JPS6329558A - Circuit substrate - Google Patents
Circuit substrateInfo
- Publication number
- JPS6329558A JPS6329558A JP17349986A JP17349986A JPS6329558A JP S6329558 A JPS6329558 A JP S6329558A JP 17349986 A JP17349986 A JP 17349986A JP 17349986 A JP17349986 A JP 17349986A JP S6329558 A JPS6329558 A JP S6329558A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- lead wires
- bonding lead
- circuit substrate
- bonding agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 230000001681 protective effect Effects 0.000 claims abstract description 8
- 229920002379 silicone rubber Polymers 0.000 abstract description 6
- 239000004945 silicone rubber Substances 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 5
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009849 vacuum degassing Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は外部引出用のリードピンを備えた回路基板に関
するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a circuit board provided with lead pins for external extraction.
（従来の技術とその問題点〉
通常、リードピンを多数備える回路基板へダムリングを
接合する場合は、マ「クント部、ボンディングリード線
及び基板端部上面の周縁から適宜幅を除く上面、即ち基
板上面に突出したリードピンの頭部部分に熱硬化性のシ
リコンゴム等の接着剤を塗布し、ダムリングを接着した
後、該接着剤中の気泡を真空脱気していた。(Prior art and its problems) Normally, when bonding a dam ring to a circuit board that has a large number of lead pins, it is necessary to After applying an adhesive such as thermosetting silicone rubber to the head portion of the lead pin protruding from the upper surface and adhering the dam ring, air bubbles in the adhesive were vacuum degassed.
これは、接着剤中に気泡があると接着強度が弱くなるた
めである。This is because the presence of air bubbles in the adhesive weakens the adhesive strength.
ところが、該ダムリングを接着する際に基板上面に塗布
されたシリコンゴム笠の接着剤の練磨及び塗布量により
該接着剤がダムリングの周端部からはみ出してボンディ
ングリード線に付着したり、或いは前記真空脱気中にボ
ンディングリード線近傍の気泡の破裂により、シリコン
ゴムの油分がはみ出してボンディングリード線に付着し
てこれらを不圧着状態にするという問題があった。However, when bonding the dam ring, due to the polishing and amount of the adhesive applied to the silicone rubber cap applied to the top surface of the substrate, the adhesive may protrude from the peripheral edge of the dam ring and adhere to the bonding lead wire. There is a problem in that during the vacuum degassing, the oil in the silicone rubber protrudes due to the bursting of air bubbles in the vicinity of the bonding lead wires and adheres to the bonding lead wires, causing them to be in a non-pressure bonded state.
（発明が解決しようとする技術的課題）以上の問題を解
決しようとする本発明の技術的課題は、回路Ｕ板上面に
ダムリングを接着する際及び回路基板にダムリングを接
着した後の真空脱着の際に、はみ出す接着剤及び油分が
ボンディングリード線に付着するのを防止することであ
る。(Technical Problems to be Solved by the Invention) The technical problems of the present invention to solve the above problems are as follows: The purpose is to prevent adhesive and oil that protrudes from adhering to the bonding lead wire during attachment and detachment.
（技術的課題を達成するための技術的手段）以上の技術
的課題を達成するための本発明の技術的手段は、リード
ピンを多数備える回路阜板におけるボンディングリード
線の周囲に、該ボンディングリード線を囲む防護突部を
設けることである。(Technical Means for Achieving the Technical Problem) The technical means of the present invention for achieving the above-mentioned technical problem is to provide a bonding lead wire around a bonding lead wire in a circuit board having a large number of lead pins. It is to provide a protective protrusion surrounding the area.
（発明の効果）
本発明は以上の様な構成にしたことにより下記の効果を
有する。(Effects of the Invention) The present invention has the following effects by having the above configuration.
■ ボンディングリード線の周囲に該リード部を囲むよ
うに設けた防護突部により、ダムリングの接着の際及び
真空脱気の際にはみ出す接着剤及び油分がボンディング
リード線に付着するのを防止することができる。■ The protective protrusion provided around the bonding lead wire so as to surround the lead part prevents the adhesive and oil spilled out during dam ring bonding and vacuum degassing from adhering to the bonding lead wire. be able to.
（実施例） 以下、本発明の一実施例を図面により説明する。(Example) An embodiment of the present invention will be described below with reference to the drawings.
回路基ｔ（１）はガラスエポキシ樹脂、セラミック等で
適宜大きさに形成された１ｕｆｆｉ （ｍ）に、縦横方
向に等間隔をもって多数のリードピン（２）が取り付け
られると共に、上面に塗布された熱硬化性樹脂のシリコ
ンゴム等の接着剤（３〉を介してダムリング（４）が接
合されている。The circuit board t(1) is 1uffi (m) made of glass epoxy resin, ceramic, etc. to an appropriate size, and a large number of lead pins (2) are attached at equal intervals in the vertical and horizontal directions, and a number of lead pins (2) are attached at equal intervals in the vertical and horizontal directions. A dam ring (4) is joined via an adhesive (3) such as curable resin silicone rubber.
又、回路基板（ｍ）の上面にはマウント部（ｎ）にＩＣ
チップ（５）が搭載されると共に、該ＩＣチップ（５）
と前記リードピン（２）とをｙ！Ａ時する導線（６）が
配列され、該導線（６）のボンディングリード線（６ａ
）を除いた上面全面にスクリーン印刷によるソルダーレ
ジスト（７）が被覆されている。Also, on the top surface of the circuit board (m), there is an IC mounted on the mount part (n).
A chip (5) is mounted, and the IC chip (5)
and the lead pin (2) y! The conductive wires (6) that are connected to A are arranged, and the bonding lead wire (6a) of the conductive wires (6)
) The entire upper surface except for portions ( ) is coated with a solder resist (7) by screen printing.
接着剤（３）は練磨が２５０〜３５０ｃｐのシリコンゴ
ムをマウント部（ｎ）、ボンディングリード線（６ａ）
及び基板（ｍ）の周縁から適宜幅線いた上面、即ち基板
（ｍ＞上面に突出したり一ドピンの頭部（２ａ）を全て
被覆した状態で適宜厚さに塗布される。Adhesive (3) is silicone rubber with a grinding rate of 250 to 350 cp to the mounting part (n) and the bonding lead wire (6a).
Then, it is applied to the upper surface of the substrate (m) with an appropriate width line extending from the periphery of the substrate (m), that is, the coating is applied to an appropriate thickness while protruding from the substrate (m>upper surface) and covering the entire head (2a) of one dowel.
又、該回路基板（１）上面のボンディングリード線（６
ａ）周囲には、該ボンディングリード線（６ａ）を囲む
ようにして平面方形状に防護突部（８）が設けられてい
る。In addition, the bonding lead wire (6) on the top surface of the circuit board (1)
a) A protective protrusion (8) is provided around the bonding lead wire (6a) in a rectangular shape in a plan view.
該防護突部（８）は回路Ｆｊ板（１）上面にダムリング
（４）を接合する（糸及びダムリング（４）を接合した
後の真空脱気の際にはみ出す接着剤（３）及び接着剤の
油分を止めて、これらがボンディングリード！（６ａ＞
に付着するのを防止するもので、該ボンディングリード
線（６ａ）後端から０．２８の位置にソルダーレジスト
（７）をスクリーン及びボッティング印刷で突設したも
のである。The protective protrusion (8) connects the dam ring (4) to the top surface of the circuit Fj board (1) (the adhesive (3) and Stop the oil from the adhesive and these are the bonding leads! (6a>
A solder resist (7) is provided protrudingly at a position of 0.28 from the rear end of the bonding lead wire (6a) by screen and botting printing.
ダムリング（４）はアルマイト処理が施されたアルミニ
ウムで回路基板（１）よりもやや小さな平面方形に形成
されると共に、マウント部（ｎ）及びボンディングリー
ド線（６ａ）に対応する中央部に開口部（４ａ）が設け
られている。The dam ring (4) is made of alumite-treated aluminum and is formed into a rectangular plane that is slightly smaller than the circuit board (1), and has an opening in the center corresponding to the mount part (n) and bonding lead wire (6a). A section (4a) is provided.
そして、回路基板（１）上面にリードピンの頭部（２ａ
）を全て被覆する状態で接合される。Then, place the head of the lead pin (2a) on the top surface of the circuit board (1).
) are bonded in a state where they are completely covered.
第１図は本発明の平面図、第２図は同■−■線断面図、
第３図は要部の拡大断面図、第４図はダムリングを取り
付ける状態の断面図である。
尚、図中
（１）二回路基板 （２）：リードピン（６ａ）
：ボンディングリード線
（８）：防護突部
特許出願人 田中電子工業株式会社代 理
人 早 川 政
名 ゛八１７；
第１図
第２図
第３図
第４図Fig. 1 is a plan view of the present invention, Fig. 2 is a sectional view taken along the line ■-■,
FIG. 3 is an enlarged sectional view of the main part, and FIG. 4 is a sectional view of the dam ring attached. In addition, in the figure (1) two circuit boards (2): lead pin (6a)
: Bonding lead wire (8): Protective protrusion Patent applicant Tanaka Electronics Co., Ltd. Agent
Masa Hayakawa
Name ゛817; Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
リード線の周囲に、該ボンディングリード線を囲む防護
突部を設けた回路基板。A circuit board provided with a protective protrusion surrounding a bonding lead wire around the bonding lead wire in a circuit board including a large number of lead pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17349986A JPS6329558A (en) | 1986-07-22 | 1986-07-22 | Circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17349986A JPS6329558A (en) | 1986-07-22 | 1986-07-22 | Circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6329558A true JPS6329558A (en) | 1988-02-08 |
Family
ID=15961649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17349986A Pending JPS6329558A (en) | 1986-07-22 | 1986-07-22 | Circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6329558A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5621100A (en) * | 1992-07-24 | 1997-04-15 | Cephalon, Inc. | K-252a derivatives for treatment of neurological disorders |
-
1986
- 1986-07-22 JP JP17349986A patent/JPS6329558A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5621100A (en) * | 1992-07-24 | 1997-04-15 | Cephalon, Inc. | K-252a derivatives for treatment of neurological disorders |
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