JPS6384176A - Magnetic focusing type hall element and manufacture thereof - Google Patents
Magnetic focusing type hall element and manufacture thereofInfo
- Publication number
- JPS6384176A JPS6384176A JP61230679A JP23067986A JPS6384176A JP S6384176 A JPS6384176 A JP S6384176A JP 61230679 A JP61230679 A JP 61230679A JP 23067986 A JP23067986 A JP 23067986A JP S6384176 A JPS6384176 A JP S6384176A
- Authority
- JP
- Japan
- Prior art keywords
- hall element
- soft ferromagnetic
- magnetic
- lead frame
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 5
- 230000005355 Hall effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 239000003302 ferromagnetic material Substances 0.000 claims 2
- 230000035945 sensitivity Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 229910000889 permalloy Inorganic materials 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 238000001721 transfer moulding Methods 0.000 abstract 1
- 239000008188 pellet Substances 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000006247 magnetic powder Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Hall/Mr Elements (AREA)
Abstract
PURPOSE:To achieve a thin configuration and high sensitivity, by using soft ferromagnetic metal such as permalloy as a lead frame material for fixing a Hall element. CONSTITUTION:A Hall element 3 composed of GaAs, In-Sb and the like is fixed on the bed part of a lead frame 1' composed of soft ferromagnetic metal (e.g., permalloy) with a bonding agent 6. Wire bonding between the electrodes of the element 3 and leads is performed by using wires 4. Then encapsulating resin 5 including soft ferromagnetic powder is dropped on the element and hardened. The device is molded with transfer molding resin 7 such as epoxy and the resin is hardened. Thus the magnetic focusing type Hall element is obtained.
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は磁界収束型ホール素子（ホール効果を用いた磁
気センサ）及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a magnetic field focusing Hall element (a magnetic sensor using the Hall effect) and a manufacturing method thereof.
（従来の技術）
磁場の強弱で抵抗が変わるのをホール効果という。従来
の磁界収束型ホール素子構造は、第３図のようにリード
フレーム１のペラＰ部ｌａ上にＭ ｎ −Ｚ ｎフェラ
イト等の高透磁率を有する軟質性基板２をｓ Ａ ｇペ
ーストや半田材のような接合材料６でマウントし、その
上に更にＧａ人３゜Ｉｎ８ｂ等のホール素子３をＡｇペ
ースト等でマウントし、がンディングワイヤ４によりホ
ール素子３上の電極とリードフレームのインナーリード
とを接続し、次にＭ ｎ −Ｚ ｎフェライトのような
軟磁性粉を含有するエンキャップ剤５でベレット中央部
に山盛り状にポツティングされている。ベレット上下の
磁性体により、磁界を収束させることによってホール素
子感度を向上させていた。図中２はモールドレジンであ
る。(Conventional technology) The change in resistance depending on the strength of the magnetic field is called the Hall effect. In the conventional magnetic field convergence type Hall element structure, as shown in FIG. A Hall element 3 made of Ga, In, or the like is further mounted with Ag paste, etc., and a bonding wire 4 connects the electrode on the Hall element 3 to the inner lead of the lead frame. Then, an encapsulant 5 containing soft magnetic powder such as Mn-Zn ferrite is potted in a heaped shape at the center of the pellet. The magnetic material on the top and bottom of the pellet converges the magnetic field, improving the sensitivity of the Hall element. 2 in the figure is mold resin.
（発明が解決しようとする問題点）
上記従来例のようにベレット下にフェライトのような軟
質磁性体基板チップを置く方法は、比較的高感度な磁気
特性は得られるが、フェライト板２のようなものと重ね
ているため、外囲器の薄型化要求は対処できなかった。(Problems to be Solved by the Invention) The method of placing a soft magnetic substrate chip such as ferrite under the pellet as in the conventional example described above can obtain relatively highly sensitive magnetic properties, but Because it overlapped with other products, it was not possible to meet the demand for a thinner envelope.
本発明は外囲器形状をできるだけ薄くし、しかも高感度
特性が得られるようにしたものである。The present invention is designed to make the envelope shape as thin as possible and to obtain high sensitivity characteristics.
（問題点を解決するための手段と作用）従来は、ホール
素子を固着するリードフレーム材料として、非磁性体材
料であるＣｕもしくはＣｕ合金（例えばリン青銅）を用
いていた。これに対して本発明は、リードフレーム材料
として・９−マロイなどの軟質強磁性メタルを用いるこ
とにより、薄形かつ高感度化を行なうものである。(Means and effects for solving the problem) Conventionally, a non-magnetic material such as Cu or a Cu alloy (for example, phosphor bronze) has been used as a lead frame material for fixing the Hall element. In contrast, the present invention uses a soft ferromagnetic metal such as 9-malloy as the lead frame material to achieve a thinner structure and higher sensitivity.
（実施例）
以下図面を参照して本発明の一実施例を説明する。第１
図は同実施例の平面図、第２図は同断面図である。即ち
軟質強磁性金属（例えばパーマロイ）よりなるリードフ
レーム１′のベッド部上に、ＧａＡｓ、Ｉｎ−８ｂ等の
ホール素子３が接着剤６にて固定されている。その後ワ
イヤ４を用いて素子３の電極とリード間のワイヤデンデ
ィングがなされる。その後、軟質強磁性粉を含有するエ
ンキャップレジン５を素子表面に滴下し硬化させる。そ
れからエポキシ等のトランスファモールドレジン７で成
形硬化させるものである。(Example) An example of the present invention will be described below with reference to the drawings. 1st
The figure is a plan view of the same embodiment, and FIG. 2 is a sectional view of the same. That is, a Hall element 3 made of GaAs, In-8b, etc. is fixed with an adhesive 6 on a bed portion of a lead frame 1' made of a soft ferromagnetic metal (for example, permalloy). Thereafter, the wire 4 is used to perform wire endings between the electrodes of the element 3 and the leads. Thereafter, encap resin 5 containing soft ferromagnetic powder is dropped onto the element surface and hardened. Then, it is molded and hardened with a transfer mold resin 7 such as epoxy.
上記のように構成された磁界収束型ホール素子にあつて
は、軟質強磁性金属よりなるリードフレーム１′と軟質
性強磁性粉を含有するエンキャップレジン５が磁気を集
める役目をするから高感度磁気特性を維持しつつ、第３
図のフェライト板２を省略できる等で外囲器の薄形化が
可能となるものである。ちなみに従来はモールド形状と
して厚さが１．１諷必要であったが、本発明では厚さを
０．６露とほぼ半分にすることができた。In the magnetic field focusing Hall element configured as described above, the lead frame 1' made of soft ferromagnetic metal and the encap resin 5 containing soft ferromagnetic powder serve to collect magnetism, resulting in high sensitivity. While maintaining the magnetic properties, the third
Since the ferrite plate 2 shown in the figure can be omitted, the envelope can be made thinner. Incidentally, conventionally, the mold shape required a thickness of 1.1 mm, but in the present invention, the thickness could be reduced to 0.6 mm, which is almost half.
以上説明した如く本発明によれば、金属細条（リードフ
レーム材料）として軟質強磁性メタルを用いたため、磁
界収束型ホール素子の高感度特性を維持しつつ、外囲器
形状の薄形化が可能となった。As explained above, according to the present invention, since a soft ferromagnetic metal is used as the metal strip (lead frame material), the envelope shape can be made thinner while maintaining the high sensitivity characteristics of the magnetic field focusing Hall element. It has become possible.
第１図は本発明の一実施例の平面図、第２図は同断面図
、第３図は従来素子の断面図である。
１′・・・軟質強磁性リードフレーム、３・・・ホール
素子、４・・・デンディングワイヤ、５・−磁性粉入リ
エンキャップ剤、６・・・接合材、７・・・モールドレ
ジン。
出願人代理人 弁理士 鈴 江 武 産業１図
第２図
第３図FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a sectional view of the same, and FIG. 3 is a sectional view of a conventional element. DESCRIPTION OF SYMBOLS 1'... Soft ferromagnetic lead frame, 3... Hall element, 4... Dending wire, 5... Magnetic powder-containing reencapping agent, 6... Bonding material, 7... Mold resin. Applicant's agent Patent attorney Takeshi Suzue Industry Figure 1 Figure 2 Figure 3
Claims (2)
上に固着されたホール効果型磁性素子と、インナリード
と前記素子上の電極を接続するボンディングワイヤと、
前記素子を上方から覆う軟質強磁性粉を含有する樹脂と
を具備したことを特徴とする磁界収束型ホール素子。(1) a metal strip made of a soft ferromagnetic material, a Hall effect magnetic element fixed on the metal strip, and a bonding wire connecting an inner lead and an electrode on the element;
A magnetic field convergence type Hall element, comprising a resin containing soft ferromagnetic powder that covers the element from above.
条の上にホール効果型磁性素子を接合し、インナリード
と前記素子上の電極とをボンディングワイヤで接続し、
前記素子表面上に軟質強磁性粉を含有する樹脂を滴下し
て硬化させ、前記各部材を囲むようにモールドレジンに
て成形硬化させたことを特徴とする磁性収束型ホール素
子の製造方法。(2) A Hall effect magnetic element is bonded onto a patterned metal strip made of soft ferromagnetic material, and an inner lead and an electrode on the element are connected with a bonding wire,
A method for manufacturing a magnetic convergence type Hall element, characterized in that a resin containing soft ferromagnetic powder is dropped onto the surface of the element and cured, and then molded and cured with a mold resin so as to surround each member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61230679A JPS6384176A (en) | 1986-09-29 | 1986-09-29 | Magnetic focusing type hall element and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61230679A JPS6384176A (en) | 1986-09-29 | 1986-09-29 | Magnetic focusing type hall element and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6384176A true JPS6384176A (en) | 1988-04-14 |
Family
ID=16911607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61230679A Pending JPS6384176A (en) | 1986-09-29 | 1986-09-29 | Magnetic focusing type hall element and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6384176A (en) |
Cited By (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265865B1 (en) * | 1997-08-19 | 2001-07-24 | Allegro Microsystems, Inc. | Single unitary plastic package for a magnetic field sensing device |
| JP2006170999A (en) * | 2004-12-15 | 2006-06-29 | Robert Bosch Gmbh | Magnetic sensor device |
| JP2007095788A (en) * | 2005-09-27 | 2007-04-12 | Asahi Kasei Electronics Co Ltd | Magnetic sensor |
| JP2008304470A (en) * | 2008-07-10 | 2008-12-18 | Asahi Kasei Electronics Co Ltd | Magnetic sensor |
| US8058870B2 (en) | 2008-05-30 | 2011-11-15 | Infineon Technologies Ag | Methods and systems for magnetic sensing |
| US8143169B2 (en) | 2007-03-29 | 2012-03-27 | Allegro Microsystems, Inc. | Methods for multi-stage molding of integrated circuit package |
| US8174256B2 (en) | 2008-05-30 | 2012-05-08 | Infineon Technologies Ag | Methods and systems for magnetic field sensing |
| US8461677B2 (en) | 2008-12-05 | 2013-06-11 | Allegro Microsystems, Llc | Magnetic field sensors and methods for fabricating the magnetic field sensors |
| US8587297B2 (en) | 2007-12-04 | 2013-11-19 | Infineon Technologies Ag | Integrated circuit including sensor having injection molded magnetic material |
| US8610430B2 (en) | 2008-05-30 | 2013-12-17 | Infineon Technologies Ag | Bias field generation for a magneto sensor |
| CN105206740A (en) * | 2015-11-03 | 2015-12-30 | 常州顶芯半导体技术有限公司 | Encapsulation mode of Hall device |
| CN105355607A (en) * | 2015-11-06 | 2016-02-24 | 常州顶芯半导体技术有限公司 | Direct-insertion type integrated circuit packaging body |
| US9620705B2 (en) | 2012-01-16 | 2017-04-11 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having non-conductive die paddle |
| US9666788B2 (en) | 2012-03-20 | 2017-05-30 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
| US9719806B2 (en) | 2014-10-31 | 2017-08-01 | Allegro Microsystems, Llc | Magnetic field sensor for sensing a movement of a ferromagnetic target object |
| US9720054B2 (en) | 2014-10-31 | 2017-08-01 | Allegro Microsystems, Llc | Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element |
| US9810519B2 (en) | 2013-07-19 | 2017-11-07 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors that act as tooth detectors |
| US9812588B2 (en) | 2012-03-20 | 2017-11-07 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| US9817078B2 (en) | 2012-05-10 | 2017-11-14 | Allegro Microsystems Llc | Methods and apparatus for magnetic sensor having integrated coil |
| US9823092B2 (en) | 2014-10-31 | 2017-11-21 | Allegro Microsystems, Llc | Magnetic field sensor providing a movement detector |
| US9823090B2 (en) | 2014-10-31 | 2017-11-21 | Allegro Microsystems, Llc | Magnetic field sensor for sensing a movement of a target object |
| US10012518B2 (en) | 2016-06-08 | 2018-07-03 | Allegro Microsystems, Llc | Magnetic field sensor for sensing a proximity of an object |
| US10041810B2 (en) | 2016-06-08 | 2018-08-07 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors that act as movement detectors |
| US10145908B2 (en) | 2013-07-19 | 2018-12-04 | Allegro Microsystems, Llc | Method and apparatus for magnetic sensor producing a changing magnetic field |
| US10215550B2 (en) | 2012-05-01 | 2019-02-26 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensors having highly uniform magnetic fields |
| US10234513B2 (en) | 2012-03-20 | 2019-03-19 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| US10260905B2 (en) | 2016-06-08 | 2019-04-16 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors to cancel offset variations |
| US10310028B2 (en) | 2017-05-26 | 2019-06-04 | Allegro Microsystems, Llc | Coil actuated pressure sensor |
| US10324141B2 (en) | 2017-05-26 | 2019-06-18 | Allegro Microsystems, Llc | Packages for coil actuated position sensors |
| US10495699B2 (en) | 2013-07-19 | 2019-12-03 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target |
| US10641842B2 (en) | 2017-05-26 | 2020-05-05 | Allegro Microsystems, Llc | Targets for coil actuated position sensors |
| US10712403B2 (en) | 2014-10-31 | 2020-07-14 | Allegro Microsystems, Llc | Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element |
| US10725100B2 (en) | 2013-03-15 | 2020-07-28 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having an externally accessible coil |
| US10823586B2 (en) | 2018-12-26 | 2020-11-03 | Allegro Microsystems, Llc | Magnetic field sensor having unequally spaced magnetic field sensing elements |
| US10837943B2 (en) | 2017-05-26 | 2020-11-17 | Allegro Microsystems, Llc | Magnetic field sensor with error calculation |
| US10866117B2 (en) | 2018-03-01 | 2020-12-15 | Allegro Microsystems, Llc | Magnetic field influence during rotation movement of magnetic target |
| US10921391B2 (en) | 2018-08-06 | 2021-02-16 | Allegro Microsystems, Llc | Magnetic field sensor with spacer |
| US10955306B2 (en) | 2019-04-22 | 2021-03-23 | Allegro Microsystems, Llc | Coil actuated pressure sensor and deformable substrate |
| US10991644B2 (en) | 2019-08-22 | 2021-04-27 | Allegro Microsystems, Llc | Integrated circuit package having a low profile |
| US10996289B2 (en) | 2017-05-26 | 2021-05-04 | Allegro Microsystems, Llc | Coil actuated position sensor with reflected magnetic field |
| US11061084B2 (en) | 2019-03-07 | 2021-07-13 | Allegro Microsystems, Llc | Coil actuated pressure sensor and deflectable substrate |
| US11237020B2 (en) | 2019-11-14 | 2022-02-01 | Allegro Microsystems, Llc | Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet |
| US11255700B2 (en) | 2018-08-06 | 2022-02-22 | Allegro Microsystems, Llc | Magnetic field sensor |
| US11262422B2 (en) | 2020-05-08 | 2022-03-01 | Allegro Microsystems, Llc | Stray-field-immune coil-activated position sensor |
| US11280637B2 (en) | 2019-11-14 | 2022-03-22 | Allegro Microsystems, Llc | High performance magnetic angle sensor |
| US11428755B2 (en) | 2017-05-26 | 2022-08-30 | Allegro Microsystems, Llc | Coil actuated sensor with sensitivity detection |
| US11493361B2 (en) | 2021-02-26 | 2022-11-08 | Allegro Microsystems, Llc | Stray field immune coil-activated sensor |
-
1986
- 1986-09-29 JP JP61230679A patent/JPS6384176A/en active Pending
Cited By (75)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265865B1 (en) * | 1997-08-19 | 2001-07-24 | Allegro Microsystems, Inc. | Single unitary plastic package for a magnetic field sensing device |
| JP2006170999A (en) * | 2004-12-15 | 2006-06-29 | Robert Bosch Gmbh | Magnetic sensor device |
| JP2007095788A (en) * | 2005-09-27 | 2007-04-12 | Asahi Kasei Electronics Co Ltd | Magnetic sensor |
| US8143169B2 (en) | 2007-03-29 | 2012-03-27 | Allegro Microsystems, Inc. | Methods for multi-stage molding of integrated circuit package |
| US8587297B2 (en) | 2007-12-04 | 2013-11-19 | Infineon Technologies Ag | Integrated circuit including sensor having injection molded magnetic material |
| DE102008064827B3 (en) * | 2007-12-04 | 2017-07-13 | Infineon Technologies Ag | Magnetic field sensor, system and method of manufacturing an integrated circuit |
| US9559293B2 (en) | 2007-12-04 | 2017-01-31 | Infineon Technologies Ag | Integrated circuit including sensor having injection molded magnetic material |
| US10355197B2 (en) | 2007-12-04 | 2019-07-16 | Infineon Technologies Ag | Integrated circuit including sensor having injection molded magnetic materials having different magnetic remanences |
| DE102008058895B4 (en) * | 2007-12-04 | 2014-11-13 | Infineon Technologies Ag | Magnetic field sensor, system with a magnetic field sensor and method of manufacturing a magnetic field sensor |
| US8058870B2 (en) | 2008-05-30 | 2011-11-15 | Infineon Technologies Ag | Methods and systems for magnetic sensing |
| US8610430B2 (en) | 2008-05-30 | 2013-12-17 | Infineon Technologies Ag | Bias field generation for a magneto sensor |
| US8174256B2 (en) | 2008-05-30 | 2012-05-08 | Infineon Technologies Ag | Methods and systems for magnetic field sensing |
| US9678170B2 (en) | 2008-05-30 | 2017-06-13 | Infineon Technologies Ag | Bias field generation for a magneto sensor |
| US10310026B2 (en) | 2008-05-30 | 2019-06-04 | Infineon Technologies Ag | Bias field generation for a magneto sensor |
| JP2008304470A (en) * | 2008-07-10 | 2008-12-18 | Asahi Kasei Electronics Co Ltd | Magnetic sensor |
| US8486755B2 (en) | 2008-12-05 | 2013-07-16 | Allegro Microsystems, Llc | Magnetic field sensors and methods for fabricating the magnetic field sensors |
| US8461677B2 (en) | 2008-12-05 | 2013-06-11 | Allegro Microsystems, Llc | Magnetic field sensors and methods for fabricating the magnetic field sensors |
| US10333055B2 (en) | 2012-01-16 | 2019-06-25 | Allegro Microsystems, Llc | Methods for magnetic sensor having non-conductive die paddle |
| US9620705B2 (en) | 2012-01-16 | 2017-04-11 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having non-conductive die paddle |
| US11961920B2 (en) | 2012-03-20 | 2024-04-16 | Allegro Microsystems, Llc | Integrated circuit package with magnet having a channel |
| US11828819B2 (en) | 2012-03-20 | 2023-11-28 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| US9812588B2 (en) | 2012-03-20 | 2017-11-07 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| US9666788B2 (en) | 2012-03-20 | 2017-05-30 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
| US10916665B2 (en) | 2012-03-20 | 2021-02-09 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with an integrated coil |
| US11677032B2 (en) | 2012-03-20 | 2023-06-13 | Allegro Microsystems, Llc | Sensor integrated circuit with integrated coil and element in central region of mold material |
| US11444209B2 (en) | 2012-03-20 | 2022-09-13 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with an integrated coil enclosed with a semiconductor die by a mold material |
| US10234513B2 (en) | 2012-03-20 | 2019-03-19 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| US10230006B2 (en) | 2012-03-20 | 2019-03-12 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with an electromagnetic suppressor |
| US10215550B2 (en) | 2012-05-01 | 2019-02-26 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensors having highly uniform magnetic fields |
| US9817078B2 (en) | 2012-05-10 | 2017-11-14 | Allegro Microsystems Llc | Methods and apparatus for magnetic sensor having integrated coil |
| US11680996B2 (en) | 2012-05-10 | 2023-06-20 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having integrated coil |
| US10725100B2 (en) | 2013-03-15 | 2020-07-28 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having an externally accessible coil |
| US10145908B2 (en) | 2013-07-19 | 2018-12-04 | Allegro Microsystems, Llc | Method and apparatus for magnetic sensor producing a changing magnetic field |
| US11313924B2 (en) | 2013-07-19 | 2022-04-26 | Allegro Microsystems, Llc | Method and apparatus for magnetic sensor producing a changing magnetic field |
| US10254103B2 (en) | 2013-07-19 | 2019-04-09 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors that act as tooth detectors |
| US10495699B2 (en) | 2013-07-19 | 2019-12-03 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target |
| US9810519B2 (en) | 2013-07-19 | 2017-11-07 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors that act as tooth detectors |
| US10670672B2 (en) | 2013-07-19 | 2020-06-02 | Allegro Microsystems, Llc | Method and apparatus for magnetic sensor producing a changing magnetic field |
| US10753769B2 (en) | 2014-10-31 | 2020-08-25 | Allegro Microsystems, Llc | Magnetic field sensor providing a movement detector |
| US11307054B2 (en) | 2014-10-31 | 2022-04-19 | Allegro Microsystems, Llc | Magnetic field sensor providing a movement detector |
| US9719806B2 (en) | 2014-10-31 | 2017-08-01 | Allegro Microsystems, Llc | Magnetic field sensor for sensing a movement of a ferromagnetic target object |
| US9720054B2 (en) | 2014-10-31 | 2017-08-01 | Allegro Microsystems, Llc | Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element |
| US10712403B2 (en) | 2014-10-31 | 2020-07-14 | Allegro Microsystems, Llc | Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element |
| US9823092B2 (en) | 2014-10-31 | 2017-11-21 | Allegro Microsystems, Llc | Magnetic field sensor providing a movement detector |
| US10753768B2 (en) | 2014-10-31 | 2020-08-25 | Allegro Microsystems, Llc | Magnetic field sensor providing a movement detector |
| US9823090B2 (en) | 2014-10-31 | 2017-11-21 | Allegro Microsystems, Llc | Magnetic field sensor for sensing a movement of a target object |
| CN105206740A (en) * | 2015-11-03 | 2015-12-30 | 常州顶芯半导体技术有限公司 | Encapsulation mode of Hall device |
| CN105355607A (en) * | 2015-11-06 | 2016-02-24 | 常州顶芯半导体技术有限公司 | Direct-insertion type integrated circuit packaging body |
| US10041810B2 (en) | 2016-06-08 | 2018-08-07 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors that act as movement detectors |
| US10837800B2 (en) | 2016-06-08 | 2020-11-17 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors that act as movement detectors |
| US10012518B2 (en) | 2016-06-08 | 2018-07-03 | Allegro Microsystems, Llc | Magnetic field sensor for sensing a proximity of an object |
| US10260905B2 (en) | 2016-06-08 | 2019-04-16 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors to cancel offset variations |
| US11073573B2 (en) | 2017-05-26 | 2021-07-27 | Allegro Microsystems, Llc | Packages for coil actuated position sensors |
| US11320496B2 (en) | 2017-05-26 | 2022-05-03 | Allegro Microsystems, Llc | Targets for coil actuated position sensors |
| US10324141B2 (en) | 2017-05-26 | 2019-06-18 | Allegro Microsystems, Llc | Packages for coil actuated position sensors |
| US10996289B2 (en) | 2017-05-26 | 2021-05-04 | Allegro Microsystems, Llc | Coil actuated position sensor with reflected magnetic field |
| US10310028B2 (en) | 2017-05-26 | 2019-06-04 | Allegro Microsystems, Llc | Coil actuated pressure sensor |
| US11768256B2 (en) | 2017-05-26 | 2023-09-26 | Allegro Microsystems, Llc | Coil actuated sensor with sensitivity detection |
| US11428755B2 (en) | 2017-05-26 | 2022-08-30 | Allegro Microsystems, Llc | Coil actuated sensor with sensitivity detection |
| US10837943B2 (en) | 2017-05-26 | 2020-11-17 | Allegro Microsystems, Llc | Magnetic field sensor with error calculation |
| US10641842B2 (en) | 2017-05-26 | 2020-05-05 | Allegro Microsystems, Llc | Targets for coil actuated position sensors |
| US10649042B2 (en) | 2017-05-26 | 2020-05-12 | Allegro Microsystems, Llc | Packages for coil actuated position sensors |
| US10866117B2 (en) | 2018-03-01 | 2020-12-15 | Allegro Microsystems, Llc | Magnetic field influence during rotation movement of magnetic target |
| US11313700B2 (en) | 2018-03-01 | 2022-04-26 | Allegro Microsystems, Llc | Magnetic field influence during rotation movement of magnetic target |
| US11255700B2 (en) | 2018-08-06 | 2022-02-22 | Allegro Microsystems, Llc | Magnetic field sensor |
| US11686599B2 (en) | 2018-08-06 | 2023-06-27 | Allegro Microsystems, Llc | Magnetic field sensor |
| US10921391B2 (en) | 2018-08-06 | 2021-02-16 | Allegro Microsystems, Llc | Magnetic field sensor with spacer |
| US10823586B2 (en) | 2018-12-26 | 2020-11-03 | Allegro Microsystems, Llc | Magnetic field sensor having unequally spaced magnetic field sensing elements |
| US11061084B2 (en) | 2019-03-07 | 2021-07-13 | Allegro Microsystems, Llc | Coil actuated pressure sensor and deflectable substrate |
| US10955306B2 (en) | 2019-04-22 | 2021-03-23 | Allegro Microsystems, Llc | Coil actuated pressure sensor and deformable substrate |
| US10991644B2 (en) | 2019-08-22 | 2021-04-27 | Allegro Microsystems, Llc | Integrated circuit package having a low profile |
| US11237020B2 (en) | 2019-11-14 | 2022-02-01 | Allegro Microsystems, Llc | Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet |
| US11280637B2 (en) | 2019-11-14 | 2022-03-22 | Allegro Microsystems, Llc | High performance magnetic angle sensor |
| US11262422B2 (en) | 2020-05-08 | 2022-03-01 | Allegro Microsystems, Llc | Stray-field-immune coil-activated position sensor |
| US11493361B2 (en) | 2021-02-26 | 2022-11-08 | Allegro Microsystems, Llc | Stray field immune coil-activated sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6384176A (en) | Magnetic focusing type hall element and manufacture thereof | |
| JP4685356B2 (en) | Magnetoelectric conversion element and manufacturing method thereof | |
| JPH03255970A (en) | Magnetic detecting sensor and its manufacture | |
| JP3259377B2 (en) | Semiconductor device | |
| WO1991011729A1 (en) | Magnetoresistance sensor | |
| JP2849100B2 (en) | Magnetoelectric conversion element and method of manufacturing the same | |
| JPS59154051A (en) | Semiconductor device | |
| JPS6384177A (en) | Magnetic focusing type hall element and manufacture thereof | |
| JPH0415942A (en) | Semiconductor device | |
| US20170323845A1 (en) | Electronic package | |
| JP3968384B2 (en) | Manufacturing method of small magnetoelectric transducer | |
| JP2752638B2 (en) | Magnetoelectric conversion element | |
| JPS612377A (en) | Molded type magnetoresistive element | |
| JPH06821Y2 (en) | Semiconductor device mounting structure | |
| JPH0291590A (en) | Lead for magneto-electric converting element | |
| JPH0291589A (en) | Magneto-electric converting element | |
| KR100601760B1 (en) | Stacked package and method for fabricating thereof | |
| JPS6218778A (en) | Mold type magnetoresistance element | |
| JPH0331384B2 (en) | ||
| JPS61226980A (en) | Sensor device and its manufacture and manufacturing equipment | |
| JPS61216438A (en) | Manufacture of sealed electronic part | |
| JP2572119B2 (en) | Magnetoresistive element and manufacturing method thereof | |
| JPH02222569A (en) | Lead frame, semiconductor device and manufacture thereof | |
| JP2968007B2 (en) | Magnetic sensor fixing holder and method of manufacturing magnetic sensor fixing holder | |
| JP3396054B2 (en) | Double lead frame, choke coil using the same, and method of manufacturing the same |