KR0135404B1 - Monolithic crystal oscillator - Google Patents

Abstract

In a state where both ends of the crystal piece are held, firstly, a multi-mode crystal oscillator for surface mounting is provided, which maintains good frequency temperature characteristics and secondly improves impact resistance.

An input / output electrode is formed on one main surface of the crystal piece, and a common electrode is formed on the other main surface. The lead electrode is extended from the input / output electrode, and connection term electrode lands are provided at the outer periphery of both ends, and the electrode land is attached to the conductive adhesive. In the multi-mode crystal oscillator which is fixed by holding the outer periphery of both ends of the crystal piece, firstly, the lead electrode and the electrode land are formed of another metal and overlap with each other, and at least one of the lead electrode and the electrode land is moved to A1. Secondly, the conductive adhesive is provided on both sides of each electrode land and is located in the electrode land on one side of each electrode land, and on the other side of the electrode land and the crystal piece so that the crystal piece is placed on the substrate. It shall be fixed to.

Description

Multimode Crystal Oscillator

1 is a cross-sectional view of a multi-mode oscillator illustrating a conventional example,

2 (a) is a drawing of one main surface of a crystal piece for explaining a conventional example,

2 (b) is a view of the other main surface of the crystal piece for explaining the conventional example,

3 is a plan view of a substrate for explaining a conventional example,

4 is a band characteristic diagram showing the amount of guaranteed attenuation of a multimode vibrator,

5 is a cross-sectional view of a multimode vibrator for explaining another example of the conventional example,

6 is a plan view of a crystal piece for explaining the application position of the adhesive of the prior art,

7 is a cross-sectional view of a multimode vibrator for explaining an embodiment of the present invention;

8 is a band characteristic diagram showing the amount of guaranteed attenuation for explaining the effect of the embodiment of the present invention.

9 is a characteristic diagram of the guaranteed attenuation for the electrode gap (G) illustrating the operation and effect of an embodiment of the present invention, where (a) is a center frequency of 22 MHz, (b) is 45 MHz, and (c) is 90 MHz ego,

10 is a schematic diagram illustrating the operation and effect of the present invention, in which the electrode gap G approaches 25 μm or more,

11 is a schematic diagram illustrating the operation and effect of the present invention, in which the electrode interval G approaches within 25 μm,

12 is a view for explaining a second embodiment of the present invention, (a) is an electrode structure diagram (plan view) of one main surface of the crystal piece, (b) is a view of the other main surface,

13 is a view for explaining a second embodiment of the present invention, (a) is a holding structure diagram (side view) of a crystal piece, (b) is a view of one main surface of a crystal piece showing a coating position of an adhesive,

14 is a frequency temperature characteristic diagram illustrating the operational effects of the second embodiment of the present invention;

15 is a view for explaining another example of the second embodiment of the present invention, (a) is an electrode structure diagram of one main surface of the crystal piece, (b) is a view showing the application position of the adhesive,

16 is an electrode structure diagram of one main surface of a crystal piece for explaining another example of the second embodiment of the present invention;

17 is an electrode structure diagram of one main surface of a crystal piece for explaining another example of the second embodiment of the present invention;

18 is an electrode structure diagram of one main surface of a crystal piece for explaining another example of the second embodiment of the present invention;

19 is an electrode structure diagram of one main surface of a crystal piece for explaining another example of the second embodiment of the present invention;

20 is a view for explaining a third embodiment of the present invention, (a) is a plan view of a crystal piece in which the adhesive 17 is directly attached to both surfaces of one end of the crystal piece 1, and (b) shows the same crystal piece. (C) is a cross-sectional view of a crystal piece in which an electrode 23 is provided at one end of the crystal piece 1 and a conductive adhesive is attached to both ends thereof, and (d) shows the same crystal piece on a substrate. Section when adhered,

21 is a view for explaining a third embodiment of the present invention, (a) is an experimental result showing the distortion amount d (μm) of the crystal piece by the coating method of FIG. 10, and (b) is a Profile defining the distortion d,

FIG. 22 is a drawing of a quartz piece showing a third embodiment of the present invention, wherein (a) and (b) are both plan views of the crystal piece;

FIG. 23 is a diagram of a crystal piece showing a second embodiment of the present invention, in which both (a) and (b) are plan views of the crystal piece.

* Description of the symbols for the main parts of the drawings *

1 ..... revision, 2 ..... airtight container,

3 ..... Input electrode, 4 ..... Output electrode,

5 ..... common electrode, 6,7,8 ..... drawing electrode,

9 ..... main body, 10 ..... metal cover,

11 .... substrate, 12 ... border,

13 ..... welding ring, 14,15 ..... connection electrode,

16 ..... shielded electrode, 17 ..... conductive adhesive.

18 ..... terminal part, 19 ..... wire,

20 ..... conducting electrode, 21, 22 ..... electrode land,

23 ..... electrode.

The present invention is intended to use a multimode crystal oscillator (hereinafter referred to as a multimode oscillator) as an MCF (Monolithic Crystal Filter), and in particular, for surface mounting, to increase the amount of guaranteed attenuation and to improve electrical characteristics and impact resistance. A multimode oscillator.

The multi-mode oscillator is useful for communication equipment and the like by obtaining a predetermined filter characteristic (transmission characteristic) by using acoustic coupling between two pairs of electrode pairs formed on a crystal piece, for example. One such type is to increase the amount of guaranteed attenuation by reducing the leakage signal due to electrical coupling between the input and output electrodes. In recent years, multi-mode vibrators for surface-mounting, such as those represented by resistors or condensers, have been demanded (Ref. 60-118993, No. 63-273981, No. 1-83007, and No. Won 4-46008).

1 to 3 are diagrams of one embodiment illustrating such a multimode vibrator. FIG. 1 is a sectional view, FIG. 2 (a) and (b) are views showing the front and back surfaces of the crystal piece, and FIG. 3 is a plan view of the insulating substrate.

The multi-mode vibrator is formed by enclosing the crystal piece 1 into the hermetic container 2. The crystal piece 1 is made into, for example, an AT cut in the form of thickness slip vibration. Split input and output electrodes 3 and 4 are formed on one main surface 1a, and common electrodes 5 are formed on the other main surface 1b. In the input / output electrodes 3, 4 and the common electrode 5, the lead electrodes 6, 7, 8a, 8b are extended to the outer periphery of both ends. The sealed container 2 is formed by seam-welding the metal cover 10 to the container body 9 having a U-shaped laminated structure. However, the metal cover 10 is grounded to the reference potential. The container body 9 is composed of an insulating substrate 11, an insulating edge 12 (hereinafter referred to as a border) and a welding ring (13). The insulating substrate 11 has connection electrodes 14 and 15 for input and output at both ends, and a shield electrode 16 serving as a reference potential at the center portion. Each of these electrodes 14, 15, 16 extends to the outer surface of the container and becomes an external terminal for surface mounting. In addition, the connecting electrodes 14 and 15 are set larger than the thickness of the shield electrode 16. Then, one main surface 1a of the crystal piece 1 is held facing the insulating substrate 11. That is, the outer periphery of both ends where the input / output electrodes 3 and 4 are formed is fixed on the connection electrodes 14 and 15 with the conductive adhesive 17 to be electrically and mechanically connected. Further, the lead electrode 8 of the common electrode 5 of the other main surface 1b is connected to the terminal portion 18 of the shield electrode 16 by wire bonding (not shown).

In this case, since one main surface 1a of the crystal piece 1 is provided opposite to the shield electrode 16 of the insulating substrate 11, it is directly transmitted by electrical coupling between the input / output electrodes 3,4. The shielded leakage signal can be shielded to increase the amount of guaranteed attenuation. However, the guaranteed attenuation here indicates the attenuation amount (A dB) at the point obtained by subtracting 910 kHz from the center frequency fo as shown in FIG.

However, in the above structure, if the electrode gap G between the input / output electrode of the crystal piece 1 and the shield electrode 16 of the insulating substrate 11 is reduced, there is a problem that the amount of guaranteed attenuation decreases in contrary to the expectation. In addition, in Japanese Patent Application Laid-Open No. 4-46008, the existence of the electrode gap G that maximizes the guaranteed attenuation amount is disclosed. However, the effect of grounding the metal cover 10 to a reference potential has not been sufficiently disclosed.

In addition, in the multi-mode armature of the above configuration, the so-called end holding that fixes the outer periphery of both ends of the crystal piece 1 is assumed. For this reason, distortion and stress generate | occur | produce in the longitudinal direction especially of the crystal piece 1 by shrinkage force at the time of hardening of the adhesive agent 17. As shown in FIG. As a result, in particular, the deterioration of the frequency temperature characteristic is caused due to the stress sensitivity characteristic, so that both ends are difficult to be practically used. From this, generally, as shown in FIG. 6, it is considered to hold | maintain only one end part of the crystal piece 1, and to make the other end a free end, and to prevent stress generation in a longitudinal direction. However, even if the one end is held, if the entire area of one end is fixed as the application area of the adhesive 17 (stress is generated in the width direction in Fig. 6 (a), the crystal piece 1 is damaged.) In the case where only a part of the part is fixed by dropping (sixth copper (b)), the connection strength is insufficient, so that the crystal piece 1 is detached at the time of impact, resulting in breakage as described above. 6, 7) were installed in the width direction of the end portion, and both ends of the one end were considered as an application area (Fig. 6 (c)). However, in this case as well, both sides of the width direction were basically fixed. In particular, it is difficult to obtain sufficient impact resistance because distortion occurs in the width direction in the crystal piece 1. In addition, in the case of holding one end, the other end of the free end swings up and down as a result. Of the crystal (1) in that part There has been a problem of breakage, separation and disconnection of the bonding wire 19, or weakening the bonding strength of one end.

It is a first object of the present invention to provide a multi-mode oscillator which increases the guaranteed attenuation amount in a state where the relationship between the electrode gap and the guaranteed attenuation amount and the influence of the metal cover are made clear.

In addition, the present invention basically focuses on the fact that both ends of the holding can secure stable holding of the crystal piece and thus the impact resistance of the breakage can be improved. It is a second object to provide a mode oscillator.

Furthermore, the present invention provides a multi-mode vibrator that improves impact resistance without compromising electrical characteristics even with four-point holding in which both ends of each stage are kept dripping in the state of holding both ends. It is aimed at 3.

First embodiment

7 is a view for explaining an embodiment corresponding to the first object of the present invention, which is a cross-sectional view of a multi-mode crystal oscillator. In addition, the same code | symbol is attached | subjected to the same part as the said prior art figure, and the description is simplified. As described above, the multi-mode crystal oscillator has the input / output electrodes 3, 4, and the drawing electrodes 6, 7 on one main surface 1a, and the common electrode 5 and the drawing electrode on the other main surface 1b. A sealed container (2) consisting of a container body (9) and a metal cover (10) in which a crystal piece (1) having 8a and 8b formed thereon is laminated with an insulating substrate (11), an edge (12), and a welding ring (13). It is formed by enclosing in. One main surface 1a of the crystal piece 1 is held opposite to the shield electrode 16 of the insulating substrate 11 (see FIG. 1).

In this embodiment, the conducting electrode 20 is formed in the through-hole provided at the plural places of the edge 12 (so-called through hole) to electrically connect the terminal portion 18 and the welding ring 13 of the shield electrode 16. Connect with That is, the welding ring 13 and the metal cover 10 bonded to it are grounded with a reference potential (shield electrode). These are integrally formed at the time of firing the container body 9.

In this case, since the welding ring 13 and the metal cover 10 are grounded at the reference potential, the attenuation loss can be increased. 8 is a diagram showing this, where curve a is the present embodiment and curve b is ungrounded. However, the center frequency was set to about 22 MHz, and the electrode interval G was set to a constant value of 50 μm.

As is apparent from this figure, it is 68 dB for the present embodiment and 39 dB for the ungrounded, and the difference is about 29 dB. Therefore, it can be seen that the effect by the ground is very large. In the experiment, the same type of results were obtained even when the metal cover 10 was removed and only the welding ring 13 was grounded.

9 (a), (b) and (c) are diagrams illustrating the relationship between the electrode spacing (horizontal axis, μm) and the guaranteed attenuation amount (vertical axis, dB). FIG. 9 (a) is the center of the multimode vibrator. The frequency fo is about 22 MHz (the fundamental wave 0, FIG. 9 (b) is 45 MHz (the fundamental wave), and FIG. 9 (c) is 90 MHz (the third overtone). The gap (G) is the depth meter (DEPTH) manufactured by Japan Precision Optical Co., Ltd. HEIGHT MEASURING SCOPE MODEL-KY90).

As a result of these experiments, in either case, when the electrode gap G is sufficiently large (about 100 μm or more at 22 MHz), the value is almost constant. And peak value was reached in the vicinity of 25 micrometers in 15-50 micrometers, and it fell rapidly when it became below this. For example, in the case of 22 MHz (Fig. 9 (a)), the peak value is 80 dB or more, or less, about 80 dB at 45 MHz (Fig. 9 (b)) and 70 dB at 90 MHz (Fig. 9 (c)). It becomes In addition, when the electrode gap G at 22 MHz is 100 µm, which is sufficiently large, it can be seen that the difference between the peak value of 80 dB and 50 dB is about 30 dB. Further, as the center frequency increases, the electrode interval G for obtaining the peak value of the guaranteed attenuation amount increases slightly. Therefore, by setting the electrode interval G to the peak value of the guaranteed loss amount and its vicinity, the guaranteed loss amount can be increased by, for example, setting it between 15 to 40 µm.

When the present inventors considered the phenomenon with respect to this experimental result, it was estimated that it originates from the following. That is, as shown in FIG. 10, when the electrode gap G approaches the peak value, for example, approaching 25 μm or more, a leakage signal due to electrical coupling (capacity C ₁ ) between the input / output electrodes 3 and 4. P ₁ flows into (intakes into) the shield electrode 16 and flows out at the reference potential. Accordingly, the gap between the input / output electrodes 3, 4 is shielded, and the amount of guaranteed attenuation increases. Next, as shown in FIG. 11, when the electrode gap G approaches within 25 mu m, the capacitors C _{2 and} C ₃ are generated between the input / output electrodes 3 and 4 and the shield electrode. The leakage signal P ₂ leaks from the input electrode 3 to the output electrode 4 via the capacitors C _{2 and} C ₃ . Therefore, it is estimated that the amount of guarantee deterioration decreases rapidly. The leakage signal P ₁ between the input and output electrodes 3 and 4 is a problem, but the same can be said for the leakage signal (not shown) generated between the input and output electrodes 3 and 4 and the common electrode 5. have.

In each of the above experiments and considerations, the guaranteed cover attenuation can be maximized by grounding the metal cover 10 to the reference potential and setting the electrode gap G to the peak value of the guaranteed attenuation amount and its vicinity. In addition, taking the case of 22 MHz as an example, by grounding the metal cover 10 to the reference potential, 30 dB can be improved by setting the electrode gap G to the peak value of the guaranteed attenuation amount, and the crystal piece 1 is simply sealed. Compared with the case inside (2), the total can improve about 60dB. In addition, in this embodiment, since the metal cover 10 is grounded by the insulating potential 12 when the metal cover 10 is grounded at the reference potential, it is electrically compared with the case where the metal cover 10 is connected via the edge surface or by bonding or the like. It becomes good without fear of internal contact.

In the above embodiment (experimental example), the electrode gap G was obtained by making the thicknesses of the input / output electrodes 3, 4 larger than the shield electrode 16, but having the thickness of the conductive adhesive to obtain the electrode gap G. Also good. In addition, although the shield electrode 16 and the metal cover 10 were performed by the through hole, of course, you may use it with another method. As described above, the present invention can be modified in various ways. Basically, the holding structure of the crystal piece 1 may be arbitrarily designed. In other words, the metal cover is grounded to the reference potential, and the shield electrode 16 and the input / output of the present invention can be designed. It is included in the technical scope of the present invention that the electrode gap G of the electrodes 3 and 4 is configured to approach the peak value of the guaranteed attenuation amount and its vicinity (15-50 μm). Of course, the shield electrode 16 may be a metal plate or the like.

Second embodiment

12 is a view for explaining an embodiment corresponding to the second object of the present invention, and in particular, an electrode structure diagram of a crystal oscillator. In addition, description of the same part as the figure of the said prior art example is abbreviate | omitted.

This electrode structure is characterized by a metal different from this on the crystal piece 1 (lead-out electrodes 9, 7 extending from the input / output electrodes 3, 4 of one main surface 1a) as shown in the drawing. The electrode lands 21 and 22 are overlapped with each other, except that the widths of the electrode lands 21 and 22 are larger than those of the lead electrodes 6 and 7. In this example, the input and output electrodes 3 and 4 are used. The lead electrodes 6 and 7 are sequentially made of a four-layered structure of Cr, Cr-Ag, and Cr (hereinafter referred to as a CrAg mixed layer) on the crystal surface, and the electrode lands 21 and 22 have a one-layered structure of Al. In addition, all of them were formed by evaporation, and the lead electrodes 6 and 7 were each diagonally shaped portions of the crystal piece 1 from the relation of the electrodes for connection of the insulating substrate 11 described later. Iv) and the electrode lands 21 and 22 were formed in the width direction along the edges at the diagonal portions, and the common electrode 5 of the other main surface 1B. The lead electrodes 8a and 8b from the tube are connected to a tube such as bonding. The outer surface of the crystal piece 1 is 5 mm in length (z 'axis direction), 2.5 mm in width (x axis direction), and about 80 μm in thickness (y' axis direction). The center frequency was about 22 MHz).

As shown in FIG. 13, the crystal piece 1 of the electrode structure was held on both sides of the insulating substrate 11 and fixed, and the frequency temperature characteristics were measured. Thus, good results were obtained, that is, FIG. As shown in Fig. 1, the conventional one (curve B) is shifted from the original cubic curve and becomes linear. In the present example (curve a), the characteristics close to the original cubic curve can be maintained. However, as the adhesive 17, for example, a urethane-based conductive adhesive having a pencil strength of 2B or less was used. The common electrode 5 is wire-bonded to the terminal portion 18 of the shield electrode 16 described above (not shown). FIG. 13 (a) is a side view of the multi-mode vibrator, FIG. b) is a top view of the crystal piece 1 which shows the application | coating position of the adhesive agent 17 (wrong point in drawing).

According to the conjecture of the present inventors, in the conventional case, shrinkage occurs during the curing of the adhesive 17, and friction occurs at the boundary between the crystal piece 1, the lead electrodes 6, 7 and the input / output electrodes 3, 4, and the crystal piece. Tension (stress) is generated on the surface of (1). This tension has a great influence on the thickness slipping vibration, and damages the original frequency temperature characteristic by the stress sensitivity characteristic.

On the other hand, in the present invention, even if the adhesive 17 shrinks, the sliding phenomenon occurs at the boundary between the lead electrodes 6 and 7, and the electrode lands 21 and 22, thereby reducing the tension generated on the surface of the crystal piece 1. . In other words, since the electrode lands 21 and 22 are made of Al, an oxide film is formed between the lead electrodes 6 and 7, and the oxide film weakens the bond between the two to facilitate slipping. Therefore, it was considered that the electrode structure of the above-described configuration had a small influence on the thickness slipping vibration without incurring distortion of the tension in the excitation portion, and thus obtained the original frequency temperature characteristics.

However, even with such improvement, the crystal impedance (hereinafter referred to as CI) does not reach a satisfactory result even if the frequency temperature characteristic is improved. That is, an oxide film is easily formed on the surface of the electrode lands 21 and 22 made of Al, and is subsequently fixed by the conductive adhesive, so that the conductivity is worsened and sufficient CI cannot be obtained. Hereinafter, a solution of the advantages will be described.

FIG. 15 is a diagram illustrating a solution of the advantages, in which FIG. 15 (a) is an electrode structure diagram and FIG. 15 (b) is a diagram showing an application position of an adhesive, that is, after forming the electrode lands 21 and 22. The lead electrodes 6, 7 are superimposed thereon. Further, when the adhesive 17 was applied on the electrode lands with the lead electrodes 6 and 7 as the center, good frequency temperature characteristics and CI characteristics were obtained. That is, since the sliding phenomenon is caused by the action of the oxide film at the boundary between the lead electrodes 6 and 7 and the electrode lands 21 and 22 as described above, stress is not generated in the excitation portions, so that the frequency temperature characteristics are maintained well. Can be. It is considered that the sliding phenomenon is hindered because the ends of the lead electrodes 6 and 7 are fixed by the adhesive 17 rather than the above.

Since the adhesive 17 is in direct contact with the lead electrodes 6 and 7 made of the CrAg mixed layer, the conductivity is not impaired, thereby preventing the CI from falling. In addition, Cr has a high resistivity and is easy to form an oxide film, but since the Ag layer is mixed, no conduction failure occurs. In addition, CI in this case was 57 ohms with respect to 105 ohms in the previous holding | maintenance of both ends. The CI was only in fa mode (inclined symmetry mode).

In the above electrode structure, the excitation electrodes 3 and 4 and the extraction electrodes 6 and 7 are made of a CrAg mixed layer, and the electrode lands 21 and 22 are made of Al. As described above, the excitation electrodes 3, 4 and the extraction electrodes 6, 7 may be made Al, and the electrode lands 21, 22 may be made of a CrAg mixed layer. That is, even in this case, the frequency temperature characteristic can be maintained satisfactorily by the slip phenomenon as described above. At the time of fixing, since the conductive adhesive is attached to the electrode lands 21 and 22 made of the CrAg mixed layer, the CI is improved without causing a poor conduction. However, since Al exists at the boundary between the electrode lands 21 and 22 and the extraction electrodes 6 and 7, it affects the conductivity of the Al by the oxide film. Therefore, as shown in FIG. 17, the contact area between the lead electrodes 6, 7 and the electrode lands 21, 22 may be increased. As shown in FIG. 18, the lead electrodes 6 and 7 may be superimposed on the electrode lands 21 and 22 made of the CrAg mixed layer.

Since the electrode structure is made of Al having a small mass of the excitation electrode part, it is particularly suitable for a high frequency multimode oscillator having a frequency adjustment relationship of, for example, 90 MHz. In addition to the above-mentioned, there are many ways to increase the conductivity and terminate the CI. In the present invention, it is intended to maintain the frequency temperature characteristics well, and not to improve the CI.

In addition, although the electrode electrodes 21 and 22 were extended by extending the diagonal portions of the lead electrodes 6 and 7, the electrode lands 21 and 22 were extended by extending the lead electrodes 6 and 7 to both ends thereof. May be provided (FIG. 19), and these are determined from the relationship between the input and output electrodes 14 and 15 for connection to the insulating substrate 11, the lead-out electrode 8 of the common electrode 5, or the space in the container. In this case, the extension ends of the lead electrodes 6 and 7 and the positions of the electrode lands 21 and 22 are not particularly affected.

From the above, by using the electrode structure of the present invention, it is possible to solve the problem of the electrical characteristics, mainly the frequency temperature characteristics, mainly in both ends holding. However, even if it is simply held at both ends, i.e., even if the center or the end of the both ends is kept as a drop, when the external dimension is 5 x 2.5 mm, the strength is insufficient in terms of impact resistance such as breakage. Therefore, 4-point holding | holding which hold | maintains both ends of droplets is desired. However, when the external dimension smaller than this is small, for example 4 × 2 mm, it is sufficient to maintain two points. Hereinafter, a solution of the advantages will be described by the third embodiment.

Third embodiment

20 is a view for explaining an embodiment corresponding to the third object of the present invention, which is intended to show that there is a difference in the amount of distortion occurring in the crystal piece 1 by the application method of the adhesive 17. will be. 20 (a) and 20 (b) show the case where the adhesive 17 is directly applied to both surfaces of one end of the crystal piece 1 to be fixed, and FIGS. 20 (c) and (d) are shown in FIG. It is a figure in the case of attaching the electrode 23 in the width direction of the one end part of the crystal piece 1, and fixing in the same shape.

FIG. 21 (a) is an experimental result diagram in which the vertical axis by these coating methods is the distortion amount d (μm). In addition, the distortion amount here measures the up-and-down difference d of the surface of a crystal piece after hardening of the adhesive agent 17 using the measuring machine ZYGO system (FIG. 21 (b)). As apparent from this, the amount of distortion generated in the crystal piece 1 is about 1.5 times larger than that in which the adhesive 17 is directly attached to the crystal piece 1 and held over the electrode 23. . However, although the adhesive was experimented with polyimide, even in the case of urethane, the extent becomes small, but it produces distortion similarly.

That is, since the bonding strength of the crystal piece 1 and the adhesive agent 17 is larger than the case where the electrode 23 is interposed, the shrinkage force directly influences at the time of hardening. In the case where the electrode 23 is interposed, it is considered that the adhesive strength between the electrode 23 and the crystal piece 1 is small, thereby causing a phenomenon such as slippage between the two and reducing the shrinkage force. Therefore, when the adhesive agent is directly stuck to the crystal piece 1, the amount of distortion is large and it is easy to break, and impact resistance deteriorates. On the other hand, when the adhesive 17 is stuck on the electrode 23, the amount of distortion is small and the damage is prevented to improve the impact resistance. In addition, when the application position of the adhesive agent 17 is close, the distortion tends to be concentrated and broken between both during shrinkage, or the distortion is alleviated as it is separated, and it is difficult to be damaged.

From the above, when four points are basically maintained, for example, as shown in Figs. 22A and 22B, the adhesive 17 is formed on both surfaces of the electrode lands 21 and 22, respectively. ) Can prevent breakage due to distortion. However, in this case, since the adhesion strength of the electrode lands 21 and 22 to the surface of the crystal piece 1 is weak, the electrode lands 21 and 22 are likely to peel off from the surface of the crystal piece 1 and the electrical conduction is damaged. The problem arises.

In this case, for example, as shown in FIGS. 23A and 23B, the adhesive 17 is located in the electrode lands 21 and 22 on one side in the width direction of the electrode lands 21 and 22, On the other side, it adheres to the position which extended to the electrode lands 21 and 22 and the crystal piece 1, respectively.

According to the fixing method described above, one side of each of the electrode lands 21 and 22 becomes a free end in terms of the adhesive 17. In addition, since the adhesive 17 adheres to the surface of the crystal piece on the other side, distortion occurs due to this. However, since one side is a free end, the distortion is easily avoided, thereby preventing damage. On the other hand, since the adhesive 17 is directly applied over the electrode lands 21 and 22 and the crystal piece 1, the peeling strength of the electrode lands 21 and 22 is also increased to maintain electrical conduction. Therefore, in addition to the electrode structure of this embodiment, such four-point holding can achieve both end holdings with improved impact resistance without compromising electrical characteristics.

The present invention finds that there is an optimum value (single point) in the electrode spacing, and sets the electrode spacing at and near the peak value of the guaranteed attenuation amount while the metal cover is grounded at the reference potential, thereby providing a multi-mode vibrator that increases the guaranteed attenuation amount. .

In addition, the present invention superimposes and connects the connecting electrode lands formed separately from the lead electrodes formed extending from the input / output electrode of the crystal piece, and at the same time either one is made Al, and the outer periphery at both ends formed with such electrode lands Since the adhesive is attached and adhered, the frequency temperature characteristics can be maintained well.

Furthermore, the present inventors apply an adhesive to both sides of the electrode land, and at the same time, one side of each electrode land is located in the electrode land, and the other side has a four-point fixation across the electrode land and the crystal piece, so that the multi-mode vibrator improves impact resistance. Can be provided.

Claims (9)

A sealed container and a crystal piece enclosed in the sealed container, the crystal piece having a first input electrode and a first output electrode on a first main surface, and a common electrode on a second main surface; And The sealed container has a container body and a metal cover, The container body is provided with an insulating substrate, an insulating edge, a welding ring, The insulating substrate has a shield electrode, a second input electrode, and a second output electrode on a main surface thereof, and the metal cover is connected to the shield electrode by electrical connection means, and the crystal piece A multimode quartz crystal oscillator, characterized in that a conductive adhesive is interposed between the insulating substrate. The multi-mode crystal oscillator according to claim 1, wherein the first main surface of the crystal piece is spaced apart from the shield electrode by a predetermined interval, and the predetermined interval is a distance that maximizes the guaranteed attenuation amount of the crystal oscillator. A sealed container and a crystal piece enclosed in the sealed container, The crystal piece has a first input electrode and a first output electrode on a first main surface, a common electrode on a second main surface, The sealed container has a container body and a metal cover, The container body is provided with an insulating substrate, an insulating edge, a welding ring, The insulating substrate has a shield electrode, a second input electrode, and a second output electrode on a main surface thereof. A conductive electrode connected to the shield electrode, Means for electrically connecting the metal cover to the conductive electrode, wherein the conductive electrode passes through the container body, And a conductive adhesive interposed between at least one electrode of the crystal piece and the insulating substrate and another one of the crystal piece and the insulating substrate. 4. The multi-mode crystal oscillator according to claim 3, wherein the first main surface of the crystal piece is spaced apart from the shield electrode by a predetermined distance, and the predetermined interval is a distance that maximizes the guaranteed attenuation amount of the crystal oscillator. The multimode crystal oscillator according to claim 4, wherein the predetermined interval is 15 to 50 µm. The method of claim 3, A first lead electrode connected to the first input electrode; A second lead electrode connected to the first output electrode; A first electrode land located on the first lead electrode; And a second electrode land located on the second lead electrode, The conductive adhesive is interposed between the first and second electrode lands and the insulating substrate, The lead electrode is made of a material different from the electrode land, And one of the lead electrode and the electrode land is made of aluminum. 7. The multimode crystal oscillator of claim 6, wherein the conductive adhesive overlaps each of the electrode land and each of the conductive electrodes. With the revision, A shield electrode, Means for holding the quartz crystal at a distance from the shield electrode; An insulating border surrounding the crystal piece, a metal cover over the crystal piece, At least one electrode passing through the through hole of the insulating edge, And the at least one electrode connects the shield electrode and the metal cover. The method of claim 8, Further provided with a welding ring for holding the metal cover on the insulating edge, The at least one electrode is in contact with the welding ring, And the welding ring is conductive to provide an electrical connection between the at least one electrode and the metal cover.