KR100396252B1 - optical device and method for fabricating the same - Google Patents

Abstract

The present invention relates to an optical device used in an optical communication system and a method of manufacturing the same, wherein after fabricating an optical waveguide device and an optical fiber block on a single substrate, the connection surface thereof is subjected to a dicing process and a grinding / polishing process, and is then connected again. The optical waveguide and the optical fiber can be connected simply and accurately without the need for an alignment device.

Description

Optical device and method for manufacturing same

The present invention relates to an optical element used in an optical communication system and the like and a manufacturing method thereof.

In general, optical communication systems use optical waveguide devices to transmit optical signals.

The optical waveguide element is connected to the optical fiber and used, and the optical signal is transmitted smoothly only when the center of the optical fiber matches the center of the optical waveguide.

However, the connection technology between the optical fiber and the optical waveguide not only requires very precision but also requires expensive alignment or connection assistance devices.

These demands pose the biggest obstacle to mass production of low cost optical waveguide devices.

FIG. 1 is a view illustrating a general method of connecting an optical waveguide element and an optical fiber. First, as shown in FIG. 1, an optical waveguide element and an input / output optical fiber block are manufactured.

Here, the optical fiber block usually has a V-shaped groove, and the optical fiber is mounted on the groove.

In the optical waveguide device and the input / output optical fiber block manufactured as described above, the surfaces to be bonded to each other are ground and polished, respectively, and then precisely connected to each other using an alignment station.

In the case of using the alignment device, first, the input optical fiber block in which one optical fiber is fixed is aligned with the input surface of the optical waveguide element.

Subsequently, the alignment device finely moves the input optical fiber block to align the core of the input optical waveguide with the core of the input optical fiber when the intensity of light output from the input optical fiber through the input optical waveguide of the optical waveguide element is maximum.

At this time, the input optical fiber and the input optical waveguide are connected using a laser or an adhesive.

The output optical fiber block on which one or more output optical fibers are fixed is aligned with the output surface of the optical waveguide element.

The alignment device then finely moves the output optical fiber block to center the output optical waveguide of the optical waveguide element and the core of the output optical fiber when the intensity of light output from the input optical fiber through the one or more output optical fibers is maximum.

At this time, the output optical fiber and the output optical waveguide are connected using a laser or an adhesive.

However, this conventional connection method does not have a reference point for matching the axis of the optical waveguide formed in the optical waveguide element with the axis of the optical fiber mounted in the optical fiber block. Special equipment is needed and difficult because it determines the optimal connection state to the shaft center depending on the size.

In addition, since the optical waveguide devices and the input / output optical fiber blocks that are currently produced are fabricated in a batch process and diced on different silicon wafers, many devices and blocks are produced at once.

However, in the assembly process of connecting the optical waveguide elements and the input / output optical fiber blocks made from different silicon substrates to each other, at least a considerable working time is required for one connection and several expensive alignment devices are required. It is a major obstacle to cost reduction and mass production of devices.

The present invention has been made to solve these problems, and an object thereof is to provide an optical device capable of mass production and cost reduction and a method of manufacturing the same.

1 is a view showing a general method for connecting an optical waveguide device and an input / output optical fiber block according to the prior art;

2a to 2j are process perspective views showing a manufacturing process of the optical device according to the first embodiment of the present invention

3A to 3J are process perspective views illustrating a manufacturing process of an optical device according to a second exemplary embodiment of the present invention.

4A to 4J are process perspective views illustrating a manufacturing process of an optical device according to a third exemplary embodiment of the present invention.

5 is a structural perspective view showing an optical element of the present invention having a connection guide

6A to 6G are process perspective views illustrating a manufacturing process of an optical device according to a fourth exemplary embodiment of the present invention.

7 is a structural perspective view showing an optical device of the present invention in which a 1 × 8 optical waveguide device and an input / output optical fiber block are connected.

Explanation of symbols for main parts of the drawings

11,21,31,51: substrate 12,22,32: mask layer

13,23,33,53: lower clad layer 14,24,34,54: core layer

14a, 24a, 34a, 42, 54a: optical waveguide 15, 25, 35, 55: upper cladding layer

11a-11c, 21a-21c, 31a-31c, 51a-51c: 1st, 2nd, 3rd sub substrate

41: connection guide 43: optical fiber

44: optical waveguide device 45: input optical fiber block

46: output optical fiber block

An optical device according to the present invention comprises a first optical fiber block having at least one first optical fiber, a second optical fiber block fabricated on the same substrate as the first optical fiber block and having at least one second optical fiber, and first and second optical fibers. An optical waveguide element fabricated on the same substrate as the block and having at least one optical waveguide, wherein the first and second optical fiber blocks are connected to both sides of the optical waveguide element so that the optical axes of the optical waveguide and the optical fiber coincide with each other; The area and height of the connection surface are the same so that the upper and lower surfaces of the optical waveguide element and the upper and lower surfaces of the first and second optical fiber blocks are parallel to each other.

Here, at least one groove-shaped connection guide is formed in a portion of the interface between the optical waveguide element and the first and second optical fiber blocks, wherein the connection guide includes a central axis of the connection guide formed in the optical waveguide element and the first and second optical fiber blocks. The central axes of the connection guides formed in the grooves are formed so as to coincide with or deviate from each other.

The substrate is made of any one of Si, GaAs, and InP.

Meanwhile, a method of manufacturing an optical device in which first and second optical fiber blocks having at least one optical fiber are connected to both sides of an optical waveguide device having at least one optical waveguide, respectively, includes a substrate having first, second and third regions. Preparing a substrate; forming at least one optical waveguide in a second region of the substrate; dicing the substrate so that the first, second, and third regions of the substrate are separated from each other. Forming a first sub substrate having a second sub substrate having a second region, a third sub substrate having a third region, and arranging at least one optical fiber on the first sub substrate and the third sub substrate, respectively; Grinding and polishing both sides of the second sub-substrate and one side of the first and third sub-substrates respectively, and the amount of the second sub-substrate so that the grinding and polished sides face each other. First, third on the side Aligning and connecting the sub substrates respectively.

Here, at least one groove may be formed by etching predetermined regions of the first and third sub-substrates to a predetermined depth before the optical waveguide forming step or after dicing the substrate.

According to another aspect of the present invention, there is provided a method of fabricating an optical device, comprising: preparing a substrate having first, second, and third regions, and forming a mask pattern on the first and third regions below the substrate and on the substrate. Forming at least one optical waveguide in a second region of the substrate by forming and patterning a lower clad layer on the front surface of the substrate, and forming and patterning a core layer on the lower clad layer; Forming an upper clad layer on the entire surface including the first cladding layer, and dicing the substrate so that the first, second, and third regions of the substrate are separated from each other, and having the first sub substrate and the second region. Forming a third sub substrate having a second sub substrate and a third region; exposing a mask pattern by removing upper and lower clad layers formed on the first sub substrate and the third sub substrate; hemp Etching the first sub-substrate and the third sub-substrate to a predetermined depth to form at least one groove and removing a mask pattern, arranging optical fibers to correspond to the grooves respectively, and the amount of the second sub-substrate Grinding and polishing the sides and one side of the first and third sub-substrates respectively, and the first and third sub-surfaces on both sides of the second sub-substrate such that the ground and polished sides face each other. Aligning and connecting the substrates respectively.

According to still another aspect of the present invention, there is provided a method of preparing a substrate having first, second, and third regions, and forming a first mask pattern on a first region and a third region below the substrate and on the substrate. Forming at least one optical waveguide in a second region of the substrate by forming and patterning a core layer on the lower clad layer, and forming a core layer on the lower clad layer. Forming an upper clad layer on the entire surface including the upper surface; forming a second mask pattern on the upper clad layer formed on the second region on the substrate; Exposing the first mask pattern by removing the upper and lower clad layers formed over the three regions, and forming the first region and the third region on the substrate with a predetermined depth using the first mask pattern as a mask. Forming at least one groove and removing the second mask pattern, and dicing the substrate so that the first, second, and third regions of the substrate are separated from each other. Forming a second sub-substrate having a second region and a third sub-substrate having a third region, arranging optical fibers so as to correspond to the grooves respectively, and forming both side surfaces of the second sub-substrate and the first and the first Grinding and polishing one side of each of the three sub-substrates, and aligning and connecting the first and third sub-substrates respectively to both sides of the second sub-substrate so that the grinding and polished sides face each other. It consists of steps.

According to still another aspect of the present invention, there is provided a method of preparing a substrate having first, second, and third regions, and forming a mask pattern on a first region and a third region below the substrate and on the substrate. And etching the first and third regions on the substrate to a predetermined depth by using the mask pattern as a mask to form at least one groove and to remove the mask pattern, and forming a lower clad layer on the entire surface of the substrate. And forming and patterning a core layer on the lower clad layer to form at least one optical waveguide in the second region of the substrate, and forming an upper clad layer on the entire surface including the patterned core layer. Exposing the grooved substrate by removing the upper and lower cladding layers formed on the first and third regions, and cutting the substrate so that the first, second and third regions of the substrate are separated from each other. (dicing) forming a first sub substrate having a first region, a second sub substrate having a second region, and a third sub substrate having a third region, arranging the optical fibers so as to correspond respectively on the grooves; Grinding and polishing both sides of the second sub-substrate and one side of the first and third sub-substrates, respectively, and both sides of the second sub-substrate such that the grinding and polished sides face each other. And aligning and connecting the first and third sub-substrates, respectively.

Here, when the grooves are formed in the first region and the third region on the substrate, the at least one connection guide may be formed by etching the first, second, and third regions of the substrate to a predetermined depth so as to be parallel to the grooves. It may be.

According to still another aspect of the present invention, there is provided a method of preparing a substrate having first, second, and third regions, forming a lower clad layer on an entire surface of an upper surface of the substrate, and forming a core layer on the lower clad layer. Forming at least one optical waveguide in the second region of the substrate, forming an upper cladding layer on the entire surface including the patterned core layer, and forming a pattern on the substrate using a mask having a predetermined pattern. First etching the upper and lower clad layers of the first region and the third region to expose the substrate and secondly etching the exposed substrate to a predetermined depth to form grooves; Removing the upper and lower cladding layers remaining in the substrate; dicing the substrate so that the first, second, and third regions of the substrate are separated from each other; 2nd standing having Forming a third sub-substrate having a substrate and a third region, arranging optical fibers to correspond to the grooves respectively, and grinding both sides of the second sub-substrate and one side of the first and third sub-substrates, respectively. grinding and polishing, and aligning and connecting the first and third sub-substrates respectively to both sides of the second sub-substrate so that the ground and polished sides face each other.

The forming of the grooves in the first and third regions of the substrate may include preparing a mask having a predetermined pattern, aligning the mask on the substrate, and using the mask to form the first region of the substrate. And exposing the substrate by dry etching the upper and lower clad layers of the third region, and forming a groove by removing the mask and wet etching the substrate exposed by the upper clad layer as a mask to a predetermined depth.

The interface between the first and second regions on the substrate and the interface between the second and third regions on the substrate are etched to a predetermined depth to form at least one connection guide.

The present invention manufactured as described above is simple in process and mass-produced, and it is possible to accurately connect the optical waveguide and the optical fiber without the need for an expensive alignment device, thereby significantly reducing the manufacturing process time and the process cost.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments taken in conjunction with the accompanying drawings.

Referring to the accompanying drawings, preferred embodiments of the present invention having the features as described above are as follows.

First, the concept of the present invention is to fabricate the optical waveguide element and the input / output optical fiber block on a single substrate, and then, by connecting them back to the dicing process and grinding / polishing process and connecting them again, without the need for expensive alignment device It is to connect the waveguide and the optical fiber simply and accurately.

First embodiment

2A to 2J are process perspective views illustrating a manufacturing process of an optical device according to a first exemplary embodiment of the present invention.

First, as shown in FIG. 2A, a silicon substrate 11 having a second region in which an optical waveguide is to be formed, a first region and a third region in which an optical fiber is to be arranged is prepared, and then the image / phase of the prepared silicon substrate 11 is prepared. An optical waveguide is formed by forming a mask layer 12 made of silicon nitride or the like on the lower surface, and patterning the mask layer 12 using a general photolithography process or the like as shown in FIG. 2B. The substrate 11 of the second region and the substrate 11 of the first region and the third region where the optical fiber is to be arranged are exposed.

2C and 2D, the lower clad layer 13 and the core layer 14 are sequentially formed on the entire surface of the substrate 11.

Here, the lower clad layer 13 and the core layer 14 is made of SiO ₂ , the thickness is formed of about 20㎛, about 8㎛, respectively.

As shown in FIG. 2E, the core layer 14 is patterned to form at least one optical waveguide 14a on the substrate of the second region.

Here, the lower clad layer 13 serves to help total reflection of the light to guide the light to the optical waveguide 14a well, and the optical waveguide 14a serves to guide the light.

Next, as shown in FIG. 2F, the upper clad layer 15 is formed on the entire surface including the optical waveguide 14a.

Like the lower cladding layer 13, the upper cladding layer 15 is made of SiO ₂ , has a thickness of about 20 μm, and serves to help total reflection of light so that the light is well guided by the optical waveguide 14a. .

Subsequently, as shown in FIG. 2G, when the substrate 11 is diced such that the first, second, and third regions of the substrate 11 are separated from each other, the diced substrate 11 is firstly divided. A first sub substrate 11a having a region, a second sub substrate 11b having a second region, and a third sub substrate 11c having a third region are separated.

Here, the first and third sub-substrates 11a and 11c become first and second optical fiber blocks in a later step, and the second sub-substrate 11b becomes an optical waveguide element.

Next, as shown in FIG. 2H, the mask layer patterned by sequentially removing the upper cladding layer 15 and the lower cladding layer 13 formed on the first sub-substrate 11a and the third sub-substrate 11c may be formed. 12).

At this time, the upper clad layer 15 and the lower clad layer 13 are removed by a dry etching process or a wet etching process such as HF using a reaction gas such as CxFy and CxCly.

As illustrated in FIG. 2I, the first sub substrate 11a and the third sub substrate 11c are etched to a predetermined depth using the mask layer 12 as a mask to form at least one groove, and the mask layer 12 ).

Here, the groove is formed in a V shape, and the first sub-substrate 11a and the third sub-substrate 11c in which the groove is formed become an input optical fiber block and an output optical fiber block.

Next, although not shown, the optical fibers are arranged and mounted so as to correspond respectively to the grooves of the input / output optical fiber blocks.

Subsequently, in the subsequent process, the connection surface to which the optical waveguide element and the input / output optical fiber block are connected, that is, both sides of the optical waveguide element and one side of the input / output optical fiber block are ground and polished, respectively.

And finally, as shown in FIG. 2J, the input / output optical fiber blocks are aligned on both sides of the optical waveguide device so that the ground and polished connection surfaces face each other, and the optical device is bonded by using an epoxy or the like. Is produced.

At this time, in the connected optical waveguide element and the optical fiber block, the upper / lower surface of the optical waveguide element and the upper / lower surface of the input / output optical fiber block are parallel to each other, and the area and height of the connection surface are the same.

As described above, since the present invention separates the optical waveguide element and the optical fiber block from the same substrate and then separates the optical waveguide element and the optical fiber block with respect to one reference plane, even if the optical waveguide element and the optical fiber block are aligned and connected, there is no expensive alignment device as in the prior art. The optical axis of the optical waveguide and the optical fiber can be easily adjusted.

Second embodiment

3A to 3J are perspective views illustrating a manufacturing process of an optical device according to a second exemplary embodiment of the present invention.

First, as shown in FIG. 3A, a silicon substrate 21 having a second region in which an optical waveguide is to be formed, a first region and a third region in which an optical fiber is to be arranged is prepared, and then the image / phase of the prepared silicon substrate 21 is prepared. An optical waveguide is formed by forming a first mask layer 22 made of silicon nitride or the like on the lower surface, and patterning the first mask layer 22 using a general photolithography process or the like as shown in FIG. 3B. The substrate 21 in the second region and the substrate 21 in the first and third regions where the optical fiber is to be arranged are exposed.

3C and 3D, the lower clad layer 23 and the core layer 24 are sequentially formed on the entire surface of the grooved substrate 21.

3E, the core layer 24 is patterned to form at least one optical waveguide 24a on the substrate of the second region.

Next, as shown in FIG. 3F, the upper clad layer 25 is formed on the entire surface including the optical waveguide 24a.

Subsequently, as shown in FIG. 3G, the second mask layer 26 is formed and patterned on the upper clad layer 25 to form the second mask layer only on the upper clad layer 25 formed on the substrate 21 in the second region. Leave 26.

The upper cladding layer 25 and the lower cladding layer 23 formed on the substrate 21 in the first region and the third region are sequentially removed using the remaining second mask layer 26 pattern as a mask to form the first mask. Expose layer 22.

Next, as illustrated in FIG. 3H, at least one groove is formed by etching the substrate of the first region and the substrate of the third region to a predetermined depth using the exposed first mask layer 22 as a mask. The second mask layers 22 and 26 are removed.

Here, the first mask layer 22 may not be removed.

Subsequently, as shown in FIG. 3I, when the substrate 21 is diced so that the first, second, and third regions of the substrate 21 are separated from each other, the diced substrate 21 is formed in the first region. And a first sub substrate 21 a having a second region, a second sub substrate 21 b having a second region, and a third sub substrate 21 c having a third region.

Here, the first and third sub-substrates 21a and 21c become input / output optical fiber blocks, and the second sub-substrate 21b becomes an optical waveguide element.

Next, although not shown, the optical fibers are arranged and mounted so as to correspond respectively to the grooves of the input / output optical fiber blocks.

Subsequently, in the subsequent process, the connection surface to which the optical waveguide element and the input / output optical fiber block are connected, that is, both sides of the optical waveguide element and one side of the input / output optical fiber block are ground and polished, respectively.

And finally, as shown in FIG. 3J, the input / output optical fiber blocks are aligned on both sides of the optical waveguide device so that the ground and polished connection surfaces face each other, and the optical device is bonded by using an epoxy or the like. Is produced.

As described above, the second embodiment of the present invention forms a groove of the optical waveguide block in advance before dicing the substrate, thereby making the process simpler and improving the reliability of the process.

Third embodiment

4A to 4J are process perspective views illustrating a manufacturing process of an optical device according to a third exemplary embodiment of the present invention.

First, as shown in FIG. 4A, a silicon substrate 31 having a second region in which an optical waveguide is to be formed and a first region and a third region in which an optical fiber is to be arranged is prepared, and then the image / phase of the prepared silicon substrate 31 is prepared. The mask layer 32 made of silicon nitride or the like is formed on the lower surface, and the mask layer 32 is patterned by using a general photolithography process or the like as shown in FIG. The substrate of three regions is exposed.

Subsequently, as shown in FIG. 4C, the substrate of the first region and the substrate of the third region are etched to a predetermined depth using the mask layer 32 as a mask to form at least one groove, and the mask layer 32 is removed. .

4D and 4E, the lower clad layer 33 and the core layer 34 are sequentially formed on the entire surface of the grooved substrate 31.

Next, as shown in FIG. 4F, the core layer 34 is patterned to form at least one optical waveguide 34a on the substrate of the second region.

Next, as shown in FIG. 4G, the upper clad layer 35 is formed on the entire surface including the optical waveguide 34a.

Subsequently, as shown in FIG. 4H, the upper clad layer 35 and the lower clad layer 33 formed on the substrate 31 in the first region and the third region are sequentially removed to expose the substrate 31.

4I and 4J are the same as FIGS. 3I and 3J of the second embodiment, and thus detailed descriptions thereof will be omitted.

The third embodiment of the present invention is similar to the second embodiment in that the grooves are formed before dicing the substrate, except that the grooves of the optical waveguide block are first formed before the optical waveguide is formed.

Also in the third embodiment of the present invention, since the grooves of the optical waveguide block are formed before dicing the substrate, the process becomes simpler and the reliability of the process is improved.

In addition, in the third embodiment of the present invention, as shown in FIG. 4C, in the forming of the grooves in the first and third regions of the substrate, the mask layer 32 is used as a mask to form the first and third regions of the substrate. At least one connection guide may be formed by etching the boundary surface between the two regions and the boundary surface between the second region and the third region above the substrate to a predetermined depth.

That is, the connection guide 41 is formed in parallel with the optical waveguide 42 and the optical fiber 43 as shown in FIG. 5, and the central axis and the input / output of the connection guide formed in the optical waveguide element 44. The central axes of the connection guides formed on the optical fiber blocks 45 and 46 coincide with each other.

When the connection guide 41 connects the optical waveguide 42 and the optical fiber 43, the connection guide of the input / output optical fiber blocks 45 and 46 coincides with the central axis of the connection guide of the optical waveguide element 44. Since the optical axes of the optical waveguide 42 and the optical fiber 43 are automatically matched, the connection between the optical waveguide and the optical fiber is very simple.

In addition, the connection guide 41 is formed so that the center axis of the connection guide formed in the optical waveguide element 44 and the center axis of the connection guide formed in the input / output optical fiber blocks 45 and 46 do not coincide with each other and are shifted from each other. You may.

That is, the connection guide may be formed such that the connection guide formed on the optical waveguide element 44 is sandwiched between the connection guides formed on the input / output optical fiber blocks 45 and 46.

Of course, the connection guide can be formed in various forms.

Fourth embodiment

6A to 6G are process perspective views illustrating a manufacturing process of an optical device according to a fourth exemplary embodiment of the present invention.

First, as shown in FIG. 6A, a lower clad layer 53 and a core layer 54 are formed on a silicon substrate 51 having a second region in which an optical waveguide is to be formed and a first region and a third region in which an optical fiber is arranged. To form sequentially.

Subsequently, as illustrated in FIG. 6B, the core layer 54 is patterned to form at least one optical waveguide 54a on the substrate of the second region.

Next, as shown in FIG. 6C, the upper clad layer 55 is formed on the entire surface including the optical waveguide 54a.

Subsequently, as shown in FIG. 6D, after preparing a mask (not shown) having a pattern for forming grooves in the first and third regions of the substrate 51, the mask is placed on the substrate 51. Align it.

Here, the mask may be precisely aligned on the substrate 51 with reference to the alignment mark or the optical waveguide formed on the substrate.

Then, the substrate 51 is exposed by dry etching the upper cladding layer 55 and the lower cladding layer 53 of the first region, the third region, and the upper region of the substrate 51 by using the aligned mask, and then exposing the mask. 6E, the substrate 51 exposed by the upper clad layer 55 as a mask is wet-etched to a predetermined depth to form a groove.

Next, the upper and lower cladding layers 55 and 53 remaining in the first and third regions on the substrate 51 are removed to expose the substrate 51.

6F and 6G are the same as those of FIGS. 3I and 3J of the second embodiment, and thus a detailed description thereof will be omitted.

Unlike the second embodiment and the third embodiment, the fourth embodiment of the present invention does not use a mask layer as a mask for forming grooves, and thus has an advantage that the process is simpler than the other embodiments.

Further, the fourth embodiment of the present invention may form at least one connection guide similarly to the third embodiment.

That is, in the step of FIG. 6D, when the connection guide pattern is formed on the mask, the connection guide may be easily formed on the substrate.

That is, the connection guide 41 is formed in parallel with the optical waveguide 42 and the optical fiber 43 as shown in FIG. 5, and the central axis and the input / output of the connection guide formed in the optical waveguide element 44. The central axes of the connection guides formed on the optical fiber blocks 45 and 46 coincide with each other.

In addition, the connection guide 41 is formed so that the center axis of the connection guide formed in the optical waveguide element 44 and the center axis of the connection guide formed in the input / output optical fiber blocks 45 and 46 do not coincide with each other and are shifted from each other. You may.

That is, the connection guide may be formed such that the connection guide formed on the optical waveguide element 44 is sandwiched between the connection guides formed on the input / output optical fiber blocks 45 and 46.

FIG. 7 is a view showing that a 1 × 8 optical waveguide device and an optical fiber are manufactured according to the manufacturing methods of the present invention.

As described above, although the embodiment of the present invention shows a method of fabricating an optical device using a silicon substrate, the present invention can be manufactured using a compound semiconductor substrate such as GaAs, InP, etc., and thus the field is extensive.

The present invention manufactured as described above is simple in process and mass-produced, and it is possible to accurately connect the optical waveguide and the optical fiber without the need for an expensive alignment device, thereby significantly reducing the manufacturing process time and the process cost.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

Claims (14)

A first optical fiber block having at least one first optical fiber; A second optical fiber block fabricated on the same substrate as the first optical fiber block and having at least one second optical fiber; And, Made on the same substrate as the first and second optical fiber blocks, and composed of an optical waveguide element having at least one optical waveguide, Here, the first and second optical fiber blocks are connected to both sides of the optical waveguide device so that the optical axis of the optical waveguide and the optical axis of the optical fiber coincide with each other. The area and the height of the connection surface is the same so that the upper and lower surfaces of the optical waveguide device and the upper and lower surfaces of the first and second optical fiber blocks are parallel to each other. The optical device of claim 1, wherein at least one groove-shaped connection guide is formed in a portion of an interface between the optical waveguide device and the first and second optical fiber blocks. The method of claim 2, wherein the connection guide is formed such that the center axis of the connection guide formed in the optical waveguide element and the center axis of the connection guide formed in the first and second optical fiber blocks coincide with each other or are shifted from each other. An optical element characterized by the above-mentioned. The optical device of claim 1, wherein the substrate is made of any one of Si, GaAs, and InP. In the manufacturing method of an optical element, wherein the first and second optical fiber blocks each having at least one optical fiber are connected to both sides of the optical waveguide element having at least one optical waveguide. Preparing a substrate having first, second, and third regions; Forming at least one optical waveguide in a second region of the substrate; Dicing the substrate so that the first, second, and third regions of the substrate are separated, respectively, a first sub substrate having the first region, a second sub substrate having the second region, and the third Forming a third sub substrate having an area; Arranging at least one optical fiber on the first sub substrate and the third sub substrate, respectively; Grinding and polishing both sides of the second sub substrate and one side of the first and third sub substrates, respectively; And, And aligning and connecting the first and third sub-substrates to both sides of the second sub-substrate so that the ground and polished sides face each other. The method of claim 5, wherein a predetermined region of the first and third sub-substrates is etched to a predetermined depth before the optical waveguide forming step, after the optical waveguide forming step, or after dicing the substrate. Optical device manufacturing method characterized in that to form a groove. The method of claim 5, wherein the substrate is made of any one of Si, GaAs, and InP. In the manufacturing method of an optical element, wherein the first and second optical fiber blocks each having at least one optical fiber are connected to both sides of the optical waveguide element having at least one optical waveguide. Preparing a substrate having first, second, and third regions; Forming a mask pattern under the substrate and on the first and third regions of the substrate; Forming a lower clad layer on a front surface of the substrate; Forming and patterning a core layer on the lower clad layer to form at least one optical waveguide in a second region of the substrate; Forming an upper clad layer on the front surface including the patterned core layer; Dicing the substrate so that the first, second, and third regions of the substrate are separated, respectively, a first sub substrate having the first region, a second sub substrate having the second region, and the third Forming a third sub substrate having an area; Exposing the mask pattern by removing upper and lower clad layers formed on the first sub-substrate and the third sub-substrate; Etching the first sub-substrate and the third sub-substrate to a predetermined depth using the mask pattern as a mask to form at least one groove, and removing the mask pattern; Arranging optical fibers to correspond to the grooves respectively; Grinding and polishing both sides of the second sub substrate and one side of the first and third sub substrates, respectively; And, And aligning and connecting the first and third sub-substrates to both sides of the second sub-substrate so that the ground and polished sides face each other. In the manufacturing method of an optical element, wherein the first and second optical fiber blocks each having at least one optical fiber are connected to both sides of the optical waveguide element having at least one optical waveguide. Preparing a substrate having first, second, and third regions; Forming a first mask pattern on the substrate and on the first and third regions of the substrate; Forming a lower clad layer on a front surface of the substrate; Forming and patterning a core layer on the lower clad layer to form at least one optical waveguide in a second region of the substrate; Forming an upper clad layer on the front surface including the patterned core layer; Forming a second mask pattern on the upper clad layer formed on the second region of the substrate; Exposing the first mask pattern by removing upper and lower cladding layers formed on the first and third regions of the substrate using the second mask pattern as a mask; Etching the first region and the third region on the substrate to a predetermined depth using the first mask pattern as a mask to form at least one groove, and removing the second mask pattern; Dicing the substrate so that the first, second, and third regions of the substrate are separated, respectively, a first sub substrate having the first region, a second sub substrate having the second region, and the third Forming a third sub substrate having an area; Arranging optical fibers to correspond to the grooves respectively; Grinding and polishing both sides of the second sub substrate and one side of the first and third sub substrates, respectively; And, And aligning and connecting the first and third sub-substrates to both sides of the second sub-substrate so that the ground and polished sides face each other. In the manufacturing method of an optical element, wherein the first and second optical fiber blocks each having at least one optical fiber are connected to both sides of the optical waveguide element having at least one optical waveguide. Preparing a substrate having first, second, and third regions; Forming a mask pattern under the substrate and on the first and third regions of the substrate; Etching the first region and the third region on the substrate to a predetermined depth using the mask pattern as a mask to form at least one groove, and removing the mask pattern; Forming a lower clad layer on a front surface of the substrate; Forming and patterning a core layer on the lower clad layer to form at least one optical waveguide in a second region of the substrate; Forming an upper clad layer on the front surface including the patterned core layer; Exposing the substrate on which the groove is formed by removing upper and lower clad layers formed on the first region and the third region on the substrate; Dicing the substrate so that the first, second, and third regions of the substrate are separated, respectively, a first sub substrate having the first region, a second sub substrate having the second region, and the third Forming a third sub substrate having an area; Arranging optical fibers to correspond to the grooves respectively; Grinding and polishing both sides of the second sub substrate and one side of the first and third sub substrates, respectively; And, And aligning and connecting the first and third sub-substrates to both sides of the second sub-substrate so that the ground and polished sides face each other. The method of claim 10, wherein when the grooves are formed in the first region and the third region of the substrate, At least one connection guide is formed by etching a boundary surface between the first region and the second region above the substrate and a boundary surface between the second region and the third region above the substrate to a predetermined depth. In the manufacturing method of an optical element, wherein the first and second optical fiber blocks each having at least one optical fiber are connected to both sides of the optical waveguide element having at least one optical waveguide. Preparing a substrate having first, second, and third regions; Forming a lower clad layer on a front surface of the substrate; Forming and patterning a core layer on the lower clad layer to form at least one optical waveguide in a second region of the substrate; Forming an upper clad layer on the front surface including the patterned core layer; The substrate is exposed by first etching the upper and lower clad layers of the first region and the third region on the substrate using a mask having a predetermined pattern, and the exposed substrate is secondly etched to a predetermined depth to form a groove. Forming; Removing upper and lower clad layers remaining in the first and third regions of the substrate; Dicing the substrate so that the first, second, and third regions of the substrate are separated, respectively, a first sub substrate having the first region, a second sub substrate having the second region, and the third Forming a third sub substrate having an area; Arranging optical fibers to correspond to the grooves respectively; Grinding and polishing both sides of the second sub substrate and one side of the first and third sub substrates, respectively; And, And aligning and connecting the first and third sub-substrates to both sides of the second sub-substrate so that the ground and polished sides face each other. The method of claim 12, wherein the forming of the grooves in the first area and the third area of the substrate is performed. Preparing a mask on which a predetermined pattern is formed; Aligning the mask over the substrate; Exposing the substrate by dry etching the upper and lower clad layers of the first region and the third region on the substrate using the mask; Removing the mask and wet etching the substrate exposed by the upper clad layer with a mask to a predetermined depth to form grooves. The method of claim 12, wherein when the grooves are formed in the first region and the third region of the substrate, At least one connection guide is formed by etching a boundary surface between the first region and the second region above the substrate and a boundary surface between the second region and the third region above the substrate to a predetermined depth.