KR100358802B1 - Manufacturing method of phosphor screen for cathode ray tube - Google Patents

Abstract

In a cathode ray tube equipped with a shadow mask with an integer magnification, the present invention relates to a method of forming a fluorescent film screen in which an effective screen region can be composed of continuous fluorescent film stripes.

Forming a photosensitive resin film on an inner surface of the face panel, mounting a shadow mask on the face panel with an integer magnification, and ultraviolet rays emitted from the exposure light source pass through holes in the shadow mask to be equal to or at least one screen of the electron beam path. Selectively exposing and curing the photosensitive resin film by controlling the ultraviolet path to reach beyond the pitch; separating and developing the face panel and the shadow mask to remove the uncured photosensitive resin film; Applying, etching, and developing at high pressure to form a black matrix film, applying a fluorescent film slurry on the inner surface of the face panel, and ultraviolet rays emitted from the exposure light source pass through the holes of the shadow mask to be equal to the electron beam path or beyond at least one screen pitch. UV light path to reach To provide a method for forming a phosphor film screen cathode ray tube comprising the step of repeatedly performed for a process of selectively exposing and developing the phosphor layer slurry to the G, B, R phosphor film.

Description

{Manufacturing method of phosphor screen for cathode ray tube}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cathode ray tube for mounting a shadow mask with an integer magnified cue, and more particularly, to a method of forming a fluorescent film screen in which an effective screen region can be composed of continuous fluorescent film stripes.

In general, a cathode ray tube is a display device that implements a predetermined screen by emitting a fluorescent screen by using an electron beam emitted from an electron gun. The display device is a display device such as a television and a monitor because of its excellent image quality and low manufacturing cost compared to other display devices. It is used.

16 is a sectional view of a cathode ray tube according to the prior art, and FIG. 17 is a schematic diagram showing a path of an electron beam. As shown, when the electron gun 1 emits three stem electron beams 5R, 5G, and 5B corresponding to the R, G, and B fluorescent films 3R, 3G, and 3B, the emitted electron beam 5 is a deflection yoke ( 7) is deflected in the horizontal and vertical directions by the generated magnetic field to form a raster on the fluorescent screen 9 and passes through the beam passing aperture 11a formed in the shadow mask 11. It is separated into the corresponding R, G, and B fluorescent films to express an accurate color.

In this manner, the three-strip electron beams 5 simultaneously emitted from the electron gun 1 pass through a beam passing aperture 11a formed in the shadow mask 11 and are disposed adjacent to each other on the fluorescent film screen 9. In this case, the gap between the shadow mask 11 and the fluorescent screen 9 is called a cue Q value.

In addition to the cue, the mask pitch Ph, which is a horizontal interval between the beam passing apertures 11a of the shadow mask 11, is the S value of the electron gun (the distance between the central G electron beam and the R or B electron beam in the main focus lens). ) And the screen pitch Ps (the distance in which a set of R, G, B fluorescent film stripes are repeated) are designed in consideration of the geometric relationship.

As the cathode ray tube of recent years has become higher resolution, the screen pitch Ps is gradually designed to increase the number of pixels in the same area, and the esche of the electron gun 1 is gradually designed to improve the focus characteristics. The gap between the shadow mask 11 and the fluorescent film screen 9 acts as a factor to make the cue smaller and smaller.

In general, when the shadow mask 11 of the normal stripe type or the aperture grille type is mounted, if the screen pitch Ps is about 0.4 mm, the cue is extremely small, about 5 to 6 mm.

However, in this case, in order to form the fluorescent film screen 9 on the inner surface of the face panel 13 by a known slurry method, the mask assembly having the shadow mask 11 is attached to the inside of the face panel 13 at least five times to be exposed. The work and development work must be carried out, but when the cue is extremely minute as described above, a lot of difficulties arise in detaching and detaching the mask assembly.

That is, if a portion of the screen is largely changed in the process of remounting the mask assembly, the fluorescent film screen 9 may be deteriorated, and the image quality may be deteriorated by preventing accurate separation of the electron beam 5 when driving the cathode ray tube. In addition, when the operation accuracy of the detacher for mounting the mask assembly inside the face panel 13 is 5 mm or less, the fluorescent film screen 9 is damaged to greatly reduce the productivity of the cathode ray tube.

Therefore, in order to solve the above problem, the present inventors have passed through a beam aperture aperture in a shadow mask type cathode ray tube (patent publication No. 94-5493) filed in 1991. A technique has been proposed for mounting a shadow mask with a doubled magnification to cross the other B and R electron beams before reaching the fluorescent screen and then to reach the fluorescent screen.

In addition, the inventors of the present application No. 73 'color cathode ray tube' filed on January 3, 2000, even if the cue is expanded to other integer multiples other than the integer multiple of 3, the three-strip electron beam is precisely applied to each R, G, B fluorescent film To achieve this, a technique for enlarging the cue without deteriorating the image quality was proposed.

However, if the fluorescent screen is formed by the same path of the light emitted from the exposure light source and the electron beam in the same state as the conventional slurry process in the state where the cue is enlarged by an integer multiple, at least one fluorescent film stripe is not formed on the left and right sides of the screen. do.

18A and 18B show a cathode ray tube equipped with a shadow mask with a doubled enlarged cue, and FIGS. 19A and 19B show a cathode ray tube equipped with a shadow mask with a four times enlarged cue, by using an electron beam path and a conventional slurry method. The formed fluorescent screens are respectively shown.

As shown, when the cue is enlarged twice, the electron beams 5 do not reach the R and B fluorescent film stripes located inside one of the outermost stripes of the screen, and thus R and B are formed when the fluorescent film screen 9 is formed. The black matrix film 15 is formed where the fluorescent film stripe is to be formed.

Also, when the cue is magnified 4 times, the electron beam 5 has two fluorescent film stripe positions located one inside in the outermost stripe of the screen, and one fluorescent film stripe position located inward across the two fluorescent film stripes. Since it does not reach, no six fluorescent film stripes are formed on both the left and right sides of the screen.

As a result, the fluorescent stripe stripes are partially arranged instead of successively arranged, thereby preventing accurate color expression from the left and right sides of the screen.

Therefore, the present invention was devised to solve the above problems, and an object of the present invention is to provide a fluorescent screen in which a effective screen region can be composed of successive fluorescent film stripes in a cathode ray tube equipped with a shadow mask with an integer magnification. The present invention provides a method for forming a membrane screen.

1A and 1B are schematic diagrams showing an electron beam path and a fluorescent film screen in a cathode ray tube with a double magnification of a cue, respectively.

2 to 8 are schematic diagrams showing a process of forming a fluorescent screen;

9A and 9B are schematic diagrams showing an electron beam path and a fluorescent film screen in a cathode ray tube with a cue enlarged 4 times, respectively.

10-15 are schematic diagrams showing a process of forming a fluorescent screen.

16 is a cross-sectional view of a cathode ray tube according to the prior art.

17 is a schematic diagram showing an electron beam path in a cathode ray tube according to the prior art.

18A and 18B are schematic views of a fluorescent film screen formed by an electron beam path and a method according to the prior art, respectively, in a cathode ray tube with a double magnification of a cue.

19A and 19B are schematic views of a fluorescent film screen formed by an electron beam path and a method according to the prior art, respectively, in a cathode ray tube with a four-fold magnification of a cue.

In order to achieve the above object, the present invention,

Forming a photosensitive resin film on an inner surface of the face panel;

Attaching a shadow mask to the face panel with an integer magnification of cue,

Selectively exposing and curing the photosensitive resin film by controlling the ultraviolet path so that the ultraviolet light emitted from the exposure light source passes through the beam passing aperture of the shadow mask to reach the same or at least one screen pitch as the electron beam path;

Separating the face panel and the shadow mask and developing to remove the uncured photosensitive resin film;

Applying a graphite slurry to the inner surface of the face panel, etching and developing under a high pressure to form a black matrix film;

Fluorescent film slurry is applied to the inner surface of the face panel, and the ultraviolet light emitted from the exposure light source passes through the beam-pass aperture of the shadow mask to control the ultraviolet light path to reach the same or at least 1 screen pitch as the electron beam path. It provides a method for forming a fluorescent film screen of a cathode ray tube, comprising the step of selectively performing the step of selectively exposing and developing the G, B, R fluorescent film.

As such, it controls the path of ultraviolet rays emitted during exposure, and does not form a fluorescent film screen or a black matrix film in a portion where the electron beam reaches at the outer side of the short side of the effective screen area. Make it happen.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A and 1B schematically show a fluorescent film screen formed by an electron beam path and a method according to the present embodiment in a cathode ray tube mounted with a shadow mask with a doubled magnification.

As shown in the figure, the black matrix film 4 is formed at the outermost position where the electron beam reaches, and the black matrix film and the fluorescent film stripe are not formed at the inside of the fluorescent film stripe. Do not.

As a result, even when the fluorescent film stripe 6R, 6B is formed at the outermost electron beam arrival position, the emitted light does not penetrate the face panel 8 by the black matrix film 4, and the inside of the fluorescent film stripe position. Since the light beam does not reach the electron beam and cannot emit light due to the absence of the fluorescent film stripe, the effective screen area is composed of a plurality of R, G and B fluorescent film stripes arranged in the center of the screen.

In order to form the fluorescent film screen 2 of the above-mentioned structure, the position of R, G, B fluorescent film stripe is determined first. That is, as shown in FIG. 2, the ultraviolet ray 12 emitted from the exposure light source 10 passes through the beam passing aperture 16a formed in the shadow mask 16 at the same angle of incidence as the electron beam 14 path. The preliminary work of designing the exposure lens system 18 is performed so that the R, G, and B fluorescent film stripe positions of the fluorescent film screen 2 can be reached.

Next, as shown in FIG. 3, the photosensitive resin solution is applied to the inner surface of the face panel 8, the face panel 8 is rapidly rotated to form a uniform film thickness, and then dried by a heater and a blower to dry the photosensitive resin film. 20 is formed. The mask assembly including the shadow mask 16 is mounted inside the face panel.

Then, as shown in FIG. 4, the face panel 8 is mounted on an exposure table provided with the exposure light source 10 and the exposure lens 18, and the exposure light source 10 is set at the G reference position G1. When the next power source is connected to emit ultraviolet light (shown in solid line), the emitted ultraviolet light enters the shadow mask 16 at the same angle of incidence as the electron beam path (shown in dashed line), and is selected by the beam passing aperture 16a. Then, only the G fluorescent film formation part of the photosensitive resin film 20 is exposed and hardened | cured selectively.

When the B electron beam reaches the rightmost edge of the screen, ultraviolet rays passing through the beam passing aperture 16a based on the B electron beam path as shown in FIG. 5 are directed toward the center of the screen to the left of one screen pitch. The position of the exposure light source 10 is controlled to reach the B fluorescent film formation site of and then emits ultraviolet rays.

The curing of the corresponding fluorescent film forming portion across the specific screen pitch is for forming the black matrix film at the point where the B electron beam on the rightmost side reaches. For this purpose, the position of the exposure light source 10 is referred to as the B reference position (B1). ) To the right of the 3 S (S) value to emit ultraviolet light.

The S value of the exposure light source 10 refers to the distance that the light source moves to expose three colors R, G, and B as one exposure light source, and when the exposure light source 10 is moved in a specific direction at a 3S value from a reference position, Since the ultraviolet light passing through the aperture 16a reaches the corresponding fluorescent film forming portion beyond one screen pitch in the direction opposite to the above direction, when the exposure light source 10 is set at the position, the B fluorescent film on the left side of the one screen pitch is Formation sites may be selectively cured.

In another embodiment, the path control of the ultraviolet rays may be performed by changing the amount of refraction of the exposure lens system 18, wherein the ultraviolet rays emitted from the exposure light source 10 while the exposure light source 10 is fixed are exposed to the exposure lens system 18. The incident angle may be controlled such that the ultraviolet ray passing through the beam passing aperture 16a reaches the corresponding portion beyond the at least one screen pitch by changing the angle of refraction while passing through the beam.

Next, when the R electron beam reaches the leftmost edge of the screen, in order to form a black matrix film at the leftmost R fluorescent film stripe position as shown in FIG. 6, the exposure light source 10 is moved to the R reference position ( 3S is moved to the left in R1) so that the ultraviolet light passing through the beam passing aperture 16a based on the electron beam path reaches the center of the screen to the R fluorescent film formation site on the right side of the screen pitch.

In this case, too, the path of the ultraviolet light can be controlled by the method of changing the refractive amount of the exposure lens system 18. Hereinafter, the path control of the ultraviolet light will be described as controlling the esque of the exposure light source.

As described above, after selectively curing the R, G, and B fluorescent film forming portions in the photosensitive resin film 20, the mask assembly is removed and developed as shown in FIG. 7 to form the uncured photosensitive resin film 20. A part is removed and a graphite suspension, which is a light absorbing material, is applied to the inner surface of the face panel 8 and dried to form a graphite coating film 22.

After the etching and the high pressure development process, the photosensitive resin film 20 under the graphite coating film 22 is removed by the corrosion force of the etching solution and the hydraulic pressure of the high pressure development to complete the black matrix film 4.

As described above, during the curing process of the photosensitive resin film 20 for forming the black matrix film 4, the black matrix film is easily formed at the position of forming the R and B fluorescent film stripes on the outermost side of the screen by controlling the positions of the R exposure light source and the B exposure light source. Can be formed.

On the black matrix film 4 formed by the above process, in order to improve adhesion of the fluorescent film slurry, an undercoat liquid is applied to the entire black matrix film and then cured. As shown in FIG. 8, the G fluorescent film slurry is applied to the inner surface of the face panel 8, the mask assembly including the shadow mask 16 is mounted inside the face panel 8, and then moved to the exposure zone to position G1. The exposure light source 10 is set to selectively expose and cure the G fluorescent film formation site in the same path as the G electron beam path.

Then, the mask assembly was removed and developed to remove the uncured G fluorescent film slurry. Then, the B fluorescent film slurry was applied to the inner surface of the face panel 8, and the exposure light source 10 was moved to the B1 position through the same process as described above. After setting, the ultraviolet rays are emitted in the same path as the B electron beam path to selectively cure the B fluorescent film formation site.

Next, the mask assembly was removed and developed to remove the uncured B fluorescent film slurry, the R fluorescent film slurry was applied to the inner surface of the face panel 8, and the exposure light source was set to the R1 position through the same process as described above. Next, ultraviolet rays are emitted in the same path as the R electron beam path to selectively cure the R fluorescent film formation site.

Finally, the mask assembly is removed and developed to remove the uncured R fluorescent film slurry to complete the fluorescent screen 2, and the completed fluorescent screen 2 is as shown in FIG.

In this way, when the queue value is enlarged twice, the fluorescent screen 2 is formed by the above-described method, so that two fluorescent film stripe portions on each of the left and right sides do not appear continuously on the screen. Consists of successive R, G, B fluorescent stripe stripes that do not appear in the left and right sides of the screen when driving the cathode ray tube.

9A and 9B schematically show a fluorescent film screen formed by an electron beam path and a method according to the present embodiment in a cathode ray tube equipped with a shadow mask with a cue enlarged four times, respectively.

As shown in the figure, a fluorescent film stripe is not formed or a black matrix film is formed at a portion where the electron beam reaches from the position at which the electron beam reaches the outermost part of the screen to the positions of five inner fluorescent film stripes.

As a result, even when the fluorescent film stripe is formed in the portion, the emitted light is blocked by the black matrix film, and even when the electron beam arrives, the light is not emitted because the fluorescent film stripe is not formed, so that it is not displayed on the screen. Therefore, the effective screen area is composed of a plurality of R, G, B fluorescent film stripes arranged in the center of the screen.

Hereinafter, the method of forming the fluorescent film screen 2 having the above-described configuration will be described in detail. Detailed description of the same process as in the above embodiment will be omitted.

First, as shown in FIG. 10, a photosensitive resin film 20 is formed on an inner surface of the face panel 8, a mask assembly is mounted inside the face panel 8, and then the face panel 8 is positioned on an exposure table. Let's do it. The ultraviolet light beam passing through the aperture 16a for the beam passing on the basis of the G electron beam path is fixed by fixing the exposure light source 10 to the position moved 3S to the left from the G reference position G1. It is allowed to reach the forming part and is then cured selectively.

As shown in 11, when the B electron beam reaches the rightmost edge of the screen, the exposure light source 10 is moved to the right of the 6S value at the B reference position B1 to pass the beam based on the B electron beam path. The ultraviolet light passing through the aperture 16a is directed toward the center of the screen to reach the B fluorescent film formation site on the left side of the two screen pitches, and is selectively cured.

Next, as shown in FIG. 12, when the R electron beam reaches the leftmost edge of the screen, the exposure light source 10 is moved 6S to the left from the R reference position R1 and the corresponding beam is referenced to the R electron beam path. Ultraviolet light that has passed through the aperture 16a passes through the R fluorescent film formation site on the right side of the two screen pitch toward the center of the screen and is cured selectively.

After selectively curing the R, G, and B fluorescent film forming portions in the photosensitive resin film 20 by such an exposure operation, the mask assembly is removed as shown in FIG. 13, and the inner surface of the face panel 8 is developed. After removing a part of the uncured photosensitive resin film 20, the black matrix film 4 is formed by the same process as in the previous embodiment.

On the black matrix film 8 formed by the above process, as shown in FIG. 14, a G fluorescent film slurry is applied to the inner surface of the face panel 8, a mask assembly is mounted inside the face panel 8, and then the face The panel 8 is placed on the exposure table. At this time, the exposure light source 10 moves to the right of the 3S value at the G1 position and is fixed, so that the ultraviolet light passing through the beam passing aperture 16a based on the G electron beam path passes through the G fluorescent film forming portion at the left of one screen pitch. It selectively cures by reaching.

The mask assembly is then removed and developed to remove the uncured G fluorescent film slurry. Finally, the B and R fluorescent film formation process is the same as in the previous embodiment, as shown in Figure 15 by setting the exposure light source 10 to the reference position (R1, B1) to inject ultraviolet light to be the same as the electron beam path Each of the B and R phosphors is cured, and the phosphor screen 2 completed through the above process is shown in FIG. 9.

In the case where the cue is enlarged 4 times as described above, if the fluorescent film screen 2 is formed by the above-described method, the black matrix film is not formed or the fluorescent film stripe is formed at the portion where the electron beam reaches outside the left and right sides of the effective screen area. As a result, four sets of R, G, and B fluorescent stripe stripes are not continuously displayed on the screen in the outermost part of the screen. As a result, the effective screen area is centered except for four sets of R, G and B fluorescent stripe stripes. R, G, B of the fluorescent film stripes are made of a continuous.

As described above, according to the present invention, when the fluorescent film stripe is formed, the effective screen area can be formed by the continuous fluorescent film stripes even when the shadow mask is mounted with a 5x or 7x magnification. Has

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

As described above, the present invention allows the effective screen region to be formed by successive R, G, and B fluorescent film stripes in a method of controlling the path of ultraviolet light emitted upon exposure. Also, accurate color expression can be performed on the left and right sides of the screen. Therefore, it is possible to improve the productivity with the cathode ray by providing the enlarged cue while facilitating the high resolution by reducing the screen pitch.

Claims (16)

Forming a photosensitive resin film on an inner surface of the face panel; Mounting a shadow mask to the face panel with a cue enlarged by an integer multiple of 5 except 3; Selectively exposing and curing the photosensitive resin film by controlling the ultraviolet path such that the ultraviolet light emitted from the exposure light source passes through the beam passing aperture of the shadow mask to reach the same or over 1 or 2 screen pitch as the electron beam path; Separating the face panel and the shadow mask and developing to remove the uncured photosensitive resin film; Applying a graphite slurry to the inner surface of the face panel, etching and developing under a high pressure to form a black matrix film; The fluorescent film slurry is applied to the inner surface of the face panel, and the ultraviolet light is controlled by controlling the ultraviolet light path so that the ultraviolet light emitted from the exposure light source passes through the beam passing aperture of the shadow mask to reach the same or 1 or 2 screen pitch as the electron beam path. A method of forming a fluorescent film screen of a cathode ray tube, comprising the step of selectively exposing and developing the slurry to the G, B, and R fluorescent films. The method of claim 1, And mounting the shadow mask with a cue enlarged twice. The method of claim 2, Selectively exposing and curing the photosensitive resin film, Selectively exposing a G fluorescent film formation site by making an ultraviolet path the same as an electron beam path; A method for forming a fluorescent film screen of a cathode ray tube comprising controlling exposure of ultraviolet rays passing through a beam passage aperture to reach beyond one screen pitch based on an electron beam path to selectively expose the R and B fluorescent film formation sites. The method of claim 3, wherein And a screen pitch shift of ultraviolet rays with respect to the R fluorescent film formation site and the B fluorescent film formation site is in a direction opposite to each other. The method of claim 3, wherein And controlling the ultraviolet rays to reach beyond one screen pitch by moving the exposure light source by 3 S (S) values from a reference position. The method of claim 5, Moving the exposure light source in a direction opposite to the screen pitch movement; The method of claim 2, Selectively exposing the fluorescent film slurry, A method for forming a fluorescent film screen of a cathode ray tube, wherein the fluorescent film slurry is exposed to ultraviolet light in the same manner as the electron beam path to the G, B, and R fluorescent films. The method of claim 1, And mounting the shadow mask with a cue enlarged four times. The method of claim 8, Selectively exposing and curing the photosensitive resin film, Selectively exposing the G fluorescent film formation region by controlling the ultraviolet light passing through the beam passing aperture to reach beyond one screen pitch based on the electron beam path; A method of forming a fluorescent film screen of a cathode ray tube, the method comprising: exposing ultraviolet rays passing through a beam passage aperture to reach beyond two screen pitches based on an electron beam path to selectively expose R and B fluorescent film forming sites. The method of claim 9, And a screen pitch shift of ultraviolet rays with respect to the R fluorescent film formation site and the B fluorescent film formation site is in a direction opposite to each other. The method of claim 9, And controlling the ultraviolet rays to reach beyond the two screen pitches by moving the exposure light source by 6 S (S) values from the reference position. The method of claim 11, Moving the exposure light source in a direction opposite to the screen pitch movement; The method of claim 8, Selectively exposing the fluorescent film slurry, Selectively exposing the G fluorescent film slurry by controlling ultraviolet rays passing through the beam passing aperture to reach beyond one screen pitch relative to the electron beam path; A method of forming a fluorescent film screen of a cathode ray tube, comprising selectively exposing the B and R fluorescent film slurries by making the ultraviolet light path the same as the electron beam path. The method of claim 13, And a screen pitch shift of the ultraviolet rays with respect to the G fluorescent film slurry is in a direction opposite to the screen pitch shift of the ultraviolet rays with respect to the G fluorescent film formation portion during exposure of the photosensitive resin film. In the fluorescent film screen of the cathode ray tube made up of a plurality of R, G, B fluorescent film stripes arranged in succession between the black matrix film, facing the shadow mask at an integer magnification interval other than an integer multiple of 3, A method for forming a fluorescent film screen of a cathode ray tube, characterized in that a fluorescent film stripe is not formed at a portion where an electron beam reaches at the outer side of an effective screen area composed of a plurality of continuous fluorescent film stripes. The method of claim 15, And a black matrix film is formed at a portion where the electron beam reaches at the outer side of the short side of the effective screen region.