JPWO2008114381A1 - Heat sink, electronic device, and method of manufacturing electronic device - Google Patents

Heat sink, electronic device, and method of manufacturing electronic device Download PDF

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JPWO2008114381A1
JPWO2008114381A1 JP2009504981A JP2009504981A JPWO2008114381A1 JP WO2008114381 A1 JPWO2008114381 A1 JP WO2008114381A1 JP 2009504981 A JP2009504981 A JP 2009504981A JP 2009504981 A JP2009504981 A JP 2009504981A JP WO2008114381 A1 JPWO2008114381 A1 JP WO2008114381A1
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heat
heat sink
base
electronic device
heating element
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安斎　久雄
久雄 安斎
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Fujitsu Ltd
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Fujitsu Ltd
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    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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Abstract

本発明はヒートシンク及び電子装置及び電子装置の製造方法に係り、半導体チップに熱的に接続されるベースと複数の放熱フィンを備えたヒートシンクにおいて、前記放熱フィンの内、半導体チップからの熱伝導温度が高い中央位置に配設された放熱フィンを長く形成すると共に、これより熱伝導温度が低くなるに従い放熱フィンを漸次短く形成する。また、放熱フィンが、ベースより直立した直立部と、このから外側に向け略直角に折り曲げられた水平部とを有する構成とする。The present invention relates to a heat sink, an electronic device, and a method for manufacturing the electronic device. The heat sink includes a base thermally connected to a semiconductor chip and a plurality of heat radiation fins. The heat dissipating fins disposed at the center position where the height is high are formed longer, and the heat dissipating fins are gradually formed shorter as the heat conduction temperature becomes lower. Moreover, it is set as the structure which a radiation fin has an upright part which stood upright from the base, and a horizontal part bent by the substantially right angle toward the outer side from this.

Description

本発明はヒートシンク及び電子装置及び電子装置の製造方法に係り、特に複数の放熱フィンを有したヒートシンク及び電子装置及び電子装置の製造方法に関する。   The present invention relates to a heat sink, an electronic device, and an electronic device manufacturing method, and more particularly, to a heat sink having a plurality of heat radiation fins, an electronic device, and an electronic device manufacturing method.

例えば、パワーデバイス等の電子装置は、高密度化及び高出力化が図られており、これに伴い発生する発熱量も増大する傾向にある。このため，これらの発熱する電子装置は、冷却を行うためのヒートシンクが設けられている。通常、この種のヒートシンクは、発熱体となる電子素子と熱的に接続されるベース上に、複数の放熱フィンを設けた構成とされている。   For example, an electronic device such as a power device has been increased in density and output, and the amount of heat generated accompanying this increase tends to increase. For this reason, these heat generating electronic devices are provided with a heat sink for cooling. Usually, this type of heat sink has a configuration in which a plurality of heat radiating fins are provided on a base that is thermally connected to an electronic element serving as a heating element.

また放熱フィンの構造としては、例えば特許文献１及び特許文献２に開示されものが知られている。図１に示されるヒートシンク１Ａは、特許文献１に開示されているものを模倣的に示したものである。また、図２に示されるヒートシンク１Ｂは、特許文献２に開示されているものを模倣的に示したものである。   Moreover, as a structure of a radiation fin, what is disclosed by patent document 1 and patent document 2, for example is known. The heat sink 1A shown in FIG. 1 imitates what is disclosed in Patent Document 1. Moreover, the heat sink 1B shown in FIG. 2 imitates what is disclosed in Patent Document 2.

各図に示すように、ヒートシンク１Ａ，１Ｂは、発熱体となる電子素子５と熱的に接続されるベース２上に複数の放熱フィン３Ａ，３Ｂを形成した構成とされている。このように複数の放熱フィン３Ａ，３Ｂを設けることにより、放熱フィン３Ａ，３Ｂの全体としての放熱面積を増大させることができ放熱効率を高めることができる。   As shown in each figure, the heat sinks 1A and 1B have a configuration in which a plurality of radiating fins 3A and 3B are formed on a base 2 that is thermally connected to an electronic element 5 serving as a heating element. By providing the plurality of heat radiation fins 3A and 3B in this manner, the heat radiation area of the heat radiation fins 3A and 3B as a whole can be increased, and the heat radiation efficiency can be increased.

尚、図１及び図２に示される状態において、ヒートシンク１Ａ，１Ｂを冷却する冷却風は、図の紙面に対して垂直方向に送風される。   In the state shown in FIGS. 1 and 2, the cooling air for cooling the heat sinks 1A and 1B is blown in a direction perpendicular to the drawing sheet.

ここで、図１に示されるヒートシンク１Ａに注目すると、このヒートシンク１Ａは放熱フィン３Ａが全て等しい長さとされている。このように、放熱フィン３Ａが全て等しい長さであると、ヒートシンク１Ａはその全体形状が略直方体形状となる。このため、このヒートシンク１Ａは後述するようにスペース効率が高く、よって従来では一般に広く用いられてきた。   Here, paying attention to the heat sink 1A shown in FIG. 1, the heat sink 1A has all the radiation fins 3A of equal length. As described above, when all the heat dissipating fins 3A have the same length, the heat sink 1A has a substantially rectangular parallelepiped shape as a whole. For this reason, the heat sink 1A has high space efficiency as will be described later, and thus has been widely used in the past.

これに対して図２に示されるヒートシンク１Ｂは、ベース２の中央位置における放熱フィン３Ｂの長さが長く、外側に向かうに従い放熱フィン３Ｂの長さが短くなるよう設定されている。   On the other hand, the heat sink 1B shown in FIG. 2 is set such that the length of the radiating fins 3B at the center position of the base 2 is long and the length of the radiating fins 3B is shortened toward the outside.

図２は、ベース２における温度分布を示している。同図におけるＡ１〜Ａ３は、図２に示したベース２のＡ１〜Ａ３の位置に対応している。図３に示すように、発熱体となる電子素子５が配設される位置Ａ２は、最も高い温度となっており、これより外側に向かうに従いベース２の温度は低くなっている。   FIG. 2 shows the temperature distribution in the base 2. A1 to A3 in the figure correspond to the positions of A1 to A3 of the base 2 shown in FIG. As shown in FIG. 3, the position A2 where the electronic element 5 serving as a heating element is disposed has the highest temperature, and the temperature of the base 2 decreases toward the outside.

よって、ヒートシンク１Ｂのようにベース２の温度が高い部位に、放熱効率が高い長い放熱フィン３Ｂを配置し、外側に向かうに従い温度低下に伴い放熱フィン３Ｂの長さを短くすることにより、放熱効率が高く無駄のないヒートシンク１Ｂを実現できる。また、放熱フィン３Ｂの長さはベース２の温度分布に対応しており、不要に長く設定されていないため、材料の低減及び軽量化を図ることができる。
特開２００６―１０８２３９号公報 特開２００３―００８２６４号公報 Therefore, by disposing a long heat radiation fin 3B having a high heat dissipation efficiency in a part where the temperature of the base 2 is high like the heat sink 1B, and shortening the length of the heat radiation fin 3B as the temperature decreases toward the outside, the heat radiation efficiency is increased. Therefore, it is possible to realize a heat sink 1B that is high and has no waste. Moreover, since the length of the radiation fin 3B corresponds to the temperature distribution of the base 2 and is not set to be unnecessarily long, the material can be reduced and the weight can be reduced.
JP 2006-108239 A JP 2003-008264 A

ところで電子機器内において、電子装置が装着される装着空間は、一般に直方体形状とされている場合が多い。従って、図１に示すような全体的な形状が立方体状であるヒートシンク１Ａは、電子機器への装着性が良好であり電子機器に対するスペース効率は高い。   By the way, in an electronic device, a mounting space in which an electronic device is mounted is generally a rectangular parallelepiped shape in many cases. Therefore, the heat sink 1A having a cubic shape as shown in FIG. 1 has a good mountability to an electronic device and a high space efficiency for the electronic device.

しかしながら、放熱フィン３Ａの長さを全て等しくする場合、放熱フィン３Ａの長さはベース２上における温度が最も高い部位における、最も長い放熱フィン３Ａを基準とする必要がある。このため、図１に示すヒートシンク１Ａは、スペース効率は高いものの、不要な長さの放熱フィン３Ａを形成する必要があるため大型化してしまい、よって材料を多く必要とし、これに伴い重量が重くなってしまうという問題点があった。   However, when all the lengths of the heat radiating fins 3A are made equal, the length of the heat radiating fins 3A needs to be based on the longest heat radiating fins 3A in the portion having the highest temperature on the base 2. For this reason, although the heat sink 1A shown in FIG. 1 has high space efficiency, it is necessary to form the radiating fins 3A having an unnecessary length, so that the size of the heat sink 1A is increased. There was a problem of becoming.

一方、図２に示すヒートシンク１Ｂは、上記のように放熱効率は高いものの、正面視した形状が山形状である。このため、ヒートシンク１Ｂを設けた電子装置では、電子機器内にヒートシンク１Ｂの形状に合った装着空間を形成する必要があり、電子機器内にいわゆるデッドスペースが生じやすくなる。よって、ヒートシンク１Ｂでは、これを電子機器に装着する際のスペース効率が低下するという問題点があった。   On the other hand, the heat sink 1B shown in FIG. 2 has a high heat radiation efficiency as described above, but has a mountain shape when viewed from the front. For this reason, in the electronic device provided with the heat sink 1B, it is necessary to form a mounting space that matches the shape of the heat sink 1B in the electronic device, so that a so-called dead space is likely to occur in the electronic device. Therefore, the heat sink 1B has a problem that the space efficiency at the time of mounting it on an electronic device is lowered.

本発明は、上述した従来技術の問題を解決する、改良された有用なヒートシンク及び電子装置及び電子装置の製造方法を提供することを総括的な目的とする。   SUMMARY OF THE INVENTION It is a general object of the present invention to provide an improved and useful heat sink, electronic device, and method for manufacturing an electronic device that solve the above-described problems of the prior art.

本発明のより詳細な目的は、スペース効率の向上と放熱効率の向上を共に図ることができるヒートシンク及び電子装置及び電子装置の製造方法を提供することにある。   A more detailed object of the present invention is to provide a heat sink, an electronic device, and a method of manufacturing the electronic device that can improve both space efficiency and heat dissipation efficiency.

この目的を達成するために、本発明は、発熱体に熱的に接続されるベースと、該ベースの前記発熱体との接続面と反対側面から延出するよう形成された複数の放熱フィンを備えたヒートシンクにおいて、前記複数の放熱フィンの内、前記発熱体からの熱伝導温度が高い部位に配設された前記放熱フィンを長く形成すると共に、これより前記熱伝導温度が低くなるに従い前記放熱フィンを短く形成し、かつ、前記放熱フィンを外側に向け折り曲げたような形状としたことを特徴とするものである。   In order to achieve this object, the present invention comprises a base thermally connected to a heating element, and a plurality of radiating fins formed so as to extend from a side surface opposite to the connection surface of the base with the heating element. In the heat sink provided, the heat dissipating fins disposed in a portion where the heat conduction temperature from the heating element is high among the plurality of heat dissipating fins are formed longer, and the heat dissipating as the heat conduction temperature becomes lower than that. The fins are formed short, and the heat dissipating fins are bent outward.

また、上記発明に係るヒートシンクにおいて、前記ベース及び前記放熱フィンを冷却風の流れ方向から見た場合、前記ベース及び前記放熱フィンの外形形状が矩形状とされた構成としてもよい。   Moreover, the heat sink which concerns on the said invention WHEREIN: When the said base and the said radiation fin are seen from the flow direction of a cooling wind, it is good also as a structure by which the external shape of the said base and the said radiation fin was made into the rectangular shape.

また、上記発明に係るヒートシンクにおいて、前記放熱フィンは逆Ｊ字状に折り曲げられた構成としてもよい。   Moreover, the heat sink which concerns on the said invention WHEREIN: The said radiation fin is good also as a structure bent by reverse J shape.

また、上記の目的を達成するために、本発明は、発熱体に熱的に接続されるベースと、該ベースの前記発熱体との接続面と反対側面から延出するよう形成された複数の放熱フィンを備えたヒートシンクにおいて、前記複数の放熱フィンの内、前記発熱体からの熱伝導温度が高い部位に配設された前記放熱フィンを長く形成すると共に、これより前記熱伝導温度が低くなるに従い前記放熱フィンを短く形成し、かつ、前記放熱フィンを、前記ベースより直立した直立部と、該直立部から外側に向け略直角に折り曲げられた水平部とにより構成したことを特徴とするものである。   In order to achieve the above object, the present invention includes a base that is thermally connected to a heating element, and a plurality of bases that are formed to extend from a side surface opposite to the connection surface of the base with the heating element. In the heat sink provided with the heat radiation fin, the heat radiation fin disposed at a portion where the heat conduction temperature from the heating element is high among the plurality of heat radiation fins is formed longer, and the heat conduction temperature becomes lower than this. The heat radiating fins are formed to be short, and the heat radiating fins are composed of an upright portion standing upright from the base and a horizontal portion bent substantially perpendicularly from the upright portion toward the outside. It is.

また、上記発明に係るヒートシンクにおいて、前記ベース及び前記放熱フィンを冷却風の流れ方向から見た場合、前記ベース及び前記放熱フィンの外形形状が矩形状とされた構成としてもよい。   Moreover, the heat sink which concerns on the said invention WHEREIN: When the said base and the said radiation fin are seen from the flow direction of a cooling wind, it is good also as a structure by which the external shape of the said base and the said radiation fin was made into the rectangular shape.

また、上記発明に係るヒートシンクにおいて、前記水平部の上面に情報表示部を設けた構成としてもよい。   In the heat sink according to the above invention, an information display unit may be provided on the upper surface of the horizontal part.

また、上記発明に係るヒートシンクにおいて、前記放熱フィンは逆Ｌ字状に折り曲げられている構成としてもよい。   Moreover, the heat sink which concerns on the said invention WHEREIN: The said radiation fin is good also as a structure bent by the reverse L shape.

また、上記の目的を達成するために、本発明に係る電子装置は、発熱体となる電子素子に熱的に接続されるベースと、該ベースの前記発熱体との接続面と反対側面から延出するよう形成された複数の放熱フィンを備えており、前記複数の放熱フィンの内、前記発熱体からの熱伝導温度が高い部位に配設された前記放熱フィンを長く形成すると共に、これより前記熱伝導温度が低くなるに従い前記放熱フィンを短く形成し、かつ、前記放熱フィンを、前記ベースより直立した直立部と、該直立部から外側に向け略直角に折り曲げられた水平部とにより構成したヒートシンクを有することを特徴とするものである。   In order to achieve the above object, an electronic device according to the present invention includes a base thermally connected to an electronic element serving as a heating element, and a base extending from a side opposite to the connection surface of the heating element. A plurality of heat dissipating fins formed so that the heat dissipating fins are disposed long in a portion of the heat dissipating fins where the heat conduction temperature is high, and The heat dissipating fins are formed to be shorter as the heat conduction temperature becomes lower, and the heat dissipating fins are composed of an upright part standing upright from the base and a horizontal part bent at a substantially right angle from the upright part toward the outside. It is characterized by having a heat sink.

また、上記発明に係る電子装置において、前記ベース及び前記放熱フィンを冷却風の流れ方向から見た場合、前記ベース及び前記放熱フィンの外形形状が矩形状とされた構成としもよい。   Further, in the electronic device according to the above invention, when the base and the radiating fin are viewed from the flow direction of the cooling air, the base and the radiating fin may have a rectangular outer shape.

また、上記発明に係る電子装置において、前記水平部の上面に情報表示部を設けた構成としてもよい。   In the electronic device according to the invention, an information display unit may be provided on the upper surface of the horizontal unit.

また、上記発明に係る電子装置において、前記放熱フィンは逆Ｌ字状に折り曲げられた構成としてもよい。   In the electronic device according to the invention, the heat dissipating fins may be bent in an inverted L shape.

また、上記の目的を達成するために、本発明は、複数の放熱フィンを有したヒートシンクを、搬送装置を用いて発熱体となる電子素子上に搭載する工程を有する電子装置の製造方法において、前記ヒートシンクの前記複数の放熱フィンを、前記発熱体からの熱伝導温度が高い部位に配設されたものを長く形成すると共に前記熱伝導温度が低くなるに従いその長さを短く形成し、かつ、前記放熱フィンを途中位置で外側に折曲することにより、前記ベースより直立した直立部と、該直立部から略直角に折り曲げられた水平部とを有する構成とし、かつ、前記搬送装置が前記水平部を吸着することにより前記ヒートシンクを前記電子素子上に搬送することを特徴とするものである。   In order to achieve the above object, the present invention provides a method of manufacturing an electronic device including a step of mounting a heat sink having a plurality of heat radiating fins on an electronic element serving as a heating element using a transport device. Forming the plurality of radiating fins of the heat sink as long as those disposed in a portion where the heat conduction temperature from the heating element is high, and shortening the length as the heat conduction temperature decreases; and The heat dissipating fin is bent outward at an intermediate position so as to have an upright portion standing upright from the base and a horizontal portion bent substantially at right angles from the upright portion, and the transport device is the horizontal The heat sink is transported onto the electronic element by adsorbing a portion.

本発明によれば、発熱体からの熱伝導温度が高い部位に配設された放熱フィンを長く形成すると共に、これより熱伝導温度が低くなるに従い放熱フィンを短く形成したことにより、各放熱フィンの長さは発熱体からの熱伝導した熱を放熱するのに適当な長さとなるため、小型化を図りつつ放熱効率を高めることができる。また、放熱フィンを外側に向け折り曲げたような形状としたことにより、ヒートシンクの全体的な形状を調整することができる。このため、ヒートシンクの全体な形状を当該ヒートシンクが装着される装着空間の形状に対応させることも可能となり、スペース効率の向上を図ることができる。   According to the present invention, the heat dissipating fins are formed long in the portion where the heat conduction temperature from the heating element is high, and the heat dissipating fins are shortened as the heat conduction temperature becomes lower. Since the length becomes an appropriate length for radiating the heat conducted from the heating element, the heat radiation efficiency can be improved while reducing the size. Moreover, the overall shape of the heat sink can be adjusted by forming the heat radiating fins so as to be bent outward. For this reason, the overall shape of the heat sink can be made to correspond to the shape of the mounting space in which the heat sink is mounted, and space efficiency can be improved.

第１従来例であるヒートシンクを示す正目図である。It is a front view which shows the heat sink which is a 1st prior art example. 第２従来例であるヒートシンクを示す正目図である。It is a front view which shows the heat sink which is a 2nd prior art example. ヒートシンクのベースの温度分布を示す図である。It is a figure which shows the temperature distribution of the base of a heat sink. 本発明の一実施例である電子装置及びヒートシンクを示す斜視図である。It is a perspective view which shows the electronic device and heat sink which are one Example of this invention. 本発明の一実施例であるヒートシンクを示す正面図である。It is a front view which shows the heat sink which is one Example of this invention. 本発明の一実施例であるヒートシンクの第１変形例を示す正面図である。It is a front view which shows the 1st modification of the heat sink which is one Example of this invention. 本発明の一実施例であるヒートシンクの第２変形例を示す正面図である。It is a front view which shows the 2nd modification of the heat sink which is one Example of this invention. 本発明の一実施例である電子装置の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the electronic device which is one Example of this invention.

符号の説明Explanation of symbols

１０Ａ，１０Ｂ 半導体装置
２０ 半導体チップ
２１ バンプ
２２ 実装基板
３０Ａ〜３０Ｃ ヒートシンク
３１ ベース
４０〜４８ 放熱フィン
４０ａ〜４８ａ 直立部
４１ｂ〜４７ｂ 水平部
４９ 中央フィン
５０〜５８ 放熱フィン
５０ａ〜５８ａ 直立部
５１ｂ〜５７ｂ 湾曲部
６０ チップマウンター
６１ リフロー炉
６２ ヒートシンク実装装置
６４ 搬送装置
７０ 情報表示部10A, 10B Semiconductor device 20 Semiconductor chip 21 Bump 22 Mounting substrate 30A-30C Heat sink 31 Base 40-48 Radiation fin 40a-48a Upright part 41b-47b Horizontal part 49 Central fin 50-58 Radiation fin 50a-58a Upright part 51b-57b Curved portion 60 Chip mounter 61 Reflow furnace 62 Heat sink mounting device 64 Conveying device 70 Information display portion

以下、本発明の実施形態について図面を参照しつつ説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１は本発明の一実施例である電子装置１０Ａ及びヒートシンク３０Ａを示す斜視図であり、図５は本発明の一実施例であるヒートシンク３０Ａの正面図である。尚、本実施例では、電子装置として半導体装置を用いた例を示について説明するものとする（以下、電子装置を半導体装置１０Ａという）
先ず、半導体装置１０Ａの全体構成について説明する。半導体装置１０Ａは、大略すると半導体チップ２０、実装基板２２、及びヒートシンク３０Ａ等により構成されている。半導体チップ２０は例えば高周波デバイス或いはパワーデバイス等の発熱を行う電子素子である。FIG. 1 is a perspective view showing an electronic device 10A and a heat sink 30A according to an embodiment of the present invention, and FIG. 5 is a front view of the heat sink 30A according to an embodiment of the present invention. In this embodiment, an example in which a semiconductor device is used as an electronic device will be described (hereinafter, the electronic device is referred to as a semiconductor device 10A).
First, the overall configuration of the semiconductor device 10A will be described. The semiconductor device 10A is roughly composed of a semiconductor chip 20, a mounting substrate 22, a heat sink 30A, and the like. The semiconductor chip 20 is an electronic element that generates heat, such as a high-frequency device or a power device.

この半導体チップ２０は、下部にバンプ２１が形成されており実装基板２２にフリップチップ接合されている。よって、実装状態において、半導体チップ２０は回路形成面と反対側の面（以下、背面という）が上部に位置した状態となっている。   The semiconductor chip 20 has bumps 21 formed on the lower portion thereof and is flip-chip bonded to the mounting substrate 22. Therefore, in the mounted state, the semiconductor chip 20 is in a state where the surface opposite to the circuit formation surface (hereinafter referred to as the back surface) is located at the top.

ヒートシンク３０Ａは、この半導体チップ２０の背面に固定されている。具体的には、ヒートシンク３０Ａは、熱伝導性の高い接着剤を用いて半導体チップ２０の背面に固定されている。尚、ヒートシンク３０Ａの半導体チップ２０への固定方法はこれに限定されるものではなく、サーマルシート等を介して接合する構成としもよい。   The heat sink 30 </ b> A is fixed to the back surface of the semiconductor chip 20. Specifically, the heat sink 30A is fixed to the back surface of the semiconductor chip 20 using an adhesive having high thermal conductivity. In addition, the fixing method to the semiconductor chip 20 of the heat sink 30A is not limited to this, It is good also as a structure joined through a thermal sheet etc.

次に、ヒートシンク３０Ａの構成について説明する。ヒートシンク３０Ａは、ベース３１と、複数（本実施例では８枚）の放熱フィン４０〜４７により構成されている。このヒートシンク３０Ａは、アルミニウム等の熱伝導性の高い金属材料により形成されている。ベース３１と放熱フィン４０〜４７は一体的に形成してしても、またベース３１に放熱フィン４０〜４７を接合することにより形成してもよい。   Next, the configuration of the heat sink 30A will be described. The heat sink 30 </ b> A includes a base 31 and a plurality (eight in the present embodiment) of radiation fins 40 to 47. The heat sink 30A is formed of a metal material having high thermal conductivity such as aluminum. The base 31 and the radiating fins 40 to 47 may be integrally formed, or may be formed by joining the radiating fins 40 to 47 to the base 31.

ベース３１は平板形状とされており、図中下面が半導体チップ２０と熱的に接続された構成とされている。また本実施例では、半導体チップ２０はベース３１の略中央位置で熱的に接続された構成とされている。従って、半導体チップ２０が発明したときの半導体チップ２０の温度分布は、図３に示した分布と略等しい分布となる。   The base 31 has a flat plate shape, and a lower surface in the drawing is thermally connected to the semiconductor chip 20. In the present embodiment, the semiconductor chip 20 is thermally connected at a substantially central position of the base 31. Therefore, when the semiconductor chip 20 is invented, the temperature distribution of the semiconductor chip 20 is substantially equal to the distribution shown in FIG.

放熱フィン４０〜４７は、ベース３１の半導体チップ２０との接続面と反対側面から延出するよう形成されている。この放熱フィン４０〜４７の各長さは、図３に示した温度分布に対応するよう長さが設定されている。   The radiation fins 40 to 47 are formed to extend from the side surface opposite to the connection surface of the base 31 with the semiconductor chip 20. The lengths of the radiation fins 40 to 47 are set so as to correspond to the temperature distribution shown in FIG.

具体的には、半導体チップ２０からの熱伝導温度が高い中央部分に配設された放熱フィン４３，４４を長く形成すると共に、これより熱伝導温度が低くなるに従い、即ち外側に向かうに従い各放熱フィンを短く形成した構成としている。   Specifically, the heat radiation fins 43 and 44 disposed in the central portion where the heat conduction temperature from the semiconductor chip 20 is high are formed longer, and each heat radiation as the heat conduction temperature becomes lower, that is, toward the outside. The fins are formed short.

いま、各放熱フィン４０〜４７の長さをＬ40〜Ｌ4７とすると、中央に位置する放熱フィン４３，４４の長さＬ43，Ｌ44は等しく設定されており（Ｌ43＝Ｌ44）、これより外側に位置する放熱フィン４０〜４２、４５〜４７の各長さＬ40〜Ｌ42、Ｌ45〜Ｌ47は、Ｌ43>Ｌ42>Ｌ41>Ｌ40及びＬ44>Ｌ45>Ｌ46>Ｌ47とされている。Now, assuming that the lengths of the radiation fins 40 to 47 are L 40 to L 47 , the lengths L 43 and L 44 of the radiation fins 43 and 44 located at the center are set equal (L 43 = L 44 ). The lengths L 40 to L 42 and L 45 to L 47 of the radiating fins 40 to 42 and 45 to 47 located on the outer side are L 43 > L 42 > L 41 > L 40 and L 44 > L 45. > L 46 > L 47 .

この構成とすることにより、ベース３１の温度が高い部位に放熱効率が高い長い放熱フィン４３，４４を配置し、外側に向かうに従い温度低下に伴い放熱フィン４０〜４２、４５〜４７の長さを短くすることにより、放熱効率が高く無駄のないヒートシンク３０Ａを実現できる。また、放熱フィン４０〜４７の長さはベース３１の温度分布に対応しており、不要に長く設定されていないため、材料の低減及び軽量化を図ることができる。   By adopting this configuration, long heat radiation fins 43 and 44 having high heat radiation efficiency are arranged in a portion where the temperature of the base 31 is high, and the length of the heat radiation fins 40 to 42 and 45 to 47 is increased as the temperature decreases toward the outside. By shortening, heat sink 30A with high heat dissipation efficiency and no waste can be realized. Moreover, since the length of the radiation fins 40-47 respond | corresponds to the temperature distribution of the base 31, and is not set unnecessarily long, reduction of a material and weight reduction can be achieved.

更に、本実施例に係るヒートシンク３０Ａは、放熱フィン４０〜４７の内、放熱フィン４１〜４６を外側に向け折り曲げたような形状としたことを特徴としている。具体的には、本実施例では各放熱フィン４１〜４６の途中位置を略直角に折り曲げることにより、ベース３１より直立した状態の部位である直立部４１ａ〜４６ａと、この直立部４１ａ〜４６ａから外側に向け略直角方向（水平方向）に延出する水平部４１ｂ〜４６ｂとを形成した構成としている。このように直立部４１ａ〜４６ａ及び水平部４１ｂ〜４６ｂを形成することにより、各放熱フィン４１〜４６は逆Ｌ字状の形状となる。   Furthermore, the heat sink 30A according to the present embodiment is characterized in that the heat radiation fins 41 to 46 of the heat radiation fins 40 to 47 are bent outward. Specifically, in this embodiment, the intermediate positions of the radiation fins 41 to 46 are bent at a substantially right angle so that the upright portions 41a to 46a that are upright from the base 31 and the upright portions 41a to 46a. The horizontal portions 41b to 46b are formed to extend outward in a substantially right angle direction (horizontal direction). Thus, by forming the upright portions 41a to 46a and the horizontal portions 41b to 46b, the respective radiation fins 41 to 46 have an inverted L shape.

本実施例では、各放熱フィン４１〜４６に直立部４１ａ〜４６ａ及び水平部４１ｂ〜４６ｂを形成するに際し、ベース３１に平板状の放熱フィン４１〜４６を形成した後にプレス加工等により折り曲げ形成したものを用いている。しかしながら、鋳造或いは機械加工により予め直立部４１ａ〜４６ａ及び水平部４１ｂ〜４６ｂが形成された放熱フィン４１〜４６を形成しておき、この放熱フィン４１〜４６をベース３１に接合する形成方法を採用してもよい。   In this embodiment, when the upright portions 41a to 46a and the horizontal portions 41b to 46b are formed on the heat radiation fins 41 to 46, the flat heat radiation fins 41 to 46 are formed on the base 31 and then bent by pressing or the like. Something is used. However, the formation method which joins the heat radiation fins 41-46 to the base 31 by forming the heat radiation fins 41-46 in which the upright portions 41a-46a and the horizontal portions 41b-46b are formed in advance by casting or machining is adopted. May be.

ここで、各放熱フィン４１〜４６における折り曲げ位置に注目する。本実施例では、放熱フィン４１〜４６に直立部４１ａ〜４６ａ及び水平部４１ｂ〜４６ｂが形成されることにより、ベース３１及びヒートシンク３０Ａを冷却風の流れ方向から見た状態、即ち図５に示す正面視した状態において、ヒートシンク３０Ａの外形形状が矩形状となるよう構成されている。   Here, attention is paid to the folding positions of the radiation fins 41 to 46. In this embodiment, the upright portions 41a to 46a and the horizontal portions 41b to 46b are formed on the radiation fins 41 to 46, so that the base 31 and the heat sink 30A are viewed from the flow direction of the cooling air, that is, as shown in FIG. When viewed from the front, the outer shape of the heat sink 30A is configured to be rectangular.

ここでいうヒートシンク３０Ａの外形とは、図５に示されるように、ベース３１の図５における接触面、両側面、放熱フィン４０，４７ａの直立部４０ａ，４７ａ、各水平部４１ｂ〜４６ｂの先端部、及び水平部４３ｂ，４４ｂにより形成されるものであり、図５に一点鎖線Ｘで示す形状である。   As shown in FIG. 5, the outer shape of the heat sink 30A here refers to the contact surface and both side surfaces of the base 31 in FIG. 5, the upright portions 40a and 47a of the radiation fins 40 and 47a, and the tips of the horizontal portions 41b to 46b. 5 and the horizontal portions 43b and 44b, and has a shape indicated by a one-dot chain line X in FIG.

具体的には、ベース３１の図５中左側面、放熱フィン４０の直立部４０ａ、及び水平部４１ｂ〜４３ｂの先端部は同一平面に位置するよう構成されている。また、ベース３１の図５中右側面、放熱フィン４７の直立部４７ａ、及び水平部４４ｂ〜４６ｂの先端部は同一平面に位置するよう構成されている。更に、水平部４３ｂと水平部４４ｂは、同一平面に位置するよう構成されている。   Specifically, the left side surface of the base 31 in FIG. 5, the upright portion 40 a of the radiating fin 40, and the tip portions of the horizontal portions 41 b to 43 b are configured to be located on the same plane. Further, the right side surface of the base 31 in FIG. 5, the upright portion 47 a of the radiating fin 47, and the tip portions of the horizontal portions 44 b to 46 b are configured to be located on the same plane. Further, the horizontal portion 43b and the horizontal portion 44b are configured to be located on the same plane.

これにより、ベース３１及びヒートシンク３０Ａを正面視した場合、ヒートシンク３０Ａの外形形状は矩形状となる。また、このように正面視したヒートシンク３０Ａの外形形状が矩形状となることにより、図４に示されるように、ヒートシンク３０Ａの全体的な形状は直方体形状となる。   Thereby, when the base 31 and the heat sink 30A are viewed from the front, the outer shape of the heat sink 30A is rectangular. Further, since the outer shape of the heat sink 30A viewed from the front is a rectangular shape, the overall shape of the heat sink 30A is a rectangular parallelepiped as shown in FIG.

上記のように、ヒートシンク３０Ａが設けられた半導体装置１０Ａが装着される電子機器は、一般に半導体装置１０Ａの装着空間は直方体形状とされている場合が多い。従って本実施例の構成とし、ヒートシンク３０Ａの全体的形状を直方体形状とすることにより、ヒートシンク３０Ａを有した半導体装置１０Ａの電子機器への装着性が良好であり、電子機器に対するスペース効率は高い。   As described above, in many cases, the electronic device to which the semiconductor device 10A provided with the heat sink 30A is mounted generally has a mounting space for the semiconductor device 10A in a rectangular parallelepiped shape. Therefore, by adopting the configuration of the present embodiment and making the overall shape of the heat sink 30A a rectangular parallelepiped shape, the semiconductor device 10A having the heat sink 30A can be easily attached to an electronic device, and the space efficiency for the electronic device is high.

具体的には、先に説明した図２に示された従来技術に係るヒートシンク１Ｂの放熱条件、放熱フィン数、及び発熱体（電子素子５，半導体チップ２０）の発熱量、ヒートシンクの材料等が本実施例に係るヒートシンク３０Ａと同一であったと仮定すると、ヒートシンク１Ｂでは図２中矢印Ｈ２で示す高さが必要となる。   Specifically, the heat dissipation conditions of the heat sink 1B according to the prior art shown in FIG. 2 described above, the number of heat dissipation fins, the heat generation amount of the heating element (electronic element 5, semiconductor chip 20), the material of the heat sink, etc. Assuming that the heat sink is the same as the heat sink 30A according to the present embodiment, the heat sink 1B requires a height indicated by an arrow H2 in FIG.

これに対して、本実施例に係るヒートシンク３０Ａは、放熱フィン４１〜４６が折り曲げられた形状とされているため、その高さは図５に矢印Ｈ１で示す高さとなる。ここで、各高さＨ１，Ｈ２を比較すると、Ｈ１<Ｈ２であることは明白である。更に、ヒートシンク１Ｂ及びヒートシンク３０Ａは、その幅寸法Ｗは略同一となる。よって本実施例に係るヒートシンク３０Ａによれば、従来に比べて小型化を図りつつ、放熱効率を高く維持することができる。   On the other hand, since the heat sink 30A according to the present embodiment has a shape in which the radiation fins 41 to 46 are bent, the height is the height indicated by the arrow H1 in FIG. Here, when the heights H1 and H2 are compared, it is clear that H1 <H2. Furthermore, the heat sink 1B and the heat sink 30A have substantially the same width dimension W. Therefore, according to the heat sink 30A according to the present embodiment, the heat dissipation efficiency can be maintained high while reducing the size as compared with the conventional one.

また、前記したように、半導体装置１０Ａが装着される電子機器内において、電子装置１０Ａが装着される装着空間は直方体形状である場合が多い。従って、本実施例のように、ヒートシンク３０Ａの全体的形状を直方体形状とすることにより、電子機器に対するスペース効率を高めることができ、電子機器内にいわゆるデッドスペースが発生することを抑制でき、電子機器の小型化に寄与することができる。   Further, as described above, in the electronic device in which the semiconductor device 10A is mounted, the mounting space in which the electronic device 10A is mounted is often a rectangular parallelepiped shape. Therefore, by making the overall shape of the heat sink 30A into a rectangular parallelepiped shape as in the present embodiment, the space efficiency for the electronic device can be increased, so that the so-called dead space can be suppressed in the electronic device, and the electronic This can contribute to downsizing of the device.

上記のように、本実施例に係るヒートシンク３０Ａは、各放熱フィン４０〜４８の各々の長さが半導体チップ２０からの熱を放熱するのに適当な長さとされているため、小型化を図りつつ放熱効率を高めることができる。また、放熱フィン４１〜４７を外側に向け折り曲げたような形状としたことにより、折り曲げ位置を適宜選定することにより、ヒートシンク３０Ａの全体的な形状を調整することが可能となる。そして本実施例のように、全体的な形状を略直方体形状とすることにより、ヒートシンク３０Ａを電子機器の装着空間の形状に容易に対応させることができる。このように、本実施例に係るヒートシンク３０Ａは、放熱効率を高めると同時に、スペース効率の向上をも同時に図ることが可能となる。   As described above, the heat sink 30A according to the present embodiment is reduced in size because the length of each of the radiation fins 40 to 48 is set to an appropriate length for radiating the heat from the semiconductor chip 20. While improving the heat dissipation efficiency. In addition, since the heat radiation fins 41 to 47 are shaped to be bent outward, the overall shape of the heat sink 30A can be adjusted by appropriately selecting the folding position. Then, as in the present embodiment, by making the overall shape into a substantially rectangular parallelepiped shape, the heat sink 30A can easily correspond to the shape of the mounting space of the electronic device. As described above, the heat sink 30A according to the present embodiment can improve the heat dissipation efficiency and simultaneously improve the space efficiency.

また、本実施例のように放熱フィン４１〜４７に水平部４１ｂ〜４７ｂを形成することにより、ベース３１の中央に設けられた放熱フィン４３，４４の水平部４３ｂ，４４ｂは、ヒートシンク３０Ａを平面視した場合、中央に溝が存在するもの、比較的広い平面を形成することとなる。そこで、本実施例では水平部４４ｂに情報表示部７０を配設した構成としている。   Further, by forming the horizontal portions 41b to 47b on the heat radiating fins 41 to 47 as in the present embodiment, the horizontal portions 43b and 44b of the heat radiating fins 43 and 44 provided at the center of the base 31 are flat on the heat sink 30A. When viewed, a groove having a groove in the center or a relatively wide plane is formed. Therefore, in this embodiment, the information display unit 70 is disposed in the horizontal unit 44b.

この情報表示部７０は例えば半導体装置１０Ａの製品情報等が印刷されたシールであり、水平部４４ｂに貼着されている。通常、半導体装置に対するこの種の製品情報は、ヒートシンク１Ａ，１Ｂを有した従来の半導体装置ではその上面に設けることはできなかった（図１及び図２参照）。よって、電子素子５の側面や底面に設ける必要があり、視認性に劣るという問題点があった。   The information display unit 70 is, for example, a seal on which product information of the semiconductor device 10A is printed, and is attached to the horizontal unit 44b. Normally, this type of product information for a semiconductor device cannot be provided on the upper surface of a conventional semiconductor device having heat sinks 1A and 1B (see FIGS. 1 and 2). Therefore, it has to be provided on the side surface and the bottom surface of the electronic element 5, and there is a problem that the visibility is poor.

しかしながら、本実施例では半導体装置１０Ａにヒートシンク３０Ａを設けても、その上部に水平部４３ｂ，４４ｂが存在するため情報表示部７０を配設することが可能となった。このため、半導体装置１０Ａを平面視することにより情報表示部７０を確認することが可能となり、情報表示部７０の視認性を向上させることができた。   However, in this embodiment, even if the heat sink 30A is provided in the semiconductor device 10A, the information display part 70 can be disposed because the horizontal parts 43b and 44b exist above the heat sink 30A. For this reason, the information display unit 70 can be confirmed by viewing the semiconductor device 10 </ b> A in plan view, and the visibility of the information display unit 70 can be improved.

尚、上記した実施例では、全ての放熱フィン４０〜４７を折り曲げた形状とすることなく、放熱フィン４１〜４６のみに折り曲げを行った構成とした。即ち、バンプ２１の両端部に設けられた放熱フィン４０及び放熱フィン４７は、直立部４０ａ，４７ａのみを有し、水平部を有しない構成とした。   In the above-described embodiment, all the radiation fins 40 to 47 are not bent, and only the radiation fins 41 to 46 are bent. That is, the radiating fin 40 and the radiating fin 47 provided at both ends of the bump 21 have only the upright portions 40a and 47a and do not have a horizontal portion.

これは、本実施例においては放熱フィン４０，４７がベース３１の側面と面一とされていたためである。よって、ベース３１にスペース的な余裕がある場合には、放熱フィン４０，４７に水平部を形成する構成としてもよい。また、図４及び図５に示す構成において、放熱フィン４０，４７に内側に折り曲げられた水平部を形成することも可能である。   This is because in the present embodiment, the radiating fins 40 and 47 are flush with the side surface of the base 31. Therefore, when the base 31 has a space, it is good also as a structure which forms a horizontal part in the radiation fins 40 and 47. FIG. Further, in the configuration shown in FIGS. 4 and 5, it is possible to form a horizontal portion bent inward in the radiation fins 40 and 47.

図６及び図７は、上記した半導体装置１０Ａ及びヒートシンク３０Ａの変形例を示している。尚、図６及び図７において、図４及び図５に示した構成と対応する構成については同一符号を付してその説明を省略するものとする。   6 and 7 show modifications of the semiconductor device 10A and the heat sink 30A described above. 6 and 7, the same reference numerals are given to the components corresponding to those shown in FIGS. 4 and 5, and the description thereof will be omitted.

図６に示す第１変形例に係るヒートシンク３０Ｂは、ベース３１の中央部に水平部を有しない中央フィン４９を形成したことを特徴とするものである。同図に示すように、ベース３１に奇数本（本変形例では９本）の放熱フィンの配設スペースがある場合、ベース３１の中央位置に中央フィン４９の形成位置が存在する構成となる。   The heat sink 30B according to the first modification shown in FIG. 6 is characterized in that a central fin 49 having no horizontal portion is formed in the central portion of the base 31. As shown in the drawing, when the base 31 has an odd number (9 in this modification) of heat dissipating fins, the center fin 49 is formed at the central position of the base 31.

この場合、ヒートシンク３０Ｂの形状を全体として直方体形状とするため、補助フィン４９の形状を同図に示すように水平部を有しない形状としてもよい。この際、電子機器への装着性を重視して、中央フィン４９を設けない構成も考えられるが、中央フィン４９を設けた方が設けない構成に比べてヒートシンク３０Ｂの全体としての放熱特性を高めることができるため有利である。   In this case, since the shape of the heat sink 30B is a rectangular parallelepiped shape as a whole, the shape of the auxiliary fins 49 may be a shape having no horizontal portion as shown in FIG. At this time, a configuration in which the central fin 49 is not provided may be considered with emphasis on the mounting property to the electronic device, but the heat dissipation characteristics of the heat sink 30B as a whole are improved as compared with a configuration in which the central fin 49 is not provided. This is advantageous.

図７に示す第２変形例に係る半導体装置１０Ｂ及びヒートシンク３０Ｃは、直立部５１ａ〜５６ａから外側に延出する部分に湾曲部５１ｂ〜５６ｂを形成したことを特徴とするものである。前記した実施例では、直立部４１ａ〜４６ａから水平部４１ｂ〜４６ｂを外側に延出するよう形成した。   The semiconductor device 10B and the heat sink 30C according to the second modification shown in FIG. 7 are characterized in that curved portions 51b to 56b are formed in portions extending outward from the upright portions 51a to 56a. In the above-described embodiment, the horizontal portions 41b to 46b are formed to extend outward from the upright portions 41a to 46a.

しかしながら、各放熱フィンにおいて、直立部から外側（内側の場合もある）に延出する部分の形状は水平形状に限定されるものではなく、本変形例のように湾曲部５１ｂ〜５６ｂとしてもよい。この構成とすることにより、放熱フィン５１〜５６は、ヒートシンク３０Ｃを正面視した状態で逆Ｊ字状の形状となる。   However, in each radiating fin, the shape of the portion extending from the upright portion to the outside (in some cases, inside) is not limited to the horizontal shape, and may be curved portions 51b to 56b as in this modification. . By setting it as this structure, the radiation fins 51-56 become a reverse J-shape when the heat sink 30C is viewed from the front.

尚、直立部から外側（内側の場合もある）に延出する部分の形状は、放熱フィンの長さやヒートシンクが装着される装着空間の大きさ等に応じて、その形状を適宜変更することが可能である。   In addition, the shape of the portion extending from the upright portion to the outside (in some cases, inside) may be changed as appropriate depending on the length of the radiation fin, the size of the mounting space in which the heat sink is mounted, and the like. Is possible.

続いて、図４に示した半導体装置１０Ａの製造方法について図８を参照して説明する。   Next, a method for manufacturing the semiconductor device 10A shown in FIG. 4 will be described with reference to FIG.

尚、図８において図４及び図５に示した構成と対応する構成については同一符号を付して、その説明を省略するものとする。また、本実施例に係る製造方法は、半導体チップ２０を実装基板２２に搭載するチップマウント工程から、ヒートシンク３０Ａを半導体チップ２０に実装する実装工程に特徴があるため、この各工程について説明し、他の製造工程についての説明は省略するものとする。   In FIG. 8, components corresponding to those shown in FIGS. 4 and 5 are denoted by the same reference numerals, and description thereof is omitted. Further, the manufacturing method according to the present embodiment is characterized by a mounting process for mounting the heat sink 30A on the semiconductor chip 20 from a chip mounting process for mounting the semiconductor chip 20 on the mounting substrate 22, and each of these processes will be described. Description of other manufacturing processes shall be omitted.

図８は、半導体装置１０Ａの製造ラインを示している。半導体チップ２０が搭載される実装基板２２は、コンベヤー６５により図中矢印で示す方向に搬送される。また、同図に示す製造ラインは、チップマウンター６０、リフロー炉６１、及びヒートシンク実装装置６２がコンベヤー６５に沿って同図に矢印で示す順で設けられた構成とされている。   FIG. 8 shows a production line for the semiconductor device 10A. The mounting substrate 22 on which the semiconductor chip 20 is mounted is conveyed by the conveyor 65 in the direction indicated by the arrow in the figure. Further, the production line shown in the figure has a configuration in which a chip mounter 60, a reflow furnace 61, and a heat sink mounting device 62 are provided along the conveyor 65 in the order indicated by arrows in the figure.

チップマウンター６０は、コレット６３を有している。このコレット６３は半導体チップ２０を吸着し、この半導体チップ２０を実装基板２２上の所定搭載位置まで搬送する。そして、コレット６３は下降して、半導体チップ２０を実装基板２２上にフェイスダウンで搭載する。この際、半導体チップ２０はバンプ２１による本固定はされず、実装基板２２に対して仮止めされた状態となっている。尚、チップマウンター６０は、半導体チップ２０以外の電子部品も合わせて実装基板２２上に搭載する。   The chip mounter 60 has a collet 63. The collet 63 sucks the semiconductor chip 20 and conveys the semiconductor chip 20 to a predetermined mounting position on the mounting substrate 22. Then, the collet 63 is lowered to mount the semiconductor chip 20 on the mounting substrate 22 face down. At this time, the semiconductor chip 20 is not permanently fixed by the bumps 21 and is temporarily fixed to the mounting substrate 22. The chip mounter 60 also mounts electronic components other than the semiconductor chip 20 on the mounting substrate 22.

上記ように実装基板２２に半導体チップ２０及び他の電子部品が搭載されると、実装基板２２はコンベヤー６５により搬送され、リフロー炉６１内に装着される。このリフロー炉６１は加熱処理を行うものであり、これによりバンプ２１（はんだよりなる）は溶融し、半導体チップ２０は実装基板２２にはんだ付けされる。また、他の電子部品も同様に実装基板２２にはんだ付けされる。これにより、半導体チップ２０及び他の電子部品は、実装基板２２に本固定された状態となる。   When the semiconductor chip 20 and other electronic components are mounted on the mounting substrate 22 as described above, the mounting substrate 22 is transported by the conveyor 65 and mounted in the reflow furnace 61. The reflow furnace 61 performs a heat treatment, whereby the bump 21 (made of solder) is melted, and the semiconductor chip 20 is soldered to the mounting substrate 22. Further, other electronic components are similarly soldered to the mounting board 22. As a result, the semiconductor chip 20 and other electronic components are permanently fixed to the mounting substrate 22.

上記したリフロー炉６１による加熱処理が終了すると、実装基板２２は冷却処理が行われた上で、コンベヤー６５によりヒートシンク実装装置６２に搬送される。このヒートシンク実装装置６２は、半導体チップ２０にヒートシンク３０Ａを実装する処理を行う。   When the heat treatment by the reflow furnace 61 is completed, the mounting substrate 22 is cooled and then transferred to the heat sink mounting device 62 by the conveyor 65. The heat sink mounting device 62 performs a process of mounting the heat sink 30 </ b> A on the semiconductor chip 20.

具体的には、ヒートシンク実装装置６２は搬送装置６４を有しており、ヒートシンク３０Ａは搬送装置６４に保持された状態で半導体チップ２０の背面位置にヒートシンク３０Ａが搬送され、続いてヒートシンク実装装置６２は搬送装置６４を下降させる。この半導体チップ２０の背面（ヒートシンク３０Ａが実装される面）には、図示しない熱伝導性の高い接着剤が塗布されている。よって、ヒートシンク３０Ａは、接着剤を介して半導体チップ２０に実装される。   Specifically, the heat sink mounting device 62 includes a transport device 64, and the heat sink 30 </ b> A is transported to the back surface position of the semiconductor chip 20 while being held by the transport device 64, and then the heat sink mounting device 62. Lowers the conveying device 64. An adhesive (not shown) having high thermal conductivity is applied to the back surface (surface on which the heat sink 30A is mounted) of the semiconductor chip 20. Therefore, the heat sink 30A is mounted on the semiconductor chip 20 via the adhesive.

この際、搬送装置６４は、コレット６３と同様に先端部に吸着面を有しており、ヒートシンク３０Ａは搬送装置６４に吸着されることにより保持される構成とされている。前記したように、ヒートシンク３０Ａは、その上部に水平部４３ｂ，４４ｂが存在する。このため、搬送装置６４の吸着面で水平部４３ｂ，４４ｂを真空吸着することが可能となり、搬送装置６４によりヒートシンク３０Ａを搬送することが可能となった。   At this time, the transport device 64 has a suction surface at the tip, similarly to the collet 63, and the heat sink 30 </ b> A is held by being sucked by the transport device 64. As described above, the heat sink 30A has the horizontal portions 43b and 44b at the top thereof. Therefore, the horizontal portions 43b and 44b can be vacuum-sucked by the suction surface of the transport device 64, and the heat sink 30A can be transported by the transport device 64.

これに対し、図１及び図２に示したヒートシンク１Ａ，１Ｂは、放熱フィン３Ａ，３Ｂが上方に向け延出した構成であるため、真空吸着することができなかった。よって、ヒートシンク１Ａ，１Ｂの側部等を把持する必要があり、組み立て効率を低下させる原因となっていた。   On the other hand, the heat sinks 1A and 1B shown in FIGS. 1 and 2 have a configuration in which the radiation fins 3A and 3B extend upward, and thus cannot be vacuum-adsorbed. Therefore, it is necessary to grip the side portions of the heat sinks 1A and 1B, which causes a reduction in assembly efficiency.

本実施例に係る製造方法では、上記のようにヒートシンク３０Ａを半導体チップ２０と同様に上部から搬送装置６４により吸着し、この状態で搬送して半導体チップ２０上に搭載することが可能となる。よって、従来に比べてヒートシンク３０Ａの搬送処理が容易になり、半導体装置１０Ａの製造効率を高めることができる。   In the manufacturing method according to the present embodiment, as described above, the heat sink 30A can be adsorbed from above by the transport device 64, and can be transported and mounted on the semiconductor chip 20 in this state. Therefore, compared with the conventional case, the transfer process of the heat sink 30A is facilitated, and the manufacturing efficiency of the semiconductor device 10A can be increased.

尚、本発明は上記した実施例に限定されるものではなく、放熱フィンを有するヒートシンク、及びこれを有する電子装置に広く適用が可能なものである。   The present invention is not limited to the above-described embodiments, and can be widely applied to a heat sink having a heat radiating fin and an electronic device having the heat sink.

Claims (12)

発熱体に熱的に接続されるベースと、
該ベースの前記発熱体との接続面と反対側面から延出するよう形成された複数の放熱フィンを備えたヒートシンクにおいて、
前記複数の放熱フィンの内、前記発熱体からの熱伝導温度が高い部位に配設された前記放熱フィンを長く形成すると共に、これより前記熱伝導温度が低くなるに従い前記放熱フィンを短く形成し、
かつ、前記放熱フィンを外側に向け折り曲げたような形状としたことを特徴とするヒートシンク。A base thermally connected to the heating element;
In a heat sink comprising a plurality of heat radiation fins formed so as to extend from the side surface opposite to the connection surface with the heating element of the base,
Among the plurality of heat radiating fins, the heat radiating fin disposed at a portion where the heat conduction temperature from the heating element is high is formed long, and the heat radiating fin is shortened as the heat conduction temperature becomes lower. ,
And the heat sink characterized by making the said radiation fin bent toward the outer side. 前記ベース及び前記放熱フィンを冷却風の流れ方向から見た場合、前記ベース及び前記放熱フィンの外形形状が矩形状とされていることを特徴とする請求項１記載のヒートシンク。   2. The heat sink according to claim 1, wherein when the base and the radiating fin are viewed from a flow direction of cooling air, an outer shape of the base and the radiating fin is a rectangular shape. 前記放熱フィンは逆Ｊ字状の形状とされていることを特徴とする請求項１記載のヒートシンク。   The heat sink according to claim 1, wherein the heat dissipating fin has an inverted J shape. 発熱体に熱的に接続されるベースと、
該ベースの前記発熱体との接続面と反対側面から延出するよう形成された複数の放熱フィンを備えたヒートシンクにおいて、
前記複数の放熱フィンの内、前記発熱体からの熱伝導温度が高い部位に配設された前記放熱フィンを長く形成すると共に、これより前記熱伝導温度が低くなるに従い前記放熱フィンを短く形成し、
かつ、前記放熱フィンを、前記ベースより直立した直立部と、該直立部から外側に向け略直角に折り曲げられた水平部とにより構成したことを特徴とするヒートシンク。A base thermally connected to the heating element;
In a heat sink comprising a plurality of heat radiation fins formed so as to extend from the side surface opposite to the connection surface with the heating element of the base,
Among the plurality of heat radiating fins, the heat radiating fin disposed at a portion where the heat conduction temperature from the heating element is high is formed long, and the heat radiating fin is shortened as the heat conduction temperature becomes lower. ,
The heat sink includes an upright portion that stands upright from the base and a horizontal portion that is bent from the upright portion toward the outside at a substantially right angle. 前記ベース及び前記放熱フィンを冷却風の流れ方向から見た場合、前記ベース及び前記放熱フィンの外形形状が矩形状とされていることを特徴とする請求項４記載のヒートシンク。   5. The heat sink according to claim 4, wherein when the base and the radiating fin are viewed from a flow direction of cooling air, an outer shape of the base and the radiating fin is a rectangular shape. 前記水平部の上面に情報表示部を設けたことを特徴とする請求項４記載のヒートシンク。   5. The heat sink according to claim 4, wherein an information display part is provided on an upper surface of the horizontal part. 前記放熱フィンは逆Ｌ字状の形状とされていることを特徴とする請求項４記載のヒートシンク。   The heat sink according to claim 4, wherein the heat dissipating fin has an inverted L shape. 発熱体となる電子素子に熱的に接続されるベースと、該ベースの前記発熱体との接続面と反対側面から延出するよう形成された複数の放熱フィンを備えており、
前記複数の放熱フィンの内、前記発熱体からの熱伝導温度が高い部位に配設された前記放熱フィンを長く形成すると共に、これより前記熱伝導温度が低くなるに従い前記放熱フィンを短く形成し、
かつ、前記放熱フィンを、前記ベースより直立した直立部と、該直立部から外側に向け略直角に折り曲げられた水平部とにより構成したヒートシンクを有することを特徴とする電子装置。A base thermally connected to an electronic element to be a heating element, and a plurality of radiation fins formed to extend from a side surface opposite to the connection surface of the base with the heating element;
Among the plurality of heat radiating fins, the heat radiating fin disposed at a portion where the heat conduction temperature from the heating element is high is formed long, and the heat radiating fin is shortened as the heat conduction temperature becomes lower. ,
An electronic device comprising: a heat sink in which the heat radiating fin includes an upright portion that stands upright from the base and a horizontal portion that is bent from the upright portion toward the outside at a substantially right angle. 前記ベース及び前記放熱フィンを冷却風の流れ方向から見た場合、前記ベース及び前記放熱フィンの外形形状が矩形状とされていることを特徴とする請求項８記載の電子装置。   9. The electronic device according to claim 8, wherein when the base and the radiating fin are viewed from a flow direction of cooling air, an outer shape of the base and the radiating fin is a rectangular shape. 前記水平部の上面に情報表示部を設けたことを特徴とする請求項８記載の電子装置。   9. The electronic device according to claim 8, further comprising an information display unit provided on an upper surface of the horizontal unit. 前記放熱フィンは逆Ｌ字状の形状とされていることを特徴とする請求項８記載の電子装置。   The electronic device according to claim 8, wherein the heat dissipating fin has an inverted L shape. 複数の放熱フィンを有したヒートシンクを、搬送装置を用いて発熱体となる電子素子上に搭載する工程を有する電子装置の製造方法において、
前記ヒートシンクの前記複数の放熱フィンを、前記発熱体からの熱伝導温度が高い部位に配設されたものを長く形成すると共に前記熱伝導温度が低くなるに従いその長さを短く形成し、かつ、前記放熱フィンを途中位置で外側に折曲することにより、前記ベースより直立した直立部と、該直立部から略直角に折り曲げられた水平部とを有する構成とし、
かつ、前記搬送装置が前記水平部を吸着することにより前記ヒートシンクを前記電子素子上に搬送することを特徴とする電子装置の製造方法。In a method for manufacturing an electronic device having a step of mounting a heat sink having a plurality of heat radiation fins on an electronic element that becomes a heating element using a transport device,
Forming the plurality of radiating fins of the heat sink as long as those disposed in a portion where the heat conduction temperature from the heating element is high, and shortening the length as the heat conduction temperature decreases; and By bending the heat dissipating fins outward at an intermediate position, an upright portion that is upright from the base, and a horizontal portion that is bent substantially perpendicularly from the upright portion,
And the said heat sink conveys the said heat sink on the said electronic element by adsorb | sucking the said horizontal part, The manufacturing method of the electronic device characterized by the above-mentioned.
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