KR100627813B1 - Method of packaging of flat fluorescent lamp at the vacuum state and vacuum packaged flat fluorescent lamp using the same - Google Patents

Abstract

Disclosed are a vacuum packaging method of a flat plate fluorescent lamp in a vacuum state using an O-ring, and a flat plate fluorescent lamp manufactured by the method. In the vacuum packaging method of the flat fluorescent lamp of the present invention, a rear substrate having a discharge electrode formed thereon and a front substrate having a phosphor layer formed therein are prepared and introduced into a vacuum chamber, and the rear substrate is formed on the edge of the rear substrate through an O-ring. After aligning the front substrate, pressure is applied between the front substrate and the rear substrate to compress the O-ring between the front substrate and the rear substrate and vent the vacuum chamber. When the pressure between the front substrate and the back substrate is removed, the front substrate and the back substrate are packaged due to the vacuum inside and the external pressure difference.

Flat Fluorescent Lamps, Packaging, O-Rings, Vacuum Chambers, Vents

Description

FIELD OF PACKAGING OF FLAT FLUORESCENT LAMP AT THE VACUUM STATE AND VACUUM PACKAGED FLAT FLUORESCENT LAMP USING THE SAME}

1A and 1B are a perspective view showing a flat fluorescent lamp for packaging a front substrate and a rear substrate according to the prior art and a cross-sectional view of a packaged flat fluorescent lamp,

2 is a cross-sectional view showing a flat fluorescent lamp according to a preferred embodiment of the present invention;

3a to 6a are perspective views showing a packaging method of a flat fluorescent lamp according to an embodiment of the present invention, and

3B to 6B are cross-sectional views illustrating a packaging method of a flat fluorescent lamp according to an exemplary embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

10, 110, 210: rear substrate 20, 120, 220: front substrate

30, 130, 230: discharge electrode 40, 140, 240: dielectric layer

50, 250: bulkhead 60, 160, 260: fluorescent material

170, 270: O-ring

The present invention relates to a vacuum packaging method of a flat plate fluorescent lamp and a flat plate fluorescent lamp manufactured by the method, and more particularly, to a vacuum packaging method of a flat plate fluorescent lamp in a vacuum state using an O-ring and a flat plate manufactured by the method It relates to a fluorescent lamp.

In general, a display device is classified into a light emitting type and a light receiving type, and a light emitting type includes a CRT, a FED, a PDP, an organic EL, and the like, and a light receiving type includes a liquid crystal display. The liquid crystal display itself does not have a structure that emits light and thus cannot implement an image unless external light is irradiated. Accordingly, a separate backlight device must be installed to implement an image.

Cold cathode fluoresent lamps (CCFLs) and flat fluoresent lamps in which the front and back substrates are distributed are widely used for this backlight. In recent years, efforts have been made to use flat fluorescent lamps as backlights, which can improve optical efficiency and reduce weight and production cost of liquid crystal display devices while satisfying luminance and uniformity of luminance simultaneously.

1A is a perspective view illustrating a flat fluorescent lamp for packaging a front substrate and a rear substrate according to the prior art, and FIG. 1B is a cross-sectional view of a packaged flat fluorescent lamp.

Referring to FIGS. 1A and 1B, the flat fluorescent lamp includes a rear substrate 10 and a front substrate 20 bonded to the rear substrate 10 through a sealant 70 to form a discharge space. A phosphor layer 80 is formed on a lower surface of the front substrate 20, and a plurality of discharge electrodes 30 having a predetermined pattern is buried on the upper surface of the back substrate 10 corresponding to the phosphor layer 80. Dielectric layer 40 is formed, and the discharge space is filled with a discharge gas made of xenon (Xe), neon (Ne), and the like.

The rear substrate 10 and the front substrate 20 are formed of a glass material, and the inside of the discharge space is formed at a pressure lower than atmospheric pressure. The front substrate 20 sags in the direction of the rear substrate, and eventually breaks, so that the partition walls 50 are positioned between the rear substrate 10 and the front substrate 20 so that the rear substrate 10 and the front substrate ( 20) is spaced apart by a predetermined distance to form a discharge space therebetween, and to support the front substrate 20 to prevent sagging and cracking. At this time, the partitions 50 are coated with a fluorescent material 60 on the side thereof can reduce the possibility of the dark portion due to the partition 50.

In such a planar fluorescent lamp, as the power is applied to the discharge electrode 30, the phosphor layer 80 is excited by ultraviolet rays generated by the discharge between the discharge electrodes 30, thereby causing surface emission.

In the above-described method of manufacturing a flat fluorescent lamp, the front substrate 20 and the rear substrate 10 are normally bonded and sealed with a glass sealant 70, and the discharge passage is evacuated and filled with discharge gas. That is, the glass-like sealant 70 of the silicon component is printed on a screen print or coated on the edges of the front substrate 20 and the rear substrate 10 using a dispenser, followed by drying and firing. The organic matter is removed through the process and bonded to each other.

As described above, the method of bonding the front substrate and the rear substrate in the flat fluorescent lamp uses a method in which a powdered frit is mixed with a vehicle, an organic solvent, prepared in a kneaded state, placed in a storage container, and then applied to the rear substrate. . By the way, the viscosity of the dough is changed according to the process of mixing the frit with the organic solvent and the surrounding environment (temperature, humidity, etc.), which causes a problem that the storage and transport of the dough, difficult to apply.

In addition, after the glass sealant 70 is applied to the rear substrate, the heat treatment is possible only after passing through the drying process, and thus, the process is complicated and time consuming, and the back substrate may be warped during the drying process.

After the back substrate and the front substrate are bonded together, the glass substrate is exhausted to a predetermined degree of vacuum through an exhaust tube provided on one surface of the glass substrate in advance. Exhaust takes a lot of time, and after exhaust, the discharge gas is injected through the exhaust tube and then the tube is heat sealed.

As described above, the conventional glass substrate bonding method and the method of evacuating after bonding cause problems in productivity due to excessive exhaust time.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a vacuum packaging method for a flat plate fluorescent lamp and a flat plate fluorescent lamp using the same.

In addition, an object of the present invention is to provide a vacuum packaging method for a flat fluorescent lamp that does not require an exhaust process and a heat treatment sintering process and a flat fluorescent lamp using the same.

In order to achieve the above object, in the vacuum packaging method of the flat fluorescent lamp of the present invention, a rear substrate having a discharge electrode formed thereon and a front substrate having a phosphor layer formed on the lower side thereof are prepared and introduced into a vacuum chamber on the edge of the rear substrate. Align the back and front substrates through the O-rings. Subsequently, pressure is applied between the front substrate and the rear substrate to remove the pressure between the front substrate and the rear substrate after the O-ring is pressed between the front substrate and the rear substrate and vented the vacuum chamber. At this time, when gas is introduced into the vacuum chamber at atmospheric pressure, the front substrate and the rear substrate are in close contact due to the pressure difference between the internal vacuum state and the external atmospheric pressure. Subsequently, a discharge gas is injected through an exhaust pipe formed on one side of the front substrate or the rear substrate.

In the present invention, a sealant such as a tor seal may be filled between the front substrate and the rear substrate outside the O-ring.

In the present invention, in order to prevent deterioration of the O-ring may be provided with a side glass or a partition wall of the O-ring adjacent to the O-ring, the O-ring may be coated with metal or Teflon.

In the present invention, after the pressure between the front substrate and the rear substrate is removed, the side surfaces of the front substrate and the rear substrate can be tightened using a clamp device.

In order to achieve the above object, the flat fluorescent lamp of the present invention is a front substrate formed below the phosphor layer for generating visible light in response to an external stimulus, spaced apart in parallel by a predetermined distance from the front substrate and the front substrate And a rear substrate having a discharge electrode for applying a high voltage to the discharge material, and a flexible O-ring interposed at the edges of the back and front substrates. Include.

In the present invention, a sealant such as a tor seal may be filled between the front substrate and the rear substrate outside the O-ring, and may further include a side glass adjacent to the O-ring inside the O-ring.

The above objects, features and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Shapes and thicknesses of the layers and materials in the drawings are exaggerated or outlined for convenience of description. Like reference numerals refer to like elements throughout.

2 is a cross-sectional view showing a flat fluorescent lamp according to a preferred embodiment of the present invention.

Referring to FIG. 2, the flat fluorescent lamp according to the embodiment of the present invention includes a rear substrate 110 and a front substrate 120 bonded to the rear substrate 110 via an O-ring 170. It is supposed to be formed. A sealant 190 such as a torsil is filled between the rear substrate and the front substrate outside the O-ring. A phosphor layer 180 is formed on a bottom surface of the front substrate 120, and a plurality of discharge electrodes 130 having a predetermined pattern is buried on the top surface of the back substrate 110 corresponding to the phosphor layer 180. Dielectric layer 140 is formed, and the discharge space is filled with a discharge gas made of xenon (Xe), neon (Ne), and the like.

The rear substrate 110 and the front substrate 120 are formed of a glass material, and the discharge space is formed at a pressure lower than atmospheric pressure, so that when the flat lamp is enlarged, the rear substrate 110 and the front substrate 120 are located above the rear substrate 110. The front substrate 120 sags in the direction of the rear substrate and is eventually broken, so that partition walls (not shown) are positioned between the rear substrate 110 and the front substrate 120 to form the rear substrate 110 and the front substrate. The space 120 is spaced apart by a predetermined distance to form a discharge space therebetween, and the front substrate 120 is supported to prevent sagging and cracking. At this time, the partitions are coated with a fluorescent material 160 on the side thereof can reduce the possibility of the dark portion due to the partition wall. In addition, when discharge occurs in the discharge space, a partition wall (not shown) may be formed on the inner surface of the O-ring 170 or side glass may be provided adjacent to the O-ring inward of the O-ring to prevent deterioration of the O-ring. Can be. The O-ring 170 is preferably coated with a metal, Teflon, etc. in order to suppress degradation to the ultraviolet.

Unlike the drawing, the above-described flat fluorescent lamp may have various shapes and shapes of electrodes. For example, a discharge passage may be formed on an upper surface of the rear substrate, an electrode may be provided on one side of the discharge passage, and an opposite electrode may be formed on the other side of the discharge passage so as to face the electrode.

3A to 6A are perspective views illustrating a packaging method of a flat fluorescent lamp according to an embodiment of the present invention, and FIGS. 3B to 6B are cross-sectional views illustrating a packaging method of a flat fluorescent lamp according to an embodiment of the present invention.

3A and 3B, a rear substrate 210 having a dielectric layer 240 having a discharge electrode 230 embedded therein and a front substrate 220 having a phosphor layer 280 formed thereon are prepared. A partition wall 250 is formed on the back substrate 210 on which the dielectric layer is formed, and a fluorescent material 260 is coated on the side surface of the partition wall 250.

Subsequently, the back and front substrates 210 and 220 are positioned in a vacuum chamber (not shown), and a pump installed in the chamber is operated to perform an exhaust operation for securing an ultra high vacuum state. The vacuum chamber is provided with pressurizing means having a pressurizing plate capable of high vacuum evacuation and compressing the back substrate and the front substrate.

Subsequently, an O-ring 270 is positioned on the rear substrate 210 to surround the partition 250 and the fluorescent material 260 in the vacuum chamber. The O-ring 270 may be made of various materials having elasticity, and may be pretreated at about 230 ° C. before being placed on the rear substrate in the vacuum chamber. In addition, the O-ring 270 is preferably coated with a metal, Teflon, etc. in order to suppress degradation to the ultraviolet.

4A and 4B, the front substrate 220 is aligned on the rear substrate 210 on which the O-ring 270 is disposed.

5A and 5B, the back substrate 210 and the front substrate 220 are compressed using the press plate 285 of the pressurization means in a vacuum state. When the back substrate and the front substrate are pressed, the elastic O-ring 270 is compressed and pressed onto the back substrate and the front substrate.

6A and 6B, the vacuum chamber is vented to atmospheric pressure while the rear substrate 210 and the front substrate 220 are compressed through the O-ring 270. When gas is introduced into the vacuum chamber at atmospheric pressure, the back substrate and the front substrate are closely contacted by the pressure of the gas.

Subsequently, even if the pressure of the pressure plate 285 applied between the rear substrate 210 and the front substrate 220 is removed, the vacuum is packaged due to the pressure difference between the vacuum inside the flat fluorescent lamp and the atmospheric pressure outside.

Subsequently, the vacuum packaged flat fluorescent lamp may be taken out of the vacuum chamber to fill a sealant 290 such as a tor seal between the rear substrate and the front substrate outside the O-ring.

In some cases, by using a clamp device (not shown) that tightens the rear substrate and the front substrate, it is possible to increase the adhesion between the rear substrate and the front substrate to prevent a decrease in the degree of vacuum.

Subsequently, an exhaust pipe (not shown) is formed at one side of the rear substrate or the front substrate, and the vacuum degree inside the flat fluorescent lamp may be secured from about 10 ⁻⁶ to about 10 ⁻⁷ torr before filling the discharge gas. After the vacuum packaging, the exhaust pipe is opened, and after discharging gas such as Ne and Xe, the exhaust pipe is tipped off. In this case, by using a clamp device that tightens the rear substrate and the front substrate, the adhesion between the rear substrate and the front substrate may be increased to prevent a sudden drop in the degree of vacuum.

The vacuum packaged flat fluorescent lamp can be widely used as a backlight and lighting device for flat panel displays and can be applied to various applications.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible in the art without departing from the technical spirit of the present invention. It will be clear to those of ordinary knowledge.

According to the present invention made as described above, it is possible to easily package a flat plate fluorescent lamp in a vacuum while easily bonding the back substrate and the front substrate.

In addition, the present invention can package the flat fluorescent lamp in a vacuum state to reduce the contamination by the adhesive or the like.

Claims (11)

Preparing a rear substrate on which a discharge electrode is formed on an upper substrate and a front substrate on which a phosphor layer is formed on a lower surface of the substrate; Aligning the rear substrate and the front substrate through an O-ring on an edge of the rear substrate; Pressing the O-ring between the front substrate and the rear substrate by applying pressure between the front substrate and the rear substrate; Venting the vacuum chamber; Removing the pressure between the front substrate and the rear substrate; And Injecting the discharge gas through the exhaust pipe formed on one side of the front substrate or the rear substrate vacuum packaging method comprising the. The method of claim 1, And a sealing agent is filled between the front substrate and the rear substrate outside the O-ring. delete The method of claim 1, And a side glass provided inside the o-ring adjacent to the o-ring. The method of claim 1, The O-ring is a vacuum packaging method of a flat fluorescent lamp, characterized in that the coating with a metal or Teflon in order to suppress degradation by ultraviolet rays. The method of claim 1, And removing the pressure between the front substrate and the rear substrate, and tightening the side surfaces of the front substrate and the rear substrate by using a clamp device. A front substrate having a lower phosphor layer generating visible light in response to an external stimulus; A rear substrate spaced apart in parallel from the front substrate by a predetermined distance to form a discharge space including a discharge material between the front substrate and a discharge electrode configured to apply a high voltage to the discharge material thereon; And And a flexible O-ring interposed at edges of the rear substrate and the front substrate. The method of claim 7, wherein And a sealant filled between the front substrate and the rear substrate outside the O-ring. delete The method of claim 7, wherein And a side glass adjacent to the O-ring inward of the O-ring. The method of claim 7, wherein The O-ring is a flat plate fluorescent lamp, characterized in that coated with a metal or Teflon in order to suppress deterioration by ultraviolet rays.

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