ( 59) is required, and the waiting time required to switch to the vacuum and atmospheric pressure is reduced, thereby reducing the overall working time.

In addition, since the vacuum pump 58 and the pressure venting pump 59 need not be mounted in the transfer chamber 20 having a relatively complicated configuration, the device design becomes easy.

The vacuum pump 58 may be provided in various kinds, for example, may be provided as a roughing pump.

The pressurized venting pump 59 is provided to inject an inert gas such as argon or nitrogen into the buffer chamber 50 to adjust the internal pressure to an atmospheric pressure or an appropriate level.

Here, the vacuum pump 58 and the pressure venting pump 59 may be used in various forms that are commonly used in the semiconductor manufacturing process.

The loading station 60 is provided in the buffer chamber 50 to load the wafer W transferred from the transfer unit 30.

The loading station 60 may be provided in various shapes. For example, as shown in FIG. 3, the loading station 60 may be provided in a cassette type so that one or more wafers W may be stacked and stacked.

The loading station 60 may be divided into two or more parts as necessary.

3 shows a loading station 60 according to a first embodiment of the present invention.

Referring to the drawings, the loading station 60 includes a first loading portion S1 on which the wafer W processed in the process chamber 10 is loaded, and a second loading on which an unprocessed wafer W is loaded. The part S2 may be divided and provided.

In this case, the first loading part S1 and the second loading part S2 may be divided and provided in the loading station 60.

Here, the positions of the first loading portion (S1) and the second loading portion (S2) may of course be provided as necessary.

The lifting driving unit 51 is provided to lift the loading station 60 up and down so that the wafer handler 25 is selectively accessible to the first loading part S1 and the second loading part S2 divided up and down.

For example, when the wafer handler 25 intends to unload the unprocessed wafer W from the loading station 60, the lifting and lowering drive unit 51 raises the loading station 60 to raise the second loading part S2. Can be accessed by the wafer handler 25.

On the contrary, when the unloaded wafer W from the process chamber 10 is to be loaded into the first loading part S1, the loading station 60 may be lowered.

The lifting driving unit 51 may be provided in various kinds. For example, as shown in FIGS. 3 and 4, a driving motor may be used, or a hydraulic press or a pneumatic press may be used.

On the other hand, the loading station 60 is fixed in place, the wafer handler 25 may be provided to selectively approach the first loading portion (S1) and the second loading portion (S2) while lifting up and down.

Here, the loading station 60 may further include a detection unit (not shown) for detecting whether the rising or falling to the appropriate height.

4 is a view showing a loading station 60 according to a second embodiment of the present invention.

Referring to the drawings, the loading station 60 is provided in parallel with one side of the first loading portion S1 and the first loading portion S1 on which the wafer W processed in the process chamber 10 is loaded. It may include a second loading portion (S2) on which the processed wafer (W) is loaded.

Here, the number of the horizontally divided loading portion (S1, S2) may be provided in various ways as needed. For example, as shown in Figure 4, may be provided in two, may be provided in three or more.

The horizontal driving unit may be provided to horizontally move the buffer chamber 50 to the left and right so that the wafer handler 25 can selectively access the first loading unit S1 and the second loading unit S2.

For example, when the unprocessed wafer W is to be taken out from the second loading part S2, the horizontal driving part moves the loading station 60 to the left side, and the processed wafer W is placed in the first loading part. If you want to carry in (S1), the horizontal driving unit may be to move the loading station 60 to the right.

The horizontal driving unit may be provided in various kinds. For example, the horizontal driving unit may be provided with a driving motor and a plurality of gear trains or belts for transmitting the driving force of the driving motor.

Meanwhile, as shown in FIG. 4, when the stacking units S1 and S2 are provided in a cassette type in which a plurality of wafers W are stacked in the vertical direction, the stacking units S1 and S2 are lifted up and down. Elevating driving unit 51 may be further provided.

The heating unit 55 is provided in the buffer chamber 50 to heat the loading station 60.

For example, when the annealing process is performed in the process chamber 10, a process of preheating to a predetermined temperature is required before loading the wafer W into the process chamber 10.

In this case, the heating part 55 may be provided to heat only the second loading part S2 on which the unprocessed wafer W is loaded.

The heating unit 55 may be provided in various kinds. For example, the heating unit 55 may be provided as an electric resistance heater that generates heat when a current flows, and a thermoelectric element (or a heat moving from one end to the other end by a potential difference between both ends). Peltier device) may be provided.

Here, when the heating part 55 is provided as a thermoelectric element, the cooling sink side of the thermoelectric element faces the first loading portion S1, and the hot sink side faces the second loading portion S2. Heating and cooling of the sections S1 and S2 can be performed simultaneously.

The cooling unit 57 is provided in the buffer chamber 50 so as to cool the loading station 60.

As described above, when the annealing process is performed in the process chamber 10, the temperature of the processed wafer W should be reduced to room temperature in a vacuum state in the buffer chamber 50.

Here, the cooling unit 57 may be provided to cool only the first loading unit S1 on which the processed wafer W is loaded.

As described above, when the heating and cooling processes in the buffer chamber 50 are performed simultaneously with the annealing process performed in the process chamber 10, the preheated wafer W is directly processed from the buffer chamber 50. Since it is necessary to transfer to), since a separate process chamber 10 for preheating is unnecessary, the process time is shortened compared to the conventional, thereby improving productivity.

The blocking film 70 is provided between the first loading portion S1 and the second loading portion S2 to block the processed wafer W from the unprocessed wafer W.

The blocking film 70 blocks particles and thermal effects between the processed wafer W and the unprocessed wafer W.

Here, the blocking film 70 may be formed of various materials, and for example, may include an insulating material or a fire resistant material such as ceramic or synthetic ceramic.

Hereinafter, an operation process of the semiconductor processing apparatus having the above-described structure will be described with reference to FIGS. 2 to 4.

First, a transfer chamber 20 is provided in the center to maintain a vacuum state and a wafer handler 25 for transferring the wafer W therein.

One side of the transfer chamber 20 is provided with one or more process chambers 10 in which the wafers W are processed. In each process chamber 10, process stations P1, P2, and P3 to which the wafers W transferred by the wafer handler 25 are loaded are provided.

Each process chamber 10 and the transfer chamber 20 are provided with a third door D3 to selectively open and close the wafer W during the transfer of the wafer W to maintain the high vacuum state inside the process chamber 10.

The other side of the transfer chamber 20 is provided with a buffer chamber 50 provided with a loading station 60 on which the wafer W transferred from the transfer unit 30 is loaded.

The buffer chamber 50 communicates with the transfer chamber 20 by the second door D2, and communicates with the transfer unit 30 by the first door D1.

Since the transfer unit 30 maintains the atmospheric pressure state, and the transfer chamber 20 maintains the vacuum state, the buffer chamber 50 may be vacuumed through a separate vacuum pump 58 and a pressure venting pump 59. It is provided to repeat the atmospheric pressure state.

By the above configuration, a case where the wafer W is to be charged into the buffer chamber 50 will be described.

First, the pressure venting pump 59 is driven to convert the inside of the buffer chamber 50 to atmospheric pressure.

Here, a sensor for detecting whether the inside of the buffer chamber 50 is at atmospheric pressure, for example, an air pressure sensor (not shown) may be provided.

When the inside of the buffer chamber 50 is at atmospheric pressure, the first door D1 is opened, and the robot arm 31 loads the wafer W into the loading station 60 through the first door D1. .

In this case, when the loading station 60 is divided into a first loading portion S1 on which the processed wafer W is loaded and a second loading portion S2 on which the unprocessed wafer W is loaded, is provided. Next, the robot arm 31 moves the loading station 60 to be accessible to the second loading portion S2.

For example, as shown in FIG. 3, the loading station 60 is provided in a cassette type capable of loading the wafer W up and down, and the first loading part S1 has a second loading part ( When S2) is provided at the lower portion, the lifting driving unit 51 may be driven to move the loading station 60 upward so that the second loading unit S2 moves to a position corresponding to the robot arm 31. .

Alternatively, as shown in FIG. 4, when the loading station 60 is divided into a first loading part S1 and a second loading part S2 arranged side by side, the horizontal driving part is driven to drive the second driving part. The loading portion S2 may be moved to a position corresponding to the robot arm 31.

When the wafer W is completely loaded on the robot arm 31, the first door D1 is closed and the vacuum pump 58 is driven to convert the interior of the buffer chamber 50 into a vacuum state.

When the buffer chamber 50 is switched to the vacuum state, the second door D2 is opened.

The wafer handler 25 takes out the unprocessed wafer W from the second loading unit S2 and transfers the unprocessed wafer W to each process station P1, P2, P3.

At this time, when the process performed in the process chamber 10 requires preheating of the wafer W (for example, an annealing process), the heating unit 55 is driven to heat the second loading unit S2.

Next, the third door D3 is closed and the process is performed in the process chamber 10.

When the process is completed in the process chamber 10, the third door D3 is opened again, and the wafer handler 25 unloads the processed wafer W to be loaded in the first loading part S1. .

In this case, when cooling of the processed wafer W is required, the cooling unit 57 is driven to cool the first loading unit S1.

Here, each of the process chambers 10 may be provided to perform all the same processes in parallel, or may be provided to perform heterogeneous processes.

In any case, a plurality of wafer handlers 25 may be provided to unload the processed wafers W from the process chamber 10 and to load the unprocessed wafers W. The completed wafer W may be transferred directly to the process chamber 10 in which the second process is performed.

Finally, when all processes are completed, the wafer W is loaded in the first loading part S1, in which case, the second door D2 is closed and the inside of the buffer chamber 50 is switched to an atmospheric pressure state. do.

Thereafter, when the inside of the buffer chamber 50 reaches the atmospheric pressure state, the robot arm 31 carries out the processed wafer W from the first loading part S1 after opening the first door D1.

Accordingly, in the semiconductor processing apparatus having the buffer chamber according to the present invention, when the wafer is brought into or taken out of the transfer chamber, the buffer chamber having a relatively small space is not required to switch the entire transfer chamber into vacuum and atmospheric pressure states. Since only the switch in the vacuum and atmospheric pressure state, it is possible to reduce the waiting time required to switch to the vacuum and atmospheric pressure state, thereby reducing the overall work time.

In addition, by providing a heating unit and a cooling unit in the buffer chamber, it is possible to preheat and cool the wafer simultaneously with various processes performed in the process chamber, so that a separate preparation step for performing the process is unnecessary.

Therefore, productivity (Throughput) can be improved by shortening the process time.

Claims (13)

A transfer chamber incorporating a wafer handler; At least one process chamber connected to the transfer chamber to be opened and closed; A transfer unit having a robot arm for transferring a wafer; And And a buffer chamber provided between the transfer part and the transfer chamber, the both sides of which are selectively opened and closed to transfer the wafer transferred to the transfer part. The buffer chamber is provided with a loading station for loading the wafer transferred from the transfer unit therein, And the loading station is divided into a first loading portion in which a wafer processed in the process chamber is loaded and a second loading portion in which an unprocessed wafer is loaded. The method of claim 1, And a vacuum pump and a pressurized venting pump for converting the buffer chamber into a vacuum state and an atmospheric pressure state. delete delete The method of claim 1, The loading station is provided in a cassette type in which the wafer is loaded up and down, wherein the first loading portion and the second loading portion is divided up and down. The method of claim 5, And a lifting and lowering driving part for supporting the loading station in a vertically movable manner so that the wafer handler is selectively accessible to the first loading part and the second loading part. The method of claim 1, The loading station includes a first loading portion in which a wafer processed in the process chamber is loaded, and a second loading portion in parallel with one side of the first loading portion, in which an unprocessed wafer is loaded, and the first loading portion. The second and the second loading portion is provided in two or more, respectively, characterized in that arranged side by side in the buffer chamber side by side Semiconductor processing equipment. The method of claim 7, wherein And a horizontal driving unit for horizontally moving the buffer chamber from side to side such that the wafer handler is selectively accessible to the first loading portion and the second loading portion. The method of claim 7, wherein And a lifting and lowering driving part for allowing the first and second loading parts to move up and down. The method of claim 1, And at least one of a heating unit and a cooling unit for cooling the loading station. The method of claim 10, And the heating unit and the cooling unit heat / cool a portion of the loading station. The method according to claim 1 or 8, And a blocking film provided between the first loading portion and the second loading portion to block the processed wafer from the unprocessed wafer. The method of claim 12, The blocking film is a semiconductor processing apparatus characterized in that it comprises an insulating material.

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