JPS6469013A - Grinding method - Google Patents
Grinding methodInfo
- Publication number
- JPS6469013A JPS6469013A JP22789287A JP22789287A JPS6469013A JP S6469013 A JPS6469013 A JP S6469013A JP 22789287 A JP22789287 A JP 22789287A JP 22789287 A JP22789287 A JP 22789287A JP S6469013 A JPS6469013 A JP S6469013A
- Authority
- JP
- Japan
- Prior art keywords
- protection film
- ultraviolet
- element forming
- resin
- forming surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To enable a protection film to be removed quickly and positively, by forming the protection film on the element forming surface of a semiconductor wafer, polishing the grinding surface opposite to the element forming surface and modifying the protection film after the polishing. CONSTITUTION:A thermosetting or ultraviolet-setting resin is applied on the element forming surface 1a of a semiconductor wafer 1 and is dried and cured to provide a protection film 2. The wafer 1 is then attached to the table surface of a grinding apparatus not shown such that the element forming surface 1a is put on the underside, and the grinding surface 1b is ground to remove the part as indicated by the broken lines. Then, lf the protection film 2 of the semiconductor wafer 1 is formed of the thermosetting resin it is irradiated with infrared rays by an infrared lamp, while if it is of the ultraviolet-setting resin, it is irradiated with ultraviolet rays by an ultraviolet lamp. After the resin is set thereby, the semiconductor wafer 1 is dipped in a cleaning solution of trichlene or the like, whereby the thermosetting or ultraviolet-setting resin is peeled off very quickly without any residual resin on the element forming surface 1a.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22789287A JPS6469013A (en) | 1987-09-10 | 1987-09-10 | Grinding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22789287A JPS6469013A (en) | 1987-09-10 | 1987-09-10 | Grinding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6469013A true JPS6469013A (en) | 1989-03-15 |
Family
ID=16867957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22789287A Pending JPS6469013A (en) | 1987-09-10 | 1987-09-10 | Grinding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6469013A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1122767A1 (en) * | 1999-04-30 | 2001-08-08 | Shin-Etsu Handotai Co., Ltd | Wafer polishing method and cleaning method, and protection film |
JP2003338477A (en) * | 2002-05-22 | 2003-11-28 | Disco Abrasive Syst Ltd | Separating method of tape |
KR100411256B1 (en) * | 2001-09-05 | 2003-12-18 | 삼성전기주식회사 | A wafer lapping process and a method of processing a wafer backside using the same |
US6713366B2 (en) * | 2002-06-12 | 2004-03-30 | Intel Corporation | Method of thinning a wafer utilizing a laminated reinforcing layer over the device side |
KR100917084B1 (en) * | 2001-12-27 | 2009-09-15 | 닛토덴코 가부시키가이샤 | Protective tape applying and separating method |
US7867829B2 (en) | 2006-09-15 | 2011-01-11 | Mitsubishi Electric Corporation | Semiconductor device manufacturing method, semiconductor wafer, and semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60189938A (en) * | 1984-03-12 | 1985-09-27 | Nitto Electric Ind Co Ltd | Protective method of semiconductor wafer |
-
1987
- 1987-09-10 JP JP22789287A patent/JPS6469013A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60189938A (en) * | 1984-03-12 | 1985-09-27 | Nitto Electric Ind Co Ltd | Protective method of semiconductor wafer |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1122767A1 (en) * | 1999-04-30 | 2001-08-08 | Shin-Etsu Handotai Co., Ltd | Wafer polishing method and cleaning method, and protection film |
KR100411256B1 (en) * | 2001-09-05 | 2003-12-18 | 삼성전기주식회사 | A wafer lapping process and a method of processing a wafer backside using the same |
KR100917084B1 (en) * | 2001-12-27 | 2009-09-15 | 닛토덴코 가부시키가이샤 | Protective tape applying and separating method |
JP2003338477A (en) * | 2002-05-22 | 2003-11-28 | Disco Abrasive Syst Ltd | Separating method of tape |
US6713366B2 (en) * | 2002-06-12 | 2004-03-30 | Intel Corporation | Method of thinning a wafer utilizing a laminated reinforcing layer over the device side |
US7867829B2 (en) | 2006-09-15 | 2011-01-11 | Mitsubishi Electric Corporation | Semiconductor device manufacturing method, semiconductor wafer, and semiconductor device |
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