KR100740250B1 - Vision inspection system and method for inspection using thereof - Google Patents

Abstract

The present invention relates to a vision inspection system and an inspection method using the same to improve the inspection speed in classifying after determining whether or not normal or defective through the image taken after the semiconductor package.

The vision inspection system of the present invention for this purpose, the first imaging means comprising a first illumination means for generating illumination on one side of the semiconductor package and a first imaging device for imaging the image reflected from one side of the semiconductor package; A first vision computer and a second vision for selectively outputting a photographing driving control signal to the first photographing means and selectively receiving a video signal from the imaging device to analyze an image to determine whether the semiconductor package is normal or defective; made in the first non-computer unit consisting of a computer, receives the image signal from the first photographing means includes a first digital video router to selectively distribute the image to the first vision computer or the second non-computer The first vision computer 41 and the second vision computer 42 To proceed to the analysis alternate with the first recording control signal output of the recording means (2) at the same time.

In addition, the vision inspection method of the present invention, after generating a drive signal selectively to the imaging means, if the image signal from the imaging means is distributed through the digital video router to analyze the image data to determine whether the semiconductor package is normal or defective A method of using a vision inspection system comprising a first vision computer and a second vision computer, the method comprising: outputting a driving control signal to a photographing means through the first vision computer and analyzing image data input to the first vision computer; Determine whether it is normal or defective, and output the driving control signal to the photographing means through the second vision computer, and analyze the image data input to the second vision computer to determine whether it is normal or defective and at the same time the first Outputting a driving control signal to the photographing means through the vision camera; And classifying the semiconductor package according to the determination result of the vision computer and the second vision computer.

Vision computer, multi, classification, inspection

Description

VISION INSPECTION SYSTEM AND METHOD FOR INSPECTION USING THEREOF

1 is an overall configuration diagram of a vision inspection system according to an embodiment of the present invention.

2 is a block diagram of each vision computer of the vision inspection system according to the present invention.

3 is a block diagram illustrating additional aspects of the present invention.

Figure 4 is a schematic diagram illustrating a vision inspection system according to the prior art.

<Description of the symbols for the main parts of the drawings>

1: semiconductor package

2: first shooting means

    21: lighting means

         211: light source, 212: reflection mirror

    22: imaging device

    23: conveying means, 231: motor

3: the first digital video router

4: first vision computer unit

    41: first vision computer, 42: second vision computer

         411: memory unit, 412: input unit, 413: image analyzer

         414: comparison judgment unit, 415: communication unit

         416: drive control unit

               416a: imaging means control section, 416b: lighting means control section,

               416c: motor drive control unit

5: central computer

6: classification means

The present invention relates to a method for classifying a semiconductor package after inspecting the semiconductor package, and more particularly, a vision for improving inspection speed in classifying a semiconductor package after determining whether it is normal or defective based on a photographed image. An inspection system and an inspection method using the same.

In general, semiconductor devices are manufactured through a series of processes and must be thoroughly inspected before shipment.

However, these semiconductor devices require a higher degree of precision than other components, so that any defect in not only the internal components of the package but also the appearance thereof may have a fatal effect on performance.

Examination of external defects of such semiconductor devices, for example, solder paste shape of a chip-bonding portion of a PCB substrate, and lead shape or lead of a ball grid array (BGA) type in surface mount technology Defect inspection is one of the very important processes.

4 is a schematic diagram illustrating a vision inspection system according to the related art, and includes a conveying means 200 for transferring the semiconductor package 100 and illumination light on the surface of the semiconductor package 100 on the semiconductor package 100. A CCD camera 400 including an illumination means 300 comprising a light source 310 and a reflection mirror 320, an imaging device 410 on which an image reflected from the semiconductor package 100 is picked up, and a CCD; The image acquisition board 500 converts an image signal from the camera 400 into a digital signal, and analyzes an image obtained from the image acquisition board 500 to determine whether a semiconductor package is defective or not, and the lighting means 300. ) And a central control unit 600 for controlling the driving of the CCD camera 400 and the transfer means 200.

The central controller 600 analyzes the obtained image signal to determine whether the semiconductor package 100 is normal or defective and then outputs a classification control signal to a classification means although not shown.

In the inspection method using the vision inspection system configured as described above, when the driving signal is output to the camera 400 and the lighting means 300 provided at one side of the semiconductor package 100 in the central controller 600, the semiconductor package 100 may be used. The image reflected from one side of the image is captured on the image pickup surface of the image pickup device 410 of the camera 400, the image captured is converted into a digital signal through the image acquisition board 500 is input to the central control unit 600.

Then, the central control unit 600 analyzes the input image signal, determines whether the semiconductor package 100 is defective, and then supplies a driving signal to the camera 400 and the lighting means 300 to obtain subsequent image information. Will print.

However, according to the vision inspection method using the vision inspection system according to the prior art, it takes a long time to determine the presence or absence of defects through image acquisition and image analysis of the semiconductor package.

That is, when an image acquired through a camera is input after generating a synchronization signal for capturing an image by capturing a semiconductor package, imaging of the camera is analyzed to determine whether there is a defect or not.

Since the synchronization path for acquiring a subsequent image is generated in the camera only after determining the analysis and the defect, the inspection speed decreases as the camera stops the imaging operation while analyzing the image in the computer of the central controller.

SUMMARY OF THE INVENTION In order to solve the above problems according to the prior art of the present invention, an object of the present invention is to provide a driving means output signal to the photographing means and a multi-computer equipped to analyze the image taken through the photographing means outputs the photographing means drive signal output And a vision inspection system and an inspection method using the same, which can reduce inspection time as multiple computers alternately perform image analysis.

The vision inspection system of the present invention for solving the above technical problem comprises a first illumination means for generating illumination on one side of the semiconductor package and a first imaging device for imaging the image reflected from one side of the semiconductor package A first vision for selectively outputting a photographing driving control signal to the photographing means and the first photographing means, selectively receiving an image signal from the imaging device, and analyzing the image to determine whether the semiconductor package is normal or defective; A first vision computer comprising a computer and a second vision computer, and a first digital video for receiving an image signal from the first photographing means and selectively distributing the image to the first vision computer or the second vision computer. Including a router, the first vision computer 41 and the second vision computer The data 42 alternately analyzes an image signal and outputs a photographing drive control signal to the first photographing means 2 simultaneously.

In this case, the vision inspection system preferably further comprises a central computer for receiving a normal or bad determination result from each of the vision computer and outputs the semiconductor package classification signal according to the result.

In addition, the vision inspection method of the present invention for solving the above technical problem, after generating a drive signal selectively to the imaging means, if the image signal from the imaging means is distributed through the digital video router to analyze the image data of the semiconductor package A vision inspection system comprising a first vision computer and a second vision computer for determining whether it is normal or defective, wherein the driving control signal is output to a photographing means through the first vision computer, and the image is input to the digital video router. Distributing and outputting the data to the first vision computer, analyzing the image data input to the first vision computer to determine whether it is normal or defective, and outputting a driving control signal to the photographing means through the second vision computer, Image data input to the digital video router to the second vision computer Distribute output, analyze image data input to the second vision computer to determine whether it is normal or bad, and output a drive control signal to a photographing means through a first vision camera, wherein the first vision computer and the first vision computer 2 classifying the semiconductor package according to the determination result of the vision computer.

The invention will become more apparent through the preferred embodiments described below with reference to the accompanying drawings. Hereinafter will be described in detail to enable those skilled in the art to easily understand and reproduce through embodiments of the present invention.

1 is an overall configuration of a vision inspection system according to an embodiment of the present invention.

Referring to the drawings, the present invention selectively outputs a driving control signal to the first photographing means 2 for photographing one side of the semiconductor package 1 and the first photographing means 2 and converts the input image into a digital signal. A first vision computer unit 4 including a computer including an image acquisition board for converting, and a first digital for distributing an image signal from the first photographing means 2 to the first vision computer unit 4. It consists of a video router 3.

In addition, a central computer 5 may be further included to input the analysis result from the first vision computer unit 4 to separate the defective device through the separating means.

The first photographing means 2 captures a plurality of first illumination means 21 for generating illumination on one side of the semiconductor package 1 and an imaging element 22 for capturing an image reflected from one side of the semiconductor package 1. It is configured to include). In this case, the illumination means 21 may be composed of a light source 211 and a reflection mirror 212 for generating illumination light on one side of the semiconductor package 1, the imaging device 22 is a line scan camera (Line) scan camera) can be used.

In addition, a transfer means 23 may be further provided to transfer the semiconductor package 1 to the photographing area, and the transfer means 23 may be provided with a motor 231.

The first vision computer unit 4 selectively outputs a photographing driving control signal to the first photographing means 2, selectively receives an image signal from the image pickup device 22, analyzes an image, and analyzes a corresponding semiconductor package. And a first vision computer 41 and a second vision computer 42 for determining whether or not it is normal or defective in (1).

The first vision computer 41 and the second vision computer 42 preferably incorporate an image acquisition board for converting the image signal acquired by the first photographing means 2 into a digital image signal.

Accordingly, while the first vision computer 41 outputs the driving signal to the first photographing means and receives the captured image signal from the first vision computer 41 to analyze the corresponding image, the second vision computer 42 ) Outputs the driving control signal to the first photographing means 2 and receives the captured image from the second vision computer 42 and analyzes the corresponding image, while again photographing the first vision computer 41. The drive control signal is output and this series of steps is repeated.

As described above, as the first vision computer 41 and the second vision computer 42 alternately repeat image capturing and analysis, the vision inspection speed is improved.

The first digital video sharer (3) receives an image signal from the image pickup device (22) of the first photographing means (2) and transfers the image to the first vision computer (41) or the second vision computer (42). And to distribute the video signal via an internal switching means.

In this case, the switching means may be controlled by the central computer 5 or by the respective vision computers 41 and 42 that are given control by outputting a driving control signal to the first photographing means 2. .

The central computer 5 receives normal or bad determination result information transmitted through the communication unit 415 of the first vision computer unit 4 and outputs a classification control signal to the classification means 6 according to the result. It is provided to classify the semiconductor package 1.

On the other hand, the first vision computer 41 and the second vision computer 42 is configured as shown in FIG.

The first vision computer 41 and the second vision computer 42 may include a memory unit 411 in which reference information about a normal state of the semiconductor package 1 is stored, and digital data from the first image acquisition means 4. An input unit 412 through which an image signal is input, an image analyzer 413 for analyzing a digital image signal input through the input unit 412, and an analysis result and a memory unit 411 of the image analyzer 413. A comparison determination unit 414 for comparing the reference information stored in the device to determine whether it is normal or bad, and a communication unit 415 for transmitting the determination result of the comparison determination unit 414 to the central computer 5. It is done by

At this time, each of the vision computers 41 and 42 has an imaging means controller 416a for outputting a driving signal to the imaging means 22 and an illumination means controller 416b for controlling the driving of the illumination means 21. It may further include a drive control unit 416 configured to include, the lighting means control unit 416b controls the driving of the light source 211 and the reflection mirror (212).

In addition, the driving controller 416 controls the driving of the motor 231 of the transfer means 23 for transferring the semiconductor package 1 to the photographing area by driving the motor 231 through the transfer means 23. The driving controller 416c may further be included.

3 is a configuration diagram showing an additional aspect of the present invention, the second photographing means 2 'for photographing the other side of the semiconductor package 1 in the vision inspection apparatus according to an embodiment of the present invention, and the second A second vision computer section 4 'for selectively outputting a drive control signal to the photographing means 2', and an image signal from the second photographing means 2 'to the second vision computer section 4'. It further comprises a second digital video router (3 ') for distributing.

The second vision computer unit 4 'selectively outputs a driving control signal to the second photographing means 2' and selectively receives an image signal from the second photographing means 2 'to analyze the image. And a third vision computer 41 'and a fourth vision computer 42' for determining whether the semiconductor package is defective or not.

Preferably, the third vision computer 41 'and the fourth vision computer 42' have an image acquisition board for converting the image signal acquired by the second photographing means 2 'into a digital image signal.

The second digital video router 3 'receives an image signal from the image pickup device 22' of the second photographing means 2 'and receives the image from the first vision computer 41' or the second vision computer. And 42 'to selectively distribute the video signal through internal switching means.

At this time, each component according to the additional aspect of the present invention is the same as one embodiment of the present invention, the description of the purpose of the specific configuration thereof will be omitted.

Hereinafter, a vision inspection method using a vision inspection system according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 and 2. First, a driving control signal is output to a motor by a photographing means through a first vision computer 41. Drive the transfer means to transfer the semiconductor package to the photographing area, and output driving control signals of the illumination means 21 and the image pickup means 22 to adjust the light source 211 and the reflection mirror 212 to obtain desired illumination. Is generated and an image of the semiconductor package 1 is picked up.

Then, an image signal picked up by the imaging means 22 and input to the first digital video router 3 is output to the first vision computer 41. At this time, if the distribution of the video signal in the first digital video router 3 is made by the internal switching means, the switching means is controlled in accordance with the control signal of the central computer 5 or is controlled by the first photographing means 22. It can be controlled by the control signal of the master computer which generated the signal.

Meanwhile, the first vision image signal is converted into a digital image signal, the converted digital image signal is analyzed by the image analyzer 413, and the analyzed information is transmitted from the comparison determiner 414 to the memory unit 411. The drive control signal is output to the first photographing means 2 through the second vision computer while determining whether the semiconductor package is normal or defective according to the result by comparing with the stored reference information.

At the same time, whether the semiconductor package 1 is judged to be normal or defective is transmitted to the central computer 5 through the communication unit 415 so that the central computer 5 controls the driving of the classification means 6 according to the result. To classify the semiconductor package 1.

Meanwhile, the image signal photographed according to the control signal of the second vision computer 42 is input to the second vision computer 42 through the digital video router 3.

The image signal input to the second vision computer 42 is converted into a digital image signal through an image acquisition board provided therein.

The image signal converted into the digital image signal is analyzed by the image analyzer 413, and the analyzed information is compared with the reference information previously stored in the memory unit 411 by the comparison determination unit 414. The drive control signal is output to the first photographing means 2 through the first vision computer 41 while determining whether the package is normal or defective.

At the same time, whether the semiconductor package 1 is judged to be normal or defective is transmitted to the central computer 5 through the communication unit 415 so that the central computer 5 can pass the semiconductor package through the classification means 6 according to the result. Classify (1).

Subsequently, the process of acquiring an image by driving a photographing means through the first vision computer 41 and the second vision computer 42 and analyzing the acquired image is alternately repeated to inspect and classify the semiconductor package. Proceed.

As described above, the present invention includes a multi-computer that outputs a driving signal to the photographing means and analyzes the image photographed by the photographing means, so that one computer analyzes the image acquired through the photographing means and the other vision computer The vision computer outputs a photographing drive signal to the photographing means and analyzes the acquired image. The vision computer which has completed the image analysis again outputs a driving signal to the photographing means. Alternately, the inspection time can be shortened to improve inspection and classification efficiency.

Although the present invention has been described with reference to the accompanying drawings, it will be apparent to those skilled in the art that many different and obvious modifications are possible without departing from the scope of the invention from this description. Therefore, the scope of the invention should be construed by the claims described to include many such variations.

Claims (9)

First imaging means comprising a first illumination means 21 for generating illumination on one side of the semiconductor package 1 and a first imaging element 22 for imaging an image reflected from one side of the semiconductor package 1. (2); Selectively outputting a photographing driving control signal to the first photographing means 2 and selectively receiving an image signal from the imaging device 22 to analyze an image to determine whether the semiconductor package 1 is normal or defective; A first vision computer section 4 composed of a first vision computer 41 and a second vision computer 42; And the comprises a first recording means 2, the video signal first digital video router (3) for inputting received selective distribution of the image by the first non-computer 41 or the second non-computer 42 a from It's done, The first vision computer 41 and the second vision computer 42 perform an analysis on an image signal and outputting a photographing driving control signal to the first photographing means 2 simultaneously. system. The method of claim 1, The vision inspection system; And a second photographing means (2 ') for photographing the other side of the semiconductor package (1). The method of claim 2, The vision inspection system; Selectively outputting a driving control signal to the second photographing means 2 ', selectively receiving an image signal from the second photographing means 2', and analyzing the image to determine whether the semiconductor package is defective; A second vision computer section 4 'composed of a third vision computer 41' and a fourth vision computer 42 ', A second digital video router 3 'that receives an image signal from the second photographing means 2' and selectively distributes the image to the third vision computer 41 'or the fourth vision computer 42'. ); Vision inspection system, characterized in that it further comprises. The method of claim 3, wherein The vision inspection system; It further comprises a central computer (5) for receiving the normal or bad determination results from each of the vision computer (41, 42, 41 '. 42') and outputs the corresponding semiconductor package 1 classification signal according to the result. A vision inspection system characterized by the above. The method of claim 3, wherein Each of the vision computers 41, 42, 41 ', 42'; A memory unit 411 storing reference information on a normal state of the semiconductor package 1, An input unit 412 to which an image signal photographed by the photographing means 2, 2 'is input; An image analyzer 413 for analyzing a digital image signal input through the input unit 412; A comparison determination unit 414 for comparing the analysis result of the image analysis unit 413 with reference information stored in the memory unit 411 to determine whether it is normal or bad; And a communication unit (415) for transmitting the central computer (5) to the determination result of the comparison determination unit (414). The method of claim 5, Each of the vision computers 41, 42, 41 ', 42'; Outputting a drive signal to the imaging means 22 further includes a driving control part 416 comprising an imaging means control part 416a and an illumination means control part 416b for controlling the driving of the illumination means 21. A vision inspection system characterized by the above. The method of claim 6, The first digital video sharer 3 or the second digital video sharer 3 'outputs a drive control signal to the photographing means to control the vision computer 41, 42, 41', 42 'or the central computer. Vision inspection system, characterized in that controlled by (5). After the driving signal is selectively generated by the photographing means and the image signal from the photographing means is distributed through the digital video router, the first vision computer and the second vision computer which analyze the image data to determine whether the semiconductor package is normal or defective are provided. In the vision inspection system comprising: Outputting a driving control signal to the photographing means through the first vision computer, Distributing and outputting image data input to the digital video router to a first vision computer, Analyzing the image data input to the first vision computer to determine whether it is normal or defective and at the same time outputs a drive control signal to the photographing means through the second vision computer, Distributing and outputting image data input to the digital video router to a second vision computer, Analyzing the image data input to the second vision computer to determine whether it is normal or bad, and outputs a driving control signal to the photographing means through the first vision camera, And classifying the semiconductor package according to the determination result of the first vision computer and the second vision computer. The method of claim 8, Controlling the digital video router to distribute the image data to the first vision computer or the second vision computer, The vision inspection method, characterized in that the first vision computer or the second vision computer outputs a photographing means drive control signal outputted by a corresponding vision computer granted control, or is carried out under the control of a central computer.

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