JPS648670A - Mos field-effect transistor - Google Patents

Mos field-effect transistor

Info

Publication number
JPS648670A
JPS648670A JP16228987A JP16228987A JPS648670A JP S648670 A JPS648670 A JP S648670A JP 16228987 A JP16228987 A JP 16228987A JP 16228987 A JP16228987 A JP 16228987A JP S648670 A JPS648670 A JP S648670A
Authority
JP
Japan
Prior art keywords
section
plane
substrate
width
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16228987A
Other languages
Japanese (ja)
Inventor
Michihiko Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16228987A priority Critical patent/JPS648670A/en
Publication of JPS648670A publication Critical patent/JPS648670A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enhance a gain constant beta value by forming the semiconductor section of source, drain and channel regions of a MOSFET in a rectangular parallelepiped having a side face substantially perpendicular to the plane of a wafer substrate, forming the height of the semiconductor section larger than its width, and extending a gate electrode perpendicularly to the plane of the substrate. CONSTITUTION:Part of an n-type silicon (Si) wafer substrate 11 is formed in a rectangular parallelepiped semiconductor section 12 having its height larger than its width. This section is formed with source, drain and channel regions, and a gate electrode 14 is formed on an insulating film 13 corresponding to the channel region. The side face of the section 12 is substantially perpendicular to the plane of the substrate 1, and the electrode 14 is also perpendicular to the plane of the substrate 11. Since the electrode 14 is extended at both sides over the top of the section 12, the gate electrode which operates as a gate is longer than a conventional case, and a channel width W corresponds to twice as large as the height (h) in the drawing. Then, the width l of the electrode 14 corresponds to the channel length L.
JP16228987A 1987-07-01 1987-07-01 Mos field-effect transistor Pending JPS648670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16228987A JPS648670A (en) 1987-07-01 1987-07-01 Mos field-effect transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16228987A JPS648670A (en) 1987-07-01 1987-07-01 Mos field-effect transistor

Publications (1)

Publication Number Publication Date
JPS648670A true JPS648670A (en) 1989-01-12

Family

ID=15751654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16228987A Pending JPS648670A (en) 1987-07-01 1987-07-01 Mos field-effect transistor

Country Status (1)

Country Link
JP (1) JPS648670A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6442176A (en) * 1987-08-10 1989-02-14 Toshiba Corp Semiconductor device and manufacture thereof
JPH02263473A (en) * 1988-11-21 1990-10-26 Hitachi Ltd Semiconductor device and semiconductor storage device
WO1990013918A1 (en) * 1989-05-12 1990-11-15 Oki Electric Industry Co., Ltd. Field effect transistor
US8076203B2 (en) 2007-10-30 2011-12-13 Elpida Memory, Inc. Semiconductor device and method of manufacturing the same
US8124976B2 (en) 2005-12-02 2012-02-28 Nec Corporation Semiconductor device and method of manufacturing the same
US8247294B2 (en) 2005-06-07 2012-08-21 Nec Corporation Manufacturing process of fin-type field effect transistor and semiconductor
KR20140137343A (en) * 2011-12-29 2014-12-02 로베르트 보쉬 게엠베하 Speaker verification in a health monitoring system

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6442176A (en) * 1987-08-10 1989-02-14 Toshiba Corp Semiconductor device and manufacture thereof
JPH02263473A (en) * 1988-11-21 1990-10-26 Hitachi Ltd Semiconductor device and semiconductor storage device
WO1990013918A1 (en) * 1989-05-12 1990-11-15 Oki Electric Industry Co., Ltd. Field effect transistor
US5281547A (en) * 1989-05-12 1994-01-25 Oki Electric Industry Co., Ltd. Method for manufacturing a field effect transistor
US8247294B2 (en) 2005-06-07 2012-08-21 Nec Corporation Manufacturing process of fin-type field effect transistor and semiconductor
US8124976B2 (en) 2005-12-02 2012-02-28 Nec Corporation Semiconductor device and method of manufacturing the same
US8076203B2 (en) 2007-10-30 2011-12-13 Elpida Memory, Inc. Semiconductor device and method of manufacturing the same
KR20140137343A (en) * 2011-12-29 2014-12-02 로베르트 보쉬 게엠베하 Speaker verification in a health monitoring system

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