KR100772201B1 - Thermoelectric element module - Google Patents

Abstract

A thermoelectric element module is provided to improve a thermoelectric generating and cooling performance by mounting plural thermoelectric elements on a single substrate. A thermoelectric element(110) includes plural n-type and p-type thermoelectric semiconductors, conductive electrodes, and silicon. The n-type and p-type thermoelectric semiconductors are arranged between a pair of ceramic panels, which are apart from each other by a predetermined distance. The conductive electrodes are arranged between the ceramic panel and the thermoelectric semiconductor. Silicon is filled between the ceramic panels. A substrate(130) includes plural mounting holes(120), whose holding protrusions are protruded from one sidewall thereof. The thermoelectric element penetrates the mounting hole. A conductive pattern(132) for electrically coupling the thermoelectric elements with each other is formed on the substrate.

Description

Thermoelectric element module

1 is a cross-sectional view showing an installation state of a cooler according to the prior art.

Figure 2 is a perspective view showing a thermoelectric module according to the present invention.

3 is an exploded perspective view of FIG. 2;

Figure 4 is a partial cross-sectional perspective view showing a thermoelectric element of the thermoelectric module according to the present invention.

5 is a cross-sectional view taken along the line A-A of FIG.

Figure 6 is a perspective view showing a state in which a pair of adjacent thermoelectric module is coupled.

* Description of the symbols for the main parts of the drawings *

100: thermoelectric module 110: thermoelectric device

112: ceramic panel 114: N-type and P-type thermoelectric semiconductor

116: conductive electrode 118: electrode terminal

120: through hole 126: locking projection

128: cutout 130: substrate

132: conductive pattern 142: connector

144: Receptacle

The present invention relates to a thermoelectric element module for controlling the temperature of a control box such as an electronic controller or a communication repeater, and more specifically, a plurality of thermoelectric elements are mounted on one substrate to improve thermoelectric heating or thermoelectric cooling performance. The present invention relates to a modular thermoelectric module.

In general, a control box such as an electronic controller or a communication repeater installed outdoors is provided with a cooler to prevent the control box from malfunctioning due to overheating due to heat generation or external temperature of the device. There are various kinds of such coolers, and the use of a cooler using a thermoelectric element capable of improving various problems occurring in a structure using an air conditioner, which is widely used in a conventional high efficiency cooler, has recently been increased in application.

Cooling devices using thermoelectric elements are the least used for cooling devices in enclosures that contain electronic equipment until recently.

1 is a cross-sectional view showing a state of installation of a conventional cooler, with reference to Figure 1 with respect to the conventional cooler as follows.

As shown in FIG. 1, the conventional cooler 1 includes a thermoelectric element 10 coupled through a control box panel 40 and inside and outside of the control box panel 40, respectively. First and second housings 50 and 60 having a predetermined space therein, and heat absorbing units 20 and heat generating units 30 provided inside the first and second housings 50 and 60, respectively. It is configured to include). The heat absorbing portion 20 includes a cold sink 22 attached to one side of the thermoelectric element 10 and a cooling fan 24 positioned in front of the cold sink 22, and the heat generating portion 30. ) Includes a heat sink 32 attached to the other side of the thermoelectric element 10 and a heat dissipation fan 34 mounted to the second housing 60 at a predetermined distance from the heat sink 32. In this case, a plurality of vent holes 52 and 62 are formed in the first and second housings 50 and 60 so that the inside thereof can communicate with the outside.

Looking at the cooling operation by the conventional cooler (1), the air inside the hot control box introduced through the vent 52 of the first housing 50 is heat exchanged by the contact with the heat absorbing portion (20). Due to the change in cold air, the internal temperature of the control box can be kept constant at all times. On the other hand, the outside air at room temperature introduced through the vent 62 of the second housing 60 is heat-exchanged by the contact with the heat generating unit 30 is changed to high temperature air. At this time, the greater the amount of heat discharged to the outside through the heat generating portion 30, the higher the cooling performance of the heat absorbing portion 20 is improved, so that the heat radiating fan 34 is provided in plurality.

By the way, the conventional cooler 1 as described above is mounted so that the thermoelectric element 10 penetrates through the control box 50. For this purpose, the mounting hole 42 must be formed in the panel 40 of the control box. Installation is not easy, especially when the thermoelectric element 10 is required due to a change in the external environment, the mounting hole 42 must be expanded or additionally formed, which is very cumbersome. Further, although not shown in the drawings, power transformers, rectifiers, and circuit boards, which are components for operating the cooler 1, are separately installed from the cooler 1, and thus, the installation is complicated, and thus the wires connecting them to the outside are provided. Since the exposure is not good appearance and there is a problem that the exposed wires are easily damaged.

Therefore, the present invention is to solve the above-mentioned problems, it is easy to install by mounting a thermoelectric element on the substrate and modularized, it is possible to mount a plurality of thermoelectric elements on one substrate to improve thermoelectric power generation or thermoelectric cooling performance The purpose of the present invention is to provide a thermoelectric module.

In addition, another object of the present invention is to provide a thermoelectric module that can easily mount and remove the thermoelectric element on the substrate, and can prevent the thermoelectric element of the mounted state from being arbitrarily removed.

The thermoelectric module according to the present invention for achieving the object as described above comprises a thermoelectric element and a substrate including a plurality of mounting holes on which the thermoelectric element is mounted, and the substrate includes a plurality of mounting holes. A conductive pattern for electrically connecting the mounted thermoelectric element is formed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view showing a thermoelectric module according to the present invention, Figure 3 is an exploded perspective view of FIG.

As shown in FIGS. 2 and 3, the thermoelectric element module 100 according to the present invention includes a thermoelectric element 110 in which thermoelectric heating and thermoelectric cooling are respectively performed on surfaces facing each other when power is applied, and the thermoelectric element ( It is composed of a substrate 130 in which a plurality of mounting holes 120 are formed so that the 110 can be mounted. At this time, the thermoelectric element 110 is provided in the same number as the mounting hole 120, the thermoelectric element 110 mounted in the mounting hole 120 is electrically by the conductive pattern 132 formed on the substrate 130 Connected.

The thermoelectric element 110 constituting the thermoelectric element module 100 and the substrate 130 will be described first with reference to the thermoelectric element 110.

4 is a partial cross-sectional perspective view showing a thermoelectric element of the thermoelectric module according to the present invention. Referring to FIG. 4, the thermoelectric element 110 includes a pair of ceramic panels 112 spaced a predetermined distance from each other. A plurality of N-type and P-type thermoconductors 114 provided between the pair of ceramic panels 112 and arranged in a predetermined pattern, and electrically connecting the plurality of N-type and P-type thermoconductors 114 in series. A conductive electrode 116 and an electrode terminal 118 are respectively bonded to the ends of the conductive electrode 116 to apply power to the plurality of N-type and P-type thermoconductors 114. At this time, the space between the pair of ceramic panels 112 is filled with a silicon layer (S) to prevent the respective components from being spaced apart from each other by an external force, and to prevent moisture from flowing into the interior.

Here, since the thermoelectric device including the ceramic panel 112, the plurality of N-type and P-type thermoconductors 114, the conductive electrodes 116, and the silicon layer S has been previously applied, a detailed description thereof will be provided. It will be omitted. However, the electrode terminals 118 bonded to the ends of the conductive electrode 116 to supply power to the plurality of N-type and P-type thermoelectric semiconductors 114 are new items that are not provided in the conventional thermoelectric elements. Only describe it.

The electrode terminal 118 is to transfer the power applied from the outside to the N-type and P-type thermoelectric semiconductor 114 as described above, the material is applied through the conductive pattern 132 of the substrate 130 to be described later It is desirable to use a metal with good electrical conductivity so that the supplied power can be delivered without loss. Looking at the shape, the electrode terminal 118 is formed of a rectangular plate of a thin thickness having a predetermined length but the interruption is bent to form a crank shape as a whole. In addition, one end of the electrode terminal 118 is bonded to the end of the conductive electrode 116 and the other end penetrates through the silicon layer S to protrude toward the side of the thermoelectric element 110.

In this case, a predetermined shape elasticity (elasticity to maintain the initial shape) is generated in the electrode terminal 118 formed in the crank shape as described above according to the deformation of the shape, and in this embodiment, the electrode terminal ( 118 is in close contact with the conductive pattern 132.

In more detail, the electrode terminal 118 is bent in a crank shape, but the other end protruding to the outside of the thermoelectric element 110 is formed to be inclined downward by a predetermined angle. When the thermoelectric element 110 is mounted on the substrate 130 in the above state, as shown in FIG. 5, the other end of the electrode terminal 118 is in a horizontal state, and the top surface of the conductive pattern 132 is formed. Close contact. At this time, the other end of the electrode terminal 118 is in close contact with the conductive pattern 132 by the shape elasticity to return to the original shape. Therefore, the electrode terminal 118 is not in close contact with each other by being in close contact with the conductive pattern 132 without a separate bonding agent such as lead. In addition, when the electrode terminal 118 is soldered to the conductive pattern 132 in the state of being in close contact as described above, of course it can be more firmly bonded between them.

As shown in FIGS. 2 and 3, the substrate 130 is a rectangular printed circuit board having a predetermined conductive pattern 132 formed on a surface thereof, and a mounting hole in which the thermoelectric element 110 is mounted. 120 is perforated, and one end is provided with a connector 142 and a receptacle 144 for coupling with other substrates, respectively.

The mounting holes 120 are provided in plural so that the plurality of thermoelectric elements 110 may be mounted on the substrate 130. In this embodiment, ten thermoelectric elements may be mounted in two rows. The plurality of mounting holes 120 are all formed in the same shape, the mounting holes 120 formed in each column are arranged in a shape corresponding to each other.

Looking at the shape in more detail, the mounting hole 120 is formed of a square consisting of a pair of horizontal side 122 and the vertical side 124, the separation distance of the vertical side 124 (hereinafter, Horizontal width, D1 is a rectangle formed longer than the separation distance (hereinafter, referred to as the vertical width, D2) of the horizontal side 122. At this time, the vertical width (D2) is the same or shorter than one side of the thermoelectric element 110 is formed in a square, the horizontal width (D1) is formed longer than one side of the thermoelectric element. In addition, any one of the pair of horizontal sides 122 is formed with a locking projection 126 protruding inward of the mounting hole 120, the length of the vertical width is formed shorter.

The reason why the horizontal width D1 of the mounting hole 120 is longer than one side of the thermoelectric element 110 is to allow the thermoelectric element 110 to be easily mounted and removed from the mounting hole 120. For sake. In addition, the reason why the vertical width D2 of the mounting hole 120 is shorter than one side of the thermoelectric element 110 is to prevent the thermoelectric element 110 mounted on the mounting hole 120 from being arbitrarily removed. For sake. In other words, when the horizontal width D1 of the mounting hole 120 is long, spaces are provided at both sides of the thermoelectric element 110 so that tools can be used for mounting and dismounting so that mounting and dismounting operations can be easily performed. . In addition, when the vertical width (D2) of the mounting hole 120 is short, the engaging projection 126 and the horizontal side 122 of the mounting hole 120 is the thermoelectric element 110 in the state in which the thermoelectric element 110 is mounted. Since the silicon layer (S) filled in the side of the pressure is fixed by the thermoelectric element 110 can be prevented from being removed arbitrarily.

In this case, when the vertical width D2 is shortened due to the protrusion of the locking protrusion 126, the thermoelectric element 110 is difficult to be mounted and removed. In this embodiment, both ends of the locking protrusion 126 are prevented. A cutout 128 of a predetermined length was formed in the hooking protrusion 126 so as to be bent to some extent. Therefore, the mounting groove 120 is easy to mount and remove the thermoelectric element 110, it is possible to obtain all the effects to prevent the thermoelectric element 110 in the mounted state to be separated.

On the other hand, the conductive pattern 132 formed on the surface of the substrate 130 is formed in a form that can be electrically connected in series with a plurality of thermoelectric elements 110 mounted in the mounting hole 120, that is, both ends The portion and the end portion are provided with a connector 142 and a receptacle 144 corresponding to the connector 142, respectively. The connector 142 and the receptacle 144 are for coupling with another thermoelectric module. When the connector 142 and the receptacle 144 are used as shown in FIG. Removal is easy. Therefore, if necessary, the thermoelectric element module 100 can be easily increased or decreased. In this case, the connection between the thermoelectric element modules 100 includes a separate connection terminal in addition to the method of directly connecting the connector 142 and the receptacle 144 as described above. It is also possible to freely change the arrangement of the thermoelectric element module 100 by connecting the same.

As described above, the configuration and coupling structure of the thermoelectric element module according to the preferred embodiment of the present invention is shown in accordance with the above description and the drawings, but this is only an example and is within the scope not departing from the technical spirit of the present invention. It will be understood by those skilled in the art that various changes and modifications are possible in the art.

As described above, the thermoelectric module according to the present invention can be easily installed by mounting a thermoelectric element on a substrate and modularizing it, and a plurality of thermoelectric elements can be mounted on one substrate, thereby improving thermoelectric power generation or thermoelectric cooling performance. .

In addition, the thermoelectric element can be easily mounted and removed, and the thermoelectric element in the mounted state can be prevented from being arbitrarily removed.

In addition, since the conductive pattern of the substrate and the conductive electrode of the thermoelectric element are directly connected by the electrode terminal, the inside of the control box can be configured simply.

Claims (5)

delete A plurality of N-type and P-type thermoelectric semiconductors are positioned between a pair of ceramic panels spaced apart from each other, a conductive electrode is provided between the ceramic panel and the thermoelectric semiconductors, and silicon is disposed in the space between the ceramic panels. The filled thermoelectric element; A substrate including a plurality of mounting holes with protrusions protruding from one inner wall of the thermoelectric element; It is configured to include, wherein the substrate is a thermoelectric module, characterized in that the conductive pattern for electrically connecting the thermoelectric elements mounted in the plurality of mounting holes are formed. The method according to claim 2, Thermoelectric module, characterized in that a predetermined cut is formed on both sides of the engaging projection. The method according to claim 2 or 3, And a connector and a receptacle corresponding thereto are provided at both ends of the conductive pattern on the substrate. The method according to claim 2 or 3, And a pair of electrode terminals electrically connected to the conductive electrode on the thermoelectric element, and when mounted on a substrate, one end of the electrode terminal contacts the conductive pattern of the substrate.

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