JPWO2019244136A5 - - Google Patents

Description

The present invention relates to a method for mounting a device on a substrate provided at the substrate position according to claim 1 and a device for mounting the device on a substrate provided at the substrate position according to claim 9.

State-of-the-art methods and devices for mounting components on a board should be wide and tall enough to allow or simplify the mounting of components for a wide variety of applications. It has been known.

As used in the claims, the term "device" refers to electronic and / or optical devices, especially semiconductor chips (also called dies) on a substrate.

Installation of components in the semiconductor industry is carried out with the help of semiconductor assembly machines known to those of skill in the art as "die bonders" or pick-and-place machines. Devices are often semiconductor chips that can be placed and bonded on different substrates at a given substrate position.

The component is picked up by a pickup member such as a clamp grip or suction element. The pickup member is moved onto the substrate and the component is placed in a predetermined position on the substrate. The pickup member may be attached to the junction head so that it can rotate about its longitudinal axis. The junction head is attached to a pick-and-place system that allows the required movement in the three spatial directions X, Y, and Z. The join head is attached to the join head by a special mounting bracket. In practice, the Z direction corresponds to the vertical direction and the XY plane corresponds to the horizontal plane. In addition to the very accurate positioning of the parts in the XY plane, it is very important that the parts are arranged in parallel in the plane and there is no shear force on the substrate. Inclined placement of components can result in unwanted properties such as reduced holding power, defective or defective electrical contacts, irregular heat transfer between the component and the board, or damage to the component. Shear force can cause the semiconductor chip to slip.

Many different configurations are known for controlling the tilt of the pickup member. It is an object of the present invention to enable improved tilt control during the placement of components from the substrate.

In addition, the present invention has the task of providing simple and inexpensive possibilities for tilt control during manufacturing, which is as long as possible for the joining head in use while maintaining simple handling. , Has a tilting mechanism with almost no wear.

A first aspect of the invention provides a process for mounting a device on a substrate, which process provides the substrate on the substrate base at the substrate position. The procedure includes the following steps: providing the substrate with a first moving axis and a displaceable joining head along the second moving axis, wherein the second moving axis is the first. To provide a junction head that is substantially perpendicular to the axis of movement and to provide a pickup member as a receiving element having a contact surface, the pickup member is disposed on the junction head and has a contact surface. Provided is a pickup member configured and arranged to be releasably mountable on a component and further configured and arranged such that a contact surface is rotatable about a first axis of movement. And to provide a first engaging member disposed on the joint head and to provide a firm engagement with the first engaging member, place the first adjusting member in the first adjusting position. To provide, to move the joining head to the first adjustment position, to firmly engage the first engaging member with the first adjusting member, and to move the joining head to the first moving axis. By moving with respect to the first adjusting member along or along the second moving axis, the contact surface rotates around the second moving axis, and from the first adjusting member to the first. Releasing the engaging member of 1 and moving the joining head towards the substrate position, the joining head maintaining and moving the contact surface around the second moving axis. ..

By providing tilt correction with conventional drives and / or actuators, as well as movement along their respective axes of motion , assembly of the component can be significantly simplified. In particular, the complexity of the joining head (and any parts or elements attached to it) can be reduced.
-This can specifically reduce the cost of the device itself. In addition, the junction head (and any part or element attached to the junction head) may be reduced in weight so that it can move much faster than is possible with conventional equipment. Rotation compensation can only be performed according to mechanical principles, and such passive embodiments ensure a high degree of complexity and / or weight reduction.

A further aspect of the invention provides a method for mounting a device on a substrate, which further comprises the following provided steps: a junction head along a third axis of movement with respect to the substrate. By configuring and arranging to be displaceable, the configuration and arrangement in which the third axis of movement is substantially perpendicular to the first axis of movement and substantially perpendicular to the second axis of movement. The arrangement, the contact surface being configured and arranged to be rotatable around a third axis of motion, and the joining head being placed along the first axis of motion or on the second axis of motion. To move, along, or along a third axis of movement , relative to the first adjusting member so that the contact surface rotates around the third axis of motion . After releasing the first engaging member from the first adjusting member, the joining head is moved to the substrate position, wherein the joining head maintains rotation of the contact surface around the third moving axis. , To move .

After positioning, the component is mounted in a plane parallel to the board at the board position, preferably by providing the required degree of rotation around the two moving axes, greatly reducing the risk of tilt problems during operation. May be done.

A further aspect of the invention provides a method for mounting a device on a substrate, which further comprises the following provided steps: a junction head along a third axis of movement with respect to the substrate. By configuring and arranging to be displaceable, the configuration and arrangement in which the third axis of movement is substantially perpendicular to the first axis of movement and substantially perpendicular to the second axis of movement. To dispose, to configure and arrange the contact surface so as to be rotatable around a third moving axis, and to provide a second engaging member disposed on the junction head. A second adjusting member is provided at a second adjusting position, wherein the second adjusting member is configured and arranged to tightly engage the second engaging member. Providing an adjusting member, moving the joining head to a second adjusting position, firmly engaging the second engaging member with the second adjusting member, and moving the joining head to the first moving shaft. To move with respect to the second adjusting member, along the second moving axis, along the second moving axis, or along the third moving axis, so that the contact surface is around the third moving axis. Rotating and moving, releasing the second engaging member from the second adjusting member, and moving the joining head to the substrate position, where the joining head is of the third moving axis. Maintaining and moving the contact surface around it.

By providing two engaging members, two adjusting members, and two adjusting positions, a preferred embodiment of the invention is required to move from a first tilt setting to a second tilt setting. Even time can be achieved in such a way that it can be significantly reduced.

This is also due to the lower mass moving, i.e., the junction head, which results from the avoidance of additional servomotors in the junction head.

In a preferred method, the joining head is contacted using an elastic member, a spring member, a magnetic member, an electrical member, an electromagnetic member, a vacuum member, a gas powered member, a friction member, a hydraulic member, an inductive member, or any combination thereof. It is configured and arranged to maintain surface rotation.

In another aspect of the invention, the preferred method for entering article data still involves the following steps: contact around a first and / or second axis of motion and / or a third axis of motion. To provide tilt sensors configured and arranged to measure surface rotation and to determine the degree of displacement along the first axis of motion, the first and / or second axis of motion and / or To provide a processor configured and arranged to obtain the desired rotation around a third axis of motion and to displace the displacement along the first axis of motion when the desired tilt of the contact surface is reached. Further configuration and placement of the processor to stop.

In another aspect of the invention, the preferred method for entering article data still involves the following steps: providing a tilt position sensor configured and arranged to measure the tilt of the substrate and the substrate. The measured tilt of is used to determine the degree of displacement along the first axis of motion, around the first axis of motion and / or around the second axis of motion, and / or around the third axis of motion. To provide a processor configured and arranged to obtain the desired rotation in.

In another aspect of the invention, the preferred temperature sensing method continues to include the following steps, preferably even in a mechanical environment: junction head support carrier and / or junction head support and / or junction head and / or tilt sensor and /. Or to provide a temperature sensor configured and arranged to measure the temperature of the contact surface and / or each temperature, and to use the measured temperature of the contact surface for displacement along a first axis of movement. Determining the degree and providing a processor configured and arranged to obtain the desired rotation around a second axis of motion and / or a third axis of motion.

In another aspect of the invention, the preferred temperature sensing method continues to include the following steps, preferably even in a mechanical environment: measuring the temperature of the substrate (160) and / or the base of the substrate and / or the respective temperatures. Providing a configured and placed temperature sensor and using the measured temperature of the substrate to determine the degree of displacement along the first axis of movement, the first axis of movement and / or the second movement. To provide a processor configured and arranged to obtain the desired rotation around an axis and / or a third moving axis.

The present invention involves temperature measurement by a temperature sensor and / or non-contact temperature measurement by radiation such as temperature measurement of a laser base or an infrared base.

In another aspect of the invention, the preferred method for controlling the rotation of the contact surface of the pickup member continues to include the following steps provided: a joining head and / or a contact surface and / or a joined component to the substrate. By measuring the tilt and / or rotation of, at least the position of the junction head can be optically detected by the reference mark, for measurement and compensation for tilt and / or rotation from the measured values. Determining the first and second compensating variables, moving the junction head to the first position compensated by the compensating variable, and firmly moving the first engaging member with the first adjusting member. Engaging, performing the first compensation, moving the junction head to a second position compensated by the compensation size, and firmly moving the second engaging member to the first adjusting member. Engaging and implementing a second compensation.

In addition, it may be advantageous to remeasure the tilt of the junction head with respect to the surface of the board or the surface of the board handler and use it for additional compensation.

The measurement of tilt, i.e., tilt and / or rotation of the junction head with respect to the substrate, is preferably performed by an optical image recognition method, thereby preferably a so-called fiducing attached to an optical reference mark, eg, the junction head. The shall is detected by the camera and used for reference. In this way, advantageous continuous monitoring is also possible during the movement sequence during installation. Thus, for example, situation-related compensation caused by mechanical play or simple error propagation of mechanical deviations is available.

In another aspect of the invention, the device is provided for mounting the device on a substrate. The device is configured and arranged to perform the procedures described herein.

A preferred configuration of the device for mounting the device on the substrate provided at the substrate position is a junction head displaceable with respect to the substrate along the first moving axis and the second moving axis, the second. A pickup with a junction head and a contact surface, where the axis of movement is substantially perpendicular to the first axis of movement and the second axis of movement is substantially perpendicular to the first axis of movement. A member, the pickup member is disposed on the joint head, the contact surface is configured and arranged so that it can be releasably or re-releaseably mounted on the component, and the contact surface is the first movement. A tight engagement between the pickup member, the first engaging member disposed on the junction head, and the first engaging member, further configured and arranged so as to be rotatable around the axis. A first adjusting member within the first adjusting position for the purpose.

In addition, a preferred configuration of the device for mounting the device on the substrate includes a joint head displaceable in a first displacement position, the first engaging member being tightly engaged with the first displacement member. During engagement, the joining head is displaceable with respect to the first displacement member along the first axis of motion or along the second axis of motion, and the contact surface is the first axis of motion. Rotate around.

In addition, preferred embodiments of the device include a first engaging member that is releasable or re-releaseable from the first adjusting member.

In addition, a preferred embodiment of the device comprises a joining head displaceable to substrate position, the contact surface being configured and arranged to maintain rotation about a first axis of movement.

In a preferred configuration of the device for mounting the device on the substrate, the junction head is further configured and arranged so that it is displaceable with respect to the substrate along a third axis of motion, the third axis of motion being a third. It is substantially perpendicular to one moving axis and substantially perpendicular to the second moving axis.

In a preferred embodiment of the device for mounting the device on a substrate, the contact surface is further configured and arranged to be rotatable around a third moving axis.

In a preferred configuration of a device for mounting a device on a substrate, the first engaging member is along a first axis of motion, along a second axis of motion, or along a third axis of motion. Further configured and arranged to slide the junction head with respect to the second adjusting member, the contact surface rotates around the third moving axis.

In a preferred embodiment of the device for mounting the device on a substrate, the junction head is further configured and configured to maintain rotation of the contact surface around a third moving axis after release from the first adjusting member. Be placed.

In a preferred configuration of the device for mounting the device on the substrate, the junction head is further configured and arranged so that it is displaceable with respect to the substrate along a third axis of motion, the third axis of motion being a third. It is substantially perpendicular to one moving axis and substantially perpendicular to the second moving axis.

In a preferred configuration of the device for mounting the device on the substrate, the contact surface is further arranged so as to be rotatable along a third moving axis, and the device is arranged on a second joint head. Further comprising an engaging member and a second adjusting member within a second adjusting position, the second adjusting member is configured and arranged to be tightly engaged with the second engaging member and has a joint head. Is further displaceable to the second adjustment position, the second engaging member is tightly engaged with the second adjusting member, and the joining head is along the first moving axis or the second. Displaceable with respect to the second adjusting member along the moving axis of, or along the third moving axis, the contact surface rotates around the third moving axis and the second engaging member. Is releasable from the second adjusting member, and the joining head is further configured and arranged to maintain rotation of the contact surface around the third moving axis after release from the second adjusting member. To.

Further Advantages and Characteristics of Preferred Methods for Mounting Devices on the board, and preferred devices for mounting devices on the board are shown in the figure below.

An embodiment of a device for mounting a component in the sense of the present invention is shown. An example of a joining head configured and arranged to rotate around a second moving axis is shown. The use of the configuration and arrangement from FIG. 2 for mounting the device on the board is shown. Represents a modified version of the embodiment shown in FIG. A method of mounting a component on a substrate in the sense of the present invention is shown. Further embodiments for tilt adjustment with a combination of racks and pinions as engagement and adjustment members are shown. Another version of the invention is shown as a combination of a rack and a pinion as an engagement and adjustment member in two adjustment positions.

FIG. 1 shows a preferred embodiment of a device 100 for assembling parts 150 in the form of an assembly device 100 such as a die bonder or an assembly machine, which is required to understand the method 200 according to the present invention. Method 200 is used to mount electronic or optical components 150 (not shown), in particular semiconductor chips, onto substrate 160. The assembling device 100 includes a movable joining head 110 to which the pickup member 180 is mounted as a receiving element such as a suction element or a clamp gripper. The assembly device 100 also includes a substrate base 190 on which the substrate 160 is placed and held.

The assembling device 100 allows the junction head 110 and / or the pickup member 180 to be displaced with respect to the substrate 160 along a first moving axis 170, which is represented here substantially in the vertical or Z direction. Configured and placed. Typically, the device is configured and arranged such that the longitudinal axis 140 of the junction head 110 and / or the pickup member 180 substantially coincides with the vertical or Z direction 170.

The assembling device 100 further allows the junction head 110 and / or the pickup member 180 to be shifted with respect to the substrate 160 along a second moving axis 175 (indicated here substantially as horizontal or X direction). Configured and deployed. The second moving axis 175 is substantially perpendicular to the first moving axis 170.

The assembling device 100 further allows the junction head 110 and / or the pickup member 180 to shift with respect to the substrate 160 along a third moving axis 177 (indicated here substantially as horizontal or Y direction). Configured and placed. The third moving axis 177 extends substantially at right angles to the first moving axis 170.
It also extends substantially at right angles to the second moving axis 175. In the device 100 shown, the XY plane is extended by a second moving axis 175 and a third moving axis 177.

The configuration of the device 100 typically provides relative motion using electrically and / or pneumatically driven axes for motion, where the pickup member 180 and / or the substrate 160 is one or more. It is configured and arranged to move along the movement axes 170, 175, 177. Since relative motion is required, the motion is due to the substrate base 190, the pickup member 180, the contact surface 185, the junction head 110, the attachment point of the junction head 110 to the remaining device 100, or any combination of us. It may be configured in.

Such moving axes 170, 175, 177 may consist of a guide (not shown) and a movable portion, eg, a carriage that is movable within the guide. The carriage may be supported in different ways, for example, by air bearings or ball bearings. There may be some elasticity between the guide and the movable slide, which is typically slightly larger in the air bearing than in the ball bearing. For each moving axis, a combination of one or more guide carriages may be provided at different points within the device 100. Each moving axis can also consist of one or more drives (not shown) for moving the relevant slides along the relevant guides.

The relative displacement between the junction head 110 and the pickup member 180 as a receiving element can also be provided to one or more moving axes 170, 175, 177. Additionally or optionally, the device 100 may be configured to allow relative rotation between the pickup member 180 and the junction head 110 around its longitudinal axis 140. The bearing of the pickup member 180 in the joining head 110 may be provided as an air bearing.

The pickup member 180 comprises a releasable or re-releaseable mounting contact surface 185 (not shown) to the component 150 while positioned on the board 160 at the board position 165 (not shown). ..

After the component 150 is positioned (or placed) on the substrate 160, the contact area 185 is typically used to limit the movement of the device during one or more joining operations. The force applied by the contact surface 185 on the substrate 160 is usually referred to as the holding force. Typically, the same contact area 185 is used for each step of the joining process, and each step uses an additional contact area 185 depending on the type of joining.

Since the junction head 110 and the pickup member 180 are connected to each other and the pickup member 180 includes a contact surface 185, those skilled in the art will appreciate that the position of the contact surface 185 is such that the junction head 110 and / or the pickup member 180 has a corresponding conversion rule. It will be clear that it may be derived from the position of or vice versa.

Preferably, the component 150 is positioned substantially parallel to the substrate 160 at their respective substrate position 165. This means that the component 150 is preferably positioned in an XY plane substantially parallel to the XY plane in which the substrate position 165 is located. Deviations from the parallel state are called tilting, tilting, or twisting, and tilting, twisting, or tilting positioning of part 150 reduces holding force and / or holds force, defective or missing electrical contacts, with part 150. It can result in undesired properties such as irregular heat transfer to and from the substrate 160, or damage to component 150. Shear forces can cause the part 150 to slip, which can lead to positioning errors. In extreme cases, the part may be malfunctioning, defective, or unreliable.

To allow tilt adjustment, the device 100 has the junction head 110 and / or the pickup member 180 having at least one horizontal axis (second moving axis 175 and / or third moving axis 177) with respect to the substrate 160. ) Is further configured and arranged so that it can rotate around. Generally, the highest degree of control is achieved by many degrees of motion and rotation (degree of freedom), which usually increases the complexity of the device 100.

In conventional placement machines, the tilt of the contact surface 185 is manually adjusted by the operator. That is, after a problem, eg, damage to the component 150 and / or the substrate 160, is detected, the operation of the device is interrupted and the tilt is manually adjusted, eg, with an adjusting screw.

With proper control and / or measurement, this one or more rotation angles may be used to control the orientation of the contact surface 185 with respect to the substrate 160 in order to minimize tilt error. Each degree of rotation requires one or more drives or actuators. In addition, a measurement system, such as one or more measuring instruments, may be required to ensure the required accuracy and control. Since relative motion is required, rotation is with respect to the substrate base 190, pickup member 180, junction head 110, contact surface 185, junction head 110 mounting points for the rest of the device 100, or any combination thereof. It may be configured.

Such additional drives and measurement systems increase the weight of the junction head 110 and / or pickup member 180, which typically limits the maximum speed measured in UPH (in units of hour). It may or may require a stronger drive to compensate for the increased inertia. The size of the junction head 110 and / or the pickup member 180 may also increase as elements are added.

For example, US Pat. No. 6,387,851B1 describes tilt adjustment by an active actuator attached directly to the junction head. Tilt adjustment is implemented by several actuators and encoders, as shown in FIG. 5 of US Pat. No. 8,387,851B1.

According to the present invention, an improved tilt adjustment is provided to the apparatus 100, which allows automatic adjustment to simultaneously minimize an increase in weight and / or size of the joining head 110 and / or the pickup member 180. In addition, the set time may be shortened, which increases the operating time of the device 100.

FIG. 2 shows an example of a joining head 110 arranged to rotate around a second moving shaft 175.

The left view of FIG. 2 schematically shows the junction head 110 and the pickup member 180, and their longitudinal axes 140 are also shown to show possible relative rotation. On the right side, the coordinate system is shown, the first movement axis 170 (Z) is shown vertically and the third movement axis 177 (Y) is shown horizontally. In this example, the junction head 110 is seen along the second moving axis 175 (X), i.e., the second moving axis 175 (X) is in the page (paper plane).

In this example, the junction head 110 is configured and arranged to rotate around a second moving axis 175 (X), in which in this example the junction head 110 is the rest of the device via the junction head fitting 105. It is pivotally connected to 100, allowing it to rotate around a pivot axis 115 .

The device 100 has a first adjusting position 132 (shown in FIG. 1) for firmly engaging the first engaging member 120 mounted on the joining head 110 with the first engaging member 120. 1 is further provided with an adjusting member 130 (shown in FIG. 1).

The first adjustment position 132 may be located at any position that the joining head 110 can reach with an available axis of movement or to a degree of freedom.

The device 100 is further configured and arranged so that the joining head 110 can be moved to the first adjustment position 132, the first engaging member 120 tightly engaging with the first adjusting member 130.

It is configured and arranged so that when the junction head 110 is moved to the first adjustment position 132, the first engaging member 120 and the first adjusting member 130 are firmly switched on and off. Means to be done. The first engaging member 120 and the first adjusting member 130 form a first pair of engaging members. For example, it may be designed as a pair of racks and pinions, balls and sockets, hooks and guides, bolts and nuts, protrusions and recesses, pairs of bolts and holes, north and south poles, or pairs of protrusions and clamps. Two or more pairs of engaging members can also be used.

Optionally, each pair of engaging members may be configured to use only mechanical principles. This passive embodiment can avoid the additional weight and complexity due to electrical or pneumatic supply and / or drive.

Those skilled in the art will recognize that the members of an engaging pair can replace their mechanical configuration without affecting the functionality of the pair. For example, the rack may be included as an engaging member in combination with a pinion as an adjusting member, and the rack may be included as an adjusting member in combination with a pinion as an engaging member.

Rigid engagement means having sufficient rigidity and duration to perform the tilt adjustment that requires engagement, the mechanical configuration selected specifically for the engagement pair, the tilt adjustment mechanism selected. (See below), which means that it depends on the required adjustment speed, the required adjustment accuracy, and the mass of the junction head 110.

The first engaging member 120 shown in FIG. 2 is a cylindrical pin selected to tightly engage in a groove (not shown).

The device 100 allows the junction head 110 to be displaced with respect to the first adjustment position along the first moving shaft 170 and the contact surface 185 to rotate around the second moving shaft 175 during engagement. Further configured and arranged such that, when the first engaging member 120 is released from the first adjusting member 130, the joining head 110 is displaceable to the substrate position 165 and the contact surface 185 is second. It is further configured and arranged so that rotation around the movement axis 175 is maintained.

As shown in the example of FIG. 2, the tilt position blocking section 117 is provided to maintain rotation around the second moving shaft 175, i.e., tilt adjustment around the second moving shaft 175. To. The tilt position blocking section 117 can also be considered to block unwanted tilt movements around the second movement axis 175.

Any standard motion locking tool may be used, such as friction brakes, hydraulic brakes, pneumatic brakes, threads, electromagnetic brakes, electric brakes, induction brakes, drivers, magnetic brakes, or any combination thereof. Elastic members can also be used to generate the appropriate preload.

Optionally, the tilt position blocking section 117 may be configured to use only mechanical principles. This passive embodiment can avoid the additional weight and complexity due to electrical or pneumatic supply and / or drive.

In the example of FIG. 2, the apparatus 100 pivots the junction head 110 when a corresponding force is applied to the tip (distal end) of the first engaging member 120 along the third moving shaft 177. It is configured and arranged so that it can rotate around the shaft 115 (and around the second moving shaft 175).

In the case of the present invention, the tilt of the contact surface 185 is advantageously adjusted before the component 150 is mounted on the substrate 160, so that the tilt of the contact surface 185 is substantially the tilt of the substrate 160 at each substrate position 165. Equal to each other. The example of FIG. 2 shows a configuration and arrangement for controlling the tilt of the junction head 110, but the tilt setting and / or setting is selected to achieve the required tilt of the contact surface 185. FIG. 2 shows a pickup member 180 that is mounted at the end of the junction head 110 and works closest to the substrate 160. The pickup member 180 is composed of a contact surface 185 at the end of the pickup member 180 farthest from the joining head 110. Therefore, one of ordinary skill in the art will recognize from knowledge of the relevant dimensions of the apparatus 100 that the tilt value of the junction head 110 can be easily converted and vice versa. Alternatively or additionally, such conversion values may be measured with a suitable calibration procedure.

In the embodiment of FIG. 2, tilt adjustment and tilt prevention are mounted on the junction head 110, for this in fact provides ample space for additional components, typically. This is because it has sufficient mass to enable robust and reliable mounting.

Alternatively or additionally, tilt adjustment and tilt locking may be provided within the pickup member 180 or even within the contact surface 185. The use of multiple tilt adjustment and tilt locking functions is also provided to allow coarse and / or fine adjustment.

FIG. 3 shows the use of the configuration and arrangement of FIG. 2 for assembling components on a substrate according to the method 200 of the present invention. Possible steps of the procedure are also shown in FIG.

FIG. 3A shows the same figure in the same coordinate system as the junction head 110 shown in FIG. Reference numbers are not included to improve the clarity of FIG. 3 and the elements shown in FIG. 2 are identical.

In FIG. 3B, the junction head 110 is moved to the first adjustment position 132. At this point, the first engaging member 120 and the first adjusting member 130 are in close proximity together.

The first engaging member 120 is then firmly engaged with the first adjusting member 130. The required action depends, among other things, on the configuration and arrangement of the pair of first engaging members 120, 130. The device 100 may be configured and arranged to engage tightly as a direct result of moving the junction head 110 to the first adjustment position 132.

Alternatively or additionally, a series of movements along the available movement axes 170, 175, 177 may be made until the pair of first engaging members 120, 130 are in close proximity to each other. For example, the embodiment of FIG. 3 requires a pin included in the first engaging member 120 to penetrate the groove of the adjusting member 130. As shown, both the pins 120 and the grooves 130 extend in the paper plane along the second moving axis 175. Therefore, the engagement may be performed by moving the junction head 110 to the first adjustment position 132, where the pin 120 is positioned just above the groove 130 and the first adjustment position 132 is the first. It is defined to allow freedom of movement along the movement axis 170 and the third movement axis 177. The junction head 110 can then be moved into the paper along the second moving shaft 175 to allow the pins 120 to enter the groove 130. Therefore, the rigid engagement 260 properly selects the mechanical tolerances of the pins 120 and the groove 130 and, when the tilt 270 is set (see below), provides a fixed position along the second moving axis 175. It can be achieved by maintaining.

Additional or alternative, clamps can be used to ensure that the engagement is sufficiently rigid.

The paired arrangement of the first engaging members 120, 130 is a pin 120 in the groove 130 arranged at an angle of about 20 degrees with respect to the first moving axis 170 (Z) in the YZ plane. In this example, the third moving axis 177 is defined as Y. The movement of the joining head 110 along the first moving shaft 170 provides a force on the first engaging member 120 along the third moving shaft 177. As shown, the upward movement 170 provides force to the left 177 and the downward movement 170 provides force to the right 177 . Grooves with larger angles, eg 30 to 60 degrees, can also be used.

The device 100 causes the force on the first engaging member 120 along the third moving shaft 177 to rotate the joining head 110 around the pivot shaft 115 (around the second moving shaft 175). Configured and placed in.

In device 100, the rotation of the junction head 110 (around the second moving shaft 175) around the pivot axis 115 rotates (or tilts) the contact surface 185 around the second moving shaft 175. Is configured and arranged to cause.

The present invention is advantageous to provide an inclination of the contact surface 185 with existing drives and actuators for displacement of the junction head along the moving shafts 170, 175, 177. No additional drive and / or actuator is required for this tilt.

FIG. 3C shows the counterclockwise rotation of the joining head 110 around the second moving shaft 175 by moving the joining head 110 upward along the first moving shaft 170.

The first engaging member 120 is then disconnected from the first adjusting member 130. The tilt (rotation around the second moving axis 175) is maintained by the tilt position blocking section 117. If a friction brake that provides sufficient friction is used, the joint head 110 may be adjusted to any tilt value within the tilt mechanism region by only applying an appropriate force to the first engaging member 120. Well, no further action is required to prevent tilting. If the tilt position blocking section 117 provides multiple degrees of blocking, less blocking during rotation of the junction head 110, and more blocking before releasing the first engaging member 120 and the first adjusting member 130. It may be advantageous to provide a degree. Alternatively or additionally, the tilt position blocking section 117 may be configured and arranged to have a higher degree of blocking during each movement of the junction head 110 at release 280.

After release 280, the junction head 110 is moved to each board position 165 on the board 160. As shown in FIG. 3D, the junction head 110 maintains rotation around the second moving shaft 175 and thus the tilt of the contact surface 185 around the second moving shaft 175. The junction head 110 reaches the respective substrate position 165 when the contact surface 185 is directly above the position on the substrate on which the respective component 150 is mounted. Therefore, the expected position can be corrected according to the tilt setting.

As shown in FIG. 3D, the component 150 is mounted on the contact surface 185 and the component around the second moving shaft 175 is substantially equal to the substrate tilt 160 around the second moving shaft 175.

It is not necessary to remove the component 150 after adjusting the tilt (FIGS. 3B and 3C). The device 100 may be configured to perform tilt adjustment while the component 150 is mounted on the contact surface 185.

Many variants of this embodiment are possible when the following two embodiments are implemented. Device 100
It is configured in such a way that displacement along at least one moving axis 170, 175, 177 results in an inclination of the contact surface 185.
When the component 150 is mounted on the substrate 160, the intended tilt is maintained.

The above uses the movement of the junction head 110 along a Z or a substantially vertical first moving axis 170 to X or a substantially horizontal second moving axis 175. Explain to rotate.

The present invention is based on the knowledge that tilt correction is possible with existing drives and / or actuators that allow motion along at least one of these moving axes 170, 175, 177. In general, the device 100 is configured and arranged to allow rotation about another axis of movement while the axes are substantially perpendicular to each other using motion along one axis of motion. good.

Therefore, when interpreting the "first", "second", and "third" axes of movement, all combinations of axes that are substantially perpendicular to each other fall under the claims. , X, Y, and Z in the specification are not the only examples that fall under the scope of protection of the claims.

In particular, the moving axes X and Y may be functionally interchanged.

The device 100 may also be configured and arranged to provide more than one tilt according to the invention.

FIG. 4 shows another version of the invention, which is a modified version of the embodiment shown in FIG.

The left figure of FIG. 4A schematically shows the joining head 110 and the pickup member 180. On the right side, the coordinate system is shown, the first movement axis 170 (Z) is shown vertically and the third movement axis 177 (Y) is shown horizontally. In this example, the junction head 110 is seen along the second moving axis 175 (X), i.e., the second moving axis 175 (X) is in the page. From this point of view, the device 100 and the junction head 110 appear as shown in FIG. The rotationalness around the pivot axis 115 and therefore the second moving axis 175 is the same.

The differences are as follows.
The additional junction head fitting 106 is modified as compared to that shown in FIG. 2, where the junction head 110 is also rotatable about a third axis of movement (see FIG. 4B below). ..
The second engaging member 122 is modified to allow a tight engagement that allows rotation around the two axes as compared to FIG. In this simple example, the second engaging member 122 is composed of a ball (or a partially spherical one) at its distal end.

The associated third adjusting member 131 is provided at the first adjusting position 132 and may be, for example, a properly sized socket, recess, or groove. Here, a socket arranged along the third moving axis 177 is shown. The firm engagement causes the ball to align with the distal end of the second engaging member 122 along the first moving shaft 170 and the second moving shaft 175, and then displace along the third moving shaft 177. The junction head 110 is placed in the first adjustment position 132 so as to allow rotation around the pivot axis 115 and thereby rotation (tilt) of the contact surface 185 around the second moving axis 175. It may be realized by moving to.

The left figure of FIG. 4B schematically shows the joining head 110 and the pickup member 180. On the right side, the coordinate system is shown, the first movement axis 170 (Z) is shown vertically and the third movement axis 175 (Y) is shown horizontally. In this example, the junction head 110 is seen along the third moving axis 177 (Y). In other words, the third moving axis 177 (X) emerges from the page (paper plane). In this example, the junction head 110 is also configured and arranged to rotate around a third moving axis 177 (Y). The junction head 110 is pivotally connected to the remaining device 100 via an additional junction head fitting 106, which also facilitates rotation around an additional pivot axis 116 and a third moving axis 177. To. The additional tilt position blocking portion 118 is mounted between the additional joint head mounter 106 and the remaining device 100 and rotates around a third moving shaft 177, i.e., around a third moving shaft 177. Maintain the tilt adjustment of. Further tilt position blocking portions 118 can also be considered to block unwanted tilt movements around the third movement axis 177. Optionally, the additional tilt position blocker 118 may also be configured to use only the mechanical principle (passive version). The third adjusting member 131 associated at the first adjusting position 132 is shown on the third moving axis 177, where the socket 131 is not visible here and is therefore marked with a dashed line. Rigid engagement is carried out in the same manner as in FIG. 4A. That is, the balls 122 are aligned along the first movement axis 170 and the second movement axis 175, then move along the third movement axis 177, and the movement of the first 170 and the third 177. Subsequent movement along the second 175 movement axis at a substantially constant position along the axis is further rotation around the pivot axis 116, and thus around the third 177 movement axis. The joining head 110 is moved so as to promote the rotation (tilt) of the contact surface 185.

In summary, in the embodiment of FIG. 4, the apparatus 100 is configured and arranged so that the junction head 110 can rotate as follows.
When a corresponding force is applied along the third moving shaft 177 to the tip (distal end) of the additional engaging member 121, around the pivot axis 115 (and around the second moving shaft 175). Rotate.
When a corresponding force is applied to the tip (distal end) of the additional engaging member 121 along the second moving shaft 175, around the additional pivot axis 116 (and around the third moving shaft 177). Rotate.

The advantage is that the component 150 for the mounting process is preferably parallel to the board 160 at the board position 165 and the required tilt by the two moving axes reduces the risk of tilt problems that interrupt the operation of the device 100. That is.

It will be apparent to those of skill in the art that different configurations and movements can be used to ensure the same rotation.

For example, in FIG. 4A, the movement of the junction head 110 causes the contact surface 185 to rotate around the second movement shaft 175 after latching to the socket 131 along the third movement shaft 177. In the configuration shown, movement from socket 131 along a third movement axis 177 can result in release . However, these can also be provided by providing different types of mesh pairs, such as pinions and racks disposed in both directions.

A single engaging member may also be used with two or more adjusting members in each of two or more engaging positions. For example, in the case of spherical engaging members, additional sockets may be provided at additional adjustment positions.

Since the junction head 110 is moved between these latch positions, the adjustment positions are considered different if a firm engagement cannot be maintained, and for FIGS. 4A and 4B, the adjustment positions are not considered different. The device 100 rotates around the same axis of motion, to different degrees around the same axis of motion, around different axes of motion, and in different directions of rotation around the same axis of motion in these different positions. , And any combination thereof.

A single adjusting member may also be used with two or more engaging members in each of two or more adjustment positions. For example, if the junction head 110 comprises two spherical engaging members, a socket may be provided to the device 100. The present invention has two adjustment positions because the joining head 110 is moved between the two adjustment positions and therefore tight engagement is not possible. The device 100 may be configured such that the device 100 is in the following different positions. Rotation around the same axis of motion , different degrees of rotation around the same axis of motion, rotation around different axes of motion, different directions of rotation around the same axis of motion, and any combination of these.

The one or more engaging members may also be used with the one or more adjusting members, which can increase flexibility.

FIG. 5 shows an outline of a method 200 for mounting a component on a substrate according to the present invention. The procedure includes:
-To provide the substrate 160 with a joining head 110 displaceable along a first moving shaft 170 and a second moving shaft 175, wherein the second moving shaft 175 is a first moving shaft. To provide a junction head, which is substantially perpendicular to the 170,
The 220 is to provide the pickup member 180 as a receiving element having a contact surface 185, wherein the pickup member 180 is mounted on the junction head 110 and the contact surface 185 is releasably mountable or releasable to the component 150. To provide a pickup member that is configured and arranged in such a manner and is further configured and arranged so that it can rotate around a second moving axis 175.
To provide a first engaging member 120 mounted on the -230 junction head 110 and
-240 To provide the first adjusting member 130 to the first adjusting position 132 for a firm engagement with the first engaging member 120.
Moving the -250 junction head 110 to the first adjustment position 132 and
-260 Firmly engaging the first engaging member 120 with the first adjusting member 130,
-270 Moving the joining head 110 along the first moving shaft 170 with respect to the first adjusting member 130, wherein the contact surface 185 rotates and moves around the second moving shaft 175. When,
-280 Releasing the first engaging member 120 from the first adjusting member 130 and
-290 Moving the joining head 110 to the substrate position 165, 203, at which the joining head 110 maintains rotation of the contact surface 185 around the second moving shaft 175.

FIG. 6 shows an alternative tilt adjusting embodiment with a pair of rack and pinion engaging members that can be used in any of the embodiments of the present invention. The joining head 110 is arranged so as to rotate around the second moving shaft 175, as in FIG. 2.

The left figure of FIG. 6 schematically shows the joining head 110 and the pickup member 180. On the right side, the coordinate system is shown, the first movement axis 170 (Z) is shown vertically and the third movement axis 177 (Y) is shown horizontally. In this example, the junction head 110 is seen along the second moving axis 175 (X), i.e., the second moving axis 175 (X) is in the page.

The junction head 110 is attached to the remaining device 100 by the junction head fitting 105 so that it can be swiveled around the pivot axis 115.

The additional engaging member 121 is composed of a pinion located at the distal end. Internally, the conventional spindle screw drive (not shown) is mounted on the pinion 121 such that the rotation of the pinion causes the rotation of the spindle screw drive. The spindle screw drive also also applies to the junction head 110 in such a way that the rotation of the spindle screw drive facilitates the rotation of the junction head 110 around the pivot shaft 115 and around the second moving axis. It will be installed. This results in the rotation (tilt) of the contact surface 185 around the second moving shaft 175. The tilt adjusting mechanism is further composed of an elastic member 119 attached between the joining head 110 and the joining head mounting tool 105. This provides a corresponding preload so that the junction head 110 is preloaded with the spindle screw drive device. This is an alternative mechanism for blocking the tilt position. In this example, the rotation around the second moving shaft 175 is locked.

An additional adjustment member provided at the first adjustment position 132 is a rack 133 configured and arranged to interact with the pinion 121 so that the pinion 121 can rotate. In this example, the rack 133 extends along the first moving axis 170.

The engagement is such that the pinion is aligned at the distal end of the pinion 121 along the first moving axis 170, the second moving axis 175, and the third moving axis 177 so that the pinion 121 and the rack 133 are in close proximity. It may be done by moving the joining head 110 to the first adjustment position 132 so as to be done. Displacement along the second moving shaft 175 to the rack 133 ensures a firm engagement. Subsequent movement along the first moving shaft 170 at substantially constant positions along the second moving shaft 175 and the third moving shaft 177 causes rotation of the pinion 121 and a spindle screw drive (Figure). (Not shown) results in rotation and rotation of the junction head 110 around the pivot axis 115. Therefore, rotation (tilt) of the contact surface 185 around the second axis 175 is also provided.

The available swivel range depends on the engagement position of the pinion 121 on the first moving shaft 170. If the reach is insufficient for the pinion to reach one end of the rack 133, the pinion 121 may be released , moved to the other end of the rack 133, and re-tightly engaged.

The rotation (tilt) of the contact surface 185 around the second moving shaft 175 is held by the preload of the joining head 110 with respect to the spindle screw drive by the elastic member 119.

The suitable elastic member 119 may be, for example, a spring, a rubber belt, or a rubber band.

In this example, the rack 133 extends along the first moving axis 170, but to those skilled in the art, the device 100 will pinion using the rack 133 extending along the second moving axis 175. It is clear that it can be configured to allow 121 rotations.

FIG. 7 shows a further embodiment of the present invention. A joining head 110 is provided that can rotate around a second moving shaft 175 and around a third moving shaft 177. The tilt adjusting and holding mechanism is similar to that shown in FIG.

The joining head is composed of two pinions 121. One is configured and arranged to rotate around a second moving shaft 175 and the other is configured and arranged to rotate around a third moving shaft 177.

The device 100 is configured and arranged to provide two racks 133, one at the first adjustment position 132 and the other at the second adjustment position 137.

The tight engagement at the first adjustment position 132 is such that the pinion at the distal end of the pinion 121 is aligned along the first movement axis 170, the second movement axis 175, and the third movement axis 177. , Achieved by moving the junction head 110 to the first adjustment position 132, where the pinion 121 and the rack 133 are in close proximity together. The displacement along the first moving shaft 170 to the rack 133 ensures a firm engagement. Subsequent movement along the second moving shaft 175 at substantially constant positions along the first moving shaft 170 and the third moving shaft 177 causes rotation of the pinion 121 and a spindle screw drive (Figure). (Not shown) results in rotation and rotation of the junction head 110 around the second moving shaft 175. Therefore, rotation (tilt) of the contact surface 185 (not shown) around the second moving shaft 175 is also provided.

The tight engagement at the second adjustment position 137 allows the pinion to be aligned at the distal end of the pinion 121 along the first movement axis 170, the second movement axis 175, and the third movement axis 177. , Achieved by moving the junction head 110 to the second adjustment position 137, where the pinion 121 and the rack 133 are in close proximity together. The displacement along the first moving shaft 170 to the rack 133 ensures a firm engagement. Subsequent movement along the third moving shaft 177 at substantially constant positions along the first moving shaft 170 and the second moving shaft 175 causes rotation of the pinion 121 and a spindle screw drive (Figure). (Not shown) results in rotation and rotation of the junction head 110 around the third moving shaft 177. Therefore, rotation (tilt) of the contact surface 185 (not shown) around the third moving shaft 177 is also provided.

The rack 133 in the first adjustment position 132 extends along the second moving axis 175. The rack 133 in the second adjustment position 137 extends along the third moving axis 177. As mentioned above with respect to FIG. 6, different orientations of each rack 133 may be used.

In another aspect of the invention, the device 100 may be configured and arranged to use motion along the axis of motion to allow rotation (tilt) around the same axis of motion.

In the configuration shown in FIG. 7, the apparatus 100 also has the junction head 110 moved between the first adjustment position 132 and the second adjustment position 137 substantially by movement along the first movement axis 170. It is configured to be able to be moved. Both rotations need to be adjusted to achieve high planar parallelism between component 150 and the board, thus reducing tilt adjustment time when the adjustment positions are close together. .. Limiting movement to one axis of movement can further reduce the time required. Further shortening can also be achieved by ensuring that the release direction of one adjustment position substantially corresponds to the engagement direction of the other adjustment position.

In general, two types of tilt error can occur. Static tilts due to mechanical and angular tolerances within the device 100, and (particularly) static tilts due to mechanical and angular tolerances at the junction head 110, pickup member 180, and contact surface 185. Other causes of tilt error are dynamic factors such as thermal expansion and wear of mechanical parts. In conventional equipment, tilt is only confirmed after 160 100-500 substrates each. The present invention provides relatively inexpensive and relatively fast adjustment options that allow tilting to be seen and adjusted after each substrate or during operation on the substrate.

In addition, it may be advantageous to provide a measuring and / or monitoring mechanism for one or more of the gradients of the contact surface 185, for this allows for some automatic monitoring. Because.

A high degree of automation determines the degree of displacement along the first moving axis 170 and is configured and arranged to obtain the desired rotation around the second moving axis 175 and / or the third moving axis 177. The processor may be provided by further configuring and arranging the processor to stop the displacement along the first axis 170 when the desired tilt of the contact surface 185 is reached. ..

It also provides tilt sensors configured and arranged to measure the tilt of the substrate 160, provides a processor (or further configures an existing processor), and uses the measured tilt of the board to provide a first. It may also be useful to determine the degree of displacement along the axis 170 of the to obtain the desired rotation around the second moving axis 175 and / or the third moving axis 177. High accuracy and reliability can be achieved by monitoring the tilt of the substrate 160.

Additional or alternative, the measurement of one or more forces on the contact surface 185 during operation, in particular the assembly of the component 150 on the substrate 160, may provide information on any possible tilt problems.

Additional or alternative, the temperature of the component 150 and / or the substrate 160 and / or the contact area 185 can be measured and / or monitored. The measured temperature is used to determine the degree of displacement along the first axis 170 to achieve the desired rotation around the second axis 175 and / or the third axis 177. By providing a processor for this (or a further configuration of an existing processor), a high degree of compensation for dynamic tilt errors that occur during operation can be achieved.

In summary, it can be said that the present invention is intended for devices and methods for mounting components on a substrate. Processing is often interrupted during operation because the components are not provided for parallel mounting to the board. In some cases, this can result in breakage of parts and substrates. Tilt control solutions increase the cost, weight, and complexity of the junction head 110 .

Tilt the contact surface 185 using existing drives and / or actuators to enable simplified tilt correction, providing high throughput and high reliability. The tilt correction mechanism is composed of one or more engaging members 120, one or more adjusting members 130, and one or more tilt position blocking portions 117. In some cases passive elements and mechanisms may be used.

100 ... Parts mounting device, 101 ... Joining head support carrier, 102 ... Joining head support, 105 ... Joining head mounter, 106 ... Further joining head mounter, 110 ... Joining head, 115 ... Pivot Shaft, 116 ... Further pivot axis, 117 ... Tilt position blocking portion, 118 ... Further tilting position blocking portion, 119 ... Elastic member, 120 ... First engaging member (eg, pin), 121 ... Further engaging members (eg, pinions), 122 ... second engaging members (eg, balls), 130 ... first adjusting members (eg, grooves), 131 ... third adjusting members (eg, sockets), 132 ... First adjusting member, 133 ... Further adjusting member (eg, rack), 137 ... Second adjusting member, 140 ... Longitudinal axis of bonder head and / or pickup member, 150 ... Parts, 160. ... substrate, 170 ... first moving axis (eg, z), 175 ... second moving axis (eg, x or y), 177 ... third moving axis (eg, y) 180 ... Pickup member, 185 ... contact surface, 190 ... board base, ... 200 ... method for mounting components on board, 203 ... maintaining rotation of contact surface around second moving axis, 210 ..... providing a joining head, 220 ... providing a pickup element having a contact surface, 230 ... providing a first engaging member, 240 ... providing a first adjusting member, 250 ... providing a first joining head. Displacement to the adjustment position, 260 ... Firm engagement of the first engaging member with the first adjusting member, 270 ... Displacement of the joining head along the first moving axis, 275 ... Joining head Rotation around the third moving axis, 280 ... Disengagement of the first engaging member, 290 ... Movement of the joining head to the substrate position

Claims (10)

A method (200) of mounting a component (150) on a substrate (160) on a substrate base (190) provided at a substrate position (165), wherein the method is:
(210) to provide a joining head (110) displaceable along a first moving axis (170) and a second moving axis (175) with respect to the substrate (160). To provide a junction head in which the movement axis (175) of 2 is substantially perpendicular to the first movement axis (170).
(220) to provide a pickup member (180) having a contact surface (185), wherein the pickup member (180) is disposed on the joint head (110) and the contact surface (185). Is configured and arranged to be releasably mountable on the component (150), further configured and arranged such that the contact surface (185) is rotatable around the second moving axis (175). To provide a pickup member that has been placed,
The joint surface (185) is configured to apply a force to the joint head (110) along the third movement axis (177) so that it rotates around the second movement axis (175). To provide (230) a first engaging member (120 , 121, 121a, 122 ) disposed on the joined head (110), said third moving shaft (177). ) Provide a first engaging member (120) that is substantially perpendicular to the first moving axis (170) and substantially perpendicular to the second moving axis (175). ) And that
The first adjusting member (130 , 131, 133 , 133a) is placed in the first adjusting position (132) due to the firm engagement with the first engaging member (120 , 121, 121a, 122 ). To provide (240) and
(250) to move the joining head (110) to the first adjusting position (132).
-The first engaging member (120 , 121, 121a, 122 ) is firmly engaged with the first adjusting member (130 , 131, 133 , 133a) (260).
By moving the joining head (110) with respect to the first adjusting member (130 , 131, 133, 133a ) along the first moving axis (170) (270), the third A force is applied along the moving shaft (177) to rotate the contact surface (185) around the second moving shaft (175).
-Release of the first engaging member (120, 121, 121a, 122 ) from the first adjusting member (130 , 131, 133 , 133a) (280).
The joining head (110) is moved towards the substrate position (165) (290), wherein the joining head (110) is in contact with the second moving axis (175). A method comprising maintaining (203), displacing (290) the rotation of a surface (185). The above method
The joining head (110) is configured and arranged so as to be displaceable with respect to the substrate (160) along the third moving axis (177).
The contact surface (185) is configured and arranged so as to be rotatable around the third moving axis (177).
A force is applied to the joining head (110) along the second moving axis (175) so that the joining surface (185) rotates around the third moving axis (177). And to provide a second engaging member ( 121b ) disposed on the joining head (110).
-Providing a second adjusting member ( 133b ) at the second adjusting position (137), wherein the second adjusting member ( 133b ) and the second engaging member ( 121b ). To provide a second adjusting member ( 133b ) that is configured and arranged to engage tightly.
-Move the joining head (110) to the second adjusting position (137), and
-To firmly engage the second engaging member ( 121b ) with the second adjusting member ( 133b ),
By moving the joining head (110) with respect to the second adjusting member ( 133b ) along the first moving shaft (170) (270), the second moving shaft (175) can be reached. A force is applied along to rotate the contact surface (185) around the third moving axis (177).
-Release of the second engaging member ( 121b ) from the second adjusting member ( 133b ) and
The joining head (110) is moved to the substrate position (165) (290), and the joining head (110) is the contact surface (the contact surface) around the third moving axis (177). 185) The method of claim 1, further comprising maintaining and moving (290) the rotation. The joining head (110) is an elastic member (119) , a spring member (119) , a magnetic member, an electric member, an electromagnetic member, a vacuum member, a gas power member, a friction member, a hydraulic member, an induction member, or any of these. The method of claim 1 or 2, wherein the combination is configured and arranged to maintain rotation of the contact surface (185 ) (203). The above method
To measure the rotation of the contact surface (185) around the first moving axis (170) and / or the second moving axis (175) and / or the third moving axis (177). To provide tilt sensors configured and deployed,
The degree of displacement along the first movement axis (170) is determined and the first movement axis (170) and / or the second movement axis (175) and / or the third movement axis (177). To provide a processor configured and arranged to obtain the desired rotation around).
Further configuring and arranging the processor to stop displacement along the first moving axis (170) when the desired tilt of the contact surface (185) is reached. (200), the method according to any one of claims 1 to 3. The above method
To provide a tilt sensor configured and arranged to measure the tilt of the substrate (160).
The measured tilt of the substrate (160) is used to determine the degree of displacement along the first moving axis (170) and the first moving axis (170) and / or second. To provide a processor configured and arranged to obtain the desired rotation around a moving axis (175) and / or a third moving axis (177) of (200), claim 1. The method according to any one of 4 to 4. The above method
The temperature and / or temperature of the junction head support carrier (101) and / or the junction head fitting (102) and / or the junction head (110) and / or the tilt sensor and / or the contact surface (185). To provide a temperature sensor configured and arranged to measure relative temperature,
The measured temperature of the contact surface (185) is used to determine the degree of displacement along the first moving axis (170) and the first moving axis (170) and / or the first. (200), further comprising providing a processor configured and arranged to obtain the desired rotation around a second moving axis (175) and / or a third moving axis (177). The method according to any one of 1 to 5. The above method
To provide a temperature sensor configured and arranged to measure the temperature and / or relative temperature of the substrate (160) and / or the substrate base.
The degree of displacement along the first moving axis (170) is determined and the measured temperature of the substrate (160) is used to determine the first moving axis (170) and / or the first. Further comprising providing a processor configured and arranged to obtain the desired rotation around a second moving axis (175) and / or a third moving axis (177) (200). The method according to any one of 1 to 6. The method further comprises a method of controlling the rotation of the contact surface (185) of the pickup member (180).
-Measure the tilt and / or rotation of the junction head (110) with respect to the component (150) attached to the substrate (160) and / or the contact surface (185) and / or the substrate (160). To measure, at least the position of the junction head is optically detectable by the reference mark.
Determining the degree of compensation for the first and second compensation of said tilt and / or rotation from the measured values.
-Move the junction head (110) to a first position that is compensated by the degree of compensation.
-The first engaging member (120) is firmly engaged with the first adjusting member (130) (260), and
・ Applying the first compensation mentioned above
-Move the junction head (110) to a second position that is compensated by the degree of compensation.
-The firm engagement of the second engaging member ( 122 ) with the first adjusting member ( 130 ).
-Including applying the second compensation mentioned above ,
The method according to any one of claims 1 to 7 , wherein the reference mark is used to determine the degree of the first and second compensation . A device (100) for mounting a component (150) on a board (160) provided on a board position (165), wherein the device (100) is:
A joining head (110) displaceable along a first moving axis (170) and a second moving axis (175) with respect to the substrate (160), the second moving axis (175). With the joining head (110), which is substantially perpendicular to the first moving axis (170).
A pickup member (180) having a contact surface (185), wherein the pickup member (180) is disposed on the joint head (110), and the contact surface (185) is a component (150). ) Is configured and arranged to be releasably mountable, and the contact surface (185) is further configured and arranged to be rotatable around the second moving axis (175). The pickup member (180), which is configured and arranged in such a manner, and
The contact surface (185) is configured to apply a force to the joining head (110) along the third moving axis (177) so that it rotates around the second moving axis (175). A first engaging member (121, 121a ) arranged on the joining head (110), wherein the third moving shaft (177) is attached to the first moving shaft (170). With the first engaging member (121, 121a ), which is substantially at right angles to the second moving axis (175).
The first adjusting member (133, 133a ) in the first adjusting position (132) for firm engagement with the first engaging member ( 121 , 121a) is provided.
moreover,
The joining head (110) is displaceable to the first adjusting position (132), and the first engaging member (121, 121a ) is with the first adjusting member (133, 133a ). Tightly engaged and
The third adjustment member (110) is displaceable with respect to the first adjustment member (133, 133a ) along the first movement axis (170) during engagement. A force is applied along the moving shaft (177) to rotate the contact surface (185) around the second moving shaft (175).
The first engaging member (121, 121a ) is removable or removably removable from the first adjusting member (130).
The junction head (110) is displaceable towards the substrate position (165) and the contact surface (185) maintains rotation about the second moving axis (175) (203). ) The device (100) configured and arranged as such. The junction head (110) is further configured and arranged so that it can be displaced with respect to the substrate (160) along the third moving axis (177).
The contact surface (185) is further arranged so as to be rotatable around the third moving axis (177).
The device (100) is
A force is applied to the joining head (110) along the second moving shaft (175) so that the contact surface (185) rotates around the third moving shaft (177). And a second engaging member ( 121b ) disposed on the joining head (110), which is arranged.
A second adjusting member ( 133b ) in the second adjusting position (137), wherein the second adjusting member (135) firmly engages with the second engaging member ( 121b ). A second adjusting member ( 133b ), which is configured and arranged in such a manner, is further provided.
moreover,
The joining head (110) is displaceable to the second adjusting position (137), and the second engaging member ( 122 ) is firmly engaged with the second adjusting member ( 133b ). Has been
The joining head (110) is displaceable with respect to the second adjusting member ( 133b ) along the first moving shaft (170), so that the joining head (110) can be displaced to the second moving shaft (175). A force is applied along it to rotate the contact surface (185) around the third moving axis (177).
The second engaging member ( 122 ) can be released or re-released from the second adjusting member ( 133b ).
After the joint head (110) is released from the second adjusting member ( 133b ), the rotation (203) of the contact surface (185) around the third moving axis (177) is performed. The device of claim 9, further configured and arranged to maintain (203).

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