JPS6356236U - - Google Patents
Info
- Publication number
- JPS6356236U JPS6356236U JP14788986U JP14788986U JPS6356236U JP S6356236 U JPS6356236 U JP S6356236U JP 14788986 U JP14788986 U JP 14788986U JP 14788986 U JP14788986 U JP 14788986U JP S6356236 U JPS6356236 U JP S6356236U
- Authority
- JP
- Japan
- Prior art keywords
- release paper
- sponge
- main body
- outer edge
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Description
図は本考案プリント回路用取付装置の実施例を
示すものであつて、第1図は全体の斜視図、第2
図は第1図A―A線に沿う一部拡大断面図、第3
図は使用の状態を示す斜視図である。
1……スポンジ、2,2′……感圧接着剤、3
,3′……離型紙、4,5……外縁、6……主体
、7,8……切線、9,10……個所、11……
細切スポンジ。
The figures show an embodiment of the printed circuit mounting device of the present invention, in which Fig. 1 is an overall perspective view, and Fig.
The figure is a partially enlarged sectional view taken along line A-A in Figure 1, and Figure 3.
The figure is a perspective view showing the state of use. 1...Sponge, 2,2'...Pressure sensitive adhesive, 3
, 3'... release paper, 4, 5... outer edge, 6... main body, 7, 8... cutting line, 9, 10... location, 11...
Shredded sponge.
補正 昭62.6.22
考案の名称を次のように補正する。
考案の名称 接着装置
実用新案登録請求の範囲を次のように補正する
。Amendment June 22, 1982 The name of the invention is amended as follows. Title of the invention Adhesive device The scope of the claim for utility model registration is amended as follows.
【実用新案登録請求の範囲】
シート状スポンジ1の表裏両面に感圧接着剤2
,2′を塗布し当該塗布面に離型紙3,3′を当
該離型紙3,3′の外縁4がスポンジ1の外縁5
より外に突出する状態として被着した主体6の表
面に於ける平行縦線上個所に裏側の離型紙3′の
内側面にまで達する深さの切線7を、また同主体
6の裏面に於ける平行横線上個所に表側の離型紙
3の内側面にまで達する深さの切線8を夫々離型
紙3,3′の外縁部には設けない個所9,10を
残して切設したことを特徴とする接着装置。
図面の簡単な説明を次のように補正する。
明細書第6頁策5行「プリント回路用取付」を
「接着」と訂正する。[Scope of claim for utility model registration] Pressure-sensitive adhesive 2 on both the front and back sides of sheet-like sponge 1
, 2' and apply release paper 3, 3' on the coated surface so that the outer edge 4 of the release paper 3, 3' is the outer edge 5 of the sponge 1
A cutting line 7 with a depth reaching the inner surface of the release paper 3' on the back side is placed on the parallel vertical line on the surface of the adhered main body 6 so as to protrude further outward, and a cut line 7 is made on the back side of the main body 6. It is characterized by cutting lines 8 deep enough to reach the inner surface of the release paper 3 on the front side at locations on parallel horizontal lines, leaving areas 9 and 10 not provided at the outer edges of the release papers 3 and 3', respectively. gluing device. The brief description of the drawing has been amended as follows. On page 6 of the specification, line 5, ``Mounting for printed circuits'' is corrected to ``adhesion.''
Claims (1)
,2′を塗布し当該塗布面に離型紙3,3′を当
該離型紙3,3′の外縁4がスポンジ1の外縁5
より外に突出する状態として被着した主体6の表
面に於ける平行縦線上個所に裏側の離型紙3′の
内側面にまで達する深さの切線7を、また同主体
6の裏面に於ける平行横線上個所に表側の離型紙
3の内側面にまで達する深さの切線8を夫々離型
紙3,3′の外縁部には設けない個所9,10を
残して切設したことを特徴とするプリント回路用
取付装置。 Pressure sensitive adhesive 2 on both front and back sides of sheet sponge 1
, 2' and apply release paper 3, 3' on the coated surface so that the outer edge 4 of the release paper 3, 3' is the outer edge 5 of the sponge 1
A cutting line 7 with a depth reaching the inner surface of the release paper 3' on the back side is placed on the parallel vertical line on the surface of the adhered main body 6 so as to protrude further outward, and a cut line 7 is made on the back side of the main body 6. It is characterized by cutting lines 8 deep enough to reach the inner surface of the release paper 3 on the front side at locations on parallel horizontal lines, leaving areas 9 and 10 not provided at the outer edges of the release papers 3 and 3', respectively. Mounting device for printed circuits.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986147889U JPH0243856Y2 (en) | 1986-09-27 | 1986-09-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986147889U JPH0243856Y2 (en) | 1986-09-27 | 1986-09-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6356236U true JPS6356236U (en) | 1988-04-15 |
JPH0243856Y2 JPH0243856Y2 (en) | 1990-11-21 |
Family
ID=31061664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986147889U Expired JPH0243856Y2 (en) | 1986-09-27 | 1986-09-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0243856Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2017145321A1 (en) * | 2016-02-25 | 2018-03-01 | 新電元工業株式会社 | Circuit board mounting structure and circuit board mounting method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4310257Y1 (en) * | 1964-05-07 | 1968-05-06 | ||
JPS493614U (en) * | 1972-04-12 | 1974-01-12 | ||
JPS49111441U (en) * | 1972-10-09 | 1974-09-24 | ||
JPS55164271A (en) * | 1979-06-08 | 1980-12-20 | Takayoshi Ishigaki | Adhesive material with release paper and its preparation |
JPS57143236U (en) * | 1981-02-28 | 1982-09-08 |
-
1986
- 1986-09-27 JP JP1986147889U patent/JPH0243856Y2/ja not_active Expired
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4310257Y1 (en) * | 1964-05-07 | 1968-05-06 | ||
JPS493614U (en) * | 1972-04-12 | 1974-01-12 | ||
JPS49111441U (en) * | 1972-10-09 | 1974-09-24 | ||
JPS55164271A (en) * | 1979-06-08 | 1980-12-20 | Takayoshi Ishigaki | Adhesive material with release paper and its preparation |
JPS57143236U (en) * | 1981-02-28 | 1982-09-08 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2017145321A1 (en) * | 2016-02-25 | 2018-03-01 | 新電元工業株式会社 | Circuit board mounting structure and circuit board mounting method |
Also Published As
Publication number | Publication date |
---|---|
JPH0243856Y2 (en) | 1990-11-21 |
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