JPS6343219A - Manufacture of electronic component - Google Patents
Manufacture of electronic componentInfo
- Publication number
- JPS6343219A JPS6343219A JP61185341A JP18534186A JPS6343219A JP S6343219 A JPS6343219 A JP S6343219A JP 61185341 A JP61185341 A JP 61185341A JP 18534186 A JP18534186 A JP 18534186A JP S6343219 A JPS6343219 A JP S6343219A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- thermosetting adhesive
- flexible substrate
- thermosetting
- upper flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims description 37
- 239000012790 adhesive layer Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 29
- 238000007789 sealing Methods 0.000 claims description 18
- 239000012528 membrane Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UKUVVAMSXXBMRX-UHFFFAOYSA-N 2,4,5-trithia-1,3-diarsabicyclo[1.1.1]pentane Chemical compound S1[As]2S[As]1S2 UKUVVAMSXXBMRX-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、メンブレンスイッチやフィルム液晶等のよう
に、接着剤を用いて可撓性基板を封口する部分を有する
電子部品の製造方法に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for manufacturing electronic components such as membrane switches and film liquid crystals, which have a portion where a flexible substrate is sealed using an adhesive. It is.
（従来の技術）
従来の電子部品の製造方法について、メンブレンスイッ
チを例として、第２図および第３図により説明する。(Prior Art) A conventional method for manufacturing electronic components will be explained using FIGS. 2 and 3 using a membrane switch as an example.
第２図（ａ）ないしくｄ）は、従来のメンブレンスイッ
チの製造工程を示す断面図である。第２図（ｄ）は、完
成したメンブレンスイッチの断面図で、メンブレンスイ
ッチは、それぞれ相対向する電極パターン１および２が
形成された下絶縁基板３および上可撓性基板４が、熱硬
化性接着剤層５で封口されたものである。FIGS. 2(a) to 2d) are cross-sectional views showing the manufacturing process of a conventional membrane switch. FIG. 2(d) is a cross-sectional view of the completed membrane switch. It is sealed with an adhesive layer 5.
このような構造のメンブレンスイッチの製造方法につい
て、第２図（ａ）ないしくｄ）により説明する。A method of manufacturing a membrane switch having such a structure will be explained with reference to FIGS. 2(a) to 2d).
先ず、第２図（ａ）に示すように、下絶縁基板３の表面
に所定の電極パターン１を形成する。次に、第２図（ｂ
）に示すように、下絶縁基板３の上に液状の熱硬化性接
着剤層５ａを印刷等の方法によって所定の厚さに塗布す
る。茨に、第２図（ｃ）に示すように、下絶縁基板３の
電極パターン１と相対向するように、電極パターン２を
形成した上可撓性基板４を接着した後、高温炉中で熱硬
化性接着剤５ａを熱硬化すると、第２図（ｄ）に示した
メンブレンスイッチが得られる。First, as shown in FIG. 2(a), a predetermined electrode pattern 1 is formed on the surface of the lower insulating substrate 3. Next, Figure 2 (b
), a liquid thermosetting adhesive layer 5a is applied to a predetermined thickness on the lower insulating substrate 3 by a method such as printing. As shown in FIG. 2(c), an upper flexible substrate 4 on which an electrode pattern 2 is formed is bonded to the thorns so as to face the electrode pattern 1 of the lower insulating substrate 3, and then the upper flexible substrate 4 is placed in a high-temperature furnace. By thermosetting the thermosetting adhesive 5a, a membrane switch shown in FIG. 2(d) is obtained.
（発明が解決しようとする問題点） しかしながら、従来の電子部品の製造方法では。(Problem that the invention attempts to solve) However, in the conventional manufacturing method of electronic components.
熱硬化性接着剤層５ａが液状であるばかりでなく、上可
撓性基板４が柔軟性を有するため、高温炉による熱硬化
過程で熱硬化性接着剤層５ａの粘度が低下する条件に、
上可撓性基板４の撓みによって下絶縁基板３との隙間が
減少する条件が加わると、第３図に示すように、上可撓
性基板４と下絶縁基板３との間の微細隙間による毛細管
現象によって、熱硬化性接着剤層５ａの中に含まれる特
に低分子量の物質６が流れ出すという問題があった。Not only is the thermosetting adhesive layer 5a liquid, but also the upper flexible substrate 4 is flexible.
When a condition is added in which the gap between the upper flexible substrate 4 and the lower insulating substrate 3 decreases due to the bending of the upper flexible substrate 4, as shown in FIG. There has been a problem in that particularly low molecular weight substances 6 contained in the thermosetting adhesive layer 5a flow out due to capillarity.
この対策として、上可撓性基板４に撓みが生じないよう
に、引張り力を加える方法が考えられるが、種々の治具
を用いて固定する複雑な工程が必要となり実現が難しい
。また、熱硬化性接着剤に充てん剤などを添加して粘度
を上げることによって、ある程度流出を防止できるが、
完全に防止できず、しかも、接着剤特性に悪い影響があ
るため良策でない。As a countermeasure to this problem, a method of applying a tensile force to the upper flexible substrate 4 so as not to cause the bending may be considered, but this requires a complicated process of fixing using various jigs and is difficult to realize. Additionally, by adding fillers to thermosetting adhesives to increase their viscosity, leakage can be prevented to some extent;
It is not a good idea because it cannot be completely prevented and it has a negative effect on the adhesive properties.
本発明は上記の問題点を解決するもので、熱硬化性接着
剤が封口部外に流出しない電子部品の製造方法を提供す
るものである。The present invention solves the above-mentioned problems and provides a method of manufacturing an electronic component in which the thermosetting adhesive does not leak out of the sealing part.
（問題点を解決するための手段）
上記の問題点を解決するために、本発明は、下絶縁基板
の封口部を囲むように、第１の熱硬化性接着剤層を塗布
したのち硬化させる工程と、上記封口部に第２の熱硬化
性接着剤層を塗布して、これに上可撓性基板を接着した
後、第２の熱硬化性接着剤層を熱硬化させる工程を含め
、電子部品の・ａ造工程を構成するものである。(Means for Solving the Problems) In order to solve the above problems, the present invention applies a first thermosetting adhesive layer so as to surround the sealing portion of the lower insulating substrate, and then hardens the adhesive layer. and a step of applying a second thermosetting adhesive layer to the sealing portion, bonding the upper flexible substrate thereto, and then thermosetting the second thermosetting adhesive layer, This constitutes the manufacturing process for electronic parts.
（作 用）
上記の工程により、下絶縁基板の封口部の周囲に沿って
、硬化した第１熱硬化性接着剤層の障壁が形成されるの
で、封口部に塗布した第２熱硬化性接着剤層に上可撓性
基板を接着し、高温炉内で熱硬化させるときに、上可撓
性基板が多少撓んでも毛細管現象が起こるような隙間減
少が生じない。(Function) Through the above process, a barrier of the hardened first thermosetting adhesive layer is formed along the periphery of the sealing part of the lower insulating substrate, so the second thermosetting adhesive layer applied to the sealing part When the upper flexible substrate is bonded to the agent layer and thermally cured in a high-temperature furnace, even if the upper flexible substrate is slightly bent, the gap does not decrease as would occur due to capillary phenomenon.
従って、高い歩留りで、仕上り外観の優れた電子部品を
製造することができる。Therefore, electronic components with excellent finished appearance can be manufactured at a high yield.
（実施例）
本発明の一実施例を、メンブレンスイッチを例として第
１図（ａ）ないしくｆ）により説明する。(Embodiment) An embodiment of the present invention will be described with reference to FIGS. 1(a) to 1(f), taking a membrane switch as an example.
第１図（ｆ）は、本発明による電子部品の製造方法によ
って製造したメンブレンスイッチの断面図で、第２図（
ｄ）に示した従来の製造す法によるメンブレンスイッチ
との相異点は、封口部の内周を囲んで第１熱硬化性接着
剤層７で障壁が形成されており、その外側の封口部の第
２熱硬化性接着剤層８で上可撓性基板４が接着剤されて
いることである。FIG. 1(f) is a sectional view of a membrane switch manufactured by the method of manufacturing an electronic component according to the present invention, and FIG.
The difference from the conventional membrane switch shown in d) is that a barrier is formed with the first thermosetting adhesive layer 7 surrounding the inner periphery of the sealing part, and the outer sealing part The upper flexible substrate 4 is adhesively bonded to the second thermosetting adhesive layer 8 .
このような構成のメンブレンスイッチを得る本発明によ
る電子部品の製造方法について説明する。A method of manufacturing an electronic component according to the present invention for obtaining a membrane switch having such a configuration will be described.
まず、第１図（ａ）に示すように、下絶縁基板３の表面
に所定の電極パターン１を形成する１次に、第１図（ｂ
）に示すように、封口部の内周に相当する位置に、スク
リーン印刷等の方法を用い液状の第１熱硬化性接着剤Ｆ
２Ｊ７ａを塗布した後、高温炉内で熱硬化させると、第
１図（ｃ）に示すように、封口部の内周に沿うように第
１熱硬化性接着剤層７の障壁が形成される。次に、第１
図（ａ）に示すように、スクリーン印刷等の方法を用い
、液状の第２熱硬化性接着剤層８ａを塗布する。続いて
、第１図（ｅ）に示すように、上記の第２熱硬化性接着
剤層８ａの上に上可撓性基板４を接着した後、高温炉内
で熱硬化させると、第１図（ｆ）に示したメンブレンス
イッチが得られる。First, as shown in FIG. 1(a), a predetermined electrode pattern 1 is formed on the surface of the lower insulating substrate 3.
), a liquid first thermosetting adhesive F is applied to a position corresponding to the inner periphery of the sealing part using a method such as screen printing.
After applying 2J7a, when it is thermally cured in a high-temperature furnace, a barrier of the first thermosetting adhesive layer 7 is formed along the inner periphery of the sealing part, as shown in FIG. 1(c). . Next, the first
As shown in Figure (a), a liquid second thermosetting adhesive layer 8a is applied using a method such as screen printing. Subsequently, as shown in FIG. 1(e), after bonding the upper flexible substrate 4 on the second thermosetting adhesive layer 8a, the first flexible substrate 4 is thermally cured in a high-temperature furnace. The membrane switch shown in Figure (f) is obtained.
このように、第１熱硬化性接着剤層７ａを熱硬化させて
、封口部の内面に障壁が形成されるので、上可等撓基板
４を封口部で接着する時に、上可撓性基板４が多少撓ん
でも毛細管現象が起こらないので、封口部外に接着剤が
流出することはない。In this way, the barrier is formed on the inner surface of the sealing part by thermosetting the first thermosetting adhesive layer 7a, so that when the upper flexible substrate 4 is bonded at the sealing part, the upper flexible substrate Even if 4 is bent to some extent, capillary action does not occur, so the adhesive will not flow out of the sealing part.
従って１歩留りが高く、仕上り外観が美しいメンブレン
スイッチが得られる製造方法となる６なお、本実施例で
はメンブレンスイッチについて説明したが、フィルム液
晶その他可撓性基板を有する電子部品に対しても同様な
効果が得られることは勿論である。Therefore, this is a manufacturing method that has a high yield and provides a membrane switch with a beautiful finished appearance6.Although membrane switches have been described in this example, the same method can be applied to film liquid crystals and other electronic components having flexible substrates. Of course, the effect can be obtained.
また、第１図（ｆ）に示した接着剤の内周に第１熱硬化
性接着剤層７を設けたが、電子部品の構造によっては、
接着剤の外側あるいは両側に設けてもよい。Further, although the first thermosetting adhesive layer 7 was provided on the inner periphery of the adhesive shown in FIG. 1(f), depending on the structure of the electronic component,
It may be provided on the outside or both sides of the adhesive.
（発明の効果）
以上説明したように、本発明によれば、第１の熱硬化性
接着剤層を先に熱硬化させ、封口部を囲うように障壁を
形成することにより、封口部に第２の熱硬化性接着剤層
を塗布し、これに上可撓性ル板を接着したのち熱硬化さ
せる時に、多少上可撓性基板が撓んでも毛細管現象が起
こるような隙間現象が生ぜず、封口部外に接着剤が流出
することがなく、歩留りの高い、仕上り外観の美しい電
子部品が得られる。(Effects of the Invention) As described above, according to the present invention, the first thermosetting adhesive layer is first thermally cured, and a barrier is formed to surround the sealing portion, so that the first thermosetting adhesive layer is heated and the barrier is formed to surround the sealing portion. When the thermosetting adhesive layer 2 is applied, the upper flexible board is bonded to this layer, and the upper flexible board is thermally cured, even if the upper flexible board is slightly bent, no gap phenomenon such as capillary phenomenon occurs. The adhesive does not flow out of the sealing part, and electronic components with a high yield and beautiful finished appearance can be obtained.
第１図（ａ）ないしくｆ）は本発明によるメンブレンス
イッチの製造方法を示す工程断面図、第２図（ａ）ない
しくｄ）は従来のメンブレンスイッチの製造方法を示す
工程断面図、第３図は従来の製造方法で起こし易い事故
例を示すメンブレンスイッチの断面図である。
１．２・・・電極パターン、 ３・・・下絶縁基板、
４ ・・・上可撓性基板、 ５ ・・・熱硬化性接着剤
層、５ａ・・・液状の熱硬化性接着剤層、 ６ ・・・
低分子量の物質、 ７・・・第１熱硬化性接着剤層、７
ａ・・・液状の第１熱硬化性接着剤、 ８・・・第２熱
硬化性接着剤層、８ａ・・・液状の第２熱硬化性接着剤
層。
特許出願人 松下電器産業株式会社
第１図
１．２ 、、、 ｔ）ウベクーレ ３２．−下（色、
＋１１反ム 、上町撓ｈｉ基先叉 ７１．く弓１
μｂぴ齋ｒ−：ｉ生毒幸１斉“１１層７ａ−弓使扼の懲
１り丸６更ｌこ・すがす４列］８ 、渇２郊へ石央イ１
＋）！ｔテ着剤ｊ届 ８己 −１，及シーの篤
２す、り更イ乙ビ（槽肴刊層
第２図
］】］
）、２・−亀才専パターン
３４−２下ホ色オ家基扱1(a) to f) are process cross-sectional views showing the method for manufacturing a membrane switch according to the present invention, FIGS. 2(a) to d) are process cross-sectional views showing the conventional method for manufacturing a membrane switch, and FIG. FIG. 3 is a cross-sectional view of a membrane switch showing an example of an accident that is likely to occur with the conventional manufacturing method. 1.2... Electrode pattern, 3... Lower insulating substrate,
4...Top flexible substrate, 5...Thermosetting adhesive layer, 5a...Liquid thermosetting adhesive layer, 6...
low molecular weight substance, 7... first thermosetting adhesive layer, 7
a... Liquid first thermosetting adhesive, 8... Second thermosetting adhesive layer, 8a... Liquid second thermosetting adhesive layer. Patent applicant: Matsushita Electric Industrial Co., Ltd. Figure 1 1.2 t) Ubekoule 32. −Bottom (color,
+11 counter, Uemachi bend hi base fork 71. bow 1
μb Pisai r-: i Ikuyuki 1 Qi "11th layer 7a - Yumushi's punishment 1 Rimaru 6 further 1, 4 rows] 8, Toshi 2 Kyo to Sekio I 1
+)! tte adhesive j notification 8self -1, and sea atsushi 2s. Family basis treatment
Claims (1)
撓性基板とを封口するとき、下絶縁基板の封口部を囲う
ように第１の熱硬化性接着剤層を塗布したのち熱硬化さ
せる工程と、封口部の前記第１の熱硬化性接着剤層の側
面に第２の熱硬化性接着剤層を塗布してこれに上可撓性
基板を接着したのち熱硬化させる工程とを含む電子部品
の製造方法。When sealing the lower insulating substrate and the upper flexible substrate, each having a predetermined pattern formed thereon, a step of applying a first thermosetting adhesive layer so as to surround the sealing portion of the lower insulating substrate and then thermosetting it. and a step of applying a second thermosetting adhesive layer to the side surface of the first thermosetting adhesive layer of the sealing part, bonding the upper flexible substrate thereto, and then thermosetting the second thermosetting adhesive layer. How the parts are manufactured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185341A JPH0831295B2 (en) | 1986-08-08 | 1986-08-08 | Electronic component manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185341A JPH0831295B2 (en) | 1986-08-08 | 1986-08-08 | Electronic component manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6343219A true JPS6343219A (en) | 1988-02-24 |
| JPH0831295B2 JPH0831295B2 (en) | 1996-03-27 |
Family
ID=16169099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61185341A Expired - Lifetime JPH0831295B2 (en) | 1986-08-08 | 1986-08-08 | Electronic component manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831295B2 (en) |
-
1986
- 1986-08-08 JP JP61185341A patent/JPH0831295B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0831295B2 (en) | 1996-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |