JPS6474784A - Fixing structure for positioning semiconductor laser chip and input lens - Google Patents
Fixing structure for positioning semiconductor laser chip and input lensInfo
- Publication number
- JPS6474784A JPS6474784A JP23093087A JP23093087A JPS6474784A JP S6474784 A JPS6474784 A JP S6474784A JP 23093087 A JP23093087 A JP 23093087A JP 23093087 A JP23093087 A JP 23093087A JP S6474784 A JPS6474784 A JP S6474784A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- mounting support
- support member
- sink member
- projection section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Semiconductor Lasers (AREA)
Abstract
PURPOSE:To conduct the positioning displacement adjustment of a mounting support member to a heat sink member easily and rapidly by utilizing the relative contacting positions of the heat sink member and a projection section for the mounting support member as a reference position. CONSTITUTION:A mounting support member 38 can be displaced in the front and rear direction, the vertical direction, the left and the right direction, etc., to a heat sink member 34 by bringing a projection section 44 in the mounting support member 38 along a straight line into contact with the heat sink member 34. Even when the mounting support member 38 is used as a fine adjustment base, the mounting support member 38 is maintained under a contacting state at all times with the heat sink member 34 by the projection section 44 when the mounting support member is displaced to the heat sink member 34, thus allowing alignment displacement adjustment by employing the relative contacting positions of the heat sink member 34 and the projection section 44 as a reference position on the positioning operation of a semiconductor laser chip 30 and a spherical lens 36.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23093087A JPS6474784A (en) | 1987-09-17 | 1987-09-17 | Fixing structure for positioning semiconductor laser chip and input lens |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23093087A JPS6474784A (en) | 1987-09-17 | 1987-09-17 | Fixing structure for positioning semiconductor laser chip and input lens |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6474784A true JPS6474784A (en) | 1989-03-20 |
Family
ID=16915514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23093087A Pending JPS6474784A (en) | 1987-09-17 | 1987-09-17 | Fixing structure for positioning semiconductor laser chip and input lens |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6474784A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5438580A (en) * | 1993-09-24 | 1995-08-01 | Opto Power Corporation | Laser package and method of assembly |
WO2012157240A1 (en) * | 2011-05-18 | 2012-11-22 | パナソニック株式会社 | Semiconductor laser module and method for manufacturing same |
TWI405026B (en) * | 2009-07-29 | 2013-08-11 | Qisda Corp | Projector and lens thereof |
-
1987
- 1987-09-17 JP JP23093087A patent/JPS6474784A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5438580A (en) * | 1993-09-24 | 1995-08-01 | Opto Power Corporation | Laser package and method of assembly |
TWI405026B (en) * | 2009-07-29 | 2013-08-11 | Qisda Corp | Projector and lens thereof |
WO2012157240A1 (en) * | 2011-05-18 | 2012-11-22 | パナソニック株式会社 | Semiconductor laser module and method for manufacturing same |
US8985870B2 (en) | 2011-05-18 | 2015-03-24 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor laser module and method for manufacturing same |
US9093812B2 (en) | 2011-05-18 | 2015-07-28 | Panasonic Intellectual Property Management Co., Ltd. | Method of manufacturing a semiconductor laser module |
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