JPS63314240A - Novel polyimide copolymer and its production - Google Patents

Novel polyimide copolymer and its production

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Publication number
JPS63314240A
JPS63314240A JP14916287A JP14916287A JPS63314240A JP S63314240 A JPS63314240 A JP S63314240A JP 14916287 A JP14916287 A JP 14916287A JP 14916287 A JP14916287 A JP 14916287A JP S63314240 A JPS63314240 A JP S63314240A
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Japan
Prior art keywords
formulas
formula
tables
organic
mathematical
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP14916287A
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Japanese (ja)
Other versions
JP2766640B2 (en
Inventor
Renichi Akahori
廉一 赤堀
Hidenori Kawai
川井 秀紀
Kosaku Nagano
広作 永野
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Kanegafuchi Chemical Industry Co Ltd
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Kanegafuchi Chemical Industry Co Ltd
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Publication of JP2766640B2 publication Critical patent/JP2766640B2/en
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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE:To obtain the title copolymer excellent in dimensional stability, tensile properties, etc., by reacting an organic tetracarboxylic acid dianhydride successively with two organic diamine compounds and conducting the ring closure of the formed polyamic acid copolymer. CONSTITUTION:An organic tetracarboxylic acid dianhydride of formula I (wherein R0 is a tetravalent organic group) is reacted with 50-90mol.% organic diamine compound of formula II (wherein R1 is a bivalent organic group) in an organic polar solvent to produce a prepolymer having acid anhydride groups on both ends. this prepolymer is mixed with an organic diamine compound of formula III (wherein R2 is a bivalent organic group, provided that the case where R1 and R2 are formulas IV and V, respectively, and the case where they are formulas V and IV, respectively, are excluded) so that the total of the diamines of formulas II and III may be equimolar to the total of the compound of formula I, and the mixture is reacted. The obtained polyamic acid copolymer is subjected to ring closure to obtain a polyimide copolymer of formula VI (wherein m is a positive integer).

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、耐熱性樹脂として知られるポリイミド樹脂に
関する。詳しくは、極めて優れた熱的かつ吸湿時の寸法
安定性と、優れた引張り特性を存するポリイミド樹脂を
得ることができる新規なポリイミド共重合体に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a polyimide resin known as a heat-resistant resin. Specifically, the present invention relates to a novel polyimide copolymer that can yield a polyimide resin having extremely excellent thermal and hygroscopic dimensional stability and excellent tensile properties.

(従来の技術) 従来、ポリイミド樹脂は高度の耐熱性、耐薬品性、電気
的特性、機械的特性、その他優れた諸特性を有している
ことが知られており、例えば、特公昭36−10999
に見られるような、4゜4′−ジアミノジフェニルエー
テルとピロメリット酸二無水物より得られるポリアミド
酸を使用して得られるポリイミド膜は、従来から広く使
用されており、伸度などの機械的特性に優れているが、
一般に線膨張係数及び湿度膨張係数が大きく、寸法安定
性が悪いことが知られている。即ち、このポリイミド樹
脂は線膨張係数が約3×10″5”C−1と大きく熱的
寸法安定性が悪く、金属などと積層した場合にいわゆる
反りやカールを生ずる等の問題点を有しており、また湿
度膨張係数も 2.5X 10”/%RHと大きく、例
えばFPC[フレキシブルプリント基板]等の加工後に
やはり反りやカールを生ずる等の問題点を有していた。
(Prior Art) It has been known that polyimide resins have high heat resistance, chemical resistance, electrical properties, mechanical properties, and other excellent properties. 10999
Polyimide membranes obtained using polyamic acid obtained from 4゜4'-diaminodiphenyl ether and pyromellitic dianhydride, as shown in Although it is excellent in
Generally, it is known that the linear expansion coefficient and humidity expansion coefficient are large, and the dimensional stability is poor. That is, this polyimide resin has a linear expansion coefficient of about 3 x 10"5"C-1, and has poor thermal dimensional stability, and has problems such as warping and curling when laminated with metal etc. Furthermore, the coefficient of humidity expansion is as large as 2.5 x 10''/%RH, which has the problem of warping and curling after processing, for example, FPC (flexible printed circuit board).

この問題を解決するため、例えばジメチルベンジジンと
ピロメリット酸二無水物より得られるポリアミド酸を使
用して得られるポリイミド膜は線膨張係数、湿度膨張係
数が共に小さく寸法安定性に優れるものの、非常に脆弱
であり、フィルムとしての実用性に欠け、実際に工業的
に使用できないという欠点を有していた。
To solve this problem, a polyimide film obtained using polyamic acid obtained from dimethylbenzidine and pyromellitic dianhydride has a small linear expansion coefficient and a low humidity expansion coefficient, but has excellent dimensional stability. It has the disadvantage that it is brittle, lacks practicality as a film, and cannot actually be used industrially.

しかしながら近年、より優れた寸法安定性を有し、しか
も伸度等の機械的特性に優れたポリイミド樹脂に対する
要求が高まってきており、この目的で種々の検討が行わ
れている。例えば、特開昭61−158025ではp−
フェニレンジアミン杏共重合し熱的寸法安定性を向上し
、同時にとフ↓ニルテトラカルボン酸成分を共重合する
ことで伸度などの機械的特性を改良しようと試みている
However, in recent years, there has been an increasing demand for polyimide resins that have better dimensional stability and excellent mechanical properties such as elongation, and various studies are being conducted for this purpose. For example, in JP-A-61-158025, p-
We are attempting to improve the thermal dimensional stability by copolymerizing phenylenediamine with apricot, and at the same time improving mechanical properties such as elongation by copolymerizing with phenyltetracarboxylic acid.

しかしビフェニルテトラカルボン酸成分を用いているた
め、生成するポリイミド樹脂は熱軟化が発現し、従来の
優れた耐熱性を損なうなどの欠点を有するようになり、
更には引っ張り試験時の降伏点が発生し耐応力歪が大き
く、使用時に変形する等の問題を生ずる。またこうして
得られるポリイミド膜はアルカリ不溶となり、アルカリ
ニ・ソチング等の後処理もしくは後加工の工程に於てそ
の加工性が著しく劣る。
However, since the biphenyltetracarboxylic acid component is used, the resulting polyimide resin has disadvantages such as thermal softening and loss of conventional excellent heat resistance.
Furthermore, a yield point occurs during a tensile test, and the stress strain resistance is large, causing problems such as deformation during use. Furthermore, the polyimide film obtained in this manner is insoluble in alkali, and its processability in post-treatment or post-processing steps such as alkali di-soching is extremely poor.

また例えば、特開昭58−185624に見られるよう
に、ジアミン成分としてジメチルベンジンを導入し、熱
的寸法安定性を改良する方法も提案されているが、こう
して得られたポリイミド膜は機械的強度に劣り脆くなる
For example, as seen in JP-A-58-185624, a method has been proposed in which dimethylbenzine is introduced as a diamine component to improve thermal dimensional stability. It becomes weaker and more brittle.

更には例えば、特開昭61−264028、特開昭61
−241325、特開昭61−181828、等におい
ては何れもジアミノジフェニルエ−チル、ベンゾフェノ
ンテトラカルボン酸二無水物、ビフェニルテトラカルボ
ン酸二無水物等のソフトセグメントと無水ピロメリット
酸、パラフェニレンジアミン、ジメチルベンジジン等の
ハードセグメントの共重合による改質が提案されている
Furthermore, for example, JP-A-61-264028, JP-A-61
-241325, JP-A-61-181828, etc., all disclose soft segments such as diaminodiphenylethyl, benzophenonetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, pyromellitic anhydride, paraphenylenediamine, Modification by copolymerization of hard segments such as dimethylbenzidine has been proposed.

しかしながら何れの場合にも上記の熱的及び吸湿時の寸
法安定性と伸度等の機械的強度を共に満足するものでは
なかった。
However, in all cases, the above-mentioned dimensional stability during thermal and moisture absorption and mechanical strength such as elongation were not satisfied.

(発明が解決しようとする問題点) 本発明は、従来広く使用されているポリイミド樹脂の優
れた機械的強度、耐熱性及び耐薬品性を維持しつつ、熱
的及び吸湿時の寸法安定性を改善することを目的とする
(Problems to be Solved by the Invention) The present invention maintains the excellent mechanical strength, heat resistance, and chemical resistance of polyimide resins that have been widely used, while improving the dimensional stability during thermal and moisture absorption. The purpose is to improve.

(問題点を解決するための手段) 本発明は、 一般式 [R1,R2は2価の有機基、但しR1,R2がそれぞ
れ−o−、−o−0−o−・である場合。
(Means for Solving the Problems) The present invention is based on the general formula [R1 and R2 are divalent organic groups, provided that R1 and R2 are -o- and -o-0-o-, respectively.

−@−0−@−,(臣とである場合を除<、R。-@-0-@-, (except in the case of minister <, R.

は4価の有機基1mは正の整数] で表される反復単位からなるポリイミド共重合体、及び
一般式 [式中、R,は4価の有機基] で表される有機テトラカルボン酸二無水物(A)とこれ
に対し50〜90モル%の一般式%式% [式中、R1は2価の有機基] で表される有機ジアミン化合物(B)を、有機極性溶媒
中にて反応させ、両末端に酸無水物基を有するプレポリ
マーを得、続いてここに一般式%式% [式中、R2は2価の有機基、但しR,、R2が÷0−
(Σ←、−@=である場合を除くコで表される有機ジア
ミン化合物(C)を全有機ジアミンffi  [(B)
 + (C) ] 、が有機テトラカルボン酸二無水物
(A)と実質的に等モルになるように添加反応し、得ら
れるポリアミド酸共重合体を熱的あるいは化学的に脱水
閉環して得ることを特徴とするポリイミド共重合体の製
造方法である。
is a tetravalent organic group 1m is a positive integer] A polyimide copolymer consisting of a repeating unit represented by the formula [wherein R is a tetravalent organic group] Anhydride (A) and 50 to 90 mol % of the organic diamine compound (B) represented by the general formula % formula % [wherein R1 is a divalent organic group] in an organic polar solvent. The reaction is carried out to obtain a prepolymer having acid anhydride groups at both ends, and then the general formula % formula % [wherein R2 is a divalent organic group, provided that R,, R2
(Except when Σ←, -@=, the organic diamine compound (C) represented by ko is the total organic diamine ffi [(B)
+ (C)] is added and reacted with the organic tetracarboxylic dianhydride (A) in substantially equimolar amounts, and the resulting polyamic acid copolymer is thermally or chemically dehydrated and ring-closed. This is a method for producing a polyimide copolymer.

このポリイミド共重合体は従来広く用いられていたポリ
イミド本来の持つ耐熱性、機械的強度等の諸特性を維持
しつつ線膨張係数及び湿度膨張係数を減少し、寸法安定
性が改良される。
This polyimide copolymer has reduced linear expansion coefficient and humidity expansion coefficient while maintaining various properties inherent to conventionally widely used polyimides, such as heat resistance and mechanical strength, and has improved dimensional stability.

このポリイミド共重合体の構成について詳しく説明する
と、ブロック単位 [式中、R1は2価の有機基、Roは 価の有機基コが1つの繰り返し単位 E式中、R2は2価の有機基、Roは 4価の有機基] により連結された構造を採ることにより規則的に配列し
た構造となる。従ってこのポリアミド酸より得られるポ
リイミド樹脂は繰り返し単位[式中、R2は2価の有機
基、ROは 4価の有機基コ が極めて均質に分散されることになり、即ちハードセグ
メント或はソフトセグメントが分子レベルで均質に分散
されることになるので、これより得られるポリイミド樹
脂の寸法安定性及び伸度が同時に著しく改良されると推
定される。ブロック単位における繰り返し数mは1〜9
、好ましくは1〜7、更に好ましくは1〜4である。な
ぜならば繰り返し数mが9を超えると共重合比が偏り共
重合することの効果を見いだせないからである。また、
この共重合体の分子量は特に規制されるものではないが
、生成するポリイミド樹脂の強度を維持するためには、
反復単位が10以上あることが望ましい。
To explain in detail the structure of this polyimide copolymer, the block unit [in the formula, R1 is a divalent organic group, and Ro is a repeating unit with one valent organic group E, in the formula, R2 is a divalent organic group, Ro is a tetravalent organic group] By adopting a structure connected by these, a regularly arranged structure is obtained. Therefore, in the polyimide resin obtained from this polyamic acid, repeating units [wherein R2 is a divalent organic group and RO is a tetravalent organic group] are extremely homogeneously dispersed, that is, hard segments or soft segments. is homogeneously dispersed at the molecular level, it is presumed that the dimensional stability and elongation of the resulting polyimide resin are simultaneously significantly improved. The number of repetitions m in block units is 1 to 9
, preferably 1-7, more preferably 1-4. This is because if the repetition number m exceeds 9, the copolymerization ratio will be biased and the effect of copolymerization cannot be found. Also,
The molecular weight of this copolymer is not particularly restricted, but in order to maintain the strength of the polyimide resin produced,
Preferably there are 10 or more repeating units.

次に、このポリイミド共重合体の製造方法について説明
すると、 一般式 %式% [式中、Roは4価の有機基] で表される有機テトラカルボン酸二無水物(A)とこれ
に対し50〜90モル%の一般式%式% [式中、R1は2価の有機基] で表される有機ジアミン化合物(B)を、有機極性溶媒
中にて反応させ、両末端に酸無水物基を有するプレポリ
マーを得、続いてここに一般式%式% [式中、R2は2価の有機基] で表される有機ジアミン化合物(C)を全を機ジアミン
量[(B)+ (C)]がを機テトラカルボン酸二無水
物(A)と実質的に等モルになるように添加反応するこ
とにより得ることができる。
Next, to explain the manufacturing method of this polyimide copolymer, organic tetracarboxylic dianhydride (A) represented by the general formula % formula % [wherein Ro is a tetravalent organic group] 50 to 90 mol % of the organic diamine compound (B) represented by the general formula % formula % [wherein R1 is a divalent organic group] is reacted in an organic polar solvent, and acid anhydride is added at both ends. A prepolymer having a group is obtained, and then an organic diamine compound (C) represented by the general formula % formula % [wherein R2 is a divalent organic group] is added to the total diamine amount [(B)+ (C)] can be obtained by adding and reacting tetracarboxylic dianhydride (A) in substantially equimolar amounts.

例えば、有機テトラカルボン酸二無水物を有機極性溶媒
中に懸濁溶解し、ここへ有機テトラカルボン酸二無水物
に対し、50〜90モル%、好ましくは50〜87.5
モル%、更に好ましくは50〜80モル%の4.4′−
ジアミノジフェニルエーテルを加え反応させ両末端酸無
水物基のプレポリマー溶液を得る。但し、このプレポリ
マーを得る反応においては有機テトラカルボン酸二無水
物と4.4′−ジアミノジフェニルエーテルとの添加順
序は逆の場合も可能である。次いでここへ有機テトラカ
ルボン酸二無水物と全ジアミン二とが実質的に等モルと
なるように、一般式[式中、Xは一価の置換基であり、
メチル基、メトキシ基等の一価の有機基又は水素原子、
ハロゲン基、ニトロ基、カルボキシル基、ヒドロキシル
基を表し1mは1〜3の整数を示す] で表される有機ジアミン化合物を加え、撹拌したのち本
発明のブロック共重合体が有機極性溶媒中5〜35重量
%、好ましくは10〜25重量%溶解してなるポリアミ
ド酸溶液が得られる。尚、上記重合反応を安定的に進行
させるためには実質的に無水の系にて60℃・以下、好
ましくは30’C以下、更に好ましくは10’C以下の
温度にて10時間以内、好ましくは5時間以内、更に好
ましくは3時間以内に反応を終えることが望ましい。何
故ならば、 J、 Appl 、  Polymer、
  Sc1..302883−2905  (1985
)に示されるように反応途中に酸無水物末端のプレポリ
マーを経由するため、この酸無水物が系内の水分と反応
し、ジカルボン酸となり重合鎖長の成長を阻害すること
があるからである。
For example, an organic tetracarboxylic dianhydride is suspended and dissolved in an organic polar solvent, and 50 to 90 mol%, preferably 50 to 87.5% of the organic tetracarboxylic dianhydride is added thereto.
mole%, more preferably 50 to 80 mole% of 4.4'-
Diaminodiphenyl ether is added and reacted to obtain a prepolymer solution containing acid anhydride groups at both ends. However, in the reaction for obtaining this prepolymer, the order of addition of the organic tetracarboxylic dianhydride and 4,4'-diaminodiphenyl ether may be reversed. Then, the general formula [wherein X is a monovalent substituent,
A monovalent organic group such as a methyl group or a methoxy group or a hydrogen atom,
represents a halogen group, a nitro group, a carboxyl group, or a hydroxyl group, and 1m represents an integer of 1 to 3.] After adding an organic diamine compound represented by A polyamic acid solution containing 35% by weight, preferably 10 to 25% by weight is obtained. In order to allow the above polymerization reaction to proceed stably, it is preferably carried out in a substantially anhydrous system at a temperature of 60°C or less, preferably 30'C or less, more preferably 10'C or less, and more preferably 10 hours or less. It is desirable to complete the reaction within 5 hours, more preferably within 3 hours. Because J, Appl, Polymer,
Sc1. .. 302883-2905 (1985
), the acid anhydride passes through the acid anhydride-terminated prepolymer during the reaction, and this acid anhydride may react with moisture in the system and become a dicarboxylic acid, inhibiting the growth of the polymer chain length. be.

次いで、この前駆体であるポリアミド酸共重合体の溶液
から本発明のポリイミド共重合体を得る方法について説
明する。
Next, a method for obtaining the polyimide copolymer of the present invention from a solution of this precursor polyamic acid copolymer will be explained.

熱的に脱水閉環(イミド化)する方法では、上記ポリア
ミド酸共重合体の溶液をドラムあるいはエンドレスベル
ト上に流延又は塗布して膜状となし、その膜を150℃
以下の温度で約30〜90分間乾燥し、自己支持性の膜
を得る。次いで、これを支持体より引き剥し端部を固定
した後、約100〜500℃まで徐々に加熱し、冷却後
これより取外し本発明のポリイミド共重合体よりなるポ
リイミド膜を得る。
In the method of thermally dehydrating and ring-closing (imidization), a solution of the above-mentioned polyamic acid copolymer is cast or coated onto a drum or an endless belt to form a film, and the film is heated at 150°C.
Dry for about 30-90 minutes at the following temperature to obtain a self-supporting membrane. Next, this is peeled off from the support, the end portions are fixed, and then gradually heated to about 100 to 500°C, cooled and then removed to obtain a polyimide film made of the polyimide copolymer of the present invention.

化学的に脱水閉環(イミド化)する方法では、上記ポリ
アミド酸共重合体の溶液に化学量論以上の脱水剤と触媒
量の第3級アミン類を加え、ドラムあるいはエンドレス
ベルト上に流延又は塗布して膜状となし、その膜を15
0℃以下の温度で約5〜30分間乾燥し、自己支持性の
膜を得る。次いで、これを支持体より引き剥し端部を固
定した後、約100〜500°Cまで徐々に加熱し、冷
却後これより取外し本発明のポリイミド共重合体よりな
るポリイミド膜を得る。
In the method of chemically dehydrating and ring-closing (imidization), a stoichiometric or higher dehydrating agent and a catalytic amount of tertiary amines are added to a solution of the polyamic acid copolymer, and the mixture is cast or cast onto a drum or endless belt. Coat it to form a film, and apply the film to 15
Dry for about 5-30 minutes at a temperature below 0°C to obtain a self-supporting membrane. Next, this is peeled off from the support, the ends are fixed, and then gradually heated to about 100 to 500°C, cooled and then removed to obtain a polyimide film made of the polyimide copolymer of the present invention.

次に、本発明に用いられる原料について説明すると、本
発明のポリイミド共重合体の前駆体であるポリアミド酸
共重合体を得るに際し、芳香族テトラカルボン酸二無水
物として、例えば、ピロメリット酸二無水物、3.3’
 、4.4’ −ビフェニルテトラカルボン酸二無水物
、3.3’ 、4゜4′−ベンゾフェノンテトラカルボ
ン酸二無水物、ナフタレン−1,2,5,6−テトラカ
ルボン酸二無水物などの二塩基酸をあげることができる
Next, to explain the raw materials used in the present invention, when obtaining the polyamic acid copolymer which is the precursor of the polyimide copolymer of the present invention, for example, pyromellitic dianhydride is used as aromatic tetracarboxylic dianhydride. Anhydride, 3.3'
, 4.4'-biphenyltetracarboxylic dianhydride, 3.3', 4゜4'-benzophenonetetracarboxylic dianhydride, naphthalene-1,2,5,6-tetracarboxylic dianhydride, etc. Dibasic acids can be mentioned.

また、芳香族ジアミン成分として4,4′−ジアミノジ
フェニルエーテルと一般式 [式中、Xは上記と同様であるコ で表されるジアミン化合物を組合せて使用するのが本発
明の効果を得るのに最も望ましい。この一般式で表され
るジアミン化合物は、例えば、3.3′−ジメチル−4
,4″−ジアミノビフェニル、3.3′−ジメトキシ−
4,4′−ジアミノビフェニル、4.4−−ジアミノパ
ラテルフェニル等をあげることができるが、これらは単
独若しくは2種以上の混合物として用いても本発明の効
果は十分に得られる。
In order to obtain the effects of the present invention, the aromatic diamine component is a combination of 4,4'-diaminodiphenyl ether and a diamine compound represented by the general formula [where X is the same as above]. Most desirable. The diamine compound represented by this general formula is, for example, 3,3'-dimethyl-4
, 4″-diaminobiphenyl, 3,3′-dimethoxy-
Examples include 4,4'-diaminobiphenyl, 4,4-diaminoparaterphenyl, etc., and the effects of the present invention can be sufficiently obtained even when these are used alone or as a mixture of two or more.

また、芳香族ジアミン成分として一般式、H2N−R−
NH2 [式中、Rは二価の有機基] で表されるジアミン化合物、例えば、4.4’ −ビス
(4−アミノフェノキシ)ビフェニル、4゜4′−ジア
ミノジフェニルスルホン、3.3’ −ジアミノジフェ
ニルスルホン、ビス[4−(4−アミノフェノキシ)フ
ェニルコスルホン、ビス[4−(3−アミノフェノキシ
)フェニルコスルホン、ビス[4−(2−アミノフェノ
キシ)フェニルコスルホン、1,4−ビス(4−アミノ
フェノキシ)ベンゼン、1.3−ビス(4−アミノフェ
ノキシ)ベンゼン、1.3−ビス(3−アミノフェノキ
シ)ベンゼン、1.4−ビス(4−アミノフェニル)ベ
ンゼン、ビス[4−(4−アミノフェノキシ)フェニル
コニ−チル、4.4’ −ジアミノジフェニルメタン、
ビス(3−エチル−4−アミノフェニル)メタン、ビス
(3−メチル−4−アミノフェニル)メタン、ビス(3
−クロロ−4−アミノフェニル)メタン、3.3’ −
ジアミノジフェニルスルホン、4.4’ −ジアミノジ
フェニルスルホン、2.2’ 、5.5’ −テトラク
ロロ−4,4′−ジアミノビフェニル、 4゜4′−ジ
アミノジフェニルスルフィド、3.3’−ジアミノジフ
ェニルエーテル、3.4’ −ジアミノジフェニルエー
テル、4.4′−ジアミノジフェニルメタン、4.4’
 −ジアミノオクタフルオロビフェニル、2.4−ジア
ミノトルエン、メタフユニレンジアミン、2,2−ビス
[4−(4−アミノフェノキシ)フェニル]プロパン、
2゜2−ビス[4−(4−アミノフェノキシ)フェニル
]ヘキサフルオロプロパン、2,2−ビス(4−アミノ
フェニル)プロパン、2,2−ビス(4−アミノフェニ
ル)へキサフルオロプロパン、2゜2−ビス(3−ヒド
ロキシ−4−アミノフェニル)プロパン、2,2−ビス
(3−ヒドロキシ−4−アミノフェニル)へキサフルオ
ロプロパン、9゜9−ビス(4−アミノフェニル)−1
0−ヒドロ−アントラセン、オルトトリジンスルホンや
3゜3’ 、4.4’−ビフェニルテトラアミン、3゜
3’ 、4.4’ −テトラアミノジフェニルエーテル
等の多価アミン化合物の一部使用も可能である。
In addition, as an aromatic diamine component, the general formula, H2N-R-
Diamine compounds represented by NH2 [wherein R is a divalent organic group], such as 4.4'-bis(4-aminophenoxy)biphenyl, 4°4'-diaminodiphenylsulfone, 3.3'- Diaminodiphenylsulfone, bis[4-(4-aminophenoxy)phenylcosulfone, bis[4-(3-aminophenoxy)phenylcosulfone, bis[4-(2-aminophenoxy)phenylcosulfone, 1,4- Bis(4-aminophenoxy)benzene, 1.3-bis(4-aminophenoxy)benzene, 1.3-bis(3-aminophenoxy)benzene, 1.4-bis(4-aminophenyl)benzene, bis[ 4-(4-aminophenoxy)phenylconythyl, 4.4'-diaminodiphenylmethane,
Bis(3-ethyl-4-aminophenyl)methane, bis(3-methyl-4-aminophenyl)methane, bis(3
-chloro-4-aminophenyl)methane, 3.3' -
Diaminodiphenylsulfone, 4.4'-diaminodiphenylsulfone, 2.2', 5.5'-tetrachloro-4,4'-diaminobiphenyl, 4゜4'-diaminodiphenylsulfide, 3.3'-diaminodiphenyl ether , 3.4'-diaminodiphenyl ether, 4.4'-diaminodiphenylmethane, 4.4'
-diaminooctafluorobiphenyl, 2,4-diaminotoluene, metafuylenediamine, 2,2-bis[4-(4-aminophenoxy)phenyl]propane,
2゜2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-aminophenyl)hexafluoropropane, 2゜2-bis(3-hydroxy-4-aminophenyl)propane, 2,2-bis(3-hydroxy-4-aminophenyl)hexafluoropropane, 9゜9-bis(4-aminophenyl)-1
It is also possible to partially use polyvalent amine compounds such as 0-hydro-anthracene, orthotolidine sulfone, 3°3', 4.4'-biphenyltetraamine, and 3°3', 4.4'-tetraaminodiphenyl ether. .

ここで該ポリアミド酸共重合体の生成反応に使用される
有機極性溶媒としては、例えば、ジメチルスルホキシド
、ジエチルスルホキシドなどのスルホキシド系溶媒、N
、N−ジメチルホルムアミド、N、N−ジエチルホルム
アミドなどのホルムアミド系溶媒、N、N−ジメチルア
セトアミド、N、N−ジエチルアセトアミドなどのアセ
トアミド系溶媒、N−メチル−2−ピロリドン、N−ビ
ニル−2−ピロリドンなどのピロリドン系溶媒、フェノ
ール、o +、 m−、又はp−クレゾール、キシレノ
ール、ハロゲン化フェノール、カテコールなどのフェノ
ール系溶媒、あるいはへキサメチルホスホルアミド、γ
−ブチロラクトンなどを挙げることができ、これらを単
独または混合物として用いるのが望ましいが、更にはキ
シレン、トルエンのような芳香族炭化水素の使用も可能
である。
Examples of the organic polar solvent used in the production reaction of the polyamic acid copolymer include sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide, N
, N-dimethylformamide, N,N-diethylformamide, etc., N,N-dimethylacetamide, N,N-diethylacetamide, etc., acetamide solvents, N-methyl-2-pyrrolidone, N-vinyl-2 - pyrrolidone solvents such as pyrrolidone, phenolic solvents such as phenol, o+, m-, or p-cresol, xylenol, halogenated phenols, catechol, or hexamethylphosphoramide, γ
-butyrolactone, etc., and it is desirable to use these alone or as a mixture, but it is also possible to use aromatic hydrocarbons such as xylene and toluene.

また、このポリアミド酸共重合体は各々前記のを機極性
溶媒中に5〜40重量%、好ましくは10〜30重二%
溶重量れているのが取り扱いの面からも望ましい。
In addition, this polyamic acid copolymer contains 5 to 40% by weight, preferably 10 to 30% by weight of each of the above in a polar solvent.
It is desirable from the viewpoint of handling that the melt weight is low.

また、ポリアミド酸共重合体を化学的に脱水閉環(イミ
ド化)する際の脱水剤としては、例えば無水酢酸等の脂
肪族酸無水物、芳香族酸無水物などがあげられる。また
触媒としては、例えばトリエチルアミンなどの脂肪族第
3級アミン類、ジメチルアニリン等の芳香族第3級アミ
ン類、ピリジン、ピコリン、イソキノリン等の複索環式
第3級アミン類などがあげられる。
Further, examples of the dehydrating agent for chemically dehydrating and ring-closing (imidizing) the polyamic acid copolymer include aliphatic acid anhydrides such as acetic anhydride, aromatic acid anhydrides, and the like. Examples of the catalyst include aliphatic tertiary amines such as triethylamine, aromatic tertiary amines such as dimethylaniline, and polycyclic tertiary amines such as pyridine, picoline, and isoquinoline.

(実施例) 以下、実施例により本発明を具体的に説明する。(Example) Hereinafter, the present invention will be specifically explained with reference to Examples.

実施例中、伸度はJIS  K−7113に準拠して方
法で測定した。線膨張係数は、熱機械分析装置[T M
 A−10,セイコー電子(株)製コを用い、10℃/
分の条件で測定し、200℃の値で表した。湿度膨張係
数は、熱機械分析装置[TMA−30、島津製作所製]
を用い、50℃の温度条件で相対湿度を20〜80%ま
で変化させて測定し、相対湿度20〜80%の間の平均
値で表した。
In the examples, elongation was measured in accordance with JIS K-7113. The coefficient of linear expansion was measured using a thermomechanical analyzer [TM
A-10, made by Seiko Electronics Co., Ltd., at 10℃/
It was measured under conditions of 200°C and expressed as a value of 200°C. The humidity expansion coefficient was measured using a thermomechanical analyzer [TMA-30, manufactured by Shimadzu Corporation]
The relative humidity was measured at a temperature of 50° C. while changing the relative humidity from 20 to 80%, and the relative humidity was expressed as an average value between 20 and 80%.

比較例1 500tl四ツ目フラスコに4,4′ −ジアミノジフ
ェニルエーテル21.549を採取し、245.00g
のN、N−ジメチルアセトアミドを加え溶解した。
Comparative Example 1 21.549 4,4'-diaminodiphenyl ether was collected in a 500 tl four-eye flask, and 245.00 g
of N,N-dimethylacetamide was added and dissolved.

他方、100Mナスフラスコにピロメリット酸二無水物
23.46 ’jを採取し、前記4,4′−ジアミノジ
フェニルエーテル溶液中に固形状で添加した。
On the other hand, 23.46'j of pyromellitic dianhydride was collected in a 100M eggplant flask and added in solid form to the 4,4'-diaminodiphenyl ether solution.

さらに、この100111!ナスフラスコ中の壁面に付
着残存するピロメリット酸二無水物をto、oo gの
N、N’−ジメチルアセトアミドで反応系(四ツ目フラ
スコ)内へ流し入れた。更に引き続き1時間撹拌を続け
、15重量%のポリアミド酸溶液を得た。反応温度は5
〜10℃に保った。但し、以上の操作でピロメリット酸
二無水物の取り扱い及び反応系内は乾燥窒素気流下に置
いた。
Furthermore, this 100111! The pyromellitic dianhydride remaining on the wall of the eggplant flask was poured into the reaction system (four-eye flask) with to, oo g of N,N'-dimethylacetamide. Stirring was further continued for 1 hour to obtain a 15% by weight polyamic acid solution. The reaction temperature is 5
It was kept at ~10°C. However, in the above operations, the pyromellitic dianhydride was handled and the inside of the reaction system was placed under a stream of dry nitrogen.

次にこれらのポリアミド酸溶液をガラス板状に流延塗布
し約100℃にて約60分間乾燥後、ポリアミド酸塗膜
をガラス板より剥し、その塗膜を支持枠に固定し、その
倹約100℃で約30分間、約200℃で約60分間、
約300℃で約60分間加熱し、脱水閉環乾燥後15か
ら25ミクロンのポリイミド膜を得た。このフィルムは
以下の性質を示した。
Next, these polyamic acid solutions were cast onto a glass plate, and after drying at about 100°C for about 60 minutes, the polyamic acid coating was peeled off from the glass plate, and the coating was fixed on a support frame. ℃ for about 30 minutes, about 200℃ for about 60 minutes,
The mixture was heated at about 300° C. for about 60 minutes, and after dehydration and ring closure drying, a polyimide film of 15 to 25 microns was obtained. This film exhibited the following properties.

線膨張係数(at 200℃)  3.5 XIQ’ 
 (”C’ )湿度膨張係数    2.5X1G″s
(%RH−宜)伸  度              
 86  %比較例2 500u四ツロフラスコに3.3゛−ジメチル−4,4
’ −ジアミノビフェニル14.809を採取し、16
0.009のN、N−ジメチルアセトアミドを加え溶解
し、比較例1の方法に従い15.209のピロメリット
酸二無水物を反応させ、15重量%のポリアミド酸溶液
を得た。但し、最終の壁面に付着残存するピロメリット
酸二無水物は1.0.009のN、N−ジメチルアセト
アミドで反応系(四ツ目フラスコ)内へ流し入れた。
Linear expansion coefficient (at 200℃) 3.5 XIQ'
("C') Humidity expansion coefficient 2.5X1G"s
(%RH-Y) Elongation
86% Comparative Example 2 3.3゛-dimethyl-4,4 in a 500u four-way flask
'-diaminobiphenyl 14.809 was collected and 16
0.009 of N,N-dimethylacetamide was added and dissolved, and 15.209 of pyromellitic dianhydride was reacted according to the method of Comparative Example 1 to obtain a 15% by weight polyamic acid solution. However, the pyromellitic dianhydride remaining on the final wall was poured into the reaction system (four-eye flask) with 1.0.009 N,N-dimethylacetamide.

次に比較例1の方法に従い、このポリアミド酸溶液より
ポリイミド膜を得た。このフィルムは以下の性質を示し
た。
Next, according to the method of Comparative Example 1, a polyimide film was obtained from this polyamic acid solution. This film exhibited the following properties.

線膨張係数(at 200℃’)  −L、OXl0−
’  (’C−”)湿度膨張係数    0.25X 
10’  (%RH−1)仲  度         
       4  %比較例3 500mi四ツ目フラスコに4,4′ −ジアミノジフ
ェニルエーテル7.089及び3.3′−ジメチル−4
,4′−ジアミノビフェニル7.509を採取し、16
0.009のN、N−ジメチルアセトアミドを加え溶解
し、比較例1の方法に従い15.429のピロメリット
酸二無水物を反応させ、15重量%のコポリアミド酸溶
液を得た。但し、最終の壁面に付着残存するピロメリッ
ト酸二無水物は10.00 gのN、N−ジメチルアセ
トアミドで反応系(四ツ目フラスコ)内へ流し入れた。
Linear expansion coefficient (at 200℃') -L, OXl0-
'('C-'') Humidity expansion coefficient 0.25X
10' (%RH-1)
4% Comparative Example 3 4,4'-diaminodiphenyl ether 7.089 and 3.3'-dimethyl-4 were added to a 500 mi four-eye flask.
, 4'-diaminobiphenyl 7.509 was collected and 16
0.009 of N,N-dimethylacetamide was added and dissolved, and 15.429 of pyromellitic dianhydride was reacted according to the method of Comparative Example 1 to obtain a 15% by weight copolyamic acid solution. However, the pyromellitic dianhydride remaining on the final wall was poured into the reaction system (four-eye flask) with 10.00 g of N,N-dimethylacetamide.

次に比較例1の方法に従い、このコポリアミド酸溶液よ
りコポリイミド膜を得た。このフィルムは以下の性質を
示した。
Next, according to the method of Comparative Example 1, a copolyimide film was obtained from this copolyamic acid solution. This film exhibited the following properties.

線膨張係数(at 200℃)  0.7 x 10’
  (’C’ )湿度膨張係数    1.0XIO“
5 (%RH−1)伸  度            
    8  %実施例1 5001!L1四ツ目フラスコに4,4′−ジアミノジ
フェニルエーテル7.08gを採取し、110.009
のN、N−ジメチルアセトアミドを加え溶解した。
Linear expansion coefficient (at 200℃) 0.7 x 10'
('C') Humidity expansion coefficient 1.0XIO
5 (%RH-1) Elongation
8% Example 1 5001! Collect 7.08 g of 4,4'-diaminodiphenyl ether in L1 four-eye flask, and add 110.009 g of 4,4'-diaminodiphenyl ether.
of N,N-dimethylacetamide was added and dissolved.

他方、50TILlナスフラスコにピロメリット酸二無
水物15.42 gを採取し、前記4,4′−ジアミノ
ジフェニルエーテル溶液中に固形状で添加した。
On the other hand, 15.42 g of pyromellitic dianhydride was collected in a 50TIL eggplant flask and added in solid form to the 4,4'-diaminodiphenyl ether solution.

更にこの50mナスフラスコ中の壁面に残存付着するピ
ロメリット酸二無水物を10.00 gのN、 Nジメ
チルアセトアミドで反応系(四ツ目フラスコ)へ流し入
れ、更に1時間撹拌を続けた。一方、50IIii三角
フラスコに3,3′−ジメチル−4゜4′ −ジアミノ
ビフェニル7.50gを採取し、50.009のN、N
−ジメチルアセトアミドを加え溶解した。この溶液を反
応系(四ツ目フラスコ)内へ添加し、コポリアミド酸溶
液を得た。以上の反応操作に於て、反応温度は5〜10
℃に、またピロメリット酸二無水物と3,3゛−ジメチ
ル−4,4′−ジアミノビフェニルの取り扱い及び反応
系内は乾燥窒素気流下にて行った。次に、比較例1の方
法に従いこのコポリアミド酸溶液よりコポリイミド膜を
得た。このフィルムは以下の性質を示した。
Furthermore, the pyromellitic dianhydride remaining and adhering to the wall of this 50 m eggplant flask was poured into the reaction system (four-eye flask) with 10.00 g of N,N dimethylacetamide, and stirring was continued for an additional hour. On the other hand, 7.50 g of 3,3'-dimethyl-4゜4'-diaminobiphenyl was collected in a 50III Erlenmeyer flask, and 50.009 of N,N
-Dimethylacetamide was added and dissolved. This solution was added into the reaction system (four-eye flask) to obtain a copolyamic acid solution. In the above reaction operation, the reaction temperature is 5 to 10
The handling of pyromellitic dianhydride and 3,3'-dimethyl-4,4'-diaminobiphenyl and the inside of the reaction system were carried out under a stream of dry nitrogen. Next, a copolyimide film was obtained from this copolyamic acid solution according to the method of Comparative Example 1. This film exhibited the following properties.

線膨張係数(at 200℃)  0.2.X1O−5
(’C−1’)湿度膨張係数    0.35X 10
″5 (%RH−1)伸  度           
    45  %実施例2 500d四ツロフラスコに3,3′−ジメチル−4,4
’ −ジアミノビフェニル7.50gを採取し、110
.009のN、N−ジメチルアセトアミドを加え溶解し
た。他方、50111ナスフラスコにピロメリット酸二
無水物 15.429を採取し、前記 3゜3′−ジメ
チル−4,4′−ジアミノビフェニル溶液中に固形状で
添加した。更にこの50mナスフラスコ中の壁面に残存
付着するピロメリット酸二無水物をio、oo 9!の
N、Nジメチルアセトアミドで反応系(四ツ目フラスコ
)へ流し入れ、更に1時間撹拌を続けた。一方、100
M1三角フラスコに4,4′−ジアミノジフェニルエー
テル7.089を採取し、50.009のN、N−ジメ
チルアセトアミドを加え溶解した。この溶液を反応系(
四ツ目フラスコ)内へ添加し、コポリアミド酸溶液を得
た。以上の反応操作に於て、反応温度は5〜10℃に、
またピロメリット酸二無水物と 4゜4′−ジアミノジ
フェニルエーテルの取り扱い及び反応系内は乾燥窒素気
流下にて行った。次に、比較例1の方法に従い、このコ
ポリアミド酸溶液よりコポリイミド膜を得た。このフィ
ルムは以下の性質を示した。
Coefficient of linear expansion (at 200°C) 0.2. X1O-5
('C-1') Humidity expansion coefficient 0.35X 10
″5 (%RH-1) Elongation
45% Example 2 3,3'-dimethyl-4,4 in a 500d four-way flask
'-Diaminobiphenyl 7.50g was collected and 110g
.. 009 N,N-dimethylacetamide was added and dissolved. On the other hand, 15.429 pyromellitic dianhydride was collected in a 50111 eggplant flask and added in solid form to the 3°3'-dimethyl-4,4'-diaminobiphenyl solution. Furthermore, io, oo 9! of N,N dimethylacetamide was poured into the reaction system (four-eye flask), and stirring was continued for an additional hour. On the other hand, 100
7.089 g of 4,4'-diaminodiphenyl ether was collected in an M1 Erlenmeyer flask, and 50.00 g of N,N-dimethylacetamide was added thereto to dissolve it. This solution is added to the reaction system (
A copolyamic acid solution was obtained. In the above reaction operation, the reaction temperature was 5 to 10°C,
The handling of pyromellitic dianhydride and 4°4'-diaminodiphenyl ether and the inside of the reaction system were carried out under a stream of dry nitrogen. Next, according to the method of Comparative Example 1, a copolyimide film was obtained from this copolyamic acid solution. This film exhibited the following properties.

線膨張係数(at 200’C)  0.2 xlO’
 (’C−’ )湿度膨張係数    0.35X 1
0’ (%RH−1)伸  度           
    42  %(発明の効果) 本発明のポリイミド共重合体から得られるポリイミド膜
は、線膨張係数及び湿度膨張係数が共に小さく、寸法安
定性に優れており、更には公知の寸法安定性を改良した
ポリイミド膜が有し得ながった柔軟性と伸度等の機械的
強度と耐熱性と加工性とを併せ持つという効果を有する
Linear expansion coefficient (at 200'C) 0.2 xlO'
('C-') Humidity expansion coefficient 0.35X 1
0' (%RH-1) Elongation
42% (Effect of the invention) The polyimide film obtained from the polyimide copolymer of the present invention has a small coefficient of linear expansion and a coefficient of humidity expansion, and has excellent dimensional stability. It has the effect of having mechanical strength such as flexibility and elongation, heat resistance, and processability that polyimide membranes cannot have.

Claims (6)

【特許請求の範囲】[Claims] (1)一般式 ▲数式、化学式、表等があります▼ [式中R_1、R_2は2価の有機基、但しR_1、R
_2がそれぞれ▲数式、化学式、表等があります▼、▲
数式、化学式、表等があります▼である場 合、▲数式、化学式、表等があります▼、▲数式、化学
式、表等があります▼である場合を除く、 R_0は4価の有機基、mは正の整数]で表される反復
単位からなるポリイミド共重合体。
(1) General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [In the formula, R_1 and R_2 are divalent organic groups, however, R_1 and R
_2 each have ▲ mathematical formulas, chemical formulas, tables, etc. ▼, ▲
There are mathematical formulas, chemical formulas, tables, etc.▼, unless ▲There are mathematical formulas, chemical formulas, tables, etc.▼, ▲There are mathematical formulas, chemical formulas, tables, etc.▼, R_0 is a tetravalent organic group, m is a tetravalent organic group A polyimide copolymer consisting of repeating units represented by a positive integer.
(2)R_1が ▲数式、化学式、表等があります▼ [式中、Xは水素原子又は一価の置換基、nは1〜3の
整数] で、R_2が ▲数式、化学式、表等があります▼ である特許請求の範囲第1項記載のポリイミド共重合体
(2) R_1 is a ▲ mathematical formula, chemical formula, table, etc. [In the formula, X is a hydrogen atom or a monovalent substituent, n is an integer from 1 to 3], and R_2 is The polyimide copolymer according to claim 1, which is ▼.
(3)R_1が ▲数式、化学式、表等があります▼ で、R_2が ▲数式、化学式、表等があります▼ [式中、Xは水素原子又は一価の置換基、nは1〜3の
整数] である特許請求の範囲第1項記載のポリイミド共重合体
(3) R_1 is ▲ There are numerical formulas, chemical formulas, tables, etc. ▼ and R_2 is ▲ There are ▲ mathematical formulas, chemical formulas, tables, etc. ▼ [In the formula, X is a hydrogen atom or a monovalent substituent, and n is 1 to 3 integer] The polyimide copolymer according to claim 1.
(4)R_0が ▲数式、化学式、表等があります▼、▲数式、化学式、
表等があります▼及び▲数式、化学式、表等があります
▼ からなる群から選ばれる少なくとも一種である特許請求
の範囲第1項記載のポリイミド共重合体。
(4) R_0 has ▲ mathematical formulas, chemical formulas, tables, etc. ▼, ▲ mathematical formulas, chemical formulas,
The polyimide copolymer according to claim 1, which is at least one member selected from the group consisting of ▼ and ▲ mathematical formulas, chemical formulas, tables, etc. ▼.
(5)R_0が ▲数式、化学式、表等があります▼ である特許請求の範囲第1、2、3項記載のポリイミド
共重合体。
(5) The polyimide copolymer according to claims 1, 2, and 3, wherein R_0 is ▲a numerical formula, a chemical formula, a table, etc.▼.
(6)一般式 ▲数式、化学式、表等があります▼ [式中、R_0は4価の有機基] で表される有機テトラカルボン酸二無水物(A)とこれ
に対し50〜90モル%の一般式 H_2N−R_1−NH_2 [式中、R_1は2価の有機基] で表される有機ジアミン化合物(B)を、有機極性溶媒
中で反応させ、両末端に酸無水物基を有するプレポリマ
ーを得、続いてここに一般式 H_2N−R_2−NH_2 〔式中、R_2は2価の有機基、但しR_1、R_2が
それぞれ▲数式、化学式、表等があります▼、▲数式、
化学式、表等があります▼である場合、 ▲数式、化学式、表等があります▼、▲数式、化学式、
表等があります▼である場合を除く] で表される有機ジアミン化合物(C)を全有機ジアミン
量[(B)+(C)]が有機テトラカルボン酸二無水物
(A)と実質的に等モルになるように添加反応し得られ
るポリアミド酸共重合体を熱的あるいは化学的に脱水閉
環して得ることを特徴とするポリイミド共重合体の製造
方法。
(6) General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [In the formula, R_0 is a tetravalent organic group] Organic tetracarboxylic dianhydride (A) represented by the following and 50 to 90 mol% of this An organic diamine compound (B) represented by the general formula H_2N-R_1-NH_2 [wherein R_1 is a divalent organic group] is reacted in an organic polar solvent to form a precipitate having acid anhydride groups at both ends. After obtaining the polymer, the general formula H_2N-R_2-NH_2 [In the formula, R_2 is a divalent organic group, however, R_1 and R_2 are respectively ▲ mathematical formulas, chemical formulas, tables, etc. ▼, ▲ mathematical formulas,
There are chemical formulas, tables, etc. ▼ If ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ Mathematical formulas, chemical formulas,
There is a table etc. ▼] If the total organic diamine amount [(B) + (C)] is substantially the same as the organic tetracarboxylic dianhydride (A), 1. A method for producing a polyimide copolymer, which is obtained by thermally or chemically dehydrating and ring-closing a polyamic acid copolymer obtained by addition reaction so as to have equimolar amounts.
JP62149162A 1987-06-17 1987-06-17 New polyimide copolymer and its production method Expired - Lifetime JP2766640B2 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6416832A (en) * 1987-07-10 1989-01-20 Kanegafuchi Chemical Ind Production of polyamic acid copolymer
JPS6416833A (en) * 1987-07-10 1989-01-20 Kanegafuchi Chemical Ind Polyamic acid copolymer, polyimide copolymer therefrom and production thereof
JPS6416834A (en) * 1987-07-10 1989-01-20 Kanegafuchi Chemical Ind Polyamic acid copolymer, polyimide copolymer therefrom and production thereof
JPH04306232A (en) * 1990-10-02 1992-10-29 E I Du Pont De Nemours & Co Precursor of polyimide copolymer
US6444783B1 (en) 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
JP2009221398A (en) * 2008-03-18 2009-10-01 Ube Ind Ltd Polyamic acid solution composition, and polyimide film

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161429A (en) * 1984-01-31 1985-08-23 Sumitomo Bakelite Co Ltd Preparation of heat-resistant resin
JPS61111359A (en) * 1984-11-06 1986-05-29 Ube Ind Ltd Polyamic acid solution composition and polyimide film
JPS63166287A (en) * 1986-12-27 1988-07-09 住友ベークライト株式会社 Manufacture of flexible printed circuit substrate
JPS63254131A (en) * 1987-04-10 1988-10-20 Mitsubishi Electric Corp Production of aromatic polyimide

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161429A (en) * 1984-01-31 1985-08-23 Sumitomo Bakelite Co Ltd Preparation of heat-resistant resin
JPS61111359A (en) * 1984-11-06 1986-05-29 Ube Ind Ltd Polyamic acid solution composition and polyimide film
JPS63166287A (en) * 1986-12-27 1988-07-09 住友ベークライト株式会社 Manufacture of flexible printed circuit substrate
JPS63254131A (en) * 1987-04-10 1988-10-20 Mitsubishi Electric Corp Production of aromatic polyimide

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6416832A (en) * 1987-07-10 1989-01-20 Kanegafuchi Chemical Ind Production of polyamic acid copolymer
JPS6416833A (en) * 1987-07-10 1989-01-20 Kanegafuchi Chemical Ind Polyamic acid copolymer, polyimide copolymer therefrom and production thereof
JPS6416834A (en) * 1987-07-10 1989-01-20 Kanegafuchi Chemical Ind Polyamic acid copolymer, polyimide copolymer therefrom and production thereof
JPH04306232A (en) * 1990-10-02 1992-10-29 E I Du Pont De Nemours & Co Precursor of polyimide copolymer
US6444783B1 (en) 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
JP2009221398A (en) * 2008-03-18 2009-10-01 Ube Ind Ltd Polyamic acid solution composition, and polyimide film

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