KR100298387B1 - Color cathod ray tube with electrificationn and reflection preventing function - Google Patents

Color cathod ray tube with electrificationn and reflection preventing function Download PDF

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Publication number
KR100298387B1
KR100298387B1 KR1019970040196A KR19970040196A KR100298387B1 KR 100298387 B1 KR100298387 B1 KR 100298387B1 KR 1019970040196 A KR1019970040196 A KR 1019970040196A KR 19970040196 A KR19970040196 A KR 19970040196A KR 100298387 B1 KR100298387 B1 KR 100298387B1
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ray tube
panel
cathode ray
conductive film
film
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KR1019970040196A
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Korean (ko)
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KR19990017299A (en
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김상문
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구자홍
엘지전자 주식회사
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/86Vessels; Containers; Vacuum locks
    • H01J29/867Means associated with the outside of the vessel for shielding, e.g. magnetic shields
    • H01J29/868Screens covering the input or output face of the vessel, e.g. transparent anti-static coatings, X-ray absorbing layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2229/00Details of cathode ray tubes or electron beam tubes
    • H01J2229/863Passive shielding means associated with the vessel
    • H01J2229/8631Coatings
    • H01J2229/8632Coatings characterised by the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2229/00Details of cathode ray tubes or electron beam tubes
    • H01J2229/863Passive shielding means associated with the vessel
    • H01J2229/8635Antistatic shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2229/00Details of cathode ray tubes or electron beam tubes
    • H01J2229/88Coatings
    • H01J2229/882Coatings having particular electrical resistive or conductive properties

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  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)

Abstract

PURPOSE: A color cathode ray tube having an electrification function and a reflective function is provided to improve transmissivity by lowering a surface resistance of a panel. CONSTITUTION: A cathode ray tube includes a panel(1) having an image display side. A conductive layer(14) is formed on a face of the panel(1). The conductive layer(14) is formed with Sn, F, and In2O3. A low reflective layer(15) is formed on the conductive layer(14). A surface resistance and a transmissivity are improved by using the conductive layer(14). The transmissivity is improved by using the low reflective layer(15). A conductive tape is adhered on a side of the above structure. The conductive layer(14) is formed with Sn of 1 to 10 weight percents, F of 1 to 30 weight percents, and In2O3 of the remaining weight percents.

Description

대전 및 반사방지 기능을 갖는 칼라 음극선관{Color cathod ray tube with electrificationn and reflection preventing function}Color cathod ray tube with electrificationn and reflection preventing function}

본 발명은 음극선관의 화상표시면에 대전 및 반사방지 기능을 갖는 코팅막을 형성하는 것에 관한 것으로, 특히 표면 저항을 낮추어 정전하를 최소화 함과 함께 양호한 투과율 특성을 갖게 하는데 적합하도록 한 것이다.The present invention relates to the formation of a coating film having an antistatic and antireflection function on an image display surface of a cathode ray tube, and is particularly suitable for lowering surface resistance to minimize electrostatic charge and having good transmittance characteristics.

도 1은 기존의 음극선관에 대한 종단면도를 나타낸 것으로, 유리질로된 내측면에 형광막이 형성된 패널(1)과 전도성을 갖는 흑연이 도포된 펀넬(2)은 융착글라스로 서로 봉합되어 지며, 펀넬의 네크부(3)에 전자빔을 발생시키는 전자총(7)이 장착되어 있고, 패널의 내측에는 색선별 전극인 새도우마스크(4)가 프레임(5)에 의해 지지되어 있으며, 펀넬의 외주면에는 전자빔을 좌우로 편향시켜 주는 편향요크(8)가 장착되어 있다.Figure 1 shows a longitudinal cross-sectional view of a conventional cathode ray tube, a panel (1) with a fluorescent film formed on the inner surface of the glass and a funnel (2) coated with conductive graphite is sealed with each other by fusion glass, funnel An electron gun 7 for generating an electron beam is mounted on the neck portion 3 of the neck. A shadow mask 4, which is a color-selective electrode, is supported by the frame 5 inside the panel, and an electron beam is provided on the outer circumferential surface of the funnel. A deflection yoke 8 for deflecting from side to side is mounted.

이렇게 구성된 칼라브라운관은 전자총(7)에 영상신호를 입력하면 전자총의 캐소드로부터 열전자가 방출되며 방출된 전자는 전자총의 각 전극에서 인가된 전압에 의하여 패널쪽으로 가속 및 집속과정을 거치면서 진행하게 된다.The color CRT configured as described above inputs an image signal to the electron gun 7 so that hot electrons are emitted from the cathode of the electron gun, and the emitted electrons are accelerated and focused toward the panel by a voltage applied from each electrode of the electron gun.

이때 전자는 펀넬(2)의 네크부에 장착된 마그네트의 자계에 의하여 전자빔(9)의 진행경로가 조정되며 조정된 전자빔은 편향요크(8)에 의하여 패널(1)의 내면에 주사되어지는데, 편향된 전자빔은 패널의 내측면 프레임(5)에 결합된 새도우마스크(4)의 solt을 통과하면서 색선별이 이루어지고 선별된 전자빔은 패널(1) 내면의 각각의 형광막에 충돌하여 발광되므로써 영상신호를 재현한다.At this time, the path of the electron beam 9 is adjusted by the magnetic field of the magnet mounted on the neck of the funnel 2, and the adjusted electron beam is scanned on the inner surface of the panel 1 by the deflection yoke 8. The deflected electron beam passes through the solt of the shadow mask 4 coupled to the inner frame 5 of the panel, and color separation is performed. The selected electron beam collides with each fluorescent film on the inner surface of the panel 1 to emit an image signal. To reproduce.

그리고 전자빔이 새도우마스크의 slot을 통과하여 형광막에 도달되는데 있어서 지자기의 영향으로 전자빔의 편향이 일어나는 것을 방지하기 위하여 패널(1) 쪽에서 볼 때 새도우마스크(7)가 결합된 프레임(5) 뒤쪽에 지자기 차폐물질(인너쉴드 : INNER SHIELD 라함.)(6)이 부착되어 있다.In order to prevent the electron beam from being deflected by the influence of geomagnetism in the electron beam passing through the slot of the shadow mask and reaching the fluorescent film, the rear surface of the frame 5 to which the shadow mask 7 is coupled is viewed from the panel 1 side. A geomagnetic shielding material (Inner Shield is called) (6) is attached.

상기 구조에서 유리질로된 패널(1)은 외광을 강하게 반사시키므로 패널에 형성된 화상을 보기가 어렵고, 음극선관에 전원이 인가되고 차단될 때 패널 내면에 고압의 양극 전압이 인가되거나 차단되는데, 이때 정전유도체에 의하여 부도체의패널외면에는 내부 고압에 대향하는 전위의 정전하가 대전되기도 한다.Since the panel 1 made of glass in the above structure strongly reflects external light, it is difficult to see an image formed on the panel. When the power is applied to the cathode ray tube and is cut off, a high-voltage anode voltage is applied or blocked on the inner surface of the panel, in which case the electrostatic Due to the derivative, a static charge of a potential opposite to the internal high pressure may be charged on the outer surface of the panel of the insulator.

이는 사용자가 접촉시 고압의 정전기에 의하여 심한 충격을 받기도 하며 패널외면에서는 먼지들의 부착으로 인하여 화상을 보기 어렵게 되기도 한다.This may be severely impacted by high pressure static electricity when the user touches, and it may be difficult to see the image due to the adhesion of dust on the outside of the panel.

이에 따라서 근래에는 대전을 방지하기 위하여 도 2에서와 같이 패널(1) 외면에 투명한 도전막(10)을 형성하여 도전 테이프(11)로서 접지시키거나 혹은 패널면에 도포된 알콕시 실란의 가수분해를 이용하여 이때 형성된 Si-O-Si 사슬 중에 미량의 하이드록시(-OH)를 남겨놓아 하이드록시의 흡습성을 이용하여 표면저항을 낮추어 전도성을 부여하는 방안(일본 특허공개소61-118932), 액상의 전도성 용액을 분무 코팅후 400℃ 이상에서 열처리하여 투명 도전막 형성(일본 실용공고소49-2411), 혹은 패널 외면의 외광 반사를 방지하기 위하여 화학적 진공증착 또는 스퍼터링 증착등으로 다층의 박막을 형성(일본 특허공개소62-154540) 하거나 또는 화학적 진공증착 또는 스퍼터링 증착으로 다층의 반사막이 형성된 별도의 패널을 부착하는 방법이 이용되고 있다.Accordingly, in order to prevent charging, in recent years, as shown in FIG. 2, a transparent conductive film 10 is formed on the outer surface of the panel 1 and grounded as a conductive tape 11, or hydrolysis of the alkoxy silane applied to the panel surface is prevented. used in this case formed in the Si-O-Si chains of the minor hydroxy (- OH) and leave the room to release by using the hygroscopicity of the hydroxy lower the surface resistance impart conductivity (Japanese Patent Publication 61-118932 cow), a liquid The conductive solution is spray-coated and heat-treated at 400 ° C. or higher to form a transparent conductive film (Japanese Utility Publication No. 49-2411), or to form a multilayer thin film by chemical vacuum deposition or sputtering deposition to prevent external light reflection on the panel surface. Japanese Patent Application Laid-Open No. 62-154540, or a method of attaching a separate panel on which a multilayer reflective film is formed by chemical vacuum deposition or sputtering deposition is used.

뿐만 아니라 일본 아사히사에서는 패널 페이스면에 산화지르코늄과 산화규소 및 전도성 산화주석의 혼합물 용액으로 투명 도전성 피막을 형성, 표면저항 특성과 광택도 특성을 좋게 하여 (일본특허공고 H04-65384) 현재 상품화하여 널리 사용되고 있다.In addition, in Asahi, Japan, a transparent conductive film is formed with a mixture solution of zirconium oxide, silicon oxide, and conductive tin oxide on the panel face, and the surface resistance and glossiness characteristics are improved (Japanese Patent Publication H04-65384). It is widely used.

도 3은 종래 음극선관의 다른 구조를 나타낸 것으로, 음극선관에 인가된 전원의 온/오프시에 정전유도에 의하여 발생되는 대전현상은 패널(1) 외면의 표면저항을 낮추어 대전된 전하의 이동을 쉽게 하여 정전기 발생시 빠른 시간내에 소거하기 위한 도전막(12)을 형성시키고, 반사방지를 위하여는 화상의 표면에 굴절율이 다른 유리층으로된 반사막(13)을 형성하여 각 층에서 반사된 빛의 간섭 효과를 이용하여 반사율을 낮추고 있다.Figure 3 shows another structure of the conventional cathode ray tube, the charging phenomenon generated by the electrostatic induction when the power applied to the cathode ray tube on / off lowers the surface resistance of the outer surface of the panel 1 to prevent the movement of charged charge The conductive film 12 is easily formed so as to be erased quickly when static electricity is generated, and the reflection film 13 made of glass layers having different refractive indices is formed on the surface of the image to prevent reflection, thereby interfering with the light reflected from each layer. The effect is used to lower the reflectance.

상기 도전막(12)은 안티몬(Sb)이 도핑된 산화주석(SnO2) 성분의 졸-겔 액을 브라운관 표면에 주입하여 회전코팅방법으로 코팅시킨 후 소성하여 코팅막을 형성시킨다.The conductive film 12 is a sol-gel liquid of the antimony (Sb) -doped tin oxide (SnO 2 ) component is injected into the surface of the CRT, coated by a rotary coating method and then fired to form a coating film.

이때의 표면 저항은 107∼8(Ω/□) 이하의 수준으로서 전자파 관련 건강에 관한 규약(TCO)의 규격에서 브라운관으로부터 5㎐ ∼ 2㎑인 이엘에프 대(ELF BAND)와 2㎑ ∼ 400㎑인 브이엘에프 대(VLF BAND)의 전자파를 최소화 하기 위하여 요구하는 103(Ω/□) 이하의 수준으로 저저항화 되어야 한다.At this time, the surface resistance is 10 7 ~ 8 (Ω / □) or less, and ELF BAND with 5㎑-2㎑ from the CRT and 2 브라운 ~ 400 according to the TCO standard. The resistance should be lowered to the level of 10 3 (Ω / □) or less required to minimize the electromagnetic waves of the VLF BAND.

한편, 종래의 도전성 물질을 사용하여 도전막과 저반사막을 형성할 경우가 있으나 이는 패널과의 굴절율 차이로 투과율이 저하되고, 콘트라스트(Contrast) 향상을 위하여 색소를 첨가하기도 하는데 이로 인하여 투과율이 더욱 더 저하되는 문제가 생긴다.On the other hand, although the conductive film and the low reflection film may be formed using a conventional conductive material, the transmittance is lowered due to the difference in refractive index with the panel, and a dye may be added to improve contrast, thereby increasing the transmittance even more. There is a problem of deterioration.

본 발명은 상기한 종래의 문제점을 해결하기 위해 안출한 것으로, 도전막을 이루는 합금조성을 적절히 조절함과 함께 그 도전막위에 저반사막을 형성시키므로써 패널 표면에서의 표면저항을 낮추어 대전되는 정전하를 최소화하고, 투과율을향상시키는데 적합한 음극선관의 화상표시면을 갖도록 하는데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and by appropriately controlling the alloy composition of the conductive film and forming a low reflection film on the conductive film, the surface resistance on the panel surface is reduced to minimize the electrostatic charges charged. The purpose is to have an image display surface of a cathode ray tube suitable for improving transmittance.

도 1은 기존 칼라 음극선관의 개략도1 is a schematic diagram of a conventional color cathode ray tube

도 2는 도전막이 형성된 기존 음극선관의 개략도2 is a schematic diagram of a conventional cathode ray tube having a conductive film formed thereon;

도 3은 대전 및 반사방지를 위한 기존 음극선관의 개략도3 is a schematic diagram of a conventional cathode ray tube for antistatic and antireflection

도 4는 본 발명에 따른 음극선관의 개략도4 is a schematic diagram of a cathode ray tube according to the present invention;

도 5는 표면 전기저항 특성 실험을 위한 측정지점을 나타낸 상태도5 is a state diagram showing a measuring point for the surface electrical resistance characteristics test

도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings

1 : 패널 14 : 도전막1 panel 14 conductive film

15 : 저반사막15: low reflection film

상기 목적 달성을 위한 본 발명은 실시예로 나타낸 도 4와 같이 화상표시면을 나타내는 패널을 구비한 음극선관에 있어서, 패널(1) 페이스면에 주석(Sn)과 불소(F)와 산화인듐(In2O3)으로 조성된 도전막(14)이 형성되고, 그 위에 저반사막(15)이 형성된 음극선관으로 구성된다.The present invention for achieving the above object is a cathode ray tube having a panel showing an image display surface as shown in Fig. 4 shown in the embodiment, the tin (Sn), fluorine (F) and indium oxide ( A conductive film 14 composed of In 2 O 3 is formed, and a cathode ray tube having a low reflection film 15 formed thereon is formed.

그리고 그위 측면에 도 2와 같은 도전성 테이프(11)를 부착한다.Then, the conductive tape 11 shown in FIG. 2 is attached to the side.

상기 도전막(14)은 대전방지 특성을 향상시키기 위해 종래에 사용되고 있는 주석(Sn)이 도핑된 산화인듐(In2O3) 즉, ITO에 미량의 불소(F)를 도핑시킴으로써 표면저항과 투과율특성을 향상시키고, 그 위에 저반사막(15)을 형성하여 투과율을 향상시킨 것이다.The conductive film 14 has a surface resistance and transmittance by doping a small amount of fluorine (F) to indium oxide (In 2 O 3 ) doped with tin (Sn), that is conventionally used to improve the antistatic properties, i.e. The characteristics were improved, and the low reflection film 15 was formed thereon to improve the transmittance.

상기 도전막(14)을 이루는 조성에서 100 중량% 중 주석(Sn)은 1∼10 중량%, 불소(F)는 1∼30 중량% 이고 나머지는 산화인듐(In2O3) 이다.In the composition of the conductive film 14, tin (Sn) is 1 to 10% by weight, fluorine (F) is 1 to 30% by weight, and the remainder is indium oxide (In 2 O 3 ).

주석(Sn)의 함량이 1 중량% 이하일 경우는 산화인듐(In2O3)에 충분한 도전성이 부여되지 않으며, 10 중량% 이상일 경우는 과량으로 인해 도전성이 나타나지 않는다.When the content of tin (Sn) is 1 wt% or less, sufficient conductivity is not imparted to indium oxide (In 2 O 3 ), and when it is 10 wt% or more, conductivity does not appear due to excess.

상기 함량중 바람직하게는 3∼7 중량% 이다.Preferably it is 3-7 weight% of the said content.

불소(F)는 도전성 금속을 포함하는 불화물을 사용하는 것이 바람직하며, 주석불화물, 인듐 불화물을 사용하는 것이 좋다.As the fluorine (F), fluoride containing a conductive metal is preferably used, and tin fluoride and indium fluoride are preferably used.

상기 불소(F)함량이 1.0 중량%일 경우는 그 함량이 미미하여 투과율의 증가가 없으며, 30 중량% 초과의 경우는 과잉 첨가로 인하여 오히려 투과율이 저하하며, 바람직하게는 5∼20 중량% 이다.If the content of fluorine (F) is 1.0% by weight, its content is insignificant and there is no increase in transmittance, and in the case of more than 30% by weight, the transmittance is lowered due to excessive addition, preferably 5 to 20% by weight.

상기 코팅막을 형성하는 방법은 주석(Sn)과 불소(F)가 도핑된 산화인듐(In2O3), 즉 ITOF 미립자를 산화규소 또는 산화규소-산화티탄(SiO2-TiO2) 미립자가 함유된 콜로이드 용액을 이용하여 소정의 두께로 도포하는 것이 좋다.The method of forming the coating film includes indium oxide (In 2 O 3 ) doped with tin (Sn) and fluorine (F), that is, the ITOF fine particles contain silicon oxide or silicon oxide-titanium oxide (SiO 2 -TiO 2 ) fine particles. It is good to apply to a predetermined thickness using the colloidal solution.

이때 세라믹 도전성 분말인 ITOF는 평균 입자경이 70㎚ 이하의 것을 사용한다.At this time, ITOF which is a ceramic electroconductive powder uses the thing whose average particle diameter is 70 nm or less.

만일 70㎚ 이상이 되면 ITOF 입자의 분산이 균일해지지 않을 뿐만 아니라 패널에 도포될 때 도포성이 나빠져 도포면의 표면이 거칠어져 균일한 도포가 어렵게 될 수가 있다.If the thickness is 70 nm or more, the dispersion of the ITOF particles is not uniform, and when applied to the panel, the applicability deteriorates and the surface of the coated surface may be roughened, thereby making it difficult to apply uniformly.

그리고 도전성 콜로이드 용액의 농도는 1 내지 10 wt% 로 한다.The concentration of the conductive colloidal solution is 1 to 10 wt%.

1 wt% 이하일 경우 막이 형성되었을 때 도전층에 ITOF의 양이 적어서 충분한 도전성을 얻기가 어려우며 농도가 10 wt% 이상일 경우는 도전성은 좋지만 투과율 및 도포막의 표면성이 나빠질 수가 있다.When it is 1 wt% or less, when the film is formed, it is difficult to obtain sufficient conductivity due to the small amount of ITOF in the conductive layer. When the concentration is 10 wt% or more, the conductivity is good but the transmittance and the surface of the coating film may be deteriorated.

상기 콜로이드 용액을 이용하여 도포함에 있어서는 브라운관의 제작공정 중 배기공정을 거쳐나온 브라운관에 우선 ITOF 도전성 입자를 패널의 표면에 공급하여 분당 회전수가 100∼2000rpm 으로 회전코팅한 후 약 200℃ 에서 1시간 정도 열처리하여 500∼10000Å 정도의 두께로 코팅된 도전막(14)을 형성한다.In the application using the colloidal solution, the ITOF conductive particles were first supplied to the surface of the panel through the evacuation process during the manufacturing process of the CRT, and then rotated at a rotational speed of 100 to 2000 rpm for about 1 hour at about 200 ° C. The heat treatment is performed to form a conductive film 14 coated with a thickness of about 500 to 10,000 kPa.

이렇게 형성된 도전막(14) 위에 산화규소(SiO2) 또는 산화규소-산화티탄(SiO2-TiO2) 성분으로 제작된 졸용액을 주입 후 분당 회전수가 100∼2000rpm으로 회전코팅한 후 약 200℃에서 1시간 정도 열처리하여 저반사막(15)을 제조한다.After the injection of the sol solution made of silicon oxide (SiO 2 ) or silicon oxide-titanium oxide (SiO 2 -TiO 2 ) on the conductive film 14 thus formed, the coating was rotated at a rotational speed of 100 to 2000 rpm and then about 200 ° C. The low reflection film 15 is prepared by heat treatment at about 1 hour.

이때 코팅두께는 70 내지 100㎚ 정도로 한다.At this time, the coating thickness is about 70 to 100nm.

코팅 두께가 70㎚ 이하이거나 100㎚ 이상이 되면 저반사막의 반사율이 2% 이상이 되기 때문에 저반사막의 효과가 떨어진다.When the coating thickness is 70 nm or less or 100 nm or more, the reflectance of the low reflection film becomes 2% or more, so the effect of the low reflection film is inferior.

막을 형성하는 또 다른 방법은 주석(Sn)과 불소(F)가 도핑된 산화인듐(In2O3), 즉 ITOF 소결체를 이용하여 스퍼트링 방법으로 패널표면에 물리적 증착을 하여 도전막(14)을 제조하고 산화규소 또는 산화규소-산화티탄(SiO2-TiO2) 미립자가 함유된 콜로이드 용액을 이용하여 저반사막을 만들거나 산화규소 또는 산화규소-산화티탄(SiO2-TiO2) 세라믹 소결체를 이용하여 스퍼터링 방법으로 패널표면에 물리적 증착을 하여 저반사막(15)을 만든다.Another method of forming the film is indium oxide (In 2 O 3 ) doped with tin (Sn) and fluorine (F), that is, conductive film 14 by physical vapor deposition on the surface of the panel by sputtering using an ITOF sintered body. To produce a low reflection film using a colloidal solution containing silicon oxide or silicon oxide-titanium oxide (SiO 2 -TiO 2 ) particles, or a silicon sintered body of silicon oxide or silicon oxide-titanium oxide (SiO 2 -TiO 2 ) The low reflection film 15 is formed by physical vapor deposition on the panel surface by sputtering.

다음은 실시예에 따라 설명한다.The following is described according to the embodiment.

실시예 1Example 1

주석(Sn)이 5wt%, 불소(F)가 8wt% 도핑된 산화인듐(In2O3)즉 ITOF 미립자(평균 입자경 20㎚)와 산화규소 또는 산화규소-산화티탄(SiO2-TiO2) 미립자가 함유된 3wt% 농도의 혼합 콜로이드 용액을 이용하여 70㎚ 두께로 패널 표면에 도전막(14)을 코팅한 후 산화규소 미립자가 함유된 콜로이드 용액으로 패널표면에 95㎚의 저반사막(15)을 형성시켜 제조한 것이다.Indium oxide (In 2 O 3 ) doped with 5 wt% tin (Sn) and 8 wt% fluorine (F), that is, ITOF fine particles (average particle diameter 20 nm) and silicon oxide or silicon oxide-titanium oxide (SiO 2 -TiO 2 ) The conductive film 14 is coated on the surface of the panel to a thickness of 70 nm using a mixed colloidal solution containing 3 wt% of fine particles, and then the low reflective film 15 having a thickness of 95 nm on the panel surface is a colloidal solution containing silicon oxide fine particles. It was prepared by forming.

이때 코팅조건은 분당 회전수를 150rpm 으로 하고 스핀코팅을 하여 막을 형성후 80℃에서 20분간 건조하고 200℃에서 1시간 열처리하여 제조하였다.At this time, the coating conditions were prepared by spinning at 150 rpm and spin coating to form a film, drying at 80 ° C. for 20 minutes, and heat-treating at 200 ° C. for 1 hour.

실시예 2Example 2

주석(Sn) 5wt%, 불소(F) 8wt% 도핑된 산화인듐(In2O3) 즉 ITOF 소결체를 이용하여 스퍼트링 방법으로 패널표면에 물리적 증착을 하여 27㎚의 도전막(14)을 제조하고 산화규소 또는 산화규소-산화티탄(SiO2-TiO2) 미립자가 함유된 콜로이드 용액을 이용하여 저반사막(15)을 만든 것이다.A 27 nm conductive film 14 was prepared by physical vapor deposition on a panel surface by sputtering using 5 wt% tin (Sn) and 8 wt% fluorine (F) doped indium oxide (In 2 O 3 ), that is, an ITOF sintered body. The low reflection film 15 was made using a colloidal solution containing silicon oxide or silicon oxide-titanium oxide (SiO 2 -TiO 2 ) particles.

실시예 3Example 3

주석(Sn) 5wt%, 불소(F) 8wt% 도핑된 산화인듐(In2O3) 즉 ITOF 소결체를 이용하여 스퍼트링 방법으로 패널 표면에 물리적 증착을 하여 27㎚의 도전막(14)을 제조하고 산화규소 또는 산화규소-산화티탄(SiO2-TiO2) 세라믹 소결체를 이용하여 스퍼트링 방법으로 패널표면에 물리적 증착을 하여 110㎚의 저반사막(15)을 만들어 제조한 것이다.A 27 nm conductive film 14 was prepared by physical deposition on a panel surface by sputtering using 5 wt% tin (Sn) and 8 wt% fluorine (F) doped indium oxide (In 2 O 3 ), that is, an ITOF sintered body. And by using a silicon oxide or silicon oxide-titanium oxide (SiO 2 -TiO 2 ) ceramic sintered by physical deposition on the surface of the panel by the sputtering method to produce a low-reflection film 15 of 110nm.

비교예 1Comparative Example 1

주석(Sn)이 4 wt% 정도 도핑된 산화인듐(In2O3) 즉 ITO 미립자(평균 입자경 20㎚)와 산화규소-산화티탄((SiO2-TiO2) 미립자가 함유된 3wt% 농도의 혼합 콜로이드 용액을 이용하여 70㎚ 두께로 패널 표면에 도전막(14)을 코팅한 후 산화규소 미립자가 함유된 콜로이드 용액으로 패널표면에 95㎚의 저반사막(15)을 형성시켜 제조한 것이다.3 wt% of indium oxide (In 2 O 3 ) doped about 4 wt% of tin (Sn), that is, ITO particles (average particle diameter 20 nm) and silicon oxide-titanium oxide ((SiO 2 -TiO 2 ) particles It is prepared by coating the conductive film 14 on the surface of the panel using a mixed colloidal solution at a thickness of 70 nm, and then forming a 95 nm low reflection film 15 on the surface of the panel using a colloidal solution containing silicon oxide fine particles.

이때 코팅조건은 실시예 1과 같이 하여 제조하였다.At this time, the coating conditions were prepared as in Example 1.

비교예 2Comparative Example 2

주석(Sn) 5wt%가 도핑된 산화인듐(In2O3) 즉 ITO 소결체를 이용하여 스퍼트링 방법으로 패널표면에 물리적 증착을 하여 27㎚의 도전막(14)을 제조하고 산화규소 미립자가 함유된 콜로이드 용액을 이용하여 95㎚의 저반사막(15)을 만들어 제조한 것이다.Indium oxide (In 2 O 3 ) doped with 5 wt% of tin (Sn), i.e., ITO sintered body, was physically deposited on the panel surface by sputtering to prepare a conductive film 14 having a thickness of 27 nm, and containing silicon oxide fine particles. 95 nm of the low reflection film 15 was made and manufactured using the colloid solution.

상기 실시예 및 비교예에 따른 패널을 이용하여 브라운관을 제조한 후 도 5에 표시한 각 지점에 대하여 도전성을 평가하여 표 1에 나타냈으며, 550㎚ 파장에서의 반사율과 투과율을 측정하여 표 2에 나타내었다.After the CRT was manufactured using the panel according to the above Examples and Comparative Examples, the conductivity of each point shown in FIG. 5 was evaluated and shown in Table 1, and the reflectance and transmittance at 550 nm wavelength were measured. Indicated.

이에 알 수 있는 바와 같이 도전성 ITO에 불소가 함유된 본 발명의 경우 도전막의 도전성이 향상될 뿐만 아니라 반사율은 유사하게 나타나지만 투과율이 향상됨을 알 수 있었다.As can be seen, in the case of the present invention in which the conductive ITO contains fluorine, not only the conductivity of the conductive film is improved, but the reflectance is similar, but the transmittance is improved.

표면 전기저항 특성 비교 (단위 : Ω/□)Comparison of Surface Electric Resistance Characteristics (Unit: Ω / □) 측정지점Measuring point 실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 비교예 1Comparative Example 1 비교예 2Comparative Example 2 #1#One 4.62 E+044.62 E + 04 2.26 E+022.26 E + 02 1.32 E+021.32 E + 02 4.62 E+054.62 E + 05 7.53 E+37.53 E + 3 #2#2 5.84 E+045.84 E + 04 4.68 E+024.68 E + 02 1.09 E+021.09 E + 02 5.73 E+055.73 E + 05 6.91 E+36.91 E + 3 #3# 3 6.18 E+046.18 E + 04 2.81 E+022.81 E + 02 3.98 E+023.98 E + 02 5.18 E+055.18 E + 05 5.43 E+35.43 E + 3 #4#4 5.23 E+045.23 E + 04 3.57 E+023.57 E + 02 1.07 E+021.07 E + 02 4.72 E+054.72 E + 05 4.36 E+34.36 E + 3 #5# 5 4.89 E+044.89 E + 04 4.42 E+024.42 E + 02 1.52 E+021.52 E + 02 4.28 E+054.28 E + 05 6.83 E+36.83 E + 3 #6# 6 5.67 E+045.67 E + 04 3.74 E+023.74 E + 02 1.01 E+021.01 E + 02 3.19 E+053.19 E + 05 6.31 E+36.31 E + 3 #7# 7 7.67 E+047.67 E + 04 5.79 E+025.79 E + 02 1.24 E+021.24 E + 02 5.42 E+055.42 E + 05 7.93 E+37.93 E + 3 #8#8 6.73 E+046.73 E + 04 3.68 E+023.68 E + 02 7.06 E+027.06 E + 02 4.65 E+054.65 E + 05 8.17 E+38.17 E + 3 #9# 9 6.79 E+046.79 E + 04 5.62 E+025.62 E + 02 2.47 E+022.47 E + 02 4.72 E+054.72 E + 05 9.26 E+39.26 E + 3

투과율 특성 비교 ( 단위 : %)Comparison of transmittance characteristics (unit:%) 실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 비교예 1Comparative Example 1 비교예 2Comparative Example 2 투과율Transmittance 5454 5757 5656 5050 5252 반사율reflectivity 0.50.5 0.10.1 0.20.2 0.50.5 0.20.2

이상에서와 같이 본 발명은 기존의 주석(Sn)이 도핑된 산화인듐(In2O3)에 불소(F)를 첨가함과 함께 그 배합비를 조절하여서된 도전막을 형성시키고, 그 위에 저반사막을 형성시킴으로써, 도전성이 향상될 뿐만 아니라 투과율이 향상된 음극선관의 화상표시면을 얻게 된다.As described above, the present invention forms a conductive film by adding fluorine (F) to the conventional indium oxide (In 2 O 3 ) doped with tin (Sn) and adjusting the mixing ratio thereof, and forming a low reflection film thereon. By forming, the image display surface of the cathode ray tube which not only improves conductivity but also improves transmittance is obtained.

Claims (6)

화상표시면을 나타내는 패널외면에 도전막과 저반사막이 순차적으로 형성된 것에 있어서, 도전막이 주석(Sn), 불소(F), 산화인듐(In2O3)으로 조성되어 이루어짐을 특징으로 하는 대전 및 반사방지기능을 갖는 칼라 음극선관.The conductive film and the low reflection film are sequentially formed on the outer surface of the panel showing the image display surface, wherein the conductive film is composed of tin (Sn), fluorine (F), and indium oxide (In 2 O 3 ). Color cathode ray tube with antireflection function. 제 1 항에 있어서,The method of claim 1, 도전막이 중량 %로써, 주석(Sn) 1∼10%, 불소(F) 1∼30%이고, 나머지는 산화인듐(In2O3)임을 특징으로 하는 대전 및 반사방지기능을 갖는 칼라 음극선관.A colored cathode ray tube with a charge and antireflection function, wherein the conductive film is, by weight%, 1 to 10% tin (Sn), 1 to 30% fluorine (F), and the rest is indium oxide (In 2 O 3 ). 제 1항에 있어서,The method of claim 1, 도전막은 주석, 불소, 산화인듐 도전성 입자가 함유된 콜로이드 용액을 이용하여 도포하여서 된 것임을 특징으로 하는 대전 및 반사방지기능을 갖는 칼라 음극선관.The conductive film is a colored cathode ray tube with a charge and antireflection function, characterized in that the coating by using a colloidal solution containing tin, fluorine, indium oxide conductive particles. 제 1 항에 있어서,The method of claim 1, 도전막은 주석, 불소, 산화인듐으로 조성된 소결체를 스퍼터링하여 형성된 것임을 특징으로 하는 대전 및 반사방지기능을 갖는 칼라 음극선관.The conductive film is formed by sputtering a sintered body composed of tin, fluorine, indium oxide, the color cathode ray tube having antistatic and antireflection functions. 제 1항에 있어서,The method of claim 1, 저반사막은 산화규소 또는 산화규소-산화티탄(SiO2-TiO2)미립자가 함유된 콜로이드 용액을 도포하여서 된 것임을 특징으로 하는 대전 및 반사방지 기능을 갖는 칼라 음극선관.The low reflection film is a color cathode ray tube with a charge and antireflection function, characterized in that by applying a colloidal solution containing silicon oxide or silicon oxide-titanium oxide (SiO 2 -TiO 2 ) particles. 제 1항에 있어서,The method of claim 1, 저반사막은 산화규소 또는 산화규소-산화티탄(SiO2-TiO2) 세라믹 소결체를 이용하여 스퍼터링하여 형성된 것임을 특징으로 하는 대전 및 반사방지 기능을 갖는 칼라 음극선관.A low-reflection film is a color cathode ray tube with a charge and antireflection function, characterized in that formed by sputtering using a silicon oxide or silicon oxide-titanium oxide (SiO 2 -TiO 2 ) ceramic sintered body.
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KR890010999A (en) * 1987-12-10 1989-08-11 미따 가쯔시게 Image display face plate and manufacturing method thereof.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030013999A (en) * 2001-08-10 2003-02-15 주식회사 대우일렉트로닉스 A braun-tube

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