KR100725838B1 - Probe card - Google Patents

Abstract

A probe card for a wafer test is provided to simplify the structure of the probe card itself and to obtain stable electric properties by using a needle directly contacting a PCB(Printed Circuit Board) pad. A probe card for a wafer test includes a PCB, a ring carrier, a probe block and a first reinforcing plate. The PCB(102) includes a predetermined pattern and a through hole(120). The ring carrier(104) is bent inward to support an edge portion of the PCB. The probe block(108) includes a needle fixing portion(110) for fixing a plurality of needles(112) and an insertion portion(114) capable of being inserted into the through hole of the PCB. The first reinforcing plate(106) is attached to a rear surface of the PCB in order to be connected with the insertion portion of the probe block.

Description

Probe card for wafer test

1 is a block diagram of a general probing apparatus in which a probe card for wafer test is mounted.

2 is a block diagram of a conventionally proposed probe card.

3 is a block diagram of a wafer test probe card according to a first embodiment of the present invention.

Figure 4 is a state diagram showing the detachable state of the probe block in the test probe card shown in FIG.

5 is a configuration diagram of a probe test probe card according to a second embodiment of the present invention.

6 is a block diagram of a probe test probe card according to a third embodiment of the present invention.

FIG. 7 is an enlarged view illustrating a main part of the part A in FIG. 6; FIG.

* Explanation of symbols in the main parts of drawings

102, 202, 302 .. PCB

104 .. Ring Carrier

106, 206, 214, 306, 314. Reinforcement plate

108, 208, 308 .. Probe Block

120, 220, 222, 320, 322, 330 .. Through hole

The present invention relates to a wafer test probe card, and more particularly, to a wafer test probe card having a concise structure in which a needle is directly connected to a PCB pad while maintaining stable electrical characteristics and enabling quick and easy block repair. will be.

In the manufacture of semiconductor devices, a fabrication process for forming a pattern on a wafer, an electric die sorting (EDS) process for examining electrical characteristics of each unit chip constituting the wafer, and assembling the wafer on which the pattern is formed into each unit chip Assembly processes and the like.

The EDS process is performed to determine a defective chip among the unit chips constituting the wafer. The probing is performed by applying an electrical signal to the chips constituting the wafer and determining the defect by a signal checked from the applied electrical signal. The device is mainly used.

The probing apparatus includes a probe card having a probe needle for contacting the wafer to apply an electrical signal to inspect the electrical state of the chips constituting the wafer.

On the other hand, Figure 1 shows the configuration of a general probing apparatus for performing the electrical characteristics of the wafer as described above. As illustrated in FIG. 1, the probing apparatus includes an alignment stage 10 for controlling movement of a wafer holder 12 on which a wafer W as an inspection object can be placed, and the alignment stage 10 includes an X axis. A moving mechanism, a Y axis moving mechanism, a Z axis moving mechanism, and the like are provided to move the wafer in the X, Y, and Z axes.

The probe card 20 is installed to face the wafer seated on the alignment stage 10. The probe card 20 is mounted to the outer case through an insert ring or the like. The probe card 20 is a circuit board in which a conductor wiring pattern is disposed on an insulated substrate, and a pogo fixing portion is formed on an upper surface thereof, and a needle 22 for conducting current through an electrode pad of a wafer to measure electrical characteristics. ) Will be provided.

However, the probing apparatus as described above performs a high temperature test by applying a high temperature thermal stress to a heater provided in the wafer chuck, and this heat is transferred to the probe card provided with the probe needle, so that the probe needle and the probe card are removed during the test. There is a problem that the temperature rises to a high temperature, the entire probe card is subjected to thermal deformation during the test, the relative position of the contact of the wafer and the probe needle is changed.

In addition, if such a condition is repeated, the pressure applied to the wafer by the probe needle is changed, thereby deteriorating contact reliability.

On the other hand, Figure 2 is a block diagram of a probe card (Patent Application No. 2005-14938) proposed by the applicant. The probe card includes a probe block having a needle 34 installed thereon to enable electrical connection between a PCB for testing a wafer and a chip pad of the wafer through a connection with an inspection system, and a plurality of probe blocks coupled to and fixed to the PCB. The housing plate 30 for fixing the contact to the PCB, the reinforcement plate for the installation and support fixing of the probe card is provided.

In addition, the probe block may include a steel bar 32 for fixing the array in the housing plate 30, a plurality of needles 34, and needles 34 to be in electrical contact with a chip of the wafer. And the needles 34 are PCB pattern contacts 38 bent in the direction of the PCB to both sides of the steel bar 32, and wafer pad contacts bent in the direction of the wafer to be contacted. (Not shown) has a vertical contact structure formed.

However, since the probe card is fixed by using the housing plate 30 or the like so as not to flow by an external pressure, the manufacturing process and the assembly process become complicated, and thus, the manufacturing cost increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object thereof is to provide a probe card for a wafer test, which has a concise structure in which a needle is directly connected to a PCB pad and can maintain stable electrical characteristics.

In addition, the present invention can minimize the strain caused by the heat stress caused by the heater during the wafer test, and also the wafer test probe to prevent the relative position of the contact and the needle of the wafer to change due to thermal deformation There is another purpose in providing the card.

In addition, another object of the present invention is to provide a probe card for a wafer test, which can improve the contact reliability by minimizing thermal deformation of the probe card so that the pressure applied to the wafer is kept constant.

In addition, the present invention can prevent the probe card from being moved arbitrarily even without using a housing plate provided to prevent the flow of the probe card, and simplify the manufacturing process or assembly process, and reduce the manufacturing cost. Another object is to provide a probe card for wafer testing that can be used.

In the probe card for a wafer test according to the first embodiment of the present invention for achieving the above object, a pattern is disposed on an insulating substrate in a probe card for use in a probing apparatus for inspecting electrical characteristics of a semiconductor wafer. A PCB having a through hole formed through the front and back surfaces thereof; A ring carrier bent inward to support the edge of the PCB; A probe block having a needle ash portion fixedly installed at a plurality of needles on one side thereof, and an insert portion insertable along a through-hole from the front surface of the PCB on the other side; And a first reinforcing plate fixedly installed to be in close contact with the back surface of the PCB and fixedly fastened to an extension of the probe block inserted along the through-hole of the PCB.

In the probe card for a wafer test according to the second embodiment of the present invention, a probe card used in a probing apparatus for inspecting electrical characteristics of a semiconductor wafer, wherein a pattern is disposed on an insulating substrate and penetrates through a front surface and a back surface. A PCB in which holes are formed; A second reinforcement plate fixedly installed to be in close contact with the rear surface of the PCB and having a through hole penetrating the front and rear surfaces thereof; A probe block having a needle ash portion fixedly installed at a plurality of needles on one side thereof, and an insert portion inserted into a through hole of the PCB and a through hole of a second reinforcing plate on the other side thereof; And a third reinforcement plate fixedly installed to be in close contact with a rear surface of the second reinforcement plate, and fixedly coupled to the insertion portion of the probe block inserted along the through hole of the PCB and the through hole of the second reinforcement plate. Characterized in that made.

In the probe apparatus for a wafer test according to the third embodiment of the present invention, a probe card used in a probing apparatus for inspecting electrical characteristics of a semiconductor wafer, wherein a pattern is disposed on an insulating substrate and penetrates the front and rear surfaces. A PCB in which a first through hole and a second through hole are formed; A fourth reinforcing plate fixedly installed to be in close contact with the rear surface of the PCB, and having a through hole penetrating the front surface and the rear surface thereof and having an insertion portion inserted into the second through hole of the PCB; A probe block having a needle ash portion fixedly installed at a plurality of needles on one side thereof, and an insert portion insertable along a through hole of the first through hole and the fourth reinforcing plate of the PCB on the other side; And a fifth reinforcement plate fixedly installed to be in close contact with the rear surface of the fourth reinforcement plate, and fixedly coupled to the insertion portion of the probe block inserted along the through hole of the PCB and the through hole of the fourth reinforcement plate. Characterized in that made.

The insertion part of the fourth reinforcement plate is inserted through the second through hole of the PCB, and the front end thereof is supported by the ring carrier.

The needle ash part may be formed by hardening and fixing a plurality of needles with epoxy on one side of the inclined surface of the probe block.

The fourth reinforcing plate is characterized in that the metal material.

The fifth reinforcement plate is made of a metal material or a ceramic.

Hereinafter, with reference to the accompanying drawings will be described in detail a probe card for a wafer test according to the present invention.

3 is a configuration diagram of a wafer test probe card according to a first exemplary embodiment of the present invention, and FIG. 4 is a state diagram illustrating a detachable state of the probe block in the test probe card shown in FIG. 3.

The probe card for a wafer test according to the first embodiment of the present invention is used in a probing apparatus for inspecting electrical characteristics of a semiconductor wafer. As shown in FIGS. 3 and 4, a pattern is disposed on an insulating substrate. Ring carrier 104, which is bent inward and the inner side of the PCB 102 through which the through hole 120 is formed to penetrate the front and back, a plurality of needles 112 is fixedly installed on one side The needle block 110 is provided, and the probe block 108 and the PCB 102 having the insertion part 114 insertable along the through hole 120 from the front surface of the PCB 102 on the other side. The first reinforcement plate 106 is fixedly installed in close contact with the rear surface and fixedly coupled to the extension part 114 of the probe block 108 inserted along the through hole 120 of the PCB 102. Will be. In this case, it is preferable that the cross-sectional shape of each of the extension portions 114 is a rectangle or an ellipse.

In the wafer test probe card according to the first embodiment of the present invention as described above, a metal or ceramic material is formed on the back surface of the PCB 102 having a pattern disposed on the front surface and a through hole 120 penetrating the front surface and the rear surface. The first reinforcing plate 106 is fixedly coupled, and the insertion portion 114 of the probe block 108 is inserted along the through hole 120 formed in the PCB 102 as shown in FIG. The first fixing plate 106 fixedly coupled to the rear surface of the 102 may be fastened by means of screw fastening or the like. At this time, the outer diameter of the insertion portion 114 of the probe block 108 is configured to be smaller than the inner diameter of the through hole 120 formed in the PCB (102).

Accordingly, in the wafer test probe card according to the first embodiment of the present invention, even if the probe block 108 is heated by the high temperature generated during the wafer test, the PCB 102 is thermally deformed in the X, Y, and Z axes. It is possible to minimize the cause. In addition, when the PCB 102 is heated, the ring carrier 104 in contact with the PCB 102 is also heated to cause thermal deformation, which is a preliminary wafer test probe card according to the first embodiment of the present invention. Will be prevented.

5 is a configuration diagram of a probe test probe card according to a second embodiment of the present invention.

The probe card for a wafer test according to the second embodiment of the present invention is used in a probing apparatus for inspecting electrical characteristics of a semiconductor wafer, as shown in FIG. 5, in which a pattern is disposed on an insulating substrate, and the front and rear surfaces thereof are disposed. A second reinforcing plate having a PCB 202 having a through hole 22 penetrating therethrough and a second reinforcing plate having a fixing hole installed in close contact with a rear surface of the PCB 202 and having a through hole 222 penetrating a front surface and a rear surface thereof; 206, a needle ash part 210 having a plurality of needles 212 fixedly installed at one side thereof is provided, and a through hole 220 and a second reinforcing plate 206 of the PCB 202 formed at the other side thereof. A probe block 208 having an insert portion inserted therein along the 222, and fixedly installed to be in close contact with a rear surface of the second reinforcement plate 206, and the through hole 220 and the second reinforcement plate of the PCB 202. Third reinforcement fixedly coupled to the insertion portion 216 of the probe block 208 is inserted along the through hole 222 of 206 The plate 214 is provided. The second reinforcement plate 206 prevents the PCB 202 from sagging along the Z axis, and the third reinforcement plate 214 thermally expands the PCB 202 along the X and Y axes. In addition to this, the X and Y axis positions of the probe block 208 are corrected.

In the wafer test probe card according to the second embodiment of the present invention configured as described above, the insertion portion 216 of the probe block 208 is formed on the PCB 202 in the same manner as shown in FIG. 4. It is inserted along the through-hole 222 of the through-hole 220 and the second reinforcing plate 206 and fastened to the third reinforcing plate 214 fixedly coupled to the rear surface of the second reinforcing plate 206, such as a housing plate. The PCB 202 can be prevented from being arbitrarily moved without having a fixing member of the PCB.

In addition, in the wafer test probe card according to the second embodiment of the present invention, the outer diameter of the insertion portion 216 of the probe block 208 has a through hole 220 and a second reinforcing plate of the PCB 202. Since the probe block 208 and the PCB 202 are heated by the high temperature generated during wafer testing because the through hole 222 of the through hole 222 is smaller than the inner diameter of the through hole 222, the PCB 202 may be X, Y, and Z axes. This can minimize the occurrence of thermal deformation. In addition, when the PCB 202 is heated, the ring carrier 204 in contact with the PCB 202 is also heated to cause thermal deformation, which is a wafer test probe card according to a second embodiment of the present invention. This can be prevented in advance.

6 is a block diagram of a wafer test probe card according to a third embodiment of the present invention.

As shown in FIG. 6, a probe test probe card according to a third embodiment of the present invention is used in a probing apparatus for inspecting electrical characteristics of a semiconductor wafer, and a pattern is disposed on an insulating substrate, and the front and rear surfaces thereof are disposed. The PCB 302 in which the first through hole 320 and the second through hole 330 penetrate the through hole 330 is fixedly installed to be in close contact with the rear surface of the PCB 302, and the through hole 322 penetrates the front and rear surfaces. ) Is formed, the fourth reinforcing plate 306 is formed, the insertion portion 318 is inserted into the second through hole 330 of the PCB 302, the needle is fixed to a plurality of needles 312 is installed on one side An ash part 310 is provided, and an inserting part 316 insertable along the through hole 322 of the first through hole 320 and the fourth reinforcing plate 306 of the PCB 302 is provided on the other side. The probe block 308 is fixedly installed in close contact with the rear surface of the fourth reinforcement plate 306, and the first through hole 320 and the fourth reinforcement of the PCB 302. Is made by a through-hole 322, the insertion portion 316 of the fifth reinforcing plate 314 is fastened fixed in the probe block 308 is inserted along the (306).

In addition, the insertion part 318 of the fourth reinforcing plate 306 is inserted through the second through hole 330 of the PCB 302 so that the front end thereof is supported by the ring carrier 304. The front end of the insertion part 318 formed in the fourth reinforcement plate 306 is supported by the ring carrier 304 so that the PCB 302 is not directly in contact with the ring carrier 304 so that the PCB 302 can be tested during wafer testing. Even if the heat is heated, the heat transfer from the PCB 302 to the ring carrier 304 is prevented, thereby preventing the ring carrier 304 from causing thermal deformation in advance.

On the other hand, the needle ash 310 is made by curing a plurality of needles 312 on the one side inclined surface of the probe block 308 with epoxy, the fourth reinforcement plate 306 and the fifth reinforcement plate 314 is made of metal or ceramic. Herein, the fourth reinforcement plate 306 prevents the PCB 302 from sagging along the Z axis, and the fifth reinforcement plate 314 allows the PCB 302 to thermally expand in the X and Y axes. In addition to this, the X and Y axis positions of the probe block 308 are corrected.

The needle ash portion 310 provided on one inclined surface of the probe block 308 is fixed by curing with epoxy, and the needle 312 is made of tungsten wire. One end of each needle 312 of the needle ash portion 310 is fixedly coupled to the pad of the PCB 302 by soldering or the like to be electrically connected. Thereafter, the other end of the needle 312 is modified and polished using a predefined coordinate value.

Meanwhile, a pattern 302a is formed on the front surface of the PCB 302 as shown in FIG. 7, and guide films 303a and 303b are provided on both sides of the pattern 302a to face each other. In the guide films 303a and 303b, the probe block 308 is inserted along the first through hole 320 of the PCB 302 and the through hole 322 of the fourth reinforcing plate 306 to fix the fifth fixing plate 314. The needle 312 fixed to the needle ashing part 310 when the pin is fixed to the needle ash part 310 is guided to prevent the needle 312 from leaving the pattern 302a of the PCB 302 to be separated from the outside. The guide films 303a and 303b may be adhesively applied to one side of the guide films 303a and 303b to be adhesively fixed to the pattern 302a of the PCB 302.

Although not shown in FIGS. 3 and 5, the guide films 303a and 303b as described above are provided in the patterns formed on the front surfaces of the PCBs 102 and 202, so that the needles 112 and 222 are the PCBs 102 and 202. It can be configured to prevent the above pattern of).

As described above, in the wafer test probe card according to the third embodiment of the present invention as described above, the fourth reinforcement plate 306 is precisely processed without the ring carrier 304 and the PCB 302 directly adhered thereto. The insertion portion 318 of the is assembled to the ring carrier 304 to be able to correct the distortion of the PCB 302 by the heat, the flatness of the PCB 302 does not affect the flatness of the product. In addition, by spatially floating the insertion portion 316 of the probe block 308 and the first through hole 320 of the PCB 302, the thermal expansion rate of the PCB 302 and the thermal expansion rate of the wafer are fundamentally different from each other. It can be solved. As shown in FIG. 4, the probe block 308 is inserted along the first through hole 320 of the PCB 302 and the through hole 322 of the fourth fixing plate 306 to the second fixing plate 314. Fixed installation.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims and their equivalents.

The present invention as described above has the effect of being able to maintain a stable electrical characteristics while having a concise structure in which the needle is directly connected to the PCB pad.

In addition, the present invention has the effect of minimizing the strain caused by the heat stress caused by the heater during the wafer test, and also to prevent the relative position of the contact point and the needle of the wafer due to thermal deformation.

In addition, the present invention has the effect of minimizing the thermal deformation of the probe card to maintain a constant pressure applied to the wafer to improve the contact reliability.

In addition, the present invention can prevent the probe card from being moved arbitrarily even without using a housing plate provided to prevent the flow of the probe card, and simplify the manufacturing process or assembly process, and reduce the manufacturing cost. It has the effect of making it possible.

In addition, the present invention has an effect that can be easily coupled to the reinforcement plate by the insertion of the probe block through the hole punched in the PCB to facilitate or quick repair for the probe block.

Claims (8)

A probe card for use in a probing apparatus for inspecting electrical characteristics of a semiconductor wafer, A PCB 102 having a pattern disposed on the insulating substrate and having a through hole 120 formed through the front and back surfaces thereof; A ring carrier 104 that is bent inward to support the edge of the PCB 102; Probe is provided with a needle ash portion 110 is fixed to a plurality of needles 112 is installed on one side, the insertion portion 114 that can be inserted along the through-hole 120 from the front surface of the PCB 102 on the other side Block 108; A first reinforcing plate fixedly installed to be in close contact with the rear surface of the PCB 102 and fixedly fastened to the insertion portion 114 of the probe block 108 inserted along the through hole 120 of the PCB 102. 106); wafer test probe card comprising a. A probe card for use in a probing apparatus for inspecting electrical characteristics of a semiconductor wafer, A PCB 202 having a pattern disposed on an insulating substrate and having a through hole 220 penetrating a front surface and a rear surface thereof; A second reinforcing plate 206 fixedly installed to be in close contact with the rear surface of the PCB 202 and having a through hole 222 penetrating the front and rear surfaces thereof; The needle ash part 210 is provided with a plurality of needles 212 fixedly installed at one side thereof, and a through hole 222 of the through hole 220 and the second reinforcing plate 206 of the PCB 202 at the other side thereof. A probe block 208 having an insert portion inserted therein; And The probe block 208 of the probe block 208 fixedly installed in close contact with the rear surface of the second reinforcing plate 206 and inserted into the through hole of the PCB 202 and the through hole 222 of the second reinforcing plate 206. And a third reinforcement plate (214) fixedly fastened to the insertion portion (216). A probe card for use in a probing apparatus for inspecting electrical characteristics of a semiconductor wafer, A PCB 302 having a pattern disposed on an insulating substrate and having a first through hole 320 and a second through hole 330 penetrating the front and rear surfaces thereof; An insertion part 318 is fixedly installed in close contact with the rear surface of the PCB 302, and has a through hole 322 penetrating the front and rear surfaces thereof and is inserted into the second through hole 330 of the PCB 302. The fourth reinforcement plate 306 is formed; A needle ash part 310 having a plurality of needles 312 fixed thereto is provided at one side thereof, and a through hole 322 of the first through hole 320 and the fourth reinforcing plate 306 of the PCB 302 at the other side thereof. A probe block 308 having an insert portion 316 insertable along the line; And The probe block fixedly installed in close contact with the rear surface of the fourth reinforcing plate 306 and inserted into the through hole 320 of the PCB 302 and the through hole 322 of the fourth reinforcing plate 306 ( And a fifth reinforcement plate (314) fixedly coupled to the insertion portion (316) of the 308. The method of claim 3, wherein Guide films 303a and 303b for preventing needles 312 of the needle ash portion 310 from deviating from the pattern of the PCB 302 at positions opposing each other on the upper surface of the pattern formed on the front surface of the PCB 302. The probe card for a wafer test, characterized in that is provided. The method of claim 3, wherein The insertion part 318 of the fourth reinforcement plate 306 is inserted through the second through hole 330 of the PCB 302 so that its tip is supported by the ring carrier 304. Probe card. The method of claim 3, wherein The needle ash unit 310, The probe card for a wafer test, characterized in that a plurality of needles 312 on the inclined surface of the probe block 308 by hardening fixed with epoxy. The method of claim 3, wherein The fourth reinforcing plate 306 is a wafer test probe card, characterized in that made of a metallic material. The method of claim 3, wherein The fifth reinforcement plate 314 is a probe card for a wafer test, characterized in that made of metal or ceramic.

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