JPS6446862A - Bus controller - Google Patents

Bus controller

Info

Publication number
JPS6446862A
JPS6446862A JP20338387A JP20338387A JPS6446862A JP S6446862 A JPS6446862 A JP S6446862A JP 20338387 A JP20338387 A JP 20338387A JP 20338387 A JP20338387 A JP 20338387A JP S6446862 A JPS6446862 A JP S6446862A
Authority
JP
Japan
Prior art keywords
dma transfer
address value
final
transfer
talker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20338387A
Other languages
Japanese (ja)
Inventor
Minako Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP20338387A priority Critical patent/JPS6446862A/en
Publication of JPS6446862A publication Critical patent/JPS6446862A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/20—Handling requests for interconnection or transfer for access to input/output bus
    • G06F13/28—Handling requests for interconnection or transfer for access to input/output bus using burst mode transfer, e.g. direct memory access DMA, cycle steal

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Bus Control (AREA)
  • Small-Scale Networks (AREA)

Abstract

PURPOSE:To shorten the time during which a GP-IB (general-purpose interface bus) is occupied by a talker in a data transfer by outputting an end signal after detecting the coincidence between each output address value obtained at the DMA transfer and the final address value of the DMA transfer data set previously so that the DMA transfer is carried out up to the final byte. CONSTITUTION:When a DMA controller 11 transfers the data on the final address, a DMA transfer end control means 13 detects the coincidence between the final address value 18 set previously and the address value 17 of an address bus 15. Then an interruption end signal 19 is outputted to a general-purpose bus 14. In such a way, a means is provided to detect the end of the DMA transfer so that the DMA transfer is thoroughly carried out up to the final byte. Thus it is possible to shorten the time during which the GP-IB is occupied by a talker in the data transfer with no intervention of software. As a result, another talker can use early the GP-IB.
JP20338387A 1987-08-18 1987-08-18 Bus controller Pending JPS6446862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20338387A JPS6446862A (en) 1987-08-18 1987-08-18 Bus controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20338387A JPS6446862A (en) 1987-08-18 1987-08-18 Bus controller

Publications (1)

Publication Number Publication Date
JPS6446862A true JPS6446862A (en) 1989-02-21

Family

ID=16473128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20338387A Pending JPS6446862A (en) 1987-08-18 1987-08-18 Bus controller

Country Status (1)

Country Link
JP (1) JPS6446862A (en)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071666A (en) * 1996-05-13 2000-06-06 Sumitomo Bakelite Company, Ltd. Positive type photosensitive resin composition and semiconductor device using the same
US6207356B1 (en) 1996-12-31 2001-03-27 Sumitomo Bakelite Company Limited Method for the pattern-processing of photosensitive resin composition
US6436593B1 (en) 1999-09-28 2002-08-20 Hitachi Chemical Dupont Microsystems Ltd. Positive photosensitive resin composition, process for producing pattern and electronic parts
US6607865B2 (en) 2000-07-31 2003-08-19 Sumitomo Electric Industries, Ltd. Positive photosensitive resin composition
US6613699B2 (en) 2001-01-05 2003-09-02 Sumitomo Bakelite Company Limited Process for producing a semiconductor device
US6908717B2 (en) 2000-10-31 2005-06-21 Sumitomo Bakelite Company Limited Positive photosensitive resin composition, process for its preparation, and semiconductor devices
US6960420B2 (en) 2002-11-06 2005-11-01 Hitachi Chemical Dupont Microsystems Ltd Photosensitive resin composition, process for forming relief pattern, and electronic component
US7150947B2 (en) 2002-05-17 2006-12-19 Hitachi Chemical Dupont Microsystems Ltd. Photosensitive polymer composition, method of forming relief patterns, and electronic equipment
US7238455B2 (en) 2003-06-23 2007-07-03 Sumitomo Bakelite Company, Ltd. Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
US7282323B2 (en) 2002-07-11 2007-10-16 Asahi Kasei Emd Corporation Highly heat-resistant, negative-type photosensitive resin composition
JP2008040905A (en) * 2006-08-08 2008-02-21 Nec Electronics Corp Semiconductor device and access method to storage device
WO2008050886A1 (en) 2006-10-24 2008-05-02 Sumitomo Bakelite Company Limited Bis(aminophenol) derivative, process for producing the same, polyamide resin, positive photosensitive resin compositions, protective film, interlayer dielectric, semiconductor device, and display element
US7368205B2 (en) 2003-08-06 2008-05-06 Sumitomo Bakelite Co., Ltd. Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
US7416822B2 (en) * 2004-01-20 2008-08-26 Asahi Kasei Emd Corporation Resin and resin composition
US7435525B2 (en) 2004-05-07 2008-10-14 Hitachi Chemical Dupont Microsystems Ltd. Positive photosensitive resin composition, method for forming pattern, and electronic part
WO2008156190A1 (en) 2007-06-18 2008-12-24 Sumitomo Bakelite Co., Ltd. Process for producing semiconductor device
US7638254B2 (en) 2004-05-07 2009-12-29 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, method for forming pattern, and electronic part
US7687208B2 (en) 2006-08-15 2010-03-30 Asahi Kasei Emd Corporation Positive photosensitive resin composition
US7781131B2 (en) 2007-08-21 2010-08-24 Sumitomo Bakelite Co., Ltd. Positive photosensitive resin composition, cured layer , protecting layer, insulating layer and semiconductor device and display therewith
US7808083B2 (en) 2004-09-29 2010-10-05 Sumitomo Bakelite Company, Ltd. Semiconductor device
US7915467B2 (en) 2004-10-20 2011-03-29 Sumitomo Bakelite Company, Ltd. Semiconductor wafer and semiconductor device
US7939241B2 (en) 2005-05-13 2011-05-10 Nec Corporation (Meth)acrylamide derivative, polymer, chemically amplified photosensitive resin composition, and patterning method
US8097386B2 (en) 2006-08-14 2012-01-17 Hitachi Chemical Dupont Microsystems, Ltd. Positive-type photosensitive resin composition, method for producing patterns, and electronic parts
US8298747B2 (en) 2007-03-12 2012-10-30 Hitachi Chemical Dupont Microsystems, Ltd. Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
US8420291B2 (en) 2007-10-29 2013-04-16 Hitachi Chemical Dupont Microsystems, Ltd. Positive photosensitive resin composition, method for forming pattern, electronic component
EP2639638A1 (en) 2005-11-30 2013-09-18 Sumitomo Bakelite Co., Ltd. Positive photosensitive resin composition, and semiconductor device and display therewith
US8758977B2 (en) 2005-09-22 2014-06-24 Hitachi Chemical Dupont Microsystems, Ltd. Negative-type photosensitive resin composition, pattern forming method and electronic parts
KR20170048339A (en) 2014-09-02 2017-05-08 도레이 카부시키가이샤 Resin and photosensitive resin composition
KR20180063101A (en) 2015-10-08 2018-06-11 닛뽄 가야쿠 가부시키가이샤 A novel polysulfonamide compound and a resin composition containing the compound
KR20190049488A (en) 2017-10-31 2019-05-09 다이요 홀딩스 가부시키가이샤 Photosensitive resin composition, dry film, cured product, semiconductor element, printed wiring board, and electronic component

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071666A (en) * 1996-05-13 2000-06-06 Sumitomo Bakelite Company, Ltd. Positive type photosensitive resin composition and semiconductor device using the same
US6235436B1 (en) 1996-05-13 2001-05-22 Sumitomo Bakelite Company Limited Semiconductor device using positive photosensitive resin composition and process for preparation thereof
US6207356B1 (en) 1996-12-31 2001-03-27 Sumitomo Bakelite Company Limited Method for the pattern-processing of photosensitive resin composition
US6436593B1 (en) 1999-09-28 2002-08-20 Hitachi Chemical Dupont Microsystems Ltd. Positive photosensitive resin composition, process for producing pattern and electronic parts
US6607865B2 (en) 2000-07-31 2003-08-19 Sumitomo Electric Industries, Ltd. Positive photosensitive resin composition
US6908717B2 (en) 2000-10-31 2005-06-21 Sumitomo Bakelite Company Limited Positive photosensitive resin composition, process for its preparation, and semiconductor devices
US6613699B2 (en) 2001-01-05 2003-09-02 Sumitomo Bakelite Company Limited Process for producing a semiconductor device
US7150947B2 (en) 2002-05-17 2006-12-19 Hitachi Chemical Dupont Microsystems Ltd. Photosensitive polymer composition, method of forming relief patterns, and electronic equipment
US8304149B2 (en) 2002-05-17 2012-11-06 Hitachi Chemical Dupont Microsystems Ltd. Photosensitive polymer composition, method of forming relief patterns, and electronic equipment
US7851128B2 (en) 2002-05-17 2010-12-14 Hitachi Chemical Dupont Microsystems Ltd. Photosensitive polymer composition, method of forming relief patterns, and electronic equipment
US7282323B2 (en) 2002-07-11 2007-10-16 Asahi Kasei Emd Corporation Highly heat-resistant, negative-type photosensitive resin composition
US6960420B2 (en) 2002-11-06 2005-11-01 Hitachi Chemical Dupont Microsystems Ltd Photosensitive resin composition, process for forming relief pattern, and electronic component
US7238455B2 (en) 2003-06-23 2007-07-03 Sumitomo Bakelite Company, Ltd. Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
US7361445B2 (en) 2003-06-23 2008-04-22 Sumitomo Bakelite Company Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
US7368205B2 (en) 2003-08-06 2008-05-06 Sumitomo Bakelite Co., Ltd. Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
US7416822B2 (en) * 2004-01-20 2008-08-26 Asahi Kasei Emd Corporation Resin and resin composition
US7638254B2 (en) 2004-05-07 2009-12-29 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, method for forming pattern, and electronic part
US7435525B2 (en) 2004-05-07 2008-10-14 Hitachi Chemical Dupont Microsystems Ltd. Positive photosensitive resin composition, method for forming pattern, and electronic part
US7808083B2 (en) 2004-09-29 2010-10-05 Sumitomo Bakelite Company, Ltd. Semiconductor device
US7915467B2 (en) 2004-10-20 2011-03-29 Sumitomo Bakelite Company, Ltd. Semiconductor wafer and semiconductor device
US7939241B2 (en) 2005-05-13 2011-05-10 Nec Corporation (Meth)acrylamide derivative, polymer, chemically amplified photosensitive resin composition, and patterning method
US8871422B2 (en) 2005-09-22 2014-10-28 Hitachi Chemical Dupont Microsystems Ltd. Negative-type photosensitive resin composition, pattern forming method and electronic parts
US8758977B2 (en) 2005-09-22 2014-06-24 Hitachi Chemical Dupont Microsystems, Ltd. Negative-type photosensitive resin composition, pattern forming method and electronic parts
EP2639638A1 (en) 2005-11-30 2013-09-18 Sumitomo Bakelite Co., Ltd. Positive photosensitive resin composition, and semiconductor device and display therewith
JP2008040905A (en) * 2006-08-08 2008-02-21 Nec Electronics Corp Semiconductor device and access method to storage device
US8097386B2 (en) 2006-08-14 2012-01-17 Hitachi Chemical Dupont Microsystems, Ltd. Positive-type photosensitive resin composition, method for producing patterns, and electronic parts
US7687208B2 (en) 2006-08-15 2010-03-30 Asahi Kasei Emd Corporation Positive photosensitive resin composition
WO2008050886A1 (en) 2006-10-24 2008-05-02 Sumitomo Bakelite Company Limited Bis(aminophenol) derivative, process for producing the same, polyamide resin, positive photosensitive resin compositions, protective film, interlayer dielectric, semiconductor device, and display element
US8298747B2 (en) 2007-03-12 2012-10-30 Hitachi Chemical Dupont Microsystems, Ltd. Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
US8198006B2 (en) 2007-06-18 2012-06-12 Sumitomo Bakelite Co., Ltd. Process for producing semiconductor device
WO2008156190A1 (en) 2007-06-18 2008-12-24 Sumitomo Bakelite Co., Ltd. Process for producing semiconductor device
US7781131B2 (en) 2007-08-21 2010-08-24 Sumitomo Bakelite Co., Ltd. Positive photosensitive resin composition, cured layer , protecting layer, insulating layer and semiconductor device and display therewith
US8420291B2 (en) 2007-10-29 2013-04-16 Hitachi Chemical Dupont Microsystems, Ltd. Positive photosensitive resin composition, method for forming pattern, electronic component
KR20170048339A (en) 2014-09-02 2017-05-08 도레이 카부시키가이샤 Resin and photosensitive resin composition
KR20180063101A (en) 2015-10-08 2018-06-11 닛뽄 가야쿠 가부시키가이샤 A novel polysulfonamide compound and a resin composition containing the compound
KR20190049488A (en) 2017-10-31 2019-05-09 다이요 홀딩스 가부시키가이샤 Photosensitive resin composition, dry film, cured product, semiconductor element, printed wiring board, and electronic component

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