KR100440667B1 - Method of thermal treatment for substrates and the furnace for its continuous thermal treatment - Google Patents

Abstract

The present invention suppresses the occurrence of a temperature distribution in a substrate by thermal effects from other adjacent heating chambers in which the average temperature in the room is different when the substrate is heat-treated in a heating chamber of a furnace. It is an object of the present invention to provide a heat treatment method of a substrate that can uniformly heat-treat the entire substrate.

In a heating chamber in which the average temperature in the room differs from at least one of the other adjacent heating chambers among the plurality of heating chambers partitioned with respect to the conveying direction of the heat-treatment body, the set temperature of each heating means provided in the heating chamber is referred to as the heat-treatment body. By controlling the temperature in the heating chamber to be different in the conveying direction of, the substrate is heat-treated uniformly by canceling the thermal effect of the other heating chamber adjacent to the substrate to be heat-treated in the heating chamber.

Description

Substrate heat treatment method and continuous heat treatment method for use {METHOD OF THERMAL TREATMENT FOR SUBSTRATES AND THE FURNACE FOR ITS CONTINUOUS THERMAL TREATMENT}

The present invention relates to a heat treatment method for a substrate including a film-forming material represented by a glass substrate for a plasma display panel, and a continuous heat treatment furnace used therein.

In recent years, the commercialization of the large-screen flat panel display (henceforth "FPD") which can be used as a wall-mounted television or a display for multimedia is advancing. As such a large screen FPD, a plasma display panel having a self-luminous type, a wide viewing angle, a quality display with good quality display, and a manufacturing process with a simple manufacturing process and easy enlargement (hereinafter, referred to as a plasma display panel) Is called the most promising candidate.

The production of the PDP is, for example, by a thick film method in which the processes of printing, drying and firing are repeated several times on the surface of a large glass substrate called front glass or back glass as shown in FIG. 5. It is performed by forming various members, such as an electrode, a derivative, and fluorescent substance, one by one, and finally sealingly attaching a front glass and a back glass.

The heat treatment of a substrate containing a film-forming material such as a glass substrate for PDP is continuous with a plurality of heating chambers partitioned with respect to the conveying direction of the thermally processed object and a conveying means for intermittently conveying the thermally processed object to an adjacent heating chamber. It is common to carry out by the method of temperature raising, warming, and temperature-falling according to a desired temperature curve by controlling temperature of each heating chamber individually using a type | formula heat treatment furnace.

The heat treatment is performed in the partitioned heating chamber in order to make the temperature of the substrate surface as uniform as possible. If heat treatment is performed in a state where the temperature distribution on the surface of the substrate is large, distortion occurs in the substrate or the member (film) formed on the substrate, and defects such as cracks and breakages are thereby generated. Each heating chamber is generally sized to contain one setter on which a substrate is placed, and a plurality of heating means are provided in the conveying direction (length direction of the furnace) and the width direction of the furnace for the heat-treatment body. have.

These divided heating means are generally configured to control the temperature individually as independent control systems, so that in the heat treatment of a substrate containing a conventional film forming material, the temperature (ambient temperature) in each divided heating chamber is The temperature control of each heating means was made to become constant, respectively.

Usually, partition walls or the like are provided between the heating chambers to prevent thermal influences from adjacent heating chambers, but it is difficult to completely prevent mutual thermal effects between adjacent heating chambers having different temperature settings. For this reason, even if the temperature of a heating means is controlled so that the temperature in each heating chamber may become constant as mentioned above, the temperature of the board | substrate which received heat processing for predetermined time in the heating chamber will be conveyed by the thermal effect from another adjacent heating chamber. There was a problem in that the difference in the uniform heat treatment quality could not be obtained.

In addition, since the transfer of the heat-treatment to the adjacent heating chamber requires tens of seconds to several minutes using any conveying means such as a roller conveyor, a chain conveyor, or a walking beam, the substrates between adjacent heating chambers having different set temperatures are different. In the conveyance, heat is transferred from the front part in the conveying direction (part near the exit side of the furnace of the substrate) to the heating chamber of the moving destination and the rear part (part near the entrance side of the furnace of the substrate) to be delayed. There exists a problem that a difference arises in hysteresis, and as a result, a temperature distribution arises in a board | substrate.

And even if the temperature distribution which arises in one conveyance is a slight thing, in the heating chamber in which the conventional room temperature was controlled uniformly, the response speed of the board | substrate conveyed into the heating chamber is slow, and the temperature distribution in the board | substrate which was once created is not solved by time. For this reason, the temperature distribution accumulates gradually every time the conveyance between heating chambers is repeated. In particular, in the heat treatment of a large-size glass substrate for PDP or the like, distortion of the film formed on the substrate or the substrate also occurs due to the temperature distribution in the substrate generated at the time of conveyance, and in some cases, the crack of the substrate may occur.

SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional situation, and when a heat treatment of a substrate including a film-forming material is performed in a heating chamber, a temperature distribution occurs in the substrate due to thermal effects from another adjacent heating chamber having a different average temperature in the room. It aims at providing the heat processing method of the board | substrate which can suppress a thing and heat-process uniformly the whole board | substrate. Moreover, an object of this invention is to provide the heat processing method of the board | substrate which can eliminate the board | substrate internal temperature distribution which arises at the time of conveying the board | substrate containing a film forming material between adjacent heating chambers which differs in set temperature. Moreover, an object of this invention is to provide the continuous heat processing furnace which can be used suitably for these heat processing methods.

1 is an explanatory view showing an example of an embodiment according to the first heat treatment method, (a) schematically shows the configuration of the heating means, (b) shows the set temperature of the heating means in the flat setting, ( c) shows the set temperature of the heating means at the time of setting a gradient, (d) shows the position of the glass substrate which is a to-be-processed body, and the thermometer installed on the said board | substrate.

FIG. 2 is an explanatory view showing an example of an embodiment according to the second heat treatment method, in which (a) to (f) respectively show the movement of the substrate between the heating chambers adjacent to the elevated region and the change in the set temperature during the movement. Shows.

3 is a schematic diagram showing an example of a regeneration burner structure.

Fig. 4 is an explanatory diagram showing the timing of changing the conveyance speed when the conveying means of the continuous transmission method is used, where (a) is an acceleration start time, (b) is a sustain period of the highest speed, and (c) is a deceleration start time. Show each one.

5 is a process chart showing a manufacturing process of the PDP.

6 is a graph showing the infrared irradiation rate of Si impregnated SiC.

<Explanation of symbols for main parts of drawing>

1: substrate

3, 5: heating chamber

7: partition wall

13: radiant tube

15: heat storage body

According to the present invention, a plurality of heating chambers partitioned with respect to the conveying direction of the heat-treatment body and a conveying means for conveying the heat-treatment body to the adjacent heating chamber are provided, and each heating chamber is provided at least in several ways with respect to the conveyance direction of the heat-treatment body. A method of heat-treating a substrate including a film-forming material by using a continuous heat treatment furnace in which a heating means capable of individually controlling a temperature as an independent control system is provided, wherein the substrate is formed of at least one other adjacent heating chamber among the plurality of heating chambers. In a heating chamber in which the average temperature of one of the rooms is different from each other, the heating chamber is controlled by controlling the set temperature of each heating means installed in the heating chamber so as to be different from the conveying direction of the object to be treated, thereby providing a gradient in the temperature in the heating chamber. The thermal effects of other adjacent heating chambers on the substrate being heat-treated within Heat treatment of the substrate characterized in that for uniformly heating the substrate (first heat treatment) is provided.

According to the present invention, there is also provided a plurality of heating chambers partitioned with respect to the conveying direction of the object to be treated, and a conveying means for conveying the object to be treated to an adjacent heating chamber, and in each heating chamber at least in the conveying direction of the object to be treated. A method of heat-treating a substrate containing a film-forming material by using a continuous heat treatment furnace in which a heating means capable of individually controlling temperature as a separate control system and each having a separate control system is provided. By adjusting the temperature setting of each heating chamber to the conveyance of the said board | substrate at the time of conveyance, the temperature distribution in the board | substrate which arose in the said conveyance process is eliminated at an early time, The heat processing method of a board | substrate (2nd heat treatment method) This is provided.

According to the present invention, there is also provided a plurality of heating chambers partitioned with respect to the conveying direction of the object to be treated, and a conveying means for conveying the object to be treated to an adjacent heating chamber, and in each heating chamber at least in the conveying direction of the object to be treated. A continuous heat treatment furnace provided with heating means capable of individually controlling the temperature as an independent control system, each of which is divided into several parts, and controls so that the set temperature of each heating means provided in the heating chamber becomes a different value in the conveying direction of the workpiece. A continuous heat treatment furnace (first heat treatment furnace) is provided, which has a temperature control device capable of doing so.

According to the present invention, there is also provided a plurality of heating chambers partitioned with respect to the conveying direction of the object to be treated, and a conveying means for conveying the object to be treated to an adjacent heating chamber, and in each heating chamber at least in the conveying direction of the object to be treated. It is a continuous heat treatment furnace provided with heating means capable of controlling the temperature individually as an independent control system, each of which is divided into several parts, and when setting the temperature of each heating chamber to be transferred between adjacent heating chambers, A continuous heat treatment furnace (second heat treatment furnace) is provided, which has a temperature control device that can be changed in synchronization with conveyance.

The continuous heat treatment furnace used in the first heat treatment method of the present invention includes a plurality of heating chambers partitioned with respect to the conveying direction of the object to be treated, and a conveying means for conveying the object to be treated to an adjacent heating chamber. Each heating chamber is provided with heating means divided into several at least with respect to the conveyance direction of a to-be-processed object. These divided heating means are each capable of controlling temperature individually as independent control systems.

Moreover, it is preferable to use the conveyance means of the intermittent transfer system which intermittently conveys a to-be-processed object to the adjacent heating chamber for the said conveyance means. Here, "intermittently conveying" refers to n + 1 from the inlet side of the adjacent furnace as soon as possible after stopping the to-be-processed object in the nth heating chamber from the furnace inlet side and performing heat treatment for a predetermined time. The conveyance method of moving to a 1st heating chamber, stopping a to-be-processed object again, and performing heat processing for a predetermined time is said. As long as this conveying method is possible, the kind of conveying means is not specifically limited, For example, a walking beam may be used, or a roller conveyor or a chain conveyor may be intermittently driven.

In the first heat treatment method, at least one of the other adjacent heating chambers (the heating chamber adjacent to the inlet side direction of the furnace and the heating chamber adjacent to the outlet side direction of the furnace) among the plurality of heating chambers partitioned as described above. ) And the set temperature of each heating means installed in the heating chamber is controlled so as to be different from the conveying direction of the heat-treatment body in a heating chamber having a different average temperature in the room, thereby providing a gradient in the temperature in the heating chamber. It offsets the thermal effects of other adjacent heating chambers on the substrate including the film forming material that is being heat treated within.

That is, a substrate including a film-forming material such as a glass substrate for PDP (hereinafter, simply referred to as a "substrate") generally moves each heating chamber sequentially while heating, heating and lowering (cooling) the process according to a desired temperature curve. In the heating chamber of the elevated temperature region where the temperature of the substrate is increased, for example, the average temperature of the room is set higher as it is closer to the outlet side of the furnace. Therefore, the substrate conveyed into the heating chamber of the elevated temperature region is placed on the inlet side of the furnace. In the near area, the temperature of the substrate tends to be lower than the target value due to the thermal effect of the heating chamber having a lower adjacent room average temperature, and conversely, in the area near the exit side of the furnace, the substrate is affected by the heat of the heating chamber in which the adjacent room average temperature is higher. The temperature of is likely to be higher than the target value.

For this reason, even if the temperature of the heating means is controlled so that the temperature in each heating chamber is constant as in the prior art, the temperature distribution in the conveying direction is generated in the substrate due to the thermal effect of other adjacent heating chambers on the substrate, This may cause defects such as distortion, cracking, and breakage of the film formed on the film.

Therefore, in the first heat treatment method, for the heating means for heating a portion where the substrate temperature is likely to be lower than the target value due to the thermal influence of another adjacent heating chamber, the set temperature is controlled to a high value so as to cancel the temperature drop caused by the thermal influence. To increase the ambient temperature around the site and, conversely, to the heating means for heating the site where the substrate temperature is likely to be higher than the target due to the thermal effects of other adjacent heating chambers, the set temperature is offset to offset the temperature rise due to the thermal effect. By controlling the temperature to a lower value and lowering the ambient temperature around the site, a set temperature of each heating means installed in the same heating chamber is controlled so as to be different from the conveying direction of the heat-treatment body, thereby providing a gradient in the temperature in the heating chamber. do.

For example, as shown in Fig. 1 (a), the temperature is divided into nine parts A to I on the upper part of the heating chamber (the ceiling of the furnace) in which the difference in the indoor average temperature from the adjacent heating chamber is 70 ° C., and each of them is individually controlled as an independent control system. In the case of heating a 40-inch glass substrate for PDP by providing a controllable heating means, when the set temperatures of the divided heating means A to I are all the same as in FIG. 1 (b) (flat setting) ) And the set temperature of the inlet-side heating means G-I to a high value (342 degreeC) with respect to the set temperature (337 degreeC) of the heating means D-F of the center part, as shown in FIG.1 (c), When the set temperature of the outlet-side heating means A to C is set to a low value (332 ° C.) (gradient setting), the temperature distribution of the substrate is examined after heating for a predetermined time, as shown in Fig. 1 (d). The temperature and the deviation of each installation location of the glass board which installed thermometer in nine places of are shown in Table 1, and are set flat It is above the temperature distribution in the side of the substrate during the gradient setting was smaller.

Measured value (℃) Deviation ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ Flat setting 250 251 257 240 242 244 235 236 240 22 Draft settings 224 222 225 224 222 228 227 226 230 8

In the first heat treatment method, by setting the temperature of each heating means divided in the same heating chamber in such a manner as to be different from the conveying direction of the object to be treated, a gradient is formed in the temperature in the heating chamber, whereby another adjacent heating chamber is formed. The glass substrate is uniformly heat treated to counteract the thermal effect on the substrate. And in the heating chamber of the low temperature area | region which lowers the temperature of a board | substrate, the setting temperature of an inlet side heating means is controlled to a low value, and the setting temperature of an outlet side heating means is controlled to a higher value, and it is contrary to the above-mentioned example. By providing a temperature gradient of, cracking of the substrate can be achieved.

For the purpose of setting the temperature gradient in the heating chamber, in the case where the substrate is heat-treated in a temperature raising, warming, and cooling (cooling) process, the temperature difference between the highest temperature region and the lowest temperature region of the substrate when the substrate is present in the heating chamber to insulate It is preferable to set a temperature gradient so that ((DELTA) T) will be 6 degrees C or less.

In addition, when the temperature distribution of a board | substrate arises also in the width direction of a furnace by the thermal effect from a furnace wall etc., a heating means is divided not only in the conveyance direction (length direction of a furnace) of a to-be-processed object, but also in the width direction of a furnace. By controlling the set temperature of each heating means to be a different value even in the width direction, it is possible to offset the thermal effect and to perform a more uniform heat treatment by providing a temperature gradient in the heating chamber.

Next, the second heat treatment method of the present invention will be described. While the above-described first heat treatment method is intended for cracking in the state where the entire substrate exists in the same heating chamber, the second heat treatment method is a temperature generated when the substrate moves between adjacent heating chambers. It is made for the purpose of eliminating distribution.

Also in the second heat treatment method, a heat treatment furnace having the same basic structure as the heat treatment furnace used in the above-described first heat treatment method is used, but in this method, adjacent heating having different set temperatures without fixing the temperature setting of each heating chamber at all times. When conveying a board | substrate between chambers, the temperature setting of each heating chamber is synchronized with the conveyance of the said board | substrate, and is changed.

For example, as described above, the closer to the exit side of the furnace, the higher the average temperature of the room is set in the heating chamber of the elevated temperature region. Therefore, when the glass substrate is conveyed between adjacent heating chambers, the front portion of the substrate (the substrate From the portion near the outlet side of the furnace) is sent into the heating chamber of the moving destination having a higher set temperature.

For this reason, in the front part of the board | substrate sent to the heating chamber of a moving destination first, and the back part (referred to the inlet side of the furnace of a board | substrate) which is delayedly sent, different heat history will generate | occur | produce a temperature distribution in a board | substrate, If the temperature setting of the heating chamber is fixed only in consideration of cracking in the state in which the entire substrate is present in the same heating chamber, the temperature distribution generated during the transportation is not solved, and the transfer is repeated between the heating chambers. Each time it accumulates and increases.

Therefore, in the second heat treatment method, for example, as shown in FIG. 2, the temperature setting of each heating chamber is changed in synchronization with the transfer of the substrate. In the drawings, 3 and 5 are heating chambers in which the temperature raising regions are adjacent to each other, and 1 is a substrate to be a heat-treatment body.

First, in the stationary state of the substrate 1 shown in Fig. 2 (a), the temperature of each heating chamber 3, 5 is a value higher than the temperature of the inlet heating means as exemplified in the above-described first heat treatment method. The temperature of the outlet-side heating means is controlled to a low value and is set in a state where a gradient of a predetermined temperature is achieved.

Then, after the heat treatment is performed for a predetermined time at the temperature setting, conveyance of the substrate 1 starts, and as shown in FIG. 2 (b), about one third of the front portion of the substrate 1 is moved to the heating chamber 5 of the moving destination. From the time when it entered, the inlet set temperature of each heating chamber will start to rise gradually. In addition, as shown in FIG. 2 (c), the inlet-side set temperature continues to rise continuously as the substrate 1 moves, and as shown in FIG. 2 (d), the substrate 1 moves to the heating chamber 5 of the moving destination. When fully entered, the inlet set temperature of each heating chamber reaches the maximum temperature.

Thus, when the board | substrate 1 moves from the heating chamber 3 before a movement to the heating chamber 5 of the moving destination with a higher set temperature, if it raises the inlet side set temperature of each heating chamber, it will delay and It is possible to rapidly increase the temperature near the entrance of the heating chamber of the moving destination by the rear portion of the substrate 1 entering the heating chamber and quickly catch up with the temperature of the front portion exposed to the high temperature first.

Then, as shown in Fig. 2E, after the substrate 1 stops at the predetermined position, the set temperature at the inlet side of each heating chamber gradually drops, and from the time when it returns to the predetermined temperature gradient as shown in Fig. 2F. The heat treatment for a predetermined time is performed, and the movement to the next heating chamber is started again.

In the second heat treatment method, when conveying substrates between adjacent heating chambers having different set temperatures in this manner, the temperature distribution in the substrate generated in the conveying step is changed at a time when the temperature setting of each heating chamber is synchronized with the conveyance of the substrate. Eliminate In addition, when conveying a board | substrate between adjacent heating chambers in which the temperature-falling area | region which lowers temperature, the temperature distribution which arose at the time of conveyance similarly to the above-mentioned example by synchronizing with the movement of a glass substrate, and gradually lowering the setting temperature of the inlet side of a heating chamber. Can be solved early.

In addition, in the above-mentioned example, although the inlet set temperature of the heating chamber was changed, the outlet set temperature of the heating chamber may be changed or the set temperature of the whole heating chamber may be changed depending on a situation. As described above, the temperature may be changed in a state where there is no difference in the set temperature of the entire heating chamber without providing a gradient at the set temperature in each heating chamber.

Next, a continuous heat treatment furnace that can be suitably used in the heat treatment method of the present invention will be described. First, the continuous heat treatment furnace (first heat treatment furnace) suitable for carrying out the first heat treatment method has, as described above, a plurality of heating chambers partitioned with respect to the conveying direction of the object to be treated, and adjacent heating chambers. A conveying means for conveying a to-be-processed object is provided. Each heating chamber is provided with heating means divided into several at least in the conveyance direction of the object to be treated, and these divided heating means are each capable of controlling temperature individually as independent control systems.

Moreover, this continuous heat treatment furnace has a temperature control apparatus which can control so that the set temperature of each heating means installed in a heating chamber may become a different value in the conveyance direction of a to-be-processed object as a characteristic structure, and accordingly, 1 The heat treatment method can be easily carried out.

The continuous heat treatment furnace (second heat treatment furnace) suitable for carrying out the second heat treatment method has the same basic structure, but as a characteristic feature, the temperature of each heating chamber when conveying the heat-treatment body between adjacent heating chambers. It has a temperature control apparatus which can change a setting to be synchronized with conveyance of the said to-be-processed object, and can implement easily the 2nd heat processing method mentioned above by this.

In any of the above heat treatment furnaces, it is preferable to use an electric heater with easy temperature control as the heating means, but a gas-fired indirect heating burner (radiation tube burner) which is advantageous in terms of operating cost can be used for part or all of the heating means. have. Moreover, although there exist a straight type | mold, a single-ended type | mold, a U-shape, etc. in a radiation tube, you may use any of these. Moreover, as a gas fired indirect heating type burner, the regeneration burner of the heat recovery type | mold with a heat accumulator is preferable.

FIG. 3 is a schematic diagram showing an example of the structure of the regeneration burner, and is provided with heat storage bodies 15 made of a burner, a ceramic honeycomb type, and the like at both ends of the radiation tube 13, respectively. When the burners provided at both ends of the radiation tube 13 are alternately burned, a high energy saving effect can be obtained.

That is, when one burner of the radiating tube is burning, the heat is recovered from the other end of the radiating tube while exhausting the heat to the heat accumulator, and when the combustion is switched to the other end burner, the combustion air is preheated using the heat recovered by the heat accumulating body. This reduces the amount of fuel required for burner heating. In addition, by switching at short intervals, the temperature distribution on the surface of the radiation tube is reduced, enabling uniform heating.

It is preferable to arrange a muffle between a heating means and the moving region of a to-be-processed object, and it is especially preferable that one part or all part of the muffle consists of a material with high infrared irradiation rate. This is because the far-infrared or near-infrared rays are irradiated from the muffle by receiving the heat generated from the heating means once, allowing the heat-treatment to be heated more quickly. Moreover, there is also an effect that the cleanliness in the moving region of the to-be-processed object is ensured by hermetic isolation of the said muffle heating means and the moving region of a to-be-processed object.

As a material with high infrared irradiation rate which comprises a muffle, the sintered compact containing SiC is preferable, and Si impregnated SiC is especially preferable. Si-impregnated SiC is obtained by sintering a molded article mainly composed of silicon carbide and carbon while impregnating metal silicon in a vacuum under an inert gas atmosphere or vacuum in which metal silicon is present, and for example, as shown in FIG. 6 in comparison with crystallized glass. Likewise, it shows a remarkably high infrared irradiation rate and a very high thermal conductivity.

The conveying means includes an intermittent transmission method for intermittently conveying the above-described target object and a continuous transmission method for continuously conveying the target object without moving to each heating chamber. In this invention, although the conveyance means of an intermittent transfer system is used suitably, conveyance of a continuous transfer system is conveyed between the heating chambers of the temperature rising area which raises the temperature of a to-be-processed object, and between the heating chambers of the heat-retaining area | region which heat-insulates a to-be-processed object. A means may be used for the conveyance between the heating chambers of the low temperature (cooling) region in which the temperature of the heat-treatment body is lowered.

However, when the conveyance means of a continuous transfer system is used for conveyance between the heating chambers of a temperature rising area | region and the heating chamber of a heat insulation area | region as mentioned above, the temperature distribution which arises when a to-be-processed object moves to the state between adjacent heating chambers is used. In order to make it small, it is necessary to make the conveyance speed of the period to which the to-be-processed body to move in the state spanning between adjacent heating chambers sufficiently high with respect to the conveyance speed of the period in which the whole to-be-processed object is located in the same heating chamber. It is preferable that the conveyance speed of the latter period is 20 times or more with respect to the conveyance speed of the former period specifically, and it is still more preferable if it is 50 times or more. As a conveyance means of the continuous transmission system which can change such a conveyance speed, a roller conveyor or a chain conveyor is mentioned, for example.

As a specific timing of a conveyance speed change, the partition wall 7 which divides the heating chamber 3 before a movement, and the heating chamber 5 of a moving destination into the front end of the board | substrate 1 which is a to-be-processed body, for example like FIG.4 (a). After the conveyance speed is accelerated from the time point at which the front lower portion reaches the bottom to reach the maximum speed, as shown in FIG. 4 (b), while the substrate 1 is in the state spanned between the heating chambers 3 and 5, Maintain that state. And as shown in FIG.4 (c), it decelerates from the time when the rear end of the board | substrate 1 reached the lower part of the back surface side of the partition wall 7, and conveys it at predetermined low speed while the board | substrate 1 whole is located in the heating chamber. do.

As described above, according to the present invention, when heat-treating a substrate including a film-forming material in a heating chamber, it is suppressed that a temperature distribution occurs in the substrate by thermal effects from another adjacent heating chamber having a different average temperature in the room. Thus, the entire substrate can be heat treated uniformly. Moreover, according to this invention, the temperature distribution in the inside of the board | substrate which arises at the time of conveying the board | substrate containing a film forming material between adjacent heating chambers which differs in set temperature can be eliminated at an early time.

Claims (29)

A plurality of heating chambers partitioned with respect to the conveyance direction of a to-be-processed object, and conveyance means for conveying a to-be-processed object to an adjacent heating chamber, are divided into each several at least with respect to the conveyance direction of a to-be-processed object, respectively. In a method of heat-treating a substrate containing a film-forming material using a continuous heat treatment furnace provided with a heating means capable of temperature control individually as an independent control system, In a heating chamber in which at least one of the adjacent heating chambers of the plurality of heating chambers differs from the average temperature in the room, the set temperature of each heating means provided in the heating chamber is controlled so as to be different from the conveying direction of the heat-treatment body. A heat treatment method for a substrate, wherein the substrate is uniformly heat treated by providing a gradient at a temperature in the heating chamber, thereby canceling the thermal effect of another heating chamber adjacent to the substrate being heat treated in the heating chamber. 2. The method of heat-treating a substrate according to claim 1, wherein the conveying means is an intermittent transfer method of intermittently conveying the object to be treated to an adjacent heating chamber. The temperature difference ΔT between the highest temperature portion and the lowest temperature portion of the substrate according to claim 1, wherein when the substrate is heat-treated in a temperature raising, warming, and lowering process, when the substrate is present in a heating chamber for warming, A gradient is provided at a temperature in the heating chamber so that the temperature is lower than or equal to ° C. A plurality of heating chambers partitioned with respect to the conveyance direction of a to-be-processed object, and conveyance means for conveying a to-be-processed object to an adjacent heating chamber, are divided into each several at least with respect to the conveyance direction of a to-be-processed object, respectively. In a method of heat-treating a substrate containing a film-forming material using a continuous heat treatment furnace provided with a heating means capable of temperature control individually as an independent control system, When conveying a board | substrate between adjacent heating chambers from which a set temperature differs, the temperature setting of each heating chamber is changed and synchronized with the conveyance of the said board | substrate, and the temperature distribution in the board | substrate which arose in the said conveyance process is eliminated early, It is characterized by the above-mentioned. Heat treatment method of the substrate. 5. The method of heat-treating a substrate according to claim 4, wherein said conveying means is an intermittent transfer type conveying means for intermittently conveying a heat treatment member to an adjacent heating chamber. A plurality of heating chambers partitioned with respect to the conveyance direction of a to-be-processed object, and conveyance means for conveying a to-be-processed object to an adjacent heating chamber, are divided into each several at least with respect to the conveyance direction of a to-be-processed object, respectively. In a continuous heat treatment furnace equipped with heating means capable of temperature control as an independent control system, And a temperature control device capable of controlling the set temperature of each heating means provided in the heating chamber to be a different value in the conveying direction of the object to be treated. The continuous heat treatment furnace according to claim 6, wherein the heating means is an electric heater. A continuous heat treatment furnace according to claim 6, wherein part or all of the heating means is a gas fired indirectly heated burner. The continuous heat treatment furnace according to claim 8, wherein the gas-fired indirect heating burner is a heat recovery type regeneration burner having a heat storage body. The continuous heat treatment furnace according to claim 6, wherein a muffle is disposed between the heating means and the moving region of the object to be treated, and part or all of the muffle is made of a material having a high infrared irradiation rate. 8. The continuous heat treatment furnace according to claim 7, wherein a muffle is disposed between the heating means and the moving region of the object to be treated, and part or all of the muffle is made of a material having a high infrared irradiation rate. The continuous heat treatment furnace according to claim 8, wherein a muffle is disposed between the heating means and the moving region of the object to be treated, and part or all of the muffle is made of a material having a high infrared irradiation rate. 10. The continuous heat treatment furnace according to claim 9, wherein a muffle is disposed between the heating means and the moving region of the object to be treated, and part or all of the muffle is made of a material having a high infrared irradiation rate. The continuous heat treatment furnace according to claim 10, wherein the material having a high infrared irradiation rate is a sintered body containing SiC. The continuous heat treatment furnace according to any one of claims 6 to 14, wherein the conveying means is an intermittent transfer type conveying means for intermittently conveying the object to be treated to an adjacent heating chamber. The conveying means of any one of Claims 6-14 which conveys between the heating chambers of the temperature rising area which raises the temperature of a to-be-processed body, and between the heating chambers of the heat-retaining area | region which heat-insulates a to-be-processed body. And a conveying means of an intermittent transfer method is used for conveying between heating chambers of the low temperature area which lowers the temperature of a to-be-processed object, and is used. The conveyance means of the continuous transfer method according to claim 16, wherein the conveying means of the continuous transfer method is adapted to convey the conveying speed of the period in which the to-be-processed object moves in a state between adjacent heating chambers with respect to the conveying speed of the period in which the entire to-be-processed object is located in the same heating chamber. Continuous heat treatment furnace, characterized in that the speed change can be made 20 times or more. A plurality of heating chambers partitioned with respect to the conveyance direction of a to-be-processed object, and conveyance means for conveying a to-be-processed object to an adjacent heating chamber, are divided into each several at least with respect to the conveyance direction of a to-be-processed object, respectively. In a continuous heat treatment furnace provided with a heating means capable of individually temperature control as an independent control system, A continuous heat treatment furnace characterized by having a temperature control device capable of changing the temperature setting of each heating chamber in synchronization with the conveyance of the heat treatment target body when conveying the heat treatment target body between adjacent heating chambers. 19. A continuous heat treatment furnace according to claim 18, wherein the heating means is an electric heater. 19. A continuous heat treatment furnace according to claim 18, wherein part or all of the heating means is a gas fired indirectly heated burner. 21. The continuous heat treatment furnace according to claim 20, wherein the gas-fired indirectly heated burner is a heat recovery type regeneration burner having a heat storage body. 19. The continuous heat treatment furnace according to claim 18, wherein a muffle is disposed between the heating means and the moving region of the object to be treated, and part or all of the muffle is made of a material having a high infrared irradiation rate. 20. The continuous heat treatment furnace according to claim 19, wherein a muffle is disposed between the heating means and the moving region of the object to be treated, and part or all of the muffle is made of a material having a high infrared irradiation rate. 21. The continuous heat treatment furnace according to claim 20, wherein a muffle is disposed between the heating means and the moving region of the object to be treated, and part or all of the muffle is made of a material having a high infrared irradiation rate. 22. The continuous heat treatment furnace according to claim 21, wherein a muffle is disposed between the heating means and the moving region of the object to be treated, and part or all of the muffle is made of a material having a high infrared irradiation rate. The continuous heat treatment furnace according to claim 22, wherein the material having a high infrared irradiation rate is a sintered body containing SiC. 27. The continuous heat treatment furnace according to any one of claims 18 to 26, wherein the conveying means is an intermittent transfer method of conveying the object to be thermally intermittently to an adjacent heating chamber. 27. The conveying means of any one of Claims 18-26 which conveys between the heating chambers of the temperature rising area which raises the temperature of a to-be-processed body, and between the heating chambers of the heat-retaining area which heat-insulates a to-be-processed body. And a conveying means of an intermittent transfer method is used for conveying between heating chambers of the low temperature region which lowers the temperature of a to-be-processed object, using the. The conveying means of the continuous transfer method according to claim 28, wherein the conveying means of the continuous transfer method is configured to convey the conveying speed of the period in which the to-be-processed object moves in a state between adjacent heating chambers with respect to the conveying speed of the period in which the whole to-be-processed object is located in the same heating chamber. Continuous heat treatment furnace, characterized in that the speed change can be made 20 times or more.