JPS6457661A - Solid-state image sensing device and manufacture thereof - Google Patents

Solid-state image sensing device and manufacture thereof

Info

Publication number
JPS6457661A
JPS6457661A JP62214081A JP21408187A JPS6457661A JP S6457661 A JPS6457661 A JP S6457661A JP 62214081 A JP62214081 A JP 62214081A JP 21408187 A JP21408187 A JP 21408187A JP S6457661 A JPS6457661 A JP S6457661A
Authority
JP
Japan
Prior art keywords
solid
state image
image sensor
sensing device
translucent resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62214081A
Other languages
Japanese (ja)
Inventor
Takao Fujizu
Fumiyuki Ota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Japan Semiconductor Corp
Original Assignee
Toshiba Corp
Iwate Toshiba Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Iwate Toshiba Electronics Co Ltd filed Critical Toshiba Corp
Priority to JP62214081A priority Critical patent/JPS6457661A/en
Publication of JPS6457661A publication Critical patent/JPS6457661A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the solid-state image sensing device of high reliability at low cost by a method wherein a solid-state image sensor is placed on the bottom of the recess of a casing, translucent resin is filled up covering the solid-state image sensor, and a translucent plate is covered on the surface thereof. CONSTITUTION:A solid-state image sensor 2, a casing 5 on which the solid-state image sensor 2 is placed on the bottom of its recessed part, translucent resin 6 filled up the recessed part covering the solid-state image sensor 2, and a light transmitting plate 7 coated on the surface of the translucent resin 6 are provided in the title solid-state image sensing device. Also, the solid-state image sensor 2 is placed on the bottom of the recessed part of the casing 5, and after the translucent resin 6 has been filled up in the above-mentioned recessed part, the light-transmitting plate 7 is coated on the surface of said translucent resin 6, and the solid-state image sensing device is manufactured. A terminal 3 and an external terminal 15, for example, are provided in the above-mentioned casing 5, and the solid-state image sensor 2 and the external terminal 15 are electrically connected by having the terminal 3 wired to the electrode 4 of the solid-state image sensor 2 using wire bonding and the like.
JP62214081A 1987-08-27 1987-08-27 Solid-state image sensing device and manufacture thereof Pending JPS6457661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62214081A JPS6457661A (en) 1987-08-27 1987-08-27 Solid-state image sensing device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62214081A JPS6457661A (en) 1987-08-27 1987-08-27 Solid-state image sensing device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6457661A true JPS6457661A (en) 1989-03-03

Family

ID=16649926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62214081A Pending JPS6457661A (en) 1987-08-27 1987-08-27 Solid-state image sensing device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6457661A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349234A (en) * 1992-05-29 1994-09-20 Eastman Kodak Company Package and method for assembly of infra-red imaging devices
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures
US5793498A (en) * 1995-03-10 1998-08-11 Telogy Networks, Inc. System for transferring facsimile data without dedicated G3 hardware
KR100608523B1 (en) * 1998-12-09 2006-08-09 후지 덴키 홀딩스 가부시끼가이샤 A semiconductor optical sensing apparatus
WO2011108051A1 (en) * 2010-03-05 2011-09-09 パナソニック株式会社 Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116649A (en) * 1980-02-19 1981-09-12 Matsushita Electric Ind Co Ltd Manufacturing of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116649A (en) * 1980-02-19 1981-09-12 Matsushita Electric Ind Co Ltd Manufacturing of semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349234A (en) * 1992-05-29 1994-09-20 Eastman Kodak Company Package and method for assembly of infra-red imaging devices
US5793498A (en) * 1995-03-10 1998-08-11 Telogy Networks, Inc. System for transferring facsimile data without dedicated G3 hardware
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures
KR100608523B1 (en) * 1998-12-09 2006-08-09 후지 덴키 홀딩스 가부시끼가이샤 A semiconductor optical sensing apparatus
WO2011108051A1 (en) * 2010-03-05 2011-09-09 パナソニック株式会社 Semiconductor device

Similar Documents

Publication Publication Date Title
EP0393206A4 (en) Image sensor and method of producing the same
DE3789865D1 (en) ELECTRICAL CONTACT WITH MONOLITHIC CAPACITOR.
DE3563479D1 (en) Method for manufacturing a measuring transducer for measuring mechanical quantities
FR2564967B1 (en) SEMICONDUCTOR CAP SENSOR
GB2214643B (en) An electrical inclination sensor
NO874390D0 (en) PIEZOEL ELECTRICAL SENSOR ELEMENTS.
NO885788D0 (en) MIXED PIEZO ELECTRICAL SENSOR.
DE3887059D1 (en) Electrical sensor with housing.
JPS6457661A (en) Solid-state image sensing device and manufacture thereof
DE3889738T2 (en) Electrical connection device with several terminals.
IT8521529A0 (en) SURFACE MOUNTED ELECTRICALLY CONDUCTIVE CONDUCTIVE DEVICE.
DE3881976T2 (en) POSITIVE PHOTO-SENSITIVE RESIN PREPARATION.
DE68927500T2 (en) Electrical deformation device
DE3888521D1 (en) ELECTRICAL CLUTCH DEVICE.
GB2186438B (en) Method for achieving the electrical and mechanical interconnection of two bodies, particularly the diaphragm and the support of a thick-film pressure sensor, and devices made by this method
DE3887027T2 (en) Sensor for measurement by electrical heating.
JPS6454369A (en) Cable terminal part
JPS57160038A (en) Semiconductor pressure sensor
JPS5768088A (en) Photosemiconductor device
GB2192186B (en) Pressure responsive electrically conductive materials
JPS57139651A (en) Humidity sensor
JPS6025084Y2 (en) Light-emitting element encapsulated with translucent resin material
SE9602359D0 (en) Device for tight connector and method of manufacturing the device
DE3889835D1 (en) ELECTRICAL CLUTCH DEVICE.
JPS53145587A (en) Photo coupling semiconductor device