KR100287619B1 - Manufacturing method of liquid chamber layer of print head - Google Patents
Manufacturing method of liquid chamber layer of print head Download PDFInfo
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- KR100287619B1 KR100287619B1 KR1019980036884A KR19980036884A KR100287619B1 KR 100287619 B1 KR100287619 B1 KR 100287619B1 KR 1019980036884 A KR1019980036884 A KR 1019980036884A KR 19980036884 A KR19980036884 A KR 19980036884A KR 100287619 B1 KR100287619 B1 KR 100287619B1
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- South Korea
- Prior art keywords
- liquid chamber
- chamber layer
- metal plate
- piezoelectric body
- manufacturing
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- 239000007788 liquid Substances 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000005452 bending Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 11
- 150000002739 metals Chemical class 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- -1 and the like Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/0458—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on heating elements forming bubbles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
본 발명은 액실층을 구성하는 금속판을 다단계로 적층한 다음 고온 고압에서 금속간의 압접에 의해 이들 금속판이 완전 밀착되도록 함으로써, 공정이 간소화되고 높은 신뢰성을 얻을 수 있는 프린트헤드의 액실층 제조방법에 관한 것으로서, 특히 판형의 압전체와 상기 압전체의 하부에 형성되어 압전체의 길이방향 신축운동을 휨운동으로 바꾸어주는 진동판 그리고 상기 진동판의 하부에 형성된 액실층으로 구성된 프린트헤드를 제작함에 있어서, 상기 액실층은 다수개의 금속판으로 구성되고 이들 금속판이 진공상태의 고온에서 압접에 의해 밀착된 특징이 있다.The present invention relates to a method for manufacturing a liquid chamber layer of a printhead, in which a metal plate constituting a liquid chamber layer is laminated in multiple stages, and then the metal plates are completely adhered to each other by pressure welding between metals at high temperature and high pressure. In particular, in the manufacture of a printhead consisting of a plate-shaped piezoelectric body and a diaphragm formed at the lower portion of the piezoelectric body to change the longitudinal stretching movement of the piezoelectric body into a bending motion, and a liquid chamber layer formed at the lower portion of the diaphragm, the liquid chamber layer has a plurality of layers. It consists of two metal plates, and these metal plates have the feature that they are adhered by pressure welding at a high temperature in a vacuum state.
Description
본 발명은 프린트헤드의 액실층 제조방법에 관한 것으로서, 더욱 상세하게는 금속판을 다단계로 적층하여 액실층이 형성되도록 하는 과정에서 금속판이 고온 고압에서 금속간의 압접에 의해 완전 밀착되도록 함으로써, 액실층의 제조 공정이 단순화되고 신뢰성이 향상되는 프린트헤드의 액실층 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a liquid chamber layer of a printhead, and more particularly, in a process of forming a liquid chamber layer by stacking a metal plate in multiple stages, thereby allowing the metal plate to be completely adhered to each other by pressure welding between metals at high temperature and high pressure. The present invention relates to a liquid chamber layer manufacturing method of a printhead in which a manufacturing process is simplified and reliability is improved.
일반적으로 압전소자(Piezo-Electric : PZT)를 이용하여 액체를 액적의 상태로 분사하는 장치는 잉크젯헤드 등에 사용된다. 이러한 압전체를 이용한 잉크젯헤드는 액체를 저장하는 액실을 갖는 액실층의 상부에 엑츄에이터가 구비된다. 엑츄에이터는 빠른 속도로 진동을 하는 과정에서 액실의 내압을 증가시키며 이때 액체를 액적의 상태로 분사하는 기능을 갖는다. 이러한 엑츄에이터는 진동판과 진동판의 상부에 결합되어 폴링(polling:전기장을 가하면 압전체에 방향성이 형성됨)된 상태에 따라 변형을 일으키는 압전체가 구비된다.In general, a device for injecting liquid in the form of droplets using piezo-electric (PZT) is used in an inkjet head or the like. An inkjet head using such a piezoelectric body is provided with an actuator on top of a liquid chamber layer having a liquid chamber for storing liquid. The actuator increases the internal pressure of the liquid chamber in the process of vibrating at a high speed, and has the function of spraying the liquid in the form of droplets. The actuator is coupled to the vibration plate and the upper portion of the vibration plate is provided with a piezoelectric material that causes deformation in accordance with the state (polling: directionality is formed in the piezoelectric body when an electric field is applied).
압전체 패스트(paste)를 스크린 프린트 방법으로 얇은 ZrO2박판위에 형성하고 이를 고온(∼1000℃)에서 소성하여 제조하는 것으로 이때 ZrO2판이 진동판의 역할을 하게된다. 좀더 상세히 설명하면, ZrO2를 얇은 그린시트(green sheet)형태로 만든후 필요한 부분에 구멍을 뚫고 이후 알맞은 크기로 잘라서 고온(1000℃ 이상)에서 소성한다. 얇고( 20㎛ 이상) 정확한 크기로 형성된 ZrO2판에 하부전극을 형성한다. 하부전극이 형성된 ZrO2판에 압전체 패스트를 정확히 정열하여 스크린 프린팅 한다. ZrO2판 위에 스크린 프린팅된 압전체를 고온에서 소성하고 압전체위에 상부전극을 형성한다.A piezoelectric paste is formed on a thin ZrO 2 thin plate by a screen printing method and fired at a high temperature (˜1000 ° C.), whereby the ZrO 2 plate serves as a diaphragm. In more detail, ZrO 2 is formed into a thin green sheet, a hole is formed in a required part, and then cut into an appropriate size and fired at a high temperature (over 1000 ° C.). The bottom electrode is formed on a thin (20 μm or larger) ZrO 2 plate with the correct size. The piezoelectric fast is correctly aligned on the ZrO 2 plate on which the lower electrode is formed and screen printed. The piezoelectric screen printed on the ZrO 2 plate is baked at a high temperature, and an upper electrode is formed on the piezoelectric body.
이같은 방법으로 제조된 엑츄에이터는 압전체의 상단과 하단에 형성된 전극에 강한 전압을 인가하여 압전체를 폴링시킨다. 그리고 압전체의 상단과 하단에 형성된 전극에 전압을 인가하여 압전체와 진동판(ZrO2)으로 이루어진 부분이 기계적 변형을 일으키도록 한다.The actuator manufactured in this way applies a strong voltage to the electrodes formed on the top and bottom of the piezoelectric to poll the piezoelectric. Then, a voltage is applied to the electrodes formed on the upper and lower ends of the piezoelectric body so that the portion formed of the piezoelectric body and the diaphragm ZrO 2 causes mechanical deformation.
이러한 액츄에이터에서 액실층은 에폭시 또는 아이노머와 같은 폴리머계통의 물질로 접합하거나 또는 브레이징을 하였다. 그러나 이들 물질의 접합은 열에 약하고 금과 같이 비싼 물질이 이용되며, 확산에 필요한 물질을 박막의 형태로 구성할 필요가 있음으로 공정이 복잡해지는 등의 단점이 있다.In such actuators, the liquid layer is bonded or brazed with a polymer-based material such as epoxy or inomer. However, the bonding of these materials is weak to heat and expensive materials such as gold are used, and there is a disadvantage that the process is complicated because it is necessary to configure a material required for diffusion in the form of a thin film.
본 발명은 종래의 문제점을 감안하여 개발한 것으로서, 본 발명의 목적은 액실층을 구성하는 금속판을 다단계로 적층한 다음 고온 고압에서 금속간의 압접에 의해 이들 금속판이 완전 밀착되도록 함으로써, 공정이 간소화되고 높은 신뢰성을 얻을 수 있는 프린트헤드의 액실층 제조방법을 제공함에 있다.The present invention was developed in view of the conventional problems, and an object of the present invention is to simplify the process by stacking the metal plates constituting the liquid chamber layer in multiple stages and then bringing these metal plates into close contact with each other by high pressure and high pressure. An object of the present invention is to provide a method of manufacturing a liquid layer of a printhead, which can obtain high reliability.
도 1은 본 발명에 따른 고온압접 시스템의 개략도,1 is a schematic diagram of a high temperature welding system according to the present invention,
도 2는 본 발명 프린트헤드의 단면도.2 is a cross-sectional view of the present invention printhead.
〈도면의 주요부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>
6 : 액실층 7 : 금속판6: liquid chamber layer 7: metal plate
8 : 진동판 9 : 압전체8: diaphragm 9: piezoelectric
상기 목적을 달성하기 위하여 본 발명은 판형의 압전체와 상기 압전체의 하부에 형성되어 압전체의 길이방향 신축운동을 휨운동으로 바꾸어주는 진동판 그리고 상기 진동판의 하부에 형성된 액실층으로 구성된 프린트헤드를 제작함에 있어서, 상기 액실층은 다수개의 금속판으로 구성되고 이들 금속판이 진공상태의 고온에서 압접에 의해 밀착된 특징이 있다.In order to achieve the above object, the present invention provides a printhead comprising a plate-shaped piezoelectric body and a diaphragm formed at the lower portion of the piezoelectric body to change longitudinal stretching motion of the piezoelectric body into a bending motion, and a liquid chamber layer formed at the lower side of the diaphragm. The liquid chamber layer is composed of a plurality of metal plates, and these metal plates are in close contact with each other by pressure welding at a high temperature in a vacuum state.
이하 본 발명의 바람직한 실시예를 첨부 도면에 따라 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명에 따른 고온압접 시스템의 개략도 이다. 밀폐된 공간의 챔버(2)가 구비되고 챔버(2) 내부에는 히터(4)가 설치된다. 그리고 히터(4)의 상부에는 부착하고자 하는 금속판(7)이 다단계로 놓이며 금속판(7)의 상부에는 일정한 압력을 가하는 프레스(1)가 설치된다. 그리고 진공상태에서 고온압접이 이루어지도록 진공부(5)가 챔버(2)와 연결되며 챔버 내부로 분위기가스를 공급하는 분위기가스 공급부(3)가 마련된다.1 is a schematic diagram of a high temperature welding system according to the present invention. The chamber 2 of the enclosed space is provided, and the heater 4 is installed inside the chamber 2. In addition, a metal plate 7 to be attached is placed on the upper part of the heater 4 in multiple stages, and a press 1 for applying a constant pressure is installed on the metal plate 7. In addition, the vacuum unit 5 is connected to the chamber 2 so that the high temperature welding is performed in the vacuum state, and the atmosphere gas supply unit 3 is provided to supply the atmosphere gas into the chamber.
각 금속판(7)은 SUS, Ni, Al등이 이용되며 서로 같은 종류의 열팽창계수가 비슷한 금속이 사용된다. 그리고 접합시 금속산화를 방지하기 위해 진공부(5)로부터 10-2torr 이하의 진공도가 챔버(2) 내부에 유지되며 분위기가스 공급부(3)로부터 N2분위기가 챔버 내부에 유지된다. 또한 Ar과 같은 불활성 기체가 이용되기도 한다.Each metal plate 7 is made of SUS, Ni, Al, and the like, and metals having similar thermal expansion coefficients are used. In order to prevent metal oxidation during bonding, a vacuum degree of 10 −2 torr or less from the vacuum unit 5 is maintained inside the chamber 2, and an N 2 atmosphere from the atmosphere gas supply unit 3 is maintained inside the chamber. Inert gases such as Ar may also be used.
금속판 간의 접합을 용이하게 하기위해 표면처리를 할수 있다. 이는 계면활성제를 이용하거나, 산으로 표면의 산화막 등을 제거하는 클리닝방법, 챔버안에서 표면 처리를 하는 방법 등이 있다.Surface treatment can be performed to facilitate the joining between the metal plates. This includes a cleaning method using a surfactant, an acid film or the like removed from the surface, a surface treatment in a chamber, and the like.
또한 금속 종류가 다른 경우 한 금속판에 다른 금속판의 성분을 가지는 박막을 형성하여 압접하는 방법이 있으며, 이는 Ni를 코팅한 SUS판과 Ni판을 압접하는 방법이 사용된다.In addition, when the metal type is different, there is a method of forming a thin film having the components of the other metal plate on one metal plate by pressure welding, which is a method of pressing the Ni-coated SUS plate and the Ni plate.
접합이 어려운 물질로 구성된 판인 경우 접합이 쉬운 물질을 코팅하여 서로 고온에서 접합하는 방법이 있다. 이는 Ni 또는 Al을 코팅하여 접합하거나, Pb 또는 Sn 또는 이들 두 금속의 합금이 주 원소인 막을 코팅하는 방법이 있다.In the case of a plate made of a material that is difficult to bond, there is a method of coating a material that is easily bonded to each other at a high temperature. This is a method of coating by joining Ni or Al, or by coating a film in which Pb or Sn or an alloy of these two metals is the main element.
접합이 원활이 이루어질수 있도록 고온에서 밀착시켜 주는 방법은 다음과 같다. 일정한 압력을 가하는 상태에서 온도를 상승시키는 방법, 추와 같이 지구 중력을 이용하여 압력을 가하는 방법, 프레스를 이용하는 방법 등이 있다.The method of close contact at high temperature to facilitate the bonding is as follows. There is a method of raising the temperature under a constant pressure, a method of applying pressure using the earth's gravity like a weight, a method using a press, and the like.
도 2는 본 발명에 따른 프린트헤드의 단면도 로서, 잉크가 흐르는 액실이 형성된 액실층(6) 구비된다. 액실층(6)은 다단계의 금속판(7)이 고온압접에 의해 서로 완전 밀착되며 액실층(6)의 상부에 휨변형을 일으키는 진동판(8)이 형성되며, 그리고 진동판(8)의 상부에 하부전극과 압전체(9) 및 상부전극이 차례로 형성된다.2 is a cross-sectional view of the printhead according to the present invention, in which a liquid chamber layer 6 having a liquid chamber in which ink flows is formed. The liquid chamber layer 6 has a multi-stage metal plate 7 completely adhered to each other by high pressure welding, and a diaphragm 8 is formed on the upper portion of the liquid chamber layer 6 to cause bending deformation. An electrode, a piezoelectric body 9 and an upper electrode are formed in this order.
이상에서와 같이 본 발명에 따르면 이상에서와 같이 본 발명에 따르면 다수개의 금속판이 고온압접에 의해 서로 완전 밀착되면 액실을 갖는 액실층이 완성된다. 그리고 액실층의 상부에 진동판과 압전체를 형성하면 프린트헤드의 액츄에이터가 구성된다. 위의 과정에서 액실층은 고온 압접에 의해 형성됨으로 구성이 간소화되고 또한 완전 밀착됨으로 신뢰성이 향상되는 등의 효과가 있다.As described above, according to the present invention, as described above, when a plurality of metal plates are completely adhered to each other by high temperature welding, a liquid chamber layer having a liquid chamber is completed. When the diaphragm and the piezoelectric body are formed on the liquid chamber layer, the actuator of the print head is constructed. In the above process, the liquid chamber layer is formed by high temperature welding, thereby simplifying the construction and improving the reliability by being in close contact with each other.
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KR1019980036884A KR100287619B1 (en) | 1998-09-08 | 1998-09-08 | Manufacturing method of liquid chamber layer of print head |
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