JPS6357055U - - Google Patents
Info
- Publication number
- JPS6357055U JPS6357055U JP1986152650U JP15265086U JPS6357055U JP S6357055 U JPS6357055 U JP S6357055U JP 1986152650 U JP1986152650 U JP 1986152650U JP 15265086 U JP15265086 U JP 15265086U JP S6357055 U JPS6357055 U JP S6357055U
- Authority
- JP
- Japan
- Prior art keywords
- pressure plate
- correction ring
- lapping machine
- lap surface
- lapping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図は本考案のラツピング盤を表わす部分拡
大断面図である。第２図は従来のラツピング盤を
表わす平面略図である。第３図は第２図の断面図
である。
Ａ…渦巻状溝ピツチ、ａ…巾広ピツチ、１…渦
巻状溝、２…ラツプ面、３…ワーク、４…プレツ
シヤープレート、５…修正リング。
FIG. 1 is a partially enlarged sectional view showing the wrapping machine of the present invention. FIG. 2 is a schematic plan view showing a conventional wrapping machine. FIG. 3 is a sectional view of FIG. 2. A... Spiral groove pitch, a... Wide pitch, 1... Spiral groove, 2... Wrap surface, 3... Workpiece, 4... Pressure plate, 5... Correction ring.
Claims (1)
た遊離砥粒方式のラツピング盤において；前記ラ
ツピング盤は、多数のワーク３を前記ラツプ面２
に押付けるプレツシヤープレート４と該プレツシ
ヤープレート４を内部に配置し回転接触して該ラ
ツプ面２の偏摩耗を修正する修正リング５とを有
しており、前記ラツプ面２の渦巻状溝ピツチＡを
徐変させプレツシヤープレート４が保持するワー
ク３及び修正リング５の摺接面積の多い部分を巾
広ピツチａに配設したことを特徴とするラツピン
グ盤。 In a free abrasive type lapping machine having a rotating lapping surface 2 in which spiral grooves 1 are carved;
It has a pressure plate 4 which is pressed against the lap surface 2, and a correction ring 5 which is arranged inside the pressure plate 4 and rotates in contact with the pressure plate 4 to correct uneven wear on the lap surface 2. This lapping machine is characterized in that the shaped groove pitch A is gradually changed, and the parts with a large sliding contact area of the work 3 held by the pressure plate 4 and the correction ring 5 are arranged in the wide pitch a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986152650U JPS6357055U (en) | 1986-10-03 | 1986-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986152650U JPS6357055U (en) | 1986-10-03 | 1986-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6357055U true JPS6357055U (en) | 1988-04-16 |
Family
ID=31070822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986152650U Pending JPS6357055U (en) | 1986-10-03 | 1986-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6357055U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001054856A (en) * | 1999-07-09 | 2001-02-27 | Applied Materials Inc | Polishing pad having grooved pattern for chemical mechanical polishing device |
| KR100764988B1 (en) * | 1997-05-15 | 2007-12-14 | 어플라이드 머티어리얼스, 인코포레이티드 | Polishing pad having a grooved pattern for use in a chemical mechenical polishing apparatus |
-
1986
- 1986-10-03 JP JP1986152650U patent/JPS6357055U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100764988B1 (en) * | 1997-05-15 | 2007-12-14 | 어플라이드 머티어리얼스, 인코포레이티드 | Polishing pad having a grooved pattern for use in a chemical mechenical polishing apparatus |
| JP2001054856A (en) * | 1999-07-09 | 2001-02-27 | Applied Materials Inc | Polishing pad having grooved pattern for chemical mechanical polishing device |