KR100601474B1 - Method for preparing printed circuit board of high resolution using imprint technology - Google Patents

Abstract

The present invention relates to a method for manufacturing a high-resolution printed circuit board using an imprint method, unlike a conventional imprint method in which a mold having a structure having a predetermined shape is directly pressed onto a resin layer and transferred, a liquid resin is applied onto the structure of the mold. Therefore, it is possible to remove the stress applied to the mold by laminating conductive metals after the semi-cured state and to solve the defects caused by gas traps, which are a chronic problem in the existing imprint process. There is this.

When manufacturing a printed circuit board according to the method of the present invention, it is possible to significantly shorten the process and reduce the process cost as compared to the conventional lithography process, and to efficiently implement a fine pattern corresponding to the high density wiring board. have.

Imprint, printed circuit board, liquid resin, conductive metal

Description

Method for preparing printed circuit board of high resolution using imprint technology

1A to 1E are cross-sectional views schematically illustrating a manufacturing process of a printed circuit board using an imprinting method according to the related art.

2A to 2F are cross-sectional views schematically illustrating a manufacturing process of a printed circuit board using the imprint method according to the present invention.

※ Explanation of code about main part of drawing ※

10 mold 11 resin insulating layer

12 conductive metal layer 13 via hole

14 circuit pattern 15 metal plating layer

16: grinder

20: mold 21: resin insulating layer

22: conductive metal layer 23: via hole

24: circuit pattern 25: metal plating layer

26: grinding machine

The present invention relates to a method for manufacturing a high resolution printed circuit board using the imprint method. More specifically, a fine pattern capable of responding to a high density wiring board through an economical and efficient process by applying a liquid resin on the mold structure, passing through a semi-cured state, and then laminating conductive metals to remove the stress applied to the mold. In addition, the method of manufacturing a high resolution printed circuit board using an imprint method that can remove the inherent defects of the air trap, which has been a problem in the conventional process by applying a liquid resin to the mold. It is about.

Today, electronic and electric technology is rapidly evolving for more information storage, faster information processing and transmission, and simpler communication network to keep pace with the 21st century's high information and communication society.

In particular, under the condition of the finiteness of a given information transmission rate, as a way of meeting these requirements, it has been proposed to implement the components as small as possible and to provide new functionality with higher reliability.

As described above, in accordance with the trend of thin and short reduction of electronic products, fine patterns, miniaturization, and packaging of printed circuit boards are simultaneously progressed.

One of the most widely used microstructure fabrication techniques to date is photolithography, a method of forming a pattern on a substrate coated with a photoresist thin film.

At this time, the size of the pattern to be formed is limited by the optical diffraction phenomenon, the resolution is determined by the thickness of the photoresist and the wavelength of the light used.

Therefore, as the degree of integration of components increases, shorter exposure techniques are required to form fine patterns.

However, as the degree of integration of components increases, the method of forming the photoresist pattern by the optical method causes the following problems.

First, since the photoresist is patterned using light, the physical shape of the photoresist pattern itself or between the patterns is changed due to the influence of interference caused by light.

The main problem here is a nonuniform change in the CD (critical dimension) of the photoresist pattern. When the CD of the photoresist pattern is not uniform as a whole and varies depending on the region of the lower layer, the material layer pattern formed by patterning the photoresist pattern as a mask is also formed in a different form from that originally desired.

Another problem is that impurities generated during the process react with the photoresist and the photoresist is eroded to change the photoresist pattern.

In the erosion of the photoresist, the material layer pattern formed by patterning the photoresist pattern as a mask also has a form different from that originally desired.

Recently, the degree of integration of printed circuit boards is increasing and accordingly, researches on how to form fine patterns have become more active.

On the other hand, as one of techniques for controlling / manipulating structures and compositions capable of determining a specific use of a substance fundamental in atomic / molecular size, there is a method using a polymer material.

The polymers have a wide range of applications ranging from selective etching resistors, optical devices, biochemical sensors, and even tissue engineering, and are expected to have a great influence on the development of next generation new materials.

In particular, there is a method using a conventional imprint method for forming a nanometer-sized fine pattern using a polymer thin film.

The nanoimprinting method (nanoimprint) is a method invented by Stephen Chou et al. (US Pat. No. 5,772,905) of Princeton University in the United States to prepare the shape required on the surface of a material having a relatively high strength in advance. This is known as a potent method of forming a fine pattern such as a semiconductor by patterning by dipping it like a coating on another material. The inventors have also proposed the application of the same technology to nano-camp optical discs (US Pat. No. 6,518,189). The nanoimprint method has an advantage of overcoming a problem of low productivity and mass production of nanoscale fine patterns.

In this regard, referring to Figures 1a to 1e briefly look at the process of manufacturing a printed circuit board using the imprint method according to the prior art as follows.

First, in order to obtain a fine pattern having a desired shape, a mold 10 having a structure corresponding to a plurality of vias and patterns to be formed is manufactured. The material of the produced mold 10 is made of high strength material such as silicon or metal, diamond or quartz glass. Meanwhile, a substrate on which a semi-cured resin insulating layer 11 is stacked is prepared on the upper surface of the conductive metal layer 12 (see FIG. 1A).

Next, after the mold 10 is pressed against the resin insulating layer 11 of the substrate (see FIG. 1B), the mold 10 is separated from the substrate and the mold 10 is removed from the resin insulating layer 11 of the substrate. The via 13 and the fine pattern 14 of the desired shape, corresponding to the structure in Fig. 1, are engraved (see FIG. 1C).

Next, the resin insulating layer 11 imprinted with the via 13 and the fine pattern 14 is plated with a conductive metal 15 to fill the inner walls of the via hole 13 and the fine pattern 14 (FIG. 1d).

Finally, the surface is polished with a polishing machine 16 through a conventional surface polishing process, and the plating layer 15 formed on the resin insulating layer 11 is removed to remove vias and circuit patterns for electrical connection between circuits. To form.

When the fine pattern is formed on the resin insulating layer 11 in this manner, it has the advantage that mass production is easy at a low cost compared to the photoresist pattern forming method described above.

However, when the imprinting technique according to the related art described above is applied to the formation of circuits and vias of a printed circuit board, a high pressure is required to imprint a resin having a high viscosity, which is expensive due to stress applied to a mold. The life of the in mold is shortened. In addition, in the case of a printed circuit board, unlike the semiconductor, the size of the substrate is very large, about 400 × 510 mm, and the precision of the pattern is lower than that required by the semiconductor in the order of μm. Therefore, since the size of the vias and the pattern is relatively large, there is a disadvantage in that the durability of the mold occurs in repeated use. In addition, when imprinting using a large-area mold, the defect caused by trapping air in the uneven portion of the mold serves as the biggest failure factor. In this case, if the molding process itself proceeds in a vacuum chamber, the air trap problem can be solved, but there are disadvantages in terms of productivity / cost, such as a long process time and a large capital investment.

In the present invention, as a result of extensive research in order to solve the above problems, unlike the conventional imprint method that presses and transfers a mold having a structure having a predetermined shape directly to the resin layer, the liquid resin on the structure of the mold After the coating was subjected to the semi-cured state, the conductive metal was laminated to remove the stress applied to the mold, thereby solving the problem caused by the pressing process. In addition, by applying a liquid resin it was possible to solve the air trap problem that occurred between the existing resin sheet and the mold. In other words, by using a low-viscosity liquid resin, the air trap problem could be remarkably improved by improving the wetting properties of the resin to the mold and increasing the mobility of the air, and the present invention was completed based thereon. .

Accordingly, an object of the present invention is to provide a manufacturing method of a high resolution printed circuit board using an imprint method which can realize a high reliability of a fine pattern corresponding to a high density wiring board through an economical and efficient process.

Method for manufacturing a printed circuit board using an imprint method according to the present invention for achieving the above object:

(a) providing a mold having a structure corresponding to a plurality of vias and patterns to be formed;

(b) applying a liquid resin to the mold in which the structure is formed and then semi-curing the mold;

(c) laminating a conductive metal layer on the semi-cured resin layer;

(d) separating the mold from the resin layer to obtain a resin layer imprinted with a plurality of vias and patterns corresponding to the structure of the mold;

(e) plating the resin layer with a conductive metal to fill inner walls of the plurality of via holes and patterns; And

(f) surface polishing the plating layer formed on the resin layer to form vias and circuit patterns for electrical connection between circuits;

Characterized in that it comprises a.

In addition, the method further comprises the step of applying a release agent on the structure formed in the mold before applying the liquid resin.

Here, the size of the structure corresponding to the via or pattern is 0.1 to 50㎛.

The mold is formed of a material selected from the group consisting of semiconductors, ceramics, metals, polymers, SiO ₂ , quartz, glass, and combinations thereof.

On the other hand, the resin is applied through a droplet coating method, a spray method or a spin coating method, wherein the resin is applied to have a thickness at least equal to the structure corresponding to the via of the mold structure, the resin corresponding to the via When applied thicker than the thickness of the structure, the top of the resin layer is removed so that the surface of the structure corresponding to the via is exposed.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

As described above, in the present invention, after applying the liquid resin on the structure of the mold and undergoing a semi-cured state, the conductive metal is laminated to remove the stress applied to the mold at its source, thereby using an economic and efficient process using an imprint method. A method of manufacturing a high resolution printed circuit board having high density and high reliability is provided.

As described with reference to FIGS. 1A to 1E, in the case of forming vias and wiring by directly applying a precise mold to a resin insulating layer having a semi-cured resin or a resin insulating layer laminated on a conductive substrate according to a conventional imprint method, The stress on the mold shortens the life of the expensive mold.

Accordingly, in the present invention, after applying the liquid resin to the mold as described below, the stress applied to the mold is essentially removed by laminating a conductive metal layer in a semi-cured state.

Therefore, when the imprint method according to the present invention is applied to a substrate fabrication process, not only can the process be significantly shortened and the process cost can be reduced as compared to the conventional lithography process, and the existing imprint method is applied to the substrate fabrication process. Compared to the case, it is possible to implement a fine pattern that can cope with the high density wiring board through a more economical and efficient process without shortening the life of the mold.

The manufacturing process of the printed circuit board using the imprint method according to the present invention will be briefly described with reference to FIGS. 2A through 2F.

First, a mold 20 in which structures corresponding to a plurality of vias and patterns to be formed are formed is manufactured (see FIG. 2A).

According to the present invention, since the pressing process of the mold 20 is omitted, in the case of a mold applied to the existing imprint method, resistance to stress in the pressing process is required, unlike the present invention, which is limited to a material having high strength. The material of the mold 20 used in the is not particularly limited. For example, the mold 20 may be classified into a transparent mold and an opaque mold, and in the case of a transparent mold, a material through which UV may be transmitted using SiO ₂ , quartz, glass, and polymers is used. , The opaque mold is formed of a material selected from the group consisting of semiconductors, ceramics, metals, polys and combinations thereof.

The mold 20 may be manufactured by stamping each structure through a shape processing process on one surface of a plate-shaped material, or by attaching a separate structure to a plate-shaped material. If it is a process known in the art, it can apply without particular limitation.

The shape processing process is not particularly limited, but electron beam lithography, photo-lithography, dicing, laser, reactive ion etching (RIE), or etching may be used.

On the other hand, the size of the structure corresponding to the via or pattern is not particularly limited, but is preferably 0.1 to 50㎛ to be applicable to the via and the fine pattern of the printed circuit board.

By selectively applying a release agent to the structure formed on the mold 20, when the mold 20 is separated from the resin layer 21 in a subsequent step, the mold 20 is more easily separated without damaging the solidified resin layer 21. can do. The release agent may be appropriately selected depending on materials of the mold 20 and the resin layer 21 used.

For example, a thermosetting silicone resin can be used as a release agent for imparting the release property.

The thermosetting silicone resin may be used in a single or in combination by selecting a resin prepared by condensation reaction or addition reaction, or curing by UV or heat, or the like, but is not particularly limited thereto and is commonly used in the art. Anything can be used.

For example, in the condensation reaction type, a polysiloxane containing silanol groups at the terminal is used as a base polymer, and a polymethylhydrogen siloxane is mixed as a crosslinking agent to be condensed under an organotin acylate catalyst. Likewise, dehydrogen condensation is caused by heating to form siloxane bonds. For example, a polydimethylsiloxane having an -OH group at the terminal and a polydimethylsiloxane (hydrogen silane) having an -H group at the terminal may be condensed in the presence of an organotin catalyst (eg, a catalyst of organotin acylate). The resin which formed the dimensional crosslinked structure is mentioned.

As the silicone resin of the addition reaction system, for example, a resin in which a polydimethylsiloxane having a vinyl group introduced at its terminal and a hydrogen silane are reacted in the presence of a platinum catalyst to form a three-dimensional crosslinked structure.

In addition, the most basic examples of ultraviolet curing silicone resins include resins obtained by radical reactions similar to those of conventional silicone rubber crosslinking reactions, resins obtained by photocuring reactions by introducing acrylic groups, and strong acids by decomposing onium salts with ultraviolet rays. And crosslinked resins obtained by cleaving the epoxy group with the strong acid, and crosslinked resins by addition reaction of vinylsiloxane and thiol. Since electron beams have stronger energy than ultraviolet rays, the crosslinking reaction occurs by radicals without using an initiator as in ultraviolet curing. Such thermosetting silicone resins typically have a degree of polymerization of about 50 to 200,000, preferably about 1000 to 100,000.

Next, the liquid resin 21 is applied to the mold 20 in which the structure is formed, and then semi-cured (see FIG. 2B).

The liquid resin 21 is not particularly limited as long as it can be used as a substrate material, for example, a vinyl ester resin, an unsaturated polyester resin, a maleimide resin, a polycyanate resin of polyphenol, or an epoxy. Thermosetting resins such as resins, phenol resins, vinyl benzyl compounds, and thermoplastic resins such as polyetherimide, polyether sulfone, polyacetal, dicyclopentadiene resin Can be.

Application of the liquid resin 21 may be performed by a spin coating method, a droplet dispensing method, a spray method, or the like.

Here, the resin 21 is most ideally applied to have the same thickness as the structure corresponding to the via of the structure of the mold 20, but may be applied to a thickness greater than that. However, when the resin 21 is applied thicker than the thickness of the structure corresponding to the via, the conductive metal 22 is a subsequent process by removing the top of the resin layer 21 to expose the surface of the structure corresponding to the via. In the lamination process, the top surface of the structure corresponding to the via and the conductive metal layer 22 may directly contact each other. In this case, a laser or an etching process may be used as a method of removing the upper resin layer 21.

On the other hand, the semi-cured process of the liquid resin is different depending on the type of resin, it can be divided into the curing using UV or the curing using heat. In the case of UV curing, curing is possible by irradiating UV with moisture in the UV chamber, which shortens the process time, but it is expensive. On the other hand, thermosetting resins typically undergo a curing process for about 30 minutes to 1 hour in a chamber at a temperature of about 100 to 200 ° C. In the case of the present invention, since the final bonding process with the metal layer is once again, only the curing in the B-stage, commonly referred to as semi-hardening, is performed.

Next, the conductive metal layer 22 is laminated on the semi-cured resin layer 21 according to a conventional process known in the art (see FIG. 2C). In the lamination process of the metal layer 22, the lamination is performed while applying pressure in a temperature chamber of 100 to 300 ° C. In some cases, a vacuum may be applied during the lamination process.

Although the said metal is not specifically limited, Usually copper, nickel, aluminum, etc. are used.

Next, the mold 20 is separated and removed from the resin layer 21 to obtain a resin layer 21 formed by stamping the via 23 and the circuit pattern 24 corresponding to the structure of the mold 20. (See FIG. 2D).

Next, the resin layer 21 is plated with a conductive metal 25 to fill the inner walls of the via 23 and the circuit pattern 24 (see FIG. 2E).

Although the metal used for the said plating is not specifically limited, Copper, nickel, aluminum, etc. are used normally.

Finally, the plating layer 25 formed on the resin layer 21 is polished using the polishing machine 26 to planarize the surface and to form vias and circuit patterns for electrical connection between circuits.

In this case, the surface polishing process is used in a chemical mechanical polishing (CMP) process to remove a step between a plurality of wiring layers on the wafer surface through mechanical polishing and chemical reaction, which is used in a planarization technique of a semiconductor device. Can be implemented.

The CMP process is one of the planarization methods requiring high precision to remove the increased surface step height on the wafer surface due to the high density, miniaturization, and multilayer structure of the semiconductor device. to be.

The principle of the CMP technique is to provide a slurry in a state in which the wafer is brought into contact with the surface of the polishing pad (elastic polishing cloth), thereby chemically reacting the surface of the wafer, and attaching the platen (polishing table) to the polishing pad. , The polishing table and the wafer carrier (Wafer Carrier, Polishing Head) for fixing the wafer are physically flattened in the uneven portion of the wafer surface. That is, the wafer is polished by the polishing pad and slurry as the platen is simply rotated and the wafer carrier is pressed at a constant pressure while simultaneously rotating and swinging. Removal Rate and Nonuniformity Rate play an important role and these are determined by the process conditions of the equipment, slurry type and pad type.

Although the present invention has been described in detail through specific embodiments, this is for explaining the present invention in detail, and the method of manufacturing a printed circuit board using the imprint method according to the present invention is not limited thereto, and it is within the technical spirit of the present invention. It will be apparent to those skilled in the art that modifications and variations are possible.

As described above, according to the present invention, the process can be significantly shortened and the process cost can be reduced as compared to the conventional lithography process. In addition, micro patterns that can cope with high-density wiring boards can be realized with high reliability, which is expected to be the next generation board manufacturing process.

In addition, by omitting the pressing process, which is a disadvantage of the conventional imprint method, it is possible to implement a fine pattern that can cope with the high density wiring board through a more economical and efficient process without shortening the life of the mold.

In addition, the use of liquid resin can improve the productivity and yield by solving the problem of air trap, which is a chronic problem of the existing imprint process, and by reducing the processing time by eliminating the vacuum device for removing the air trap, As it can improve and reduce equipment investment cost, it can secure price competitiveness applicable to substrate process. In addition, high-quality fine patterns without air traps can be realized with high efficiency.

All modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

Claims (7)

(a) providing a mold having a structure corresponding to a plurality of vias and patterns to be formed; (b) applying a liquid resin to the mold in which the structure is formed and then semi-curing the mold; (c) laminating a conductive metal layer on the semi-cured resin layer; (d) separating the mold from the resin layer to obtain a resin layer imprinted with a plurality of vias and patterns corresponding to the structure of the mold; (e) plating the resin layer with a conductive metal to fill inner walls of the plurality of via holes and patterns; And (f) surface polishing the plating layer formed on the resin layer to form vias and circuit patterns for electrical connection between circuits; Method of manufacturing a printed circuit board using an imprint method comprising a. The method of claim 1, wherein the method further comprises applying a releasing agent onto a structure formed in the mold before applying the liquid resin. The method of claim 1, wherein the size of the structure corresponding to the via or pattern is 0.1 to 50 μm. The printed circuit board of claim 1, wherein the mold is formed of a material selected from the group consisting of semiconductors, ceramics, metals, polymers, SiO ₂ , quartz, glass, and combinations thereof. Manufacturing method. The method of manufacturing a printed circuit board using an imprint method according to claim 1, wherein the resin is applied by a droplet coating method, a spray method or a spin coating method. 6. The method of claim 1, wherein the resin is coated to have at least the same thickness as the structure corresponding to the via of the mold of the mold. 7. The method of claim 6, wherein when the resin is applied thicker than the thickness of the structure corresponding to the via, the upper surface of the resin layer is removed to expose the surface of the structure corresponding to the via. Method of manufacturing a printed circuit board.

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