KR100273654B1 - Duplexer and menufacture method of it - Google Patents

Abstract

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a splitter using a surface acoustic wave bandpass filter, which aims to improve the characteristic characteristics of a conductor material, enable adjustment of several kinds of frequency characteristics in the same package, and improve the directional freedom of the device. Shall be.

On top of the multilayer ceramic package 32 having the filter mouths 33a and 33b having different center frequencies, patterns 37a and 37b for phase matching circuits corresponding to the filter chips 33a and 33b are formed. Each end thereof is connected to the common terminal pattern 37c.

Description

Splitter and manufacturing method

1 is a block diagram of a first embodiment of the present invention.

FIG. 2 is a circuit diagram of an example of the splitter of FIG. 1. FIG.

3 is a characteristic diagram for explaining the branching device of FIG.

4 is a manufacturing process diagram of the present invention.

5 is a graph showing the frequency characteristics of the splitter according to the first embodiment.

6 is a perspective view of a second embodiment of the present invention.

7 is a graph showing the frequency characteristics of the splitter according to the second embodiment.

8 is a cross-sectional view of a third embodiment of the present invention.

9 is a cross-sectional view of a fourth embodiment of the present invention.

10 is a bottom view of a fourth embodiment of the present invention.

11 is a perspective view of a fourth embodiment of the present invention.

12 is a graph showing the frequency characteristics of the splitter according to the fourth embodiment.

13 is a cross-sectional view of a fifth embodiment of the present invention.

14 is a perspective view of a fifth embodiment of the present invention.

FIG. 15 is a graph showing the frequency characteristics of the splitter according to the fifth embodiment. FIG.

16 is a cross-sectional view of a sixth embodiment of the present invention.

17 is a perspective view of a sixth embodiment of the present invention.

18 is a block diagram of a conventional splitter.

The present invention relates to a splitter using an elastic surface and a bandpass filter.

In recent years, the miniaturization of mobile communication devices such as portable telephones has been rapidly progressed, and small size and high performance of components used in these devices are desired, and these are used for branching and generation of signals of wireless communication devices. Doing. Many of the splitters are composed of band pass filters using dielectrics, band stop filters, or a combination thereof. Currently, the use of surface acoustic wave filters is being researched and developed.

Conventionally, when a splitter is constructed using two band pass surface wave filter chips (each band center frequency is set to f ₁ and f ₂ ), each chip has a phase so as not to interfere with each other's filter characteristics. A matching circuit is required, the constant of which is determined by the center frequency of the two filter chips and their difference. These can be made compact by accommodating them in a multilayer ceramic package.

18 shows a configuration diagram of a conventional splitter. 18 (a) is a perspective view, FIG. 18 (b) is an internal plan view, and FIG. 18 (c) is a sectional view.

In the splitter 11 shown in Figs. 18A to 18C, two phase matching lines 13a and 13b are interposed between predetermined green sheets 12 among the plurality of green sheets 12 in which the ground layer GND is formed. A ground signal terminal 15, a filter side signal terminal 16, and a common side signal terminal 17 are formed in the periphery of the filter chip 14a, 14b interposed therebetween. Ceramic package 18 is formed. The receiving terminal 19, the transmitting terminal 20, and the antenna terminal 21 are formed from the lower surface and the lower surface of the multilayer ceramic package 18.

The filter chips 14a and 14b are mounted on the upper layer of the multilayer ceramic package 18, and the corresponding ground signal terminal 15, filter side signal terminal 16, common side signal terminal 17 and wire ( 22) electrical connection is made. The upper opening portion is sealed with a metal cap 23.

The filter chips 14a and 14b also have different center frequencies. In addition, the phase matching lines 13a and 13b are formed by strip lines, and are formed simultaneously when the multilayer ceramic package 18 is formed. By providing the phase matching lines 13a and 13b in the multilayer ceramic package 18, the dielectric constant in the package can be used, so that the length of the line can be shortened and the package can be made small.

In the splitter 11, the characteristics of the filter chips 14a and 14b having two different center frequencies are influenced by the circuit patterns of the phase matching lines 13a and 13b. For example, the filter should be almost equivalent to the external circuit in the passband and much less or larger than the external circuit in the stopband, so that these characteristics should not be degraded. Therefore, in each pass band, it is ideal that the impedance of the other end is infinite and the reflection coefficient is almost one.

In order to have these characteristics, a phase matching circuit is required, which is actually formed of a strip line and controlled using the characteristics. In addition, when the phase matching circuit is formed in a strip line pattern, the resistance also increases in proportion to the line length, which tends to increase the propagation loss in the signal loss or distribution constant. As the stray capacitance is affected by the phase circuit constant and the like, the higher the frequency used and the higher the dielectric constant of the package material, the larger the ratio becomes. In order to solve this problem, a method of forming a low resistance conductor on a material having a low dielectric constant, for example, by forming a copper conductor pattern on a glass ceramic material is known.

However, forming copper conductor patterns of low-resistance conductors on glass ceramic materials of low dielectric constant improves device characteristics, but the strength of glass ceramic itself and the adhesion to conductors become poor, resulting in lack of reliability in use. there is a problem.

Therefore, when alumina ceramics material is used and tungsten is used as the conductor material, there is a problem that loss due to conductor resistance and deterioration of characteristics due to stray capacitance occur as described above.

Accordingly, the present invention has been made in view of the above problems, and provides a splitter that improves the characteristics of the conductor material, enables the combination of several kinds of frequency characteristics in the same package, and improves the directional freedom of the device. For the purpose of

The above problems can be solved by taking the following means.

In the invention of claim 1, a multi-package splitter having a predetermined number of surface acoustic wave filter chips each having a different band center frequency, and having a phase matching circuit between the filter chips, the surface layer of the multi-layer package. The pattern for the phase matching circuit is formed.

In the invention of claim 2, in the splitter according to claim 1, the pattern for the phase matching circuit is formed as a micro strip line.

In the invention according to Claim 3, the pattern for phase matching circuit is formed of a layer including the same member in the splitter according to Claim 1 or 2 above.

The invention according to claim 4 is characterized in that the grounding layer is formed by interposing a void portion on the pattern for the phase matching circuit in the shunt according to any one of claims 1 to 3 above.

In the invention of claim 5, in the frequency divider according to claim 1 to 4, a predetermined number of external connection terminals for external connection are formed on the lowermost layer of the multilayer package, and the phase matching circuit It is connected to each common terminal of a pattern, It is characterized by connecting to the said predetermined external connection terminal.

In the invention according to claim 6, in the shunt according to any one of claims 1 to 5, the pattern for phase matching is characterized in that a predetermined number of adjustment patterns to be connected for adjustment of line length are formed. .

According to a seventh aspect of the present invention, there is provided a method for manufacturing a multi-package splitter having a predetermined number of surface acoustic wave filter chips each having a different band center frequency, and having a phase matching circuit between the filter chips. Forming a green sheet; forming a predetermined pattern on the green sheets; and forming openings as necessary; laminating and firing the green sheets; After forming a pattern film on the upper surface, forming a predetermined number of patterns for the phase matching circuit by etching, separating the individual film into individual multilayer packages, and forming terminals for external connection. And mounting the filter chip to make an electrical connection and sealing by the lid portion.

In the invention according to claim 8, a filter chip with a predetermined number of elastic surfaces each having a different band center frequency, the filter chip is mounted on a chip mounting surface, and a junction terminal with an external circuit is formed at the bottom layer. Further, in the splitter having a package having a phase matching circuit between the filter chips, the phase matching circuit is formed between the chip mounting surface and the junction terminal.

In the invention of claim 9, in the splitter according to claim 8, the pattern for the phase matching circuit is formed as a micro strip line.

In the invention of claim 10, in the spectrometer according to claim 8 or 9, the pattern for the abnormal matching circuit is formed of a layer including the copper member.

In the invention according to claim 11, the common grounding pattern is formed between the chip mounting surface and the joining terminal in any one of the sub-parameters according to any one of claims 8 to 10.

According to a twelfth aspect of the present invention, in any one of the above-mentioned separators of any one of claims 8 to 1, an antenna terminal pattern connected to the filter chip is formed in the multilayer package.

Each of the above means functions as follows.

According to the invention of Claims 1 to 3, the pattern for phase matching formed by the micro strip line on the surface layer of the multilayer package is formed by the layer including the copper member. As a result, the pattern for the phase matching circuit can be formed by the low resistance conductor, the deterioration of the reflection coefficient due to the stray capacitance can be improved, and the deterioration of the loss of filter characteristics can be suppressed and reduced.

According to the invention of claim 4, a ground layer is provided on the pattern for the phase matching circuit with a gap therebetween. As a result, the influence from the outside such as the characteristic impedance value can be reduced, and the stabilization of the branching characteristic can be achieved.

According to the invention of claim 5 or 6, the pattern for the phase matching circuit in which a predetermined number of adjustment patterns for adjusting the line length is formed is connected to the common terminal by connecting to the common terminal. As a result, the degree of freedom of directionality of the external connection terminals to be formed is increased, and the length of the line can be easily adjusted, so that the package can be shared and the degree of directional freedom of the device can be improved.

According to the seventh aspect of the present invention, after laminating and firing a green sheet having a predetermined pattern or the like, a pattern for a phase matching circuit is formed on the surface layer. As a result, a pattern for the phase matching circuit is formed in a separate step of forming the green sheet, so that the conductor material can be selected regardless of the firing temperature of the green sheet.

According to the inventions of Claims 8 to 10, similarly to the effects of the inventions of Claims 1 to 3, a pattern for a phase matching circuit formed by microstrip lines on the surface layer of the multilayer package is formed by the filling containing the eastern material. As a result, the pattern for the phase matching circuit can be formed by the low resistance conductor, the deterioration of the reflection coefficient due to the stray capacitance can be improved, and the loss deterioration of the filter characteristics can be suppressed and reduced.

Further, in the invention according to the present invention, since the pattern for the phase matching circuit is opposed to the substrate on the mounting side in the mounted state, radiation to the outside can be suppressed.

According to the invention of claim 11, by forming a common grounding pattern between the chip mounting surface and the junction terminals disposed on the lowermost layer, the wiring (casting) formed on the outer surface of the package between the common grounding pattern and the junction terminals is shortened. You can do it. As a result, the inductance component due to the cast can be reduced, and the out-of-band attenuation characteristics can be improved.

According to the invention of claim 12, by forming the antenna terminal pattern connected to the filter chip inside the multilayer package, it is possible to reduce the leakage of signals from the antenna terminal pattern to the outside.

EXAMPLE

EMBODIMENT OF THE INVENTION Next, the Example of this invention is described with drawing.

1 is a block diagram of a first embodiment of the present invention. FIG. 1 (a) is an overall perspective view of the splitter 31, and FIG. 1 (b) is a longitudinal sectional view. FIG. 1 (a), a duplexer 31 shown in (b) is, for example, a multi-layer ceramic package 32 is formed by four layers (32 ₁ ~32 _4).

The ground GND pattern is formed on the lower surface of the layers 32 _{1 to} 32 ₃ of the multilayer ceramic package 32, and the signal (including a power system) pattern is formed on the lower surface of the layer 32 ₂ . In addition, the layers 32 _{1 to} 32 ₄ are formed with openings for forming cavities for storing the filter chips 33a and 33b passing through the surface acoustic wave. In addition, the frequency characteristics of the filter chips 33a and 33b are explained in FIG.

In this way the two filter chips (33a, 33b) mounted on the lower face of the layer (32 ₁₎ is connected to a signal pattern of each layer (32 ₂₎ by a wire (34). It is also sealed by the cap 34 so as to close the opening of the layer 32 ₃ .

And multi-layer ceramic package 32 and is conducted by the through-hole between certain of the layers (32 ₁ ~32 _4), the external connection terminals on the bottom surface of the predetermined side and a bottom layer (32 ₄₎ of the multi-layer package 32, 36a to 36c are provided. For example, the external connection terminal 36a is a reception terminal connected to the filter chip 33a, the external connection terminal 36b is a transmission terminal connected to the filter chip 33b, and the external connection terminal 36c is a common terminal described later. Antenna terminal connected with

On the other hand, on the upper surface of the uppermost layer 32 ₁ , as shown in FIG. For example, it is formed of a copper member, one end of each of the patterns 37a and 37b is connected to the common terminal pattern 37c, and the other end thereof is connected to the filter chips 33a and 33b by through holes. The common terminal pattern 37c is connected to the receiving terminal 36a formed on the side of the multilayer package 32 as described above.

Here, FIG. 2 shows a circuit diagram of an example of the splitter of FIG. Moreover, the characteristic diagram for demonstrating the denominator of FIG. 1 is shown in FIG. As shown in FIG. 2, two filter chips F ₁ are provided through the phase matching circuits 37a and 37b for the common terminals T ₁ and T ₂ (common terminal pattern 37c) connected to the antenna terminal 36c, respectively. , F ₂ (33a, 33b) are connected. The receiving terminal 36a is connected to the terminal A ₁ or the terminal B ₁ . The transmission terminal 36b is connected to a terminal A ₂ or a terminal B ₂ . Terminals A ₁ and A ₂ are provided in filter chip F ₁ , and terminals B ₁ and B ₂ are provided in filter chip F ₂ .

The filter chips F ₁ and F ₂ (33a, 33b) have different band center frequencies as shown in FIG. 3, for example, the center frequency (f ₁ ) of the filter chip F ₁ (33a) is 836 MHz, the filter The center frequency f ₂ of chip F ₂ 33b is set to 881 MHz.

4, the manufacturing process diagram of this invention is shown. In FIG. ₄ , green sheets to be the layers 32 _{1 to} 32 4 of FIG. 1 are first formed as many as necessary (step S1). The green sheet refers to, for example, a plastic sheet material before sintering formed of an alumina material having a dielectric constant of 9.7. Patterns such as signal system, power system, ground system, etc. are formed in each of the green sheets, and openings for forming the cavity of the area where the filter chips 33a, 33b are mounted are formed as necessary (S2). ).

Subsequently, the formed green sheet is laminated and baked, for example, at 1500-1600 degreeC for 15 to 24 hours (S3). In this state, a plurality of multilayer ceramic packages are integrally formed. Thus, a pattern film is formed on the upper layer by, e.g., deposition of copper material (S4). When the pattern film is formed, a predetermined number of patterns 37a and 37b and the common terminal pattern 37c for the phase-matching circuit of the sinusoidal shape shown in FIG. 1 are formed by etching (S5). Thereafter, the respective multilayer ceramic packages 32 are cut and separated (S6).

The external connection terminals 36a to 36b are formed for each of the multilayer ceramic packages 32 from the lower surface to the side surface thereof, and then the filter mouths 33a and 33b are mounted to be connected by the wires 34 and the cap 35 is formed. It is sealed with (S7).

Thus, the formation of the multilayer ceramic package 32 and the formation of the patterns 37a and 37b for the phase matching circuit are separated, so that the materials for forming the patterns 37a and 37b can be different, so that the members with low resistance For example, a multilayer structure of copper, copper, nickel, or aluminum can be used, the length can be shortened due to the reduction of loss, and the filter characteristics can be improved.

Next, Fig. 5 shows a graph of the frequency characteristics of this embodiment. FIG. 5 (a) is a graph of the entire frequency characteristic, and FIG. 5 (b) is a graph in which the loss change of FIG. 5 (a) is partially enlarged. The frequency characteristics shown in Figs. 5 (a) and 5 (b) are, for example, a line width of the pattern 37a for the phase matching circuit being formed at about 200 mu m and a length of about 40 mm, and the line width of the pattern 37b is formed. Loss of the patterns 37a and 37b of the splitter 31 (the dielectric constant of the multilayer ceramic package layer 32 ₁ is 9.7) when formed at about 200 mu m and length of about 35 mm, and the splitter 31 Shows the change in the loss of the other passband when a low duplexer (transformer) is formed.

As shown in Fig. 5 (a), the filter chip F ₁ (33a) showed attenuation of -2.19 dB at 824 MHz and -2.70 dB at 849 MHz, -41.80 dB at 869 MHz, and -28.30 attenuation at 894 MHz. The filter chip F ₂ (33b) showed attenuation of -3.78dB at 869MHz and -3.12dB at 894MHz, -42.84dB at 824MHz, and -34.94 at 849MHz.

FIG. 5B shows the inner layer formed by the combination of the alumina ceramic material and the tungsten conductor pattern in the conventional case shown in FIG. 18 (solid line), and the upper patterns 37a and 37b shown in FIG. Compare the combination of alumina ceramic material and tungsten conductor pattern (broken line) with the combination of alumina ceramic material and copper conductor pattern (single dashed line) in the configuration of upper patterns 37a and 37b shown in FIG. It is.

In other words, even when the alumina ceramic material and the tungsten conductor pattern are combined, the filter characteristic is good because the amount of attenuation in the center frequency band is smaller in the case of the upper portion of FIG. 18 than in the conventional inner layer (solid line) of FIG. In addition, in the case where the copper conductor pattern is formed on the upper portion instead of the tungsten conductor pattern (dotted and dashed line), the attenuation amount is reduced due to the reduction of the high frequency loss caused by the reduction of the DC resistance, thereby improving the filter characteristics.

Thus, by forming a pattern for a phase matching circuit on the upper part of the multilayer ceramic package 32 with a low resistance member such as copper, the loss deterioration of the filter characteristics due to the resistance of the pattern is reduced to about half of the conventional one. The deterioration of the reflection coefficient due to the stray capacitance can be improved, and the deterioration of the filter characteristics in the circuit configuration of the splitter 31 can be suppressed. In addition, since the common terminal pattern 37c can be connected to the external connection terminal (antenna terminal) 36c from both sides of the multilayer ceramic package 32, the independent terminals (transmission and reception terminals) at the time of designing the board mounting the offset The degree of freedom of directionality can be increased.

However, if the pattern for the phase matching circuit is layered as in the prior art (Fig. 18), the dielectric constants on both sides (up and down) of the multilayer ceramic package 32 can be used, thereby shortening the line length of the pattern and miniaturizing the package. On the other hand, the present invention can use only the dielectric constant of one side (lower side) of the multilayer ceramic package 32, so that the length of the line needs to be increased, but the material of the patterns 37a and 37b can be formed of a low resistance material. The length can be shortened than before.

Next, Fig. 6 shows a perspective view of a second embodiment of the present invention. The splitter 31 shown in FIG. 6 has, for example, five adjustment patterns separated from each other for adjusting the line length at the end portion of the pattern 37a for the phase matching circuit on the upper layer of the multilayer ceramic package 32 ( 41a) (41a ₁ ~41a ₅₎ are formed. Further, for example, five adjustment patterns 41b (41b _{1 to} 41b ₅ ), which are separated from each other for adjusting the line length, are formed at the end portion of the pattern 37b.

After the line length is determined, the adjustment pattern 41a ₅ and the common terminal pattern 37c are connected by the wire 42 in the pattern 37a. In the pattern 37b, the adjustment pattern 41b ₃ and the common terminal pattern 37c are connected by the wire 42, and the adjustment patterns 41b ₃ and 41b ₅ are connected by the wire 42.

Such adjustment patterns 41a and 41b are formed at the time of formation of the patterns 37a and 37b and adjust the line lengths of the patterns 37a and 37b at the connection position by the wire 42.

7 shows a graph of the frequency characteristics of the second embodiment. In FIG. 7, the pattern 37a for the phase matching circuit when the center frequency of the filter chip 33a (F ₁ ) is set to 875 MHz is selected from the adjustment patterns 41a (41a _{1 to} 41a ₅ ) and the wire 42 is used. ), The frequency characteristic of the splitter 31 in the case of being connected to is indicated by F ₁ , and the pattern 37b when the center frequency of the filter chip 33b (F ₂ ) is set to 937 MHz is used as the adjustment pattern 41b ( 41b _{1 to} 41b ₅ , the frequency characteristic of the splitter 31 when connected to the wire 42 is represented by F ₂ . In any case, it is possible to achieve a significant decrease in the amount of attenuation (3 dB) in the center frequency band, and it can be seen that the same effect as in the first embodiment can be obtained. As a result, filter chips having different frequencies can be combined without changing the multilayer ceramic package 32.

6 shows a case in which the adjustment patterns 41a and 41b are formed separately, but it is also possible to form a pattern in which the adjustment patterns 41a and 41b are separated and vary the length of the line only by the bonding position of the wire 42. However, in the present embodiment, the shape is separated in order to avoid the adverse effect on the phase matching in the unnecessary adjustment pattern portion. Therefore, when the line length of the adjustment pattern 41a, 41b to be formed is short, and a bad influence does not occur in phase matching in an unnecessary part, it is not necessary to make it into the pattern isolate | separated.

In addition, patterns 37a and 37b for phase matching circuits are formed as shown in FIG. 1, and a predetermined number of patterns for bypassing the sinusoidal shapes of the patterns 37a and 37b are formed as adjustment patterns. By deleting the path portion by trimming, the line lengths of the patterns 37a and 37b can be adjusted.

Next, Fig. 8 shows a cross sectional view of the third embodiment of the present invention. The splitter 31 shown in FIG. 8 is provided with a shield cap 52 as a grounding layer via spacers 51 on the upper layer of the multilayer ceramic package 32 shown in FIG. Is the same as FIG. 1 (or 6). That is, the shield cap 5 is provided on the patterns 37a and 37b for the phase matching circuit with the gaps 53 interposed therebetween by the spacers 51.

According to this, the shield cap 52 can avoid the influences of the patterns 37a and 37b for the phase matching circuit from the external situation, and can also be used in the second embodiment (FIG. 6). 42) can be protected.

Next, FIGS. 9 to 11 show a fourth embodiment of the present invention. 9 is a cross-sectional view of the splitter 61 according to the fourth embodiment, FIG. 10 is a bottom view of the splitter 61, and FIG. 11 is a perspective view of the splitter 61.

The splitter 61 is composed of, for example, a multilayer ceramic package 62 formed of four layers 62 _{1 to} 62 ₄ , filter chips 33a and 33b, a cap 35, and the like. On the lower surface of the lowermost layer _{6 4} of the multilayer ceramic package 62, as shown in FIG. 10, a receiving terminal 66a, a transmitting terminal 66b, an antenna terminal 66c, and a ground (ground) terminal 66d. ) Is formed.

Each of the terminals 66a to 66d is formed in the multilayer ceramic package 62 by the wirings 66a- _{1 to} 66d- ₁ (hereinafter referred to as casting) formed on the side of the multilayer ceramic package 62 shown in FIG. It is electrically connected with the filter chips 33a, 33b etc. which were arrange | positioned. In addition, each terminal (66a~66d) formed in the lowermost one (62 ₄₎ is mounted at the junction corresponding to the terminal, and a duplexer (61) according to claim 8 in a different circuit board, the respective terminal (66a~66d ) Is bonded to another circuit board.

In the top layer (62 ₁₎ and second layer (62 ₂₎ has an opening for forming the cavity 64 of the first for receiving the filter chips (33a, 33b) of the resilient surface and the passage is formed. The filter chips 33a and 33b are mounted on the chip mounting surface 63 formed on the upper part of the third layer 6 2 ₃ , so that the filter chips 33a and 33b cooperate with the layers 62 ₁ and 62 ₂ . It is located in the cavity 64 to form.

In addition, the second and the predetermined signal pattern and a ground pattern the top surface of the second layer (62 ₂₎ are formed, each pattern is connected to the above-illustration cast (66a _-1 ~66d _-1). The signal pattern and the ground pattern formed on the upper surface of the second layer 6 2 ₂ are electrically connected to the filter chips 33a and 33b by the wires 34. As a result, the filter chips 33a and 33b and the terminals 66a to 66d are electrically connected.

The cap 35 is disposed on top of the top layer 62 ₁ to block the first cavity 64 formed in the multilayer ceramic package 62. As a result, the filter chips 33a and 33b are hermetically sealed in the multilayer ceramic package 62.

The bottom layer (62 _4), an opening is also formed, and thus the form of the second cavity 67 of the bottom surface of the third layer (62 ₃₎ and the bottom layer (62 ₄₎ cooperate to multi-layer ceramic package 62. In the cavity 67 of a second, specifically speaking, the lower face of the third layer (62 ₃₎ exposed in the cavity 67 of the second, the pattern 68 for the phase matching circuit in a serpentine shape forming It is. The pattern 68 for the phase matching circuit is formed of microstrip lines, and as the material, for example, a conductive material is mainly selected from copper or copper. One end of the pattern 68 for the phase matching circuit is at the same time as access to the filter chips (33a, 33b) by the through hole 69, the other end of the wiring formed on the third layer (62 ₃₎ (not shown) It is connected to the antenna terminal 66c via this.

Note that the formation position of the pattern 68 for the phase matching circuit is described below. In the splitter 61 according to the present embodiment, the pattern 68 for the phase matching circuit is formed on the bottom of the multilayer ceramic package 62. It is formed in the cavity 67 of the. Therefore, when the splitter 61 is mounted on another circuit board, the pattern 68 for the phase matching circuit is opposed to the board on the mounting side, so that radiation to the outside can be suppressed.

12 shows a graph of frequency characteristics according to the present embodiment. The frequency characteristic shown in FIG. 12 shows the result of the characteristic test under the same conditions as FIG. That is, the frequency characteristic shown in FIG. 12 is, for example, the splitter 61 (made of the multilayer ceramic package) when the line width of the pattern 68 for the phase matching circuit is formed to be about 200 µm and the length is about 25 mm. The dielectric constant of the third layer 32 ₃ represents the loss of the pattern 68 for the phase matching circuit of 9.7) and the change in the loss of the other pass when constructing the duplexer (transformer) with the splitter 61.

Comparing FIG. 12 and FIG. 5 (a), the frequency characteristic of the splitter 61 according to the present embodiment is almost the same as the frequency characteristic of the splitter 31 according to the first embodiment shown in FIG. It shows that the characteristic is equivalent, and thus, good filter characteristics can be obtained.

As described above, in the splitter 61 according to the present embodiment, the pattern 68 for the phase matching circuit is formed of a low resistance member such as copper, so that the deterioration of the loss of filter characteristics due to the resistance of the pattern 68 is prevented. It can be reduced to about half of the related art, and the deterioration of the reflection coefficient due to the stray capacitance can be improved, and the deterioration of the filter characteristics in the circuit configuration of the splitter 31 can be suppressed.

In addition, even in the configuration of the present embodiment, since the antenna terminal 66c can be pulled out on both sides of the multilayer ceramic package 62, the degree of freedom in the directionality of the independent terminals at the time of design can be increased. As described above, in the splitter 61 according to the present embodiment, since the pattern 68 for the phase matching circuit faces the substrate on the mounting side in the mounted state, radiation to the outside can be suppressed. have.

Also in this embodiment, as shown in FIG. 6, the pattern 68 for phase matching circuits can be separated, and the pattern 68 for phase matching circuits is formed in a pattern that does not separate, and the bonding position of the wires is formed. It is possible to vary the length of the track alone.

In addition, the pattern 68 for the phase matching circuit is formed as shown in FIG. 1A, and the sinusoidal shape of each pattern (corresponding to the patterns 37a and 37b of FIG. 1A) is formed. The line length of each pattern can also be adjusted by forming a predetermined number using the pattern to pass as a pattern for adjustment, and deleting a bypass part by trimming as needed.

Next, FIGS. 13 and 14 show a fifth embodiment of the present invention. 13 is a cross-sectional view of the splitter 71 according to the fifth embodiment, and FIG. 14 is a perspective view of the splitter 71. The same components as those of the splitter 61 according to the fourth embodiment described with reference to FIGS. 9 and 11 in FIGS. 13 and 14 are denoted by the same reference numerals, and description thereof will be omitted.

In the splitter 71 according to the present embodiment, the common grounding pattern is formed between the chip mounting surface 63 and the formation positions of the terminals 66a to 66d in the height direction in the splitter 61 according to the fourth embodiment. It is characterized by forming 72.

Specifically, in this embodiment, the third layer (62 ₃₎ to the second partition, the common ground patterns between the formation position of the chip-mounting surface 63 and the respective terminal (66a~66d) by forming a conductor film therebetween ( A configuration for forming 72 is realized.

The common grounding pattern 72 is connected to the casting 66d- ₁ shown in FIG. 14, and therefore the common grounding pattern 72 is formed on the bottom surface through the cast facet 66d- ₁ . The structure is connected to the ground terminal 66d.

By setting the splitter 71 in the above configuration, the common grounding pattern 68 and the ground terminal 66d are connected to each other so that the cast 66d- ₁ formed on the outer surface of the multilayer ceramic package 62 can be shortened. (See Figure 14). Thus, by being cast illustration (66d _-1) it is short it is possible to reduce the inductance component of the cast illustration (66d _-1).

FIG. 15 is a diagram showing the attenuation characteristics (denoted by? In the drawing) of the splitter 71 according to the present embodiment while comparing with the characteristics (denoted by? In the drawing) of the conventional splitter. As shown in FIG. 15, the attenuation characteristic of the splitter 71 according to the present embodiment is particularly excellent in the out-of-band attenuation characteristic, and therefore, the out-of-band attenuation characteristic is particularly improved in the splitter 71 according to the present embodiment. It can be planned.

Next, FIGS. 16 and 17 show a sixth embodiment of the present invention. 16 is a cross-sectional view of the splitter 81 according to the sixth embodiment, and FIG. 17 is a perspective view of the splitter 81. In addition, in FIG. 16 and FIG. 17, the same code | symbol is attached | subjected about the same structure as the splitter 61 which concerns on 4th Example demonstrated using FIGS. 9-11, and the description is abbreviate | omitted.

In the splitter 81 according to the present embodiment, an antenna terminal pattern 82 connected to the filter chips 33a and 33b is formed in the multilayer ceramic package 62 in the splitter 61 according to the fourth embodiment. It is characterized by one.

Specifically, the by forming the antenna terminal pattern 82, between the upper surface of the lower and the third layer (62 ₃₎ of the second layer (62 ₂₎ in the example a duplexer 81 of this embodiment, the antenna terminal patterns 82 The structure formed in the multilayer ceramic package 62 is taken. Both ends of the antenna terminal pattern 82 are connected to a pair of castings 66c- ₁ formed on the side surface of the multilayer ceramic package 62 as shown in FIG.

By setting the splitter 81 in the above configuration, it is possible to reduce the leakage of signals from the antenna terminal pattern 82 to the outside. In other words, in the configuration in which the common terminal pattern 37c, which can be used as the antenna terminal pattern, is exposed on the upper surface of the multilayer ceramic package 32, as in the splitter 31 according to the first embodiment described with reference to FIG. There is a possibility that a signal leaks from the common terminal pattern 37c. However, by forming the antenna terminal pattern 82 inside the multilayer ceramic package 62 as in the present embodiment, the multilayer ceramic package 62 exhibits a shielding function, so that a signal leaks out from the antenna terminal pattern 82 to the outside. You can alleviate doing.

As mentioned above, according to invention of Claims 1-3, the pattern for phase matching formed by the micro strip line in the layer of the surface of a multilayer package is formed by the layer containing the copper member. As a result, the pattern for the phase matching circuit can be formed by the low resistance conductor, the deterioration of the reflection coefficient due to the stray capacitance can be improved, and the deterioration of the solsil of the filter characteristic can be suppressed and reduced.

According to the invention of claim 4, a ground layer is provided on the pattern for the phase matching circuit with a gap therebetween. As a result, the influence from the outside such as the characteristic impedance value is reduced, and stabilization of the branching characteristic can be achieved.

Further, according to the invention of claim 5 or 6, a pattern for a phase matching circuit in which a predetermined number of adjustment patterns for adjusting the line length is formed is connected to a common terminal and connected to an external connection terminal. As a result, the degree of freedom of directionality of the external connection terminals to be formed is increased, and the length of the line can be easily adjusted, so that the package can be shared and the degree of freedom of direction of the device can be improved.

According to the seventh aspect of the present invention, after laminating and firing a green sheet having a predetermined pattern or the like, a pattern for a phase matching circuit is formed in the surface layer. As a result, a pattern for a phase matching circuit is formed in a separate process from forming the green sheet, so that the conductor material can be selected regardless of the firing temperature of the green sheet.

According to the inventions of Claims 8 to 10, similar to the operation of the inventions of Claims 1 to 3, the deterioration of the reflection coefficient due to the stray capacitance can be improved, and the deterioration of the loss of filter characteristics can be suppressed and reduced, and the mounted state. Since the pattern for the phase matching circuit is opposed to the substrate on the mounting side, radiation to the outside can be suppressed.

According to the invention of claim 11, the wiring (casting) formed on the outer surface of the package between the common grounding pattern and the junction terminal can be shortened, thereby making it possible to reduce the inductance component due to the casting. The out of band attenuation characteristic can be improved.

According to the invention of claim 12, by forming the antenna terminal pattern connected to the filter chip inside the multilayer package, it is possible to reduce the leakage of signals from the antenna terminal pattern to the outside.

Claims (11)

① a multi-layer package formed by alumina ceramic (analumina-ceramic), A predetermined number of surface-acoustic-wave band pass filter chips each having a different band center frequency and mounted on an interior side of the multilayer package; A cap mounted on the multilayer package; (4) connecting the surface acoustic wave bandpass filter chips and including phase matching circuit patterns formed on an exterior surface layer of the multilayer package, wherein the cap and the multilayer package And the multi-layer comprises at least a layer on which the chip is mounted and a layer on which the chip is housed. The splitter according to claim 1, wherein the pattern for the phase matching circuit is formed as a micro strip line. The splitter according to claim 1 or 2, wherein the pattern for the phase matching circuit is formed of a layer including the copper member. The splitter according to claim 1 or 2, wherein a ground layer is formed by interposing a void portion (53) in the pattern matching circuit term. A predetermined number of external connection terminals 36a to 36c for external low speed are formed in the lowermost layer 3 ₄ of the multi-layer package 32, and the pattern 37a for phase matching circuits is formed. And 37b) are connected to a common terminal (37c) and to the predetermined external connection terminal. The splitter according to claim 1 or 2, wherein the pattern for phase matching is provided with a predetermined number of adjustment patterns (41a, 41b) connected for adjustment of line length. ① a predetermined number of surface acoustic wave band pass filter chips each having a different band center frequency, A multilayer package having the predetermined number of filter chips mounted on a chip mounting surface, the multilayer package having terminals for connection with an external circuit formed at its bottom; A pattern for a phase matching circuit connecting the surface acoustic wave band pass filter chips; The pattern for the phase matching circuit is formed on an outer surface of the multilayer capacitor, and the outer surface of the multilayer package is disposed between the chip mounting surface and the terminal, and the multi-layer comprises at least a chip. A splitter comprising a mounting layer and a layer for storing chips. 8. The splitter according to claim 7, wherein the pattern for the phase matching circuit is formed as a micro strip line. The splitter according to claim 7 or 8, wherein the pattern for the phase matching circuit is formed of a layer including the copper member. The splitter according to claim 7 or 8, wherein a common grounding pattern (72) is formed between the chip mounting surface (63) and the junction terminals (66a to 66d). The splitter according to claim 7 or 8, wherein an antenna terminal pattern (82) connected to said filter chip (33a, 33b) is formed inside said multilayer package (62).