JPWO2022202653A1 - - Google Patents

Info

Publication number
JPWO2022202653A1
JPWO2022202653A1 JP2023509120A JP2023509120A JPWO2022202653A1 JP WO2022202653 A1 JPWO2022202653 A1 JP WO2022202653A1 JP 2023509120 A JP2023509120 A JP 2023509120A JP 2023509120 A JP2023509120 A JP 2023509120A JP WO2022202653 A1 JPWO2022202653 A1 JP WO2022202653A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023509120A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202653A1 publication Critical patent/JPWO2022202653A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023509120A 2021-03-26 2022-03-18 Pending JPWO2022202653A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021053518 2021-03-26
PCT/JP2022/012565 WO2022202653A1 (en) 2021-03-26 2022-03-18 Wafer treatment method

Publications (1)

Publication Number Publication Date
JPWO2022202653A1 true JPWO2022202653A1 (en) 2022-09-29

Family

ID=83395832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509120A Pending JPWO2022202653A1 (en) 2021-03-26 2022-03-18

Country Status (3)

Country Link
JP (1) JPWO2022202653A1 (en)
TW (1) TW202249102A (en)
WO (1) WO2022202653A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023074536A1 (en) * 2021-10-27 2023-05-04 東洋紡株式会社 Protective film-equipped laminate of inorganic substrate and heat-resistant polymer film

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5639280B2 (en) * 2012-08-10 2014-12-10 積水化学工業株式会社 Wafer processing method
JP2014072445A (en) * 2012-09-28 2014-04-21 Nitto Denko Corp Semiconductor device manufacturing method
JP6502824B2 (en) * 2015-10-19 2019-04-17 信越化学工業株式会社 Wafer processed body, temporary adhesive for wafer processing, and method for manufacturing thin wafer
JP7045765B2 (en) * 2018-04-16 2022-04-01 信越化学工業株式会社 Substrate processing body with circuit and substrate processing method with circuit
JP7035915B2 (en) * 2018-09-03 2022-03-15 信越化学工業株式会社 Manufacturing method of thin wafer

Also Published As

Publication number Publication date
TW202249102A (en) 2022-12-16
WO2022202653A1 (en) 2022-09-29

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230724