JPS6457661A - Solid-state image sensing device and manufacture thereof - Google Patents
Solid-state image sensing device and manufacture thereofInfo
- Publication number
- JPS6457661A JPS6457661A JP62214081A JP21408187A JPS6457661A JP S6457661 A JPS6457661 A JP S6457661A JP 62214081 A JP62214081 A JP 62214081A JP 21408187 A JP21408187 A JP 21408187A JP S6457661 A JPS6457661 A JP S6457661A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state image
- image sensor
- sensing device
- translucent resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To obtain the solid-state image sensing device of high reliability at low cost by a method wherein a solid-state image sensor is placed on the bottom of the recess of a casing, translucent resin is filled up covering the solid-state image sensor, and a translucent plate is covered on the surface thereof. CONSTITUTION:A solid-state image sensor 2, a casing 5 on which the solid-state image sensor 2 is placed on the bottom of its recessed part, translucent resin 6 filled up the recessed part covering the solid-state image sensor 2, and a light transmitting plate 7 coated on the surface of the translucent resin 6 are provided in the title solid-state image sensing device. Also, the solid-state image sensor 2 is placed on the bottom of the recessed part of the casing 5, and after the translucent resin 6 has been filled up in the above-mentioned recessed part, the light-transmitting plate 7 is coated on the surface of said translucent resin 6, and the solid-state image sensing device is manufactured. A terminal 3 and an external terminal 15, for example, are provided in the above-mentioned casing 5, and the solid-state image sensor 2 and the external terminal 15 are electrically connected by having the terminal 3 wired to the electrode 4 of the solid-state image sensor 2 using wire bonding and the like.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62214081A JPS6457661A (en) | 1987-08-27 | 1987-08-27 | Solid-state image sensing device and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62214081A JPS6457661A (en) | 1987-08-27 | 1987-08-27 | Solid-state image sensing device and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457661A true JPS6457661A (en) | 1989-03-03 |
Family
ID=16649926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62214081A Pending JPS6457661A (en) | 1987-08-27 | 1987-08-27 | Solid-state image sensing device and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457661A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5349234A (en) * | 1992-05-29 | 1994-09-20 | Eastman Kodak Company | Package and method for assembly of infra-red imaging devices |
US5770889A (en) * | 1995-12-29 | 1998-06-23 | Lsi Logic Corporation | Systems having advanced pre-formed planar structures |
US5793498A (en) * | 1995-03-10 | 1998-08-11 | Telogy Networks, Inc. | System for transferring facsimile data without dedicated G3 hardware |
KR100608523B1 (en) * | 1998-12-09 | 2006-08-09 | 후지 덴키 홀딩스 가부시끼가이샤 | A semiconductor optical sensing apparatus |
WO2011108051A1 (en) * | 2010-03-05 | 2011-09-09 | パナソニック株式会社 | Semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56116649A (en) * | 1980-02-19 | 1981-09-12 | Matsushita Electric Ind Co Ltd | Manufacturing of semiconductor device |
-
1987
- 1987-08-27 JP JP62214081A patent/JPS6457661A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56116649A (en) * | 1980-02-19 | 1981-09-12 | Matsushita Electric Ind Co Ltd | Manufacturing of semiconductor device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5349234A (en) * | 1992-05-29 | 1994-09-20 | Eastman Kodak Company | Package and method for assembly of infra-red imaging devices |
US5793498A (en) * | 1995-03-10 | 1998-08-11 | Telogy Networks, Inc. | System for transferring facsimile data without dedicated G3 hardware |
US5770889A (en) * | 1995-12-29 | 1998-06-23 | Lsi Logic Corporation | Systems having advanced pre-formed planar structures |
KR100608523B1 (en) * | 1998-12-09 | 2006-08-09 | 후지 덴키 홀딩스 가부시끼가이샤 | A semiconductor optical sensing apparatus |
WO2011108051A1 (en) * | 2010-03-05 | 2011-09-09 | パナソニック株式会社 | Semiconductor device |
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