JPS6433770U - - Google Patents
Info
- Publication number
- JPS6433770U JPS6433770U JP12769287U JP12769287U JPS6433770U JP S6433770 U JPS6433770 U JP S6433770U JP 12769287 U JP12769287 U JP 12769287U JP 12769287 U JP12769287 U JP 12769287U JP S6433770 U JPS6433770 U JP S6433770U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- soldering
- copper foil
- shielding portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例の断面図、第２図
はその平面図、第３図はこの考案の他の実施例の
断面図、第４図はその平面図、第５図は従来のプ
リント配線板の断面図、第６図はその平面図、第
７図は従来の他のプリント配線板の平面図である
。
１……レジスト部（半田付け遮蔽部）、２，２
′……プリント配線板、７……はとめ、７ａ……
フランジ、８……半田、９……銅箔部分、１０…
…銅箔エツチング部（半田付け遮蔽部）。
Fig. 1 is a sectional view of one embodiment of this invention, Fig. 2 is a plan view thereof, Fig. 3 is a sectional view of another embodiment of this invention, Fig. 4 is a plan view thereof, and Fig. 5 is a conventional FIG. 6 is a sectional view of the printed wiring board, FIG. 6 is a plan view thereof, and FIG. 7 is a plan view of another conventional printed wiring board. 1...Resist part (soldering shielding part), 2, 2
'... Printed wiring board, 7... Eyelet, 7a...
Flange, 8...Solder, 9...Copper foil part, 10...
...Copper foil etching part (soldering shield part).
Claims (1)
配線板において、 前記はとめのフランジで隠蔽される前記貫通孔
の周囲の銅箔部分に半田付け遮蔽部を設けたこと
を特徴とするプリント配線板。 (2) 前記半田付け遮蔽部がレジスト部である実
用新案登録請求の範囲第(1)項記載のプリント配
線板。 (3) 前記半田付け遮蔽部が銅箔エツチング部で
ある実用新案登録請求の範囲第(1)項記載のプリ
ント配線板。[Claims for Utility Model Registration] (1) In a printed wiring board having a through hole for attaching a grommet, a soldering shielding portion is provided in a copper foil portion around the through hole that is hidden by a flange of the grommet. A printed wiring board characterized by: (2) The printed wiring board according to claim 1, wherein the soldering shielding portion is a resist portion. (3) The printed wiring board according to claim (1), wherein the soldering shielding portion is a copper foil etching portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987127692U JPH0547484Y2 (en) | 1987-08-20 | 1987-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987127692U JPH0547484Y2 (en) | 1987-08-20 | 1987-08-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6433770U true JPS6433770U (en) | 1989-03-02 |
| JPH0547484Y2 JPH0547484Y2 (en) | 1993-12-14 |
Family
ID=31380345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987127692U Expired - Lifetime JPH0547484Y2 (en) | 1987-08-20 | 1987-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0547484Y2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7162598B2 (en) | 1998-08-20 | 2007-01-09 | Hitachi, Ltd. | Storage system |
| US7167962B2 (en) | 1999-08-19 | 2007-01-23 | Hitachi, Ltd. | Remote copy for a storage controller with reduced data size |
| US7194590B2 (en) | 2001-02-28 | 2007-03-20 | Hitachi, Ltd. | Three data center adaptive remote copy |
| US7213114B2 (en) | 2001-05-10 | 2007-05-01 | Hitachi, Ltd. | Remote copy for a storage controller in a heterogeneous environment |
| US7246214B2 (en) | 1998-09-09 | 2007-07-17 | Hitachi, Ltd. | Remote copy for a storage controller with reduced data size |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5398958U (en) * | 1977-01-14 | 1978-08-10 | ||
| JPS5857916A (en) * | 1981-10-02 | 1983-04-06 | Matsushita Electric Ind Co Ltd | Laser processing to resin material |
-
1987
- 1987-08-20 JP JP1987127692U patent/JPH0547484Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5398958U (en) * | 1977-01-14 | 1978-08-10 | ||
| JPS5857916A (en) * | 1981-10-02 | 1983-04-06 | Matsushita Electric Ind Co Ltd | Laser processing to resin material |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7162598B2 (en) | 1998-08-20 | 2007-01-09 | Hitachi, Ltd. | Storage system |
| US7246214B2 (en) | 1998-09-09 | 2007-07-17 | Hitachi, Ltd. | Remote copy for a storage controller with reduced data size |
| US7167962B2 (en) | 1999-08-19 | 2007-01-23 | Hitachi, Ltd. | Remote copy for a storage controller with reduced data size |
| US7194590B2 (en) | 2001-02-28 | 2007-03-20 | Hitachi, Ltd. | Three data center adaptive remote copy |
| US7213114B2 (en) | 2001-05-10 | 2007-05-01 | Hitachi, Ltd. | Remote copy for a storage controller in a heterogeneous environment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0547484Y2 (en) | 1993-12-14 |