KR100308393B1 - Semiconductor Package and Manufacturing Method - Google Patents

Abstract

The present invention relates to a semiconductor package and a method of manufacturing the same, and to attaching a plurality of semiconductor chips on a relatively wide heat spreader and performing the rest of the manufacturing process to prevent damage to the semiconductor chip, easy handling of materials during the manufacturing process, A semiconductor chip having a plurality of input / output pads formed on an upper surface thereof in order to obtain an excellent heat dissipation effect; A heat spreader on the bottom of the semiconductor chip, the plate being wider than the bottom of the semiconductor chip, the adhesive being interposed with an adhesive; An adhesive bonded to an upper surface of the semiconductor chip; The polyimide layer is bonded to the upper surface of the adhesive, the circuit pattern of the bond finger, the connecting portion and the solder borland is formed on the polyimide layer, the circuit board sheet is coated on the top surface except for the bond finger and solder borland Wow; Conductive wires connecting the input / output pads of the semiconductor chip and the bond fingers of the circuit board sheets; An encapsulant encapsulated on an upper surface of the semiconductor chip to protect the input / output pad, the conductive wire, the bond finger of the circuit board sheet, and the like from an external environment; It is characterized in that it comprises a solder ball fused to the solder ball land of the circuit board sheet to input and output the signal of the semiconductor chip to the outside.

Description

Semiconductor package and manufacturing method

The present invention relates to a semiconductor package and a method for manufacturing the same. More specifically, by bonding a plurality of semiconductor chips on a relatively wide heat spreader to perform the remaining manufacturing process, it is excellent in heat dissipation and prevents damage to the semiconductor chip. It relates to a semiconductor package that is easy to handle materials and a method of manufacturing the same.

In general, a semiconductor package protects a semiconductor chip such as a single device, an integrated circuit, or a hybrid circuit in which various electronic circuits and wiring are formed from various external environments such as dust, moisture, electrical, and mechanical loads, and at the same time improves the performance of the semiconductor chip. In order to optimize and maximize, it refers to the use of lead frame, printed circuit board or circuit board sheet, etc. to form signal outgoing terminals to the main board and encapsulation using encapsulant.

The semiconductor package has been converted into a chip size similar to that of a semiconductor chip, and the circuit pattern has a thinner and thinner circuit pattern than a lead frame or a printed circuit board. It is manufactured using a circuit board sheet.

An example of the above chip sized semiconductor package is illustrated in FIGS. 1A and 1B, and the structure and manufacturing method thereof will be described below.

First, as shown in FIG. 1A, a conventional semiconductor package 100 ′ is bonded to a semiconductor chip 10 ′ having a plurality of input / output pads 11 ′ on an upper surface thereof, and to an upper surface of the semiconductor chip 10 ′. An adhesive 70 'and a polyimide layer 21' are attached to an upper surface of the adhesive 70 ', and a bond finger 22', a connecting portion 23 'and a solder borland are formed on the polyimide layer 21'. A circuit board sheet 20 'having a circuit pattern of 24', and having an upper surface except for the bond finger 22 'and the solder ball land 24' coated with a cover coat 25 '; A conductive wire 30 'connecting the input / output pad 11' of the semiconductor chip 10 'and the bond finger 22' of the circuit board sheet 20 'and the bond of the circuit board sheet 20'. An encapsulant 50 'covering the side surface of the conductive wire 30' and the semiconductor chip 10 'from the portion of the finger 22' and fused to the solder ball land 24 'of the circuit board sheet 20'. Consists of multiple solder balls (60 ') .

In the method of manufacturing the semiconductor package 100 ', a circuit such as a bond finger 22', a connecting portion 23 ', a solder ball 24', and the like, is disposed on an upper surface of the semiconductor chip 10 'via an adhesive 70'. Adhering a circuit board sheet 20 'including a pattern, and bonding the bond finger 22' of the circuit board sheet 20 'and the input / output pad 11' of the semiconductor chip 10 'to conductive wires; Bonding to the bottom surface of the semiconductor chip 10 'to which the circuit board sheet 20' is bonded to the flexible tape 40 ', and The encapsulant 50 'from the bond finger 22' and the conductive wire 30 'of the circuit board sheet 20' to the area where the lower tape 40 'is located along the side surface of the semiconductor chip 10'. Encapsulating the solder ball 60 'to the solder ball land 24' of the circuit board sheet 20 ', and integrally encapsulating the encapsulant 50' and the tape 40 'at the bottom thereof. Single semiconductor package (1) 00 '), and peeling off the tape 40' on the bottom surface of the single semiconductor package 100 '.

However, such a semiconductor package has a disadvantage that the semiconductor chip is easily damaged when the bottom surface of the semiconductor chip is exposed to the outside, and the electrical performance of the semiconductor package due to the heat generated during the operation of the semiconductor chip is not provided by appropriate heat dissipation means. This problem is greatly reduced.

In addition, since a plurality of semiconductor chips are transported while being bonded to a flexible tape during the manufacturing process, the tape is easily bent, and thus the handling of materials is very inconvenient. Also, after the sealing process is completed with an encapsulant, the tape is finished. There is a problem in that the manufacturing process is complicated because an additional process that needs to be removed again from the bottom of the semiconductor chip.

The present invention has been made to solve the above-mentioned conventional problems, and excellent heat dissipation by preventing the damage to the semiconductor chip by carrying out the rest of the manufacturing process while adhering a plurality of semiconductor chips on a relatively wide heat spreader, The present invention provides a semiconductor package that is easy to handle materials and a method of manufacturing the same.

1A and 1B are cross-sectional views showing a conventional semiconductor package and a manufacturing state.

2A and 2B are cross-sectional views showing a semiconductor package according to the present invention.

3A to 3G are state diagrams illustrating a manufacturing process of a semiconductor package according to the present invention.

-Description of the main symbols in the drawings-

100 '; Conventional Semiconductor Package

100,101; A semiconductor package 10 according to the present invention; Semiconductor chip

11; I / O pad

20; Circuit board sheet

21; Polyimide layer 22; Bond finger

23; Connection

24; Solder ball land

25; Cover coat 30; Conductive Wire

40; Heat spreader 41; Unit groove

50; Encapsulant 60; Solder ball

70,71; glue

80; Singulation tool

In order to achieve the above object, the semiconductor package according to the present invention comprises: a semiconductor chip having a plurality of input / output pads formed on an upper surface thereof; A heat spreader on the bottom of the semiconductor chip, the plate being wider than the bottom of the semiconductor chip, the adhesive being interposed with an adhesive; An adhesive bonded to an upper surface of the semiconductor chip; The polyimide layer is bonded to the upper surface of the adhesive, the circuit pattern of the bond finger, the connecting portion and the solder borland is formed on the polyimide layer, the circuit board sheet is coated on the top surface except for the bond finger and solder borland Wow; Conductive wires connecting the input / output pads of the semiconductor chip and the bond fingers of the circuit board sheets; An encapsulant encapsulated on an upper surface of the semiconductor chip to protect the input / output pad, the conductive wire, the bond finger of the circuit board sheet, and the like from an external environment; It is characterized in that it comprises a solder ball fused to the solder ball land of the circuit board sheet to input and output the signal of the semiconductor chip to the outside.

Here, the encapsulant surrounds the side surface of the semiconductor chip, and may be encapsulated up to the heat spreader upper surface which is an outer circumference of the bottom of the semiconductor chip.

In addition, the semiconductor package according to the present invention in order to achieve the above object is provided with a heat spreader having a plurality of substantially checkerboard unit grooves are formed by crossing perpendicular to the bottom surface; Bonding a plurality of semiconductor chips having input / output pads formed on an upper surface thereof to an opposite surface of the surface on which the unit grooves of the heat spreader are formed; Bonding a circuit board sheet including a circuit pattern, such as a bond finger, a connection part, and a solder ball land, through an adhesive to an upper surface of the semiconductor chip; Bonding the bond finger of the circuit board sheet and the input / output pad of the semiconductor chip with a conductive wire; Encapsulating an encapsulant on an upper surface of the semiconductor chip to protect it from an external environment with an input / output pad of the semiconductor chip, a conductive wire, and a bond finger of a circuit board sheet; Fusing the solder balls to the solder balls of the circuit board sheet; And singulating the heat spreader and separating the heat spreader into individual semiconductor packages.

Here, the encapsulation may be performed to the upper surface of the heat spreader located at the outer circumference of the bottom surface of the semiconductor chip.

In addition, the singulation step may singulate the encapsulant and the heat spreader at the same time, and in this case, the heat spreader may be singulated along the unit groove of the bottom surface of the heat spreader so that the heat spreader is easily cut.

On the other hand, the step of adhering the semiconductor chip on the heat spreader may be performed after adhering the circuit board sheet on the semiconductor chip first depending on the situation.

In this way, according to the semiconductor package and the manufacturing method of the present invention, the heat spreader is adhered to the entire bottom surface of the semiconductor chip, so that heat generated during operation of the semiconductor chip is rapidly released through the heat spreader, and the electrical performance This is always maintained optimally, and the risk of damage to the semiconductor chip is minimized by blocking not only the top and side surfaces of the semiconductor chip, but also the bottom of the semiconductor chip.

In addition, as the semiconductor chips are transported and transported while being bonded to a hard metallic heat spreader during the manufacturing process, the material handling is easy, and after the sealing process is completed, foreign substances such as tape adhered to the bottom of the semiconductor chips are conventionally removed. There is no need for an additional process to remove.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.

2A and 2B are cross-sectional views illustrating semiconductor packages 100 and 101 according to the present invention.

The semiconductor chip 10 located at the center is an input / output pad 11 of which the edge pad is formed as shown in FIG. 2A or the center pad is formed as shown in FIG. 2B. Is used.

The bottom surface of the semiconductor chip 10 is a flat plate wider than the bottom area of the semiconductor chip 10 in order to dissipate heat generated during operation of the semiconductor chip 10 to the outside, and is a heat spreader with an adhesive 71. 40 is bonded and fixed.

Here, the heat spreader 40 preferably uses copper (Cu), tungsten (W), nickel (Ni), or an alloy thereof. In addition, a nickel (Ni) plating layer (not shown) having a predetermined thickness is formed on the bottom of the heat spreader 40 to prevent oxidation of the heat spreader 40 in the air.

Subsequently, the adhesive 70 is bonded to the upper surface of the semiconductor chip 10 without covering the input / output pad 11, and the circuit board sheet 20 is adhered to the upper surface of the adhesive 70. Likewise, the circuit board sheet 20 is also designed not to cover the input / output pad 11. Here, the adhesive 70 uses a double-sided adhesive tape or epoxy.

The circuit board sheet 20 has an insulating polyimide layer 21 on the lowest surface thereof and is bonded to the adhesive 70. On the polyimide layer 21, a conductive film, preferably a copper foil, 22), a circuit pattern consisting of the connecting portion 23 and the solder borland 24 is formed, the upper surface except for the bond finger 22 and the solder borland 24 is coated with an insulating cover coat (25). .

The input / output pad 11 of the semiconductor chip 10 is connected to the bond finger 22 and the conductive wire 30 of the circuit board sheet 20 by using gold wire or aluminum wire. The input / output pad 11 of the semiconductor chip 10 can be electrically energized with the circuit board sheet 20.

Meanwhile, the input / output pad 11, the conductive wire 30, and the bond finger 22 of the circuit board sheet 20 of the semiconductor chip 10 may be protected from external dust, moisture, electrical and mechanical loads. The upper surface is sealed with the sealing material 50. Of course, in the encapsulation state, as shown in FIG. 2A, when the semiconductor chip 10 has an edge pad as the input / output pad 11, the encapsulant 50 surrounds the side surface of the semiconductor chip 10 while the heat spreader ( 40) It is sealed to the upper surface, and as shown in FIG. 2B, when the semiconductor chip 10 has a center pad as the input / output pad 11, the encapsulant 50 is sealed only on the upper portion of the semiconductor chip 10. .

Here, the encapsulant 50 includes an epoxy molding compound for encapsulating using a mold or a liquid encapsulant 50 for performing encapsulation using a dispenser. I use it.

In addition, the solder ball 60 made of lead (Pb) and tin (Sn) is fused to the solder ball land 24 of the circuit board sheet 20, so that the input / output pad 11 of the semiconductor chip 10 is the solder ball 60. The solder ball 60 is mounted on the motherboard later, so that the semiconductor chip 10 and the motherboard can exchange predetermined electrical signals.

3A to 3G are state diagrams illustrating a manufacturing process of the semiconductor packages 100 and 101 according to the present invention. Herein, whether the semiconductor chip 10 has an edge pad or a center pad as the input / output pad 11 is shown. Since the manufacturing processes are similar, only the case having the edge pad will be described.

First, a heat spreader 40 having a plurality of unit grooves 41 having a substantially checkerboard shape is formed on the bottom surface and intersected with each other perpendicularly or crosswise (FIG. 3A).

Here, the size of the unit recess 41 is formed to be slightly wider than the width of the bottom surface of the semiconductor chip 10 attached later, and the forming method is conventional chemical etching, mechanical stamping, or laser. Etc.

Subsequently, the plurality of semiconductor chips 10 having the input / output pads 11 formed thereon are adhered to the surface opposite to the surface on which the unit recess 41 of the heat spreader 40 is formed via the adhesive 71. 3b)

Subsequently, the adhesive 70 is interposed on the upper surface of the semiconductor chip 10 to prevent the input / output pad 11 from being covered, and circuit patterns such as the bond finger 22, the connection part 23, and the solder ball land 24. The circuit board sheet 20 including the adhesive is bonded onto the adhesive 70. (Fig. 3c)

Subsequently, the bond finger 22 of the circuit board sheet 20 and the input / output pad 11 of the semiconductor chip 10 are bonded to each other using a conductive wire 30, preferably a gold wire or an aluminum wire. 3d)

Subsequently, the upper surface of the encapsulant 50 may be protected so that the input / output pad 11, the conductive wire 30, and the bond finger 22 of the circuit board sheet 20 may be protected from the external environment. That is, it is encapsulated using an epoxy molding compound or a liquid encapsulant 50 (Fig. 3e).

At this time, the encapsulant 50 is filled up to the upper surface of the heat spreader 40 positioned at the outer circumference of the bottom surface of the semiconductor chip 10 to encapsulate the side surface of the semiconductor chip 10. Of course, when the semiconductor chip 10 has a center pad as shown in FIG. 2B, the encapsulant 50 is encapsulated only on the upper surface of the semiconductor chip 10.

Subsequently, the solder ball 60 is temporarily attached to the solder ball land 24 of the circuit board sheet 20 by attaching a sticky flux to the solder ball land 24, and then the solder ball 60 is put into a high temperature furnace. ) Is welded to the solder ball land 24 (FIG. 3F).

Finally, the heat spreader 40 is separated into a single semiconductor package 100 by means of a singing blade 80, preferably a sawing blade, a punch or a laser (FIG. 3G).

At this time, when the encapsulant 50 is positioned on the heat spreader 40 as shown in FIG. 3g, the encapsulant 50 and the heat spreader 40 are simultaneously regulated, but the center pad as shown in FIG. In the case of having only the heat spreader 40 is singulated.

In the singulation step, the metal heat spreader 40 is singulated along the unit groove of the bottom surface of the heat spreader 40 so that the metal heat spreader 40 can be easily cut.

Meanwhile, in the above description, the plurality of semiconductor chips 10 are adhered to the heat spreader 40 and the remaining manufacturing processes are performed. However, first, a plurality of semiconductors are used by using the adhesive 70 on the bottom surface of the circuit board sheet 20. After adhering the chip 10, the remaining plate-like heat spreader 40 may be adhered to the bottom surface of the semiconductor chip 10 via an adhesive 71 to perform the remaining manufacturing process.

As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modifications may be made without departing from the scope and spirit of the present invention.

Therefore, according to the semiconductor package and the manufacturing method thereof according to the present invention, the heat spreader is adhered to the entire bottom surface of the semiconductor chip so that heat generated during operation of the semiconductor chip is quickly released to the outside through the heat spreader, and the electrical performance This is to be optimally maintained at all times, and the risk of damage to the semiconductor chip is minimized by blocking not only the top and side surfaces of the semiconductor chip, but also the bottom of the semiconductor chip.

In addition, as the semiconductor chips are transported and transported while being bonded to a hard metallic heat spreader during the manufacturing process, materials handling is easy, and after the encapsulation process is completed, foreign materials such as tape on the bottom of the semiconductor chip must be removed. There is no need for a conventional process, thereby simplifying the manufacturing process.

Claims (8)

A semiconductor chip having a plurality of input / output pads formed on an upper surface thereof; A heat spreader on the bottom of the semiconductor chip, the plate being wider than the bottom of the semiconductor chip, the adhesive being interposed with an adhesive; An adhesive bonded to an upper surface of the semiconductor chip; The polyimide layer is bonded to the upper surface of the adhesive, the circuit pattern of the bond finger, the connecting portion and the solder borland is formed on the polyimide layer, the circuit board sheet is coated on the top surface except for the bond finger and solder borland Wow; Conductive wires connecting the input / output pads of the semiconductor chip and the bond fingers of the circuit board sheets; An encapsulant encapsulated on an upper surface of the semiconductor chip to protect the input / output pad, the conductive wire, the bond finger of the circuit board sheet, and the like from an external environment; A semiconductor package comprising a solder ball fused to the solder ball land of the circuit board sheet to input and output signals of the semiconductor chip to the outside. The semiconductor package of claim 1, wherein the encapsulant encapsulates a side surface of the semiconductor chip and encapsulates the upper surface of the heat spreader, which is an outer circumference of the bottom surface of the semiconductor chip. Providing a substantially plate-shaped heat spreader; Bonding a plurality of semiconductor chips having an input / output pad formed on an upper surface thereof with an adhesive to one surface of the heat spreader; Bonding a circuit board sheet including a circuit pattern, such as a bond finger, a connection part, and a solder ball land, through an adhesive to an upper surface of the semiconductor chip; Bonding the bond finger of the circuit board sheet and the input / output pad of the semiconductor chip with a conductive wire; Encapsulating an encapsulant on an upper surface of the semiconductor chip to protect the input / output pad, the conductive wire, and the bond finger of the circuit board sheet from the external environment; Fusing the solder balls to the solder balls of the circuit board sheet; And a step of singulating the heat spreader and separating the heat spreader into individual semiconductor packages. The method of manufacturing a semiconductor package according to claim 3, wherein the step of providing the heat spreader comprises a plurality of unit grooves (41) having a substantially checkerboard shape crossing vertically on one surface. The method of claim 3, wherein the encapsulation is performed on an upper surface of a heat spreader positioned at an outer circumference of a bottom surface of the semiconductor chip. The method of claim 3, wherein the singulation step is performed by simultaneously sawing the encapsulant and the heat spreader. The method of claim 3, wherein the bonding of the semiconductor chip on the heat spreader is performed after adhering the circuit board sheet on the semiconductor chip. The method according to any one of claims 3 to 6, wherein the singulation step uses a unit groove formed on the bottom surface of the heat spreader so that the heat spreader is easily cut, and singulates along the unit groove. A method for producing a semiconductor package.