JPS6356236U - - Google Patents

Info

Publication number
JPS6356236U
JPS6356236U JP14788986U JP14788986U JPS6356236U JP S6356236 U JPS6356236 U JP S6356236U JP 14788986 U JP14788986 U JP 14788986U JP 14788986 U JP14788986 U JP 14788986U JP S6356236 U JPS6356236 U JP S6356236U
Authority
JP
Japan
Prior art keywords
release paper
sponge
main body
outer edge
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14788986U
Other languages
Japanese (ja)
Other versions
JPH0243856Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986147889U priority Critical patent/JPH0243856Y2/ja
Publication of JPS6356236U publication Critical patent/JPS6356236U/ja
Application granted granted Critical
Publication of JPH0243856Y2 publication Critical patent/JPH0243856Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案プリント回路用取付装置の実施例を
示すものであつて、第1図は全体の斜視図、第2
図は第1図A―A線に沿う一部拡大断面図、第3
図は使用の状態を示す斜視図である。 1……スポンジ、2,2′……感圧接着剤、3
,3′……離型紙、4,5……外縁、6……主体
、7,8……切線、9,10……個所、11……
細切スポンジ。
The figures show an embodiment of the printed circuit mounting device of the present invention, in which Fig. 1 is an overall perspective view, and Fig.
The figure is a partially enlarged sectional view taken along line A-A in Figure 1, and Figure 3.
The figure is a perspective view showing the state of use. 1...Sponge, 2,2'...Pressure sensitive adhesive, 3
, 3'... release paper, 4, 5... outer edge, 6... main body, 7, 8... cutting line, 9, 10... location, 11...
Shredded sponge.

補正 昭62.6.22 考案の名称を次のように補正する。 考案の名称 接着装置 実用新案登録請求の範囲を次のように補正する
Amendment June 22, 1982 The name of the invention is amended as follows. Title of the invention Adhesive device The scope of the claim for utility model registration is amended as follows.

【実用新案登録請求の範囲】 シート状スポンジ1の表裏両面に感圧接着剤2
,2′を塗布し当該塗布面に離型紙3,3′を当
該離型紙3,3′の外縁4がスポンジ1の外縁5
より外に突出する状態として被着した主体6の表
面に於ける平行縦線上個所に裏側の離型紙3′の
内側面にまで達する深さの切線7を、また同主体
6の裏面に於ける平行横線上個所に表側の離型紙
3の内側面にまで達する深さの切線8を夫々離型
紙3,3′の外縁部には設けない個所9,10を
残して切設したことを特徴とする接着装置。 図面の簡単な説明を次のように補正する。 明細書第6頁策5行「プリント回路用取付」を
「接着」と訂正する。
[Scope of claim for utility model registration] Pressure-sensitive adhesive 2 on both the front and back sides of sheet-like sponge 1
, 2' and apply release paper 3, 3' on the coated surface so that the outer edge 4 of the release paper 3, 3' is the outer edge 5 of the sponge 1
A cutting line 7 with a depth reaching the inner surface of the release paper 3' on the back side is placed on the parallel vertical line on the surface of the adhered main body 6 so as to protrude further outward, and a cut line 7 is made on the back side of the main body 6. It is characterized by cutting lines 8 deep enough to reach the inner surface of the release paper 3 on the front side at locations on parallel horizontal lines, leaving areas 9 and 10 not provided at the outer edges of the release papers 3 and 3', respectively. gluing device. The brief description of the drawing has been amended as follows. On page 6 of the specification, line 5, ``Mounting for printed circuits'' is corrected to ``adhesion.''

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] シート状スポンジ1の表裏両面に感圧接着剤2
,2′を塗布し当該塗布面に離型紙3,3′を当
該離型紙3,3′の外縁4がスポンジ1の外縁5
より外に突出する状態として被着した主体6の表
面に於ける平行縦線上個所に裏側の離型紙3′の
内側面にまで達する深さの切線7を、また同主体
6の裏面に於ける平行横線上個所に表側の離型紙
3の内側面にまで達する深さの切線8を夫々離型
紙3,3′の外縁部には設けない個所9,10を
残して切設したことを特徴とするプリント回路用
取付装置。
Pressure sensitive adhesive 2 on both front and back sides of sheet sponge 1
, 2' and apply release paper 3, 3' on the coated surface so that the outer edge 4 of the release paper 3, 3' is the outer edge 5 of the sponge 1
A cutting line 7 with a depth reaching the inner surface of the release paper 3' on the back side is placed on the parallel vertical line on the surface of the adhered main body 6 so as to protrude further outward, and a cut line 7 is made on the back side of the main body 6. It is characterized by cutting lines 8 deep enough to reach the inner surface of the release paper 3 on the front side at locations on parallel horizontal lines, leaving areas 9 and 10 not provided at the outer edges of the release papers 3 and 3', respectively. Mounting device for printed circuits.
JP1986147889U 1986-09-27 1986-09-27 Expired JPH0243856Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986147889U JPH0243856Y2 (en) 1986-09-27 1986-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986147889U JPH0243856Y2 (en) 1986-09-27 1986-09-27

Publications (2)

Publication Number Publication Date
JPS6356236U true JPS6356236U (en) 1988-04-15
JPH0243856Y2 JPH0243856Y2 (en) 1990-11-21

Family

ID=31061664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986147889U Expired JPH0243856Y2 (en) 1986-09-27 1986-09-27

Country Status (1)

Country Link
JP (1) JPH0243856Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017145321A1 (en) * 2016-02-25 2018-03-01 新電元工業株式会社 Circuit board mounting structure and circuit board mounting method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4310257Y1 (en) * 1964-05-07 1968-05-06
JPS493614U (en) * 1972-04-12 1974-01-12
JPS49111441U (en) * 1972-10-09 1974-09-24
JPS55164271A (en) * 1979-06-08 1980-12-20 Takayoshi Ishigaki Adhesive material with release paper and its preparation
JPS57143236U (en) * 1981-02-28 1982-09-08

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4310257Y1 (en) * 1964-05-07 1968-05-06
JPS493614U (en) * 1972-04-12 1974-01-12
JPS49111441U (en) * 1972-10-09 1974-09-24
JPS55164271A (en) * 1979-06-08 1980-12-20 Takayoshi Ishigaki Adhesive material with release paper and its preparation
JPS57143236U (en) * 1981-02-28 1982-09-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017145321A1 (en) * 2016-02-25 2018-03-01 新電元工業株式会社 Circuit board mounting structure and circuit board mounting method

Also Published As

Publication number Publication date
JPH0243856Y2 (en) 1990-11-21

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