KR100745345B1 - Laser scanning apparatus and method for fabricating organic light emitting display device using the same - Google Patents

Abstract

The present invention provides a laser irradiation apparatus capable of adjusting a driving speed of a laser head at a sealing start part, a sealing end part, and a corner part when a laser is irradiated to a sealing part of an organic light emitting display device through a program. The present invention relates to a method of manufacturing an organic light emitting display device. A laser irradiation apparatus according to the present invention includes a substrate and a mask on a substrate stage in a chamber, and a laser irradiation apparatus for fusion bonding a frit located at a sealing portion of the substrate, wherein the sealing is performed such that the frit curing degree of the sealing portion is uniform. It includes a laser head having a computing section for adjusting the laser traveling speed at the corner of the section and the straight section. By such a configuration, the adhesion of the frit may be increased to prevent peeling of the frit, and the sealing force may be improved to improve the life of the organic light emitting device.

Laser irradiation device, laser head traveling speed, corner part, frit

Description

LASER SCANNING APPARATUS AND METHOD FOR FABRICATION ORGANIC LIGHT EMITTING DISPLAY DEVICE USING THE SAME

1 is a schematic perspective view of a laser irradiation apparatus according to the present invention.

2 is a schematic perspective view of an organic light emitting display device according to the present invention;

3 is a plan view illustrating a first substrate of an organic light emitting display device according to an embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view of an organic light emitting display device taken along a line A-A 'of FIG.

♣ Explanation of symbols for the main parts of the drawing ♣

12a: second substrate 12b: first substrate

12c: opening 13: mask

14: frit 15: first alignment portion

16: laser head 16a: arithmetic unit

17: laser head guide 18: second alignment portion

The present invention relates to a laser irradiation apparatus and a manufacturing method of an organic light emitting display device using the same, and more particularly, when the laser is irradiated to the sealing portion of the organic light emitting display device, the sealing start portion, the sealing end portion and the corner portion By controlling the driving speed of the laser head in the laser, the adhesion of the frit is increased, which prevents the peeling of the frit and also improves the sealing force, thereby improving the life of the organic light emitting display device. A method of manufacturing an irradiation apparatus and an organic light emitting display device using the same.

Recently, an organic light emitting diode among organic semiconductor devices is most widely applied, and has a relatively simple structure. The organic light emitting diode is also referred to as an organic light emitting diode, and is a self-luminous device that uses an organic layer as a light emitting layer. Unlike a liquid crystal display, an organic light emitting diode does not require a separate back light to emit light, and thus, the thickness of the organic light emitting display itself. It is thin and light. Therefore, in recent years, organic light emitting display devices have been actively developed as display panels of portable information terminals such as mobile computers, portable telephones, portable game devices, and electronic books.

A typical organic EL device has a structure in which at least one organic film layer including a light emitting layer is interposed between a pair of electrodes, that is, the first electrode and the second electrode. The first electrode is formed on a substrate, and functions as an anode for injecting holes, and an organic layer is formed on the first electrode. On the organic layer, a second electrode serving as a cathode for injecting electrons is formed to face the first electrode.

In the organic light emitting device, when moisture or oxygen flows into the device from the surrounding environment, the life of the device is shortened due to oxidation and peeling of the electrode material, and the luminous efficiency is lowered and the color of light emission is deteriorated. do.

Therefore, in the manufacture of the organic light emitting device, a sealing treatment is usually performed to isolate the device from the outside and prevent moisture from penetrating. As such a sealing treatment method, typically, an organic polymer such as PET (polyester) is laminated on the second electrode of the organic light emitting device, or a cover or cap is formed of metal or glass containing a moisture absorbent, After filling nitrogen gas therein, a method of encapsulating the edge of the cover or cap with a sealing material such as epoxy is used.

However, such a method is impossible to block 100% of element destructive factors such as moisture or oxygen introduced from the outside, so that the device structure is disadvantageous to be applied to an organic electroluminescent device of an active top emitting structure in which the device structure is particularly vulnerable to moisture. The process is complicated. In order to solve the above problems, the method of encapsulating the capsule is improved by using a frit as a sealing material to improve the adhesion between the device substrate and the cap.

According to US Patent Publication No. 20040207314, which discloses a structure in which a frit is applied to a glass substrate to seal an organic light emitting device, the use of the frit completely seals the gap between the device substrate and the cap so that the organic field is more effectively. The light emitting device can be protected.

In the method of encapsulating the frit, the frit is applied to the sealing portions of the organic light emitting diodes, the laser head of the laser irradiation apparatus is moved, and the laser is irradiated to the sealing portions of the organic light emitting diodes. The frit is hardened and sealed.

However, in general, the running speed of the laser head is constant at any value between 10 and 20 mm / s. In such a laser irradiation apparatus, when the laser head only travels linearly as in the straight part, the sealing start part of the sealing part is used. At the sealing end and at the corner, double or broken irradiation is made.

Therefore, the sealing force decreases as the adhesion to a part of the organic light emitting device sealing portion decreases, thereby causing a problem of deterioration and deterioration of the organic light emitting device.

Accordingly, the present invention is an invention designed to solve the above-mentioned conventional problems, and an object of the present invention is when a laser is irradiated to a sealing portion of an organic light emitting display device, the laser at the sealing start portion, the sealing termination portion and the corner portion. The present invention provides a laser irradiation apparatus capable of adjusting a traveling speed of a laser head and a method of manufacturing an organic light emitting device using the same.

In order to achieve the above object, in the laser irradiation apparatus having a substrate and a mask on the substrate stage in the chamber according to the present invention, and melt-bonding the frit located in the sealing portion of the substrate, the frit curing degree of the sealing portion A laser head including a calculating part for adjusting a laser traveling speed at a corner part of the sealing part and a straight part to be uniform, a laser head guide for supporting the laser head, and the laser head moving the upper part of the sealing part; A first CCD attached to one region of a laser head guide to measure positions of the substrate and the mask, and attached to at least one first alignment portion for aligning the substrate and the mask and one region of the laser head And a second CCD for measuring the position of the substrate and the laser head, And a second alignment portion for aligning the laser heads.

In addition, a first substrate including a pixel region having at least one organic light emitting element formed thereon and a non-pixel region formed at an outer edge of the pixel region, and the pixel region of the first substrate. A method of manufacturing an organic light emitting display device using a laser irradiation device, comprising: a second substrate and a mask bonded to an area including the second substrate; A first step of applying and then firing the frit on one region of the non-pixel region, a second step of bonding the first substrate and the second substrate, and a third step of placing a mask on the second substrate The laser head, which is supported and moved by the laser head guide on the mask, adjusts the laser traveling speed by a calculating part and irradiates a laser to the sealing part. And a fourth step of curing the frit.

Hereinafter, a laser irradiation apparatus and a method of manufacturing an organic light emitting display device using the same according to the present invention will be described in detail with reference to the accompanying drawings.

In general, frit is used in the meaning of powder in the glass state, but the frit in the present invention is collectively used in the glass state of the gel state to which the organic substance is added to the powder state and the glass of the solid state cured by laser irradiation.

1 is a schematic perspective view of a laser irradiation apparatus according to the present invention.

Referring to FIG. 1, a laser irradiation apparatus for fusion bonding a frit 14 located in a sealing portion 12c of a substrate according to the present invention may include a first substrate 12b on a substrate stage 11 inside a chamber 10. And the second substrate 12a is seated. A mask 13 having a sealing portion 12c patterned on the second substrate 12a, and a transmitting portion 13a for transmitting the laser and supporting the mask 13 is attached to the mask 13. have.

The frit 14 is applied to the sealing portion 12c of the second substrate 12a, and the laser at the corner portion and the straight portion of the sealing portion 12c is disposed outside or inside the chamber 10. The hardening degree of the frit 14 of the said sealing part 12c becomes uniform by the calculating part 16a which adjusts a running speed.

The calculating unit 16a is a predetermined laser traveling speed adjusting program connected to the outside, and adjusts the laser traveling at the corner portion to be the same or slower than the laser traveling speed at the straight portion of the sealing unit 12c. In addition, by controlling the laser traveling speed at the beginning and the end of the sealing to prevent double irradiation and disconnection irradiation, the frit hardening degree of the entire sealing portion is made uniform.

The laser head 16 is supported by the laser head guide 17, and is mounted to move on top of the substrates 12a and 12b. One area of the laser head guide 17 includes a first CCD for measuring positions of the substrates 12a and 12b and the mask 13, and the substrates 12a and 12b by the first CCD. At least one first alignment part 15 for aligning the mask 13 is mounted. Accordingly, the first alignment unit 15 aligns the shape of the sealing unit 12c so that the patterned mask 13 and the substrates 12a and 12b coincide with each other.

One area of the laser head 16 includes a second CCD for measuring positions of the substrates 12a and 12b and the laser head 16. The substrates 12a and 12b are formed by the second CCD. ) And a second alignment portion 18 for aligning the laser head 16 with each other. Thus, the second alignment portion 18 aligns the moving position of the laser head 16 with the sealing portion 12c.

The temperature adjusting part 19 for adjusting the temperature inside the chamber with a temperature sensor is further provided at a position corresponding to the second alignment part 18 of the laser head 16.

In addition, the substrate stage 11 is formed to be at least larger than the substrates 12a and 12b to support the substrates 12a and 12b and to form the pattern of the sealing portion 12c in the mask 13. It is.

Although not shown in the drawing, a monitoring camera is installed in the chamber 10 where laser sealing is performed, and thus, a failure rate of the organic light emitting display device can be reduced by monitoring the sealing process.

Hereinafter, a method of manufacturing an organic light emitting display device using the laser irradiation device of the present invention will be described.

In the method of manufacturing an organic light emitting display device according to the present invention, first, a pixel area in which at least one organic light emitting element is formed on a substrate stage 11 in a chamber 10 and a non-pixel formed at an outer edge of the pixel area. A first substrate 12b including a region, a second substrate 12a and a mask 13 bonded to one region including the pixel region of the first substrate 12b are provided.

Then, the frit 14 in a solid state is coated on one region of the non-pixel region of the second substrate 12a. At this time, when the heat applied to the glass material is sharply dropped to produce the frit 14 to be used, the frit 14 in the form of a glass powder is produced. In general, the frit 14 includes an oxide powder in the glass powder. do. Then, an organic substance is added to the frit 14 containing the oxide powder to make a paste in a gel state, and then fired in a range of 300 ° C to 700 ° C. At this time, when the temperature for firing the frit 14 is 300 ° C. or less, the organic matter does not disappear well even when the firing process is performed. When the firing temperature is 700 ° C. or higher, it is not preferable to increase the firing temperature to 700 ° C. or higher because the intensity of the laser beam must also be proportionally counted in response to the increase in the firing temperature.

When the frit 14 is fired, the organic material is extinguished in the air, and the gel paste is cured to exist as the solid frit 14.

An organic film layer (not shown) is formed on the first substrate 12b. The organic film layer essentially includes a light emitting layer, and includes at least one selected from the group consisting of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. It includes either.

Thereafter, the first substrate 12b and the second substrate 12a are bonded to each other. In this case, the second substrate 12a is disposed on the first substrate 12b so that the first substrate 12b and the second substrate 12a overlap a portion of the pixel region and the non-pixel region. The frit 14 is provided between the first substrate 12b and the second substrate 12a in the non-pixel region.

Then, the mask 13 having the pattern of the sealing part 12c formed on the second substrate 12a is positioned, and the first alignment part 15 attached to one region of the laser head guide 17 is disposed. The sealing part 12c of the second substrate 12a and the mask 13 are aligned with each other through the first CCD.

Finally, the laser head 16 moving on the mask 13 by the laser head guide 17 adjusts the laser traveling speed by the calculating part 16a, and ranges from 25 mW to 50 mW to the sealing part 12c. By irradiating the laser with the intensity of, the frit 14 is cured to bond the first substrate 12b and the second substrate 12a together.

At this time, the moving position of the laser head 16 and the sealing part 12c of the substrates 12a and 12b through the second CCD of the second alignment unit 18 attached to one region of the laser head 16. Sorts to match. The calculation unit 16a, which is a program for adjusting the laser travel speed, is equal to or more than the laser travel speed at the start point of the sealing part, the sealing end part, and the corner part, than the laser travel speed at the straight part of the sealing part 12c. Programmatically adjust to move slowly. Therefore, the double irradiation and the disconnection irradiation of a laser can be prevented, and the hardening degree of the frit 14 of the whole sealing part 12c can be made uniform.

2 is a schematic perspective view of an organic light emitting display device according to the present invention.

Referring to FIG. 2, the organic light emitting display device 20 according to the present invention includes a first substrate 21 having an image display unit 25 including at least one organic light emitting diode (not shown), and the first substrate 21. The second substrate 23 is formed on the first substrate 21 to encapsulate the pixel region 25. Although not shown in the drawings, a thin film transistor and an organic light emitting diode are formed on the first substrate 21.

A pad portion 27 having at least one terminal is formed at the other end of the first substrate 21, which is an area other than the pixel area 25. The pad part 27 is connected to an interface panel (not shown) such as a flexible printed circuit board (FPCB) and an integrated circuit (IC), and a terminal formed on the pad part 27 and a plurality of dummy pins formed on the interface panel. Are electrically connected to drive the organic light emitting display device 20.

The sealing part 24 is formed along the circumferential area of the pixel area 25, which is an area excluding the pad part 27 of the first substrate 21. The frit 22 is coated on the sealing part 24, and the driving speed of the laser head is controlled by a laser irradiation device to seal the organic light emitting element formed on the pixel region 25, and the frit 22 is applied to the sealing part 24. Is cured to bond the first substrate 21 and the second substrate 23 together.

The second substrate 23 is made of plastic or glass having insulation and transparency, and in particular, glass is widely used as a material of the second substrate 23 because of excellent insulation, transparency and water resistance.

3 is a plan view illustrating a first substrate of an organic light emitting display device according to an exemplary embodiment.

As shown in FIG. 3, the first substrate 37 includes a pixel region 31 and a non-pixel region 32 surrounding the pixel region 31. In the pixel region 31, a plurality of organic light emitting diodes 30 connected in a matrix manner are formed between the scan line 34 and the data line 36, and the pixel region 31 is formed in the non-pixel region 32. Scan line 34 and data line 36 extending from scan line 34 and data line 36, a power supply line (not shown) for operation of organic light emitting diode 30, and a pad ( The scan driver 33 and the data driver 35 which process signals supplied from the outside through the 34a and 36a and supply them to the scan line 34 and the data line 36 are formed.

4 is a schematic cross-sectional view illustrating an organic light emitting display device taken along a line A-A 'of FIG. 2.

Referring to FIG. 4, the organic light emitting display device will be briefly described. A buffer layer 41 is formed on a first substrate 40, and an active channel layer 42a and a source / drain region 42b are formed on the buffer layer 41. ), A semiconductor layer including an LDD layer (not shown) is formed. The gate insulating layer 43 and the gate electrode 44 are patterned on the semiconductor layer and sequentially formed. An interlayer insulating layer 45 is formed on the gate electrode 44 to expose the source / drain region 42b of the semiconductor layer, and a source and drain electrode so as to contact the exposed source / drain region 42b. 46a and 46b are formed on one region of the interlayer insulating layer 45.

A via hole is formed on the interlayer insulating layer 45 and a region of the planarization layer 47 is etched on the planarization layer 47 so that the drain electrode 46b is exposed. The drain electrode 46b and the first electrode layer 48 are electrically connected through each other (not shown). The first electrode layer 48 is formed in one region of the planarization layer 47, and the pixel definition in which the opening 54 is formed on the planarization layer 47 to at least partially expose the first electrode layer 48. A film 49 is formed.

In addition, an organic layer 50 is formed on one region and the opening 54 of the pixel defining layer 49, and the second electrode layer 51 is formed on the entire surface of the organic layer 50 and the pixel defining layer 49. Is formed.

The organic film layer 50 essentially includes a light emitting layer, and in addition, includes a variety of known organic film layers such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. The organic film layer may have a single layer structure consisting of only a light emitting layer, or may have a multilayer structure consisting of an organic film layer different from the light emitting layer. The organic layer 50 may be made of various light emitting materials that are commonly used. Specifically, the organic layer 50 may be made of conductive, nonconductive or semiconducting organic monomolecules, oligomers, or polymers.

When a voltage is applied to the organic light emitting device formed as described above, electrons and holes from the first electrode layer and the second electrode layer are recombined in the organic film layer 50 which is the light emitting layer, respectively, to emit light.

When moisture or oxygen is introduced into the device from the surrounding environment, the organic light emitting device may shorten the life of the device due to oxidation or peeling of the electrode material, not only to lower the luminous efficiency but also to change the color of the emitted light. Therefore, after the sealing process is performed with a second substrate (Encapsulation) 53 to protect the organic light emitting device, a connector for connecting an external signal terminal is mounted to complete the product. In this case, the second substrate for sealing the organic light emitting device should have excellent waterproofness, low absorption rate, low water passing rate, and high osmotic resistance.

In the present invention, the frit 52 is used to bond the second substrate 53 that seals the organic light emitting device to the first substrate 40. Since the frit 52 is made of the same glass material as the first substrate 40 and the second substrate 53, there is almost no permeation of moisture, thereby completely preventing device destruction due to inflow of external moisture. That is, the sealing force against external moisture of the organic light emitting device can be greatly improved, so that there is no need to mount a moisture absorbent material therein.

In the above-described embodiment, the frit is applied to the second substrate and bonded to the first substrate. However, the frit may be applied to the first substrate or both substrates to bond the first substrate and the second substrate.

Although the technical spirit of the present invention has been described in detail according to the above-described preferred embodiment, it should be noted that the above-described embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention.

As described above, according to the present invention, when the laser is irradiated to the sealing portion of the organic light emitting display device, the running speed of the laser head at the sealing start portion, the sealing termination portion and the corner portion is programmed. By adjusting, the adhesion of the frit is increased to prevent the peeling phenomenon of the frit, and the sealing force is improved, thereby improving the life of the organic light emitting device.

Claims (15)

A laser irradiation apparatus comprising a substrate and a mask on a substrate stage in a chamber, wherein the frit is melt-bonded to a frit located at a sealing portion of the substrate. A laser head including a calculating part for adjusting a laser traveling speed at the beginning part, the end part, and the corner part and the straight part of the sealing part so that the frit curing degree of the sealing part is uniform; A laser head guide which supports the laser head and moves the upper portion of the sealing part by the laser head; At least one first alignment unit attached to one region of the laser head guide, the first CCD configured to measure positions of the substrate and the mask, and for aligning the substrate and the mask; And And a second alignment unit attached to one region of the laser head to measure a position of the substrate and the laser head, and a second alignment unit for aligning the substrate and the laser head. Device. According to claim 1, And the calculation unit adjusts the laser traveling speed at the start, the end, and the corner to be the same or slower than the laser traveling speed at the linear portion of the sealing portion. According to claim 1, The calculation unit is a laser irradiation apparatus, characterized in that the predetermined laser traveling speed control program connected to the outside. According to claim 1, The substrate may include a first substrate including a pixel region in which at least one organic light emitting element including a first electrode, an organic layer, and a second electrode is formed, and a non-pixel region formed at an outer edge of the pixel region, and the first substrate. And a second substrate bonded to one region including the pixel region of the substrate, wherein the frit is applied to one region of the non-pixel region between the first substrate and the second substrate. According to claim 1, The mask is laser irradiation apparatus, characterized in that the pattern of the sealing portion is formed. According to claim 1, And a temperature control unit attached to a position corresponding to the second alignment unit of the laser head to adjust the temperature inside the chamber. The method of claim 6, And the temperature controller is a temperature sensor. According to claim 1, And the substrate stage is at least larger than the substrate. A first substrate including a pixel region having at least one organic light emitting element formed on the substrate stage and a non-pixel region formed at an outer edge of the pixel region, and bonded to one region including the pixel region of the first substrate; A method of manufacturing an organic light emitting display device using a laser irradiation device having a second substrate and a mask and melting and bonding a frit located at a sealing portion of the first substrate, A first step of applying a frit on one region of the non-pixel region of the second substrate and then baking the frit; A second step of bonding the first substrate and the second substrate; A third step of positioning a mask on the second substrate; And a fourth step of the laser head supported and moved by the laser head guide on the mask to adjust the laser traveling speed by a calculation unit and irradiate a laser to the sealing unit to cure the frit. A method of manufacturing an organic light emitting display device using a laser irradiation device. The method of claim 9, In the fourth step, the calculating unit adjusts the laser traveling speed at the start portion, the end portion and the corner portion to be equal to or slower than the laser traveling speed at the straight portion of the sealing portion. A method of manufacturing an organic light emitting display device using the same. The method of claim 9, In the third step, the organic field using the laser irradiation apparatus, the alignment of the sealing portion of the second substrate and the mask is aligned through the first CCD of the first alignment portion attached to one area of the laser head guide. Method of manufacturing a light emitting display device. The method of claim 9, In the fourth step, the alignment position of the laser head and the sealing portion of the second substrate to be aligned by the second CCD of the second alignment portion attached to one area of the laser head using a laser irradiation apparatus A method of manufacturing an organic light emitting display device. The method of claim 9, And the temperature for firing the frit in the first step is in the range of 300 ° C to 700 ° C. The method of claim 9, And the intensity of the laser irradiated to the frit in the fourth step is in the range of 25 mW to 50 mW. The method of claim 9, The organic layer of the organic light emitting device formed on the substrate in the first step essentially includes a light emitting layer, at least one selected from the group consisting of a hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer A method of manufacturing an organic light emitting display device using a laser irradiation apparatus comprising a.

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