KR100728989B1 - Substrate for fbga package fabrication - Google Patents

Abstract

A substrate for manufacturing an FBGA(Fine-pitch Ball Grid Array) package is provided to improve the productivity by increasing the number of FBGA packages formed on one strip level substrate as well as one disc using an optimum and maximum sized strip level substrate. A packaging process is performed by using a strip level substrate(40) with a plurality of unit level substrates(42). The size of the strip level substrate is in a predetermined range of 240 mm x 74 mm. The size of the strip level substrate has a fluctuation width of ± 10 mm or less. The number of unit level substrates on the strip level substrate is 120.

Description

Substrate for FBGA package fabrication

1 is a cross-sectional view showing a conventional FBGA package.

2A and 2B are plan views illustrating a substrate for manufacturing a conventional FBGA package.

3 is a view showing a panel (panel) configuration for manufacturing a substrate for manufacturing a conventional FBGA package.

4 and 5a and 5b is a plan view showing a substrate for manufacturing an FBGA package according to the present invention.

Figure 6 is a view showing a panel (panel) configuration for manufacturing a substrate for manufacturing a FBGA package according to the present invention.

7A and 7B are views for explaining an arrangement structure of a unit level substrate in a substrate for manufacturing a FBGA package according to the prior art and the present invention.

Explanation of symbols on the main parts of the drawings

40, 40A, 40B: strip level board 42, 42A, 42B: unit level board

60: panel

The present invention relates to an FBGA package, and more particularly, to a substrate for manufacturing a FBGA package to improve productivity.

As is well known, semiconductor packages have been developed in the direction of improving their electrical properties while reducing their size. A ball grid array (BGA) package is a good example of this, and since the overall size is similar to the chip size, the mounting area can be minimized and solder balls can be used to connect with external circuits. Since the electrical connection is made, the electrical characteristics are improved by minimizing the electrical signal transmission path. In particular, the recent semiconductor chip has a smaller size and has more signal input / output pads, so that the BGA package is manufactured in the form of a fine-pitch BGA (FBGA) package.

In the FBGA package, as shown in FIG. 1, the semiconductor chip 2 is attached to the substrate 1 having a cavity 4 in a face-down type, and the semiconductor chip ( The bonding pad of 2) and the electrode terminal of the substrate 1 are electrically connected by metal wires 5 penetrating through the cavity 4, and the upper surface of the substrate 1 including the semiconductor chip 2; The cavity 4 of the substrate 1 including the metal wire 5 is sealed with the encapsulants 6a and 6b, respectively, and each of the ball lands 1a provided on the lower surface of the substrate 1 is provided. It has a structure in which the solder ball 7 is attached.

On the other hand, such an FBGA package is generally manufactured at a strip level rather than a unit level, and thus, a substrate for manufacturing an FBGA package is also provided at the strip level.

2A and 2B are plan views illustrating a conventional FBGA package manufacturing substrate, and as shown, one strip level substrate 20A, 20B has a size of about 220 mm x 60 mm as a whole. 20A, 20B includes a plurality of unit level substrates 22A, 22B therein.

For example, in the case where 60 solder balls are attached to one unit level substrate 22A, as shown in FIG. 2A, one strip level substrate 20A has 72 unit level substrates 22A in 18 rows x 4 columns. ), And if 84 solder balls are attached to one unit level substrate 22B, as shown in FIG. 2B, one row level substrate 20B has 54 rows x 3 columns. The unit level substrate 22B is designed.

Here, the overall size (220 mm x 60 mm) of the strip level substrates 20A and 20B may be slightly different from each other in length and width, respectively, for example, ± 5 mm. Thus, equipment for manufacturing FBGA packages is provided to handle strip level substrates of this size.

However, the above-described conventional FBGA package manufacturing substrate, that is, a strip level substrate having a size of about 220 mm x 60 mm cannot design more than a limited number of unit level substrates, which further limits productivity. In other words, conventional strip level substrates have a limited number of unit level substrates that can be designed within a standardized size, given the substrate warpage problem in the FBGA package fabrication process. have.

Accordingly, an object of the present invention is to provide a substrate for manufacturing an FBGA package, which can improve productivity by allowing a larger number of unit level substrates to be designed on one strip level substrate. There is this.

In order to achieve the above object, the FBGA package manufacturing substrate of the present invention is provided as a strip level substrate including a plurality of unit level substrates. It is characterized in that the longitudinal length has a size of 240 mm x 74 mm within the fluctuation range ± 10 mm.

In this case, the strip level substrate is designed such that 120 unit level substrates are arranged in 20 rows x 6 columns when 60 solder balls are attached to the unit level substrate.

In addition, the strip-level substrate is characterized in that the unit level substrate is designed to be arranged in 80 rows in 20 rows x 4 columns when 84 solder balls are attached to the unit level substrate.

In addition, the strip level substrate is characterized in that it is designed as a single block of a single structure.

(Example)

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, describing the technical principle of the present invention, the present invention increases the size of the strip level substrate than conventional, thereby increasing the number of unit level substrates designed on one strip level substrate to improve the overall productivity.

Specifically, Figure 4 is a plan view showing a substrate for manufacturing an FBGA package according to the present invention, as shown, the present invention is a horizontal × vertical strip of the strip level substrate 40 including a plurality of unit level substrate 42 The length is designed to have a size of 240 mm x 74 mm increased than conventional. At this time, the width and width of fluctuation are within ± 10 mm.

As described above, the present invention can increase the number of the unit level substrates 42 designed therein as the size of the strip level substrate 40 is increased than in the related art. For example, the present invention increases the size of the strip level substrate 40 from 220 mm x 60 mm to 240 mm x 74 mm, where 60 solder balls are attached to one unit level substrate 42A. As shown in FIG. 5A, 120 unit level substrates 42A can be designed in 20 rows x 6 columns on one strip level substrate 40A, and 84 units in one unit level substrate 42B. When the solder balls are attached, as shown in FIG. 5B, 80 unit level substrates 32B can be designed in one strip level substrate 30B in 20 rows x 4 columns.

Therefore, in the present invention, when 60 solder balls are attached to one unit level substrate, 48 FBGA packages may be manufactured, and 84 solder balls may be attached to one unit level substrate. In the case of 26 FBGA packages can be further manufactured, as a result, the present invention can greatly improve productivity.

On the other hand, if the size of the strip level substrate is increased, a larger number of unit level substrates can be designed therein, but in this case, the warpage problem of the substrate during the packaging process, in particular, the molding process becomes serious and the manufacturing yield decreases. May be induced.

Therefore, the present invention is designed to optimize and maximize the size of the strip-level substrate in a range where no substrate warpage occurs in the packaging process through various experiments.

Specifically, the working area of the molding equipment is about 300 mm x 240 mm, and the size of the mold mold is based on the molding equipment which is currently used the most (Towa Corporation Y series.). 260 mm x 220 mm, up to 290 mm x 230 mm, other mold molds of 230 mm x 74.3 mm, up to 270 mm x 85 mm.

In addition, although the size of the strip level substrate was conventionally about 220 mm × 60 mm using such molding equipment, the size of the strip level substrate may be up to 250 mm × 75 mm in consideration of equipment + mold (chase / cavity). It is expected that it will be possible to increase.

Thus, the present invention is to increase the size of the strip level substrate 40 to 240 mm x 74 mm, which is within the maximum range of the molding equipment as described above.

Tables 1 and 2 below show characteristics test results after a packaging process using strip-level substrates in which 60 solder balls and 84 solder balls are attached to one unit level substrate.

Table 1

ITEM CONTENTS SPEC. (Mm)  1. SUBSTRATE THICKNESS  WITHOUT TAPE 0.25 ± 0.030  2. STANDARD TOLERANCE  UNSPECIFIED ± 0.050  UNSPECIFIED RADIUS Max. 0.300  3. WARPAGE  STRIP Max. 2.500  4. TRACE WIDTH  BOTTOM WIDTH Min. 0.020  5. TRACE SPACE  BOTTOM SPACE Min. 0.020  6.BOND FINGER WIDTH  TOP WIDTH Min. 0.095  BOND FINGER SPACE  BOTTOM SPACE Min. 0.030  8. BURR  BOND FINGER NOT PERMIT  OTHER Max. 0.100

Table 2

ITEM CONTENTS SPEC. (Mm)  1. SUBSTRATE THICKNESS  WITHOUT TAPE 0.25 ± 0.030  2. STANDARD TOLERANCE  UNSPECIFIED ± 0.050  UNSPECIFIED RADIUS Max. 0.300  3. WARPAGE  STRIP Max. 2.500  4. TRACE WIDTH  BOTTOM WIDTH Min. 0.020  5. TRACE SPACE  BOTTOM SPACE Min. 0.020  6.BOND FINGER WIDTH  TOP WIDTH Min. 0.075  BOND FINGER SPACE  BOTTOM SPACE Min. 0.030  8. BURR  BOND FINGER NOT PERMIT  OTHER Max. 0.100

Table 3 below shows the spec. Of tested FBGA packages.

Table 3

 PACKAGE TYPE  FBGA 60BALL & 84BALL  PLATING Cu 10 to 25 μm  CORE  CCL-HL832HS (T = 0.15 mm) Ni 5-15㎛  COPPER FOIL  2 LAYER (T = 6㎛) Au 0.3 ~ 0.9㎛  SOLDER RESIST  PSR-4000 AUS-300 S / R THICKNESS  20 to 40 μm (on Cu)  TAPE -

Therefore, as can be seen from Table 1 and Table 2, the present invention can prevent the problem of substrate warpage from increasing while increasing the size of the strip level substrate to 240 mm x 74 mm, which is larger than the conventional one.

Furthermore, in addition to being able to design a larger number of unit level substrates by increasing the size of the strip level substrate, the present invention also optimizes the design of panels for the fabrication of strip level substrates so that they are discarded in the original. The manufacturing cost of strip-level substrates can also be reduced by minimizing the cost.

Specifically, FIGS. 3 and 6 are views illustrating a panel configuration for manufacturing a substrate for manufacturing a FBGA package according to the prior art and the present invention.

First, as shown in FIG. 3, about 12 strip level substrates 20 having a size of 220 mm × 60 mm are designed in a disc 30 having a size of 510 mm × 407 mm. On the other hand, as shown in FIG. 6, the present invention designs about 10 strip level substrates 40 of 240 mm × 74 mm in the original plate 60 of 510 mm × 407 mm through an optimal design.

Here, conventionally, 60 ball unit level substrates in one strip level substrate 20 are designed in 18 rows x 4 columns, and 84 ball unit level substrates are designed in 18 rows x 3 columns. In one strip-level board 40, 60 ball unit level boards are designed in 120 rows by 20 rows by 6 columns, and 84 ball unit level boards are designed in 80 rows by 20 rows by 4 columns. Conventionally, one plate can obtain 864 60-ball FBGA packages and 648 84-ball FBGA packages, whereas the present invention obtains 1200 60-ball FBGA packages and 800 84-ball FBGA packages. As a result, there is no decrease in productivity due to the reduction of the number of strip level substrates, but rather a productivity increase of about 40% as a whole.

Furthermore, in designing a strip level substrate, the present invention, instead of the conventional block division structure of dividing the unit level substrates into four blocks, as shown in Fig. 7A, unit level, as shown in Fig. 7B. It is designed by adopting a 1-block structure that designs the entire substrates in 1-block.

In this way, the present invention can design a larger number of unit level substrates on one strip level substrate as compared to the conventional block division structure, and thus, the productivity of the unit level substrate can be further improved. have.

As mentioned above, although the present invention has been illustrated and described with reference to specific embodiments, the present invention is not limited thereto, and the scope of the following claims is not limited to the scope of the present invention. It can be easily understood by those skilled in the art that can be modified and modified.

As described above, the present invention can produce a larger number of FBGA packages than conventional ones for one disc as well as one strip level substrate by designing strip level substrates of optimized and maximized size, and thus, the present invention. Can improve productivity very easily.

Claims (4)

A substrate for manufacturing a FBGA package provided as a strip level substrate including a plurality of unit level substrates and undergoing a packaging process, The strip-level substrate is a substrate for manufacturing a FBGA package, characterized in that the length of the width × length has a size of 240mm × 74mm within the fluctuation range ± 10mm. The substrate for manufacturing an FBGA package according to claim 1, wherein the strip level substrate is designed such that 120 unit level substrates are arranged in 20 rows x 6 columns when 60 solder balls are attached to the unit level substrate. The substrate for manufacturing an FBGA package according to claim 1, wherein the strip level substrate is designed such that 80 unit level substrates are arranged in 20 rows x 4 columns when 84 solder balls are attached to the unit level substrate. 4. A substrate according to any one of the preceding claims, wherein the strip level substrate is designed as a single block of a single structure.

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