JPWO2021117586A1 - - Google Patents
Info
- Publication number
- JPWO2021117586A1 JPWO2021117586A1 JP2021563897A JP2021563897A JPWO2021117586A1 JP WO2021117586 A1 JPWO2021117586 A1 JP WO2021117586A1 JP 2021563897 A JP2021563897 A JP 2021563897A JP 2021563897 A JP2021563897 A JP 2021563897A JP WO2021117586 A1 JPWO2021117586 A1 JP WO2021117586A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019223571 | 2019-12-11 | ||
| PCT/JP2020/044951 WO2021117586A1 (en) | 2019-12-11 | 2020-12-03 | Photosensitive insulating film-forming composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021117586A1 true JPWO2021117586A1 (en) | 2021-06-17 |
Family
ID=76330289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021563897A Pending JPWO2021117586A1 (en) | 2019-12-11 | 2020-12-03 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021117586A1 (en) |
| TW (1) | TW202136916A (en) |
| WO (1) | WO2021117586A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI786979B (en) * | 2021-09-03 | 2022-12-11 | 財團法人工業技術研究院 | Anhydride compound, polyimide, and thin film |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5125747B2 (en) * | 2007-05-25 | 2013-01-23 | 東レ株式会社 | Photosensitive resin composition |
| KR20120109489A (en) * | 2009-12-04 | 2012-10-08 | 도레이 카부시키가이샤 | Photosensitive resin composition, laminate utilizing same, and solid-state imaging device |
| JP2012194534A (en) * | 2011-02-28 | 2012-10-11 | Fujifilm Corp | Photosensitive composition, photosensitive solder resist composition and photosensitive solder resist film, and permanent pattern, formation method therefor and printed circuit board |
| WO2013085004A1 (en) * | 2011-12-09 | 2013-06-13 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device |
| JP6923334B2 (en) * | 2016-04-14 | 2021-08-18 | 旭化成株式会社 | Method for manufacturing photosensitive resin composition and cured relief pattern |
-
2020
- 2020-12-03 WO PCT/JP2020/044951 patent/WO2021117586A1/en active Application Filing
- 2020-12-03 JP JP2021563897A patent/JPWO2021117586A1/ja active Pending
- 2020-12-07 TW TW109142984A patent/TW202136916A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202136916A (en) | 2021-10-01 |
| WO2021117586A1 (en) | 2021-06-17 |