JPS63295087A - Laser beam machine - Google Patents

Abstract

PURPOSE:To guarantee prescribed machining accuracy by constituting a control device so that it operates correcting the deviated position of a focal position on a work of a laser beam corresponding to an output. CONSTITUTION:A gradient theta of an optical axis of a laser beam corresponding to a laser excitation input A of a laser oscillator 1 is measured in advance. From the relation with an excitation input A when the theta was measured an amount (h) of deviation of a focal position of the laser beam can be obtained as a function of an excitation input A. Therefore, the excitation input A is inputted into an NC controller 8, an operation is conducted in the device 8 to obtain an amount of deviation (h) of the focal position and the move of the NC controller 8 is corrected by the amount equivalent to this (h). By this method, the NC controller 8 operates correcting a command value for the program position by the amount of deviation (h) of the focal position. Accordingly, even if a gradient theta occurs to the optical axis of the laser beam, a machined result can be obtained according to the command value for the program position.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to improvements in laser processing equipment.

[Prior Art] CO lasers (λ-IO 16 mm) are widely used in industry because they are highly efficient and can be manufactured at low cost even as high-output oscillators. Furthermore, since the YAG laser has a smaller wavelength (λ-1.06 mm) than the CO laser, it is suitable for fine processing and is widely used like the Co laser. These laser oscillators use electrical energy to excite the laser, and the CO laser uses electric discharge to excite the laser medium, and the YAG laser uses a flash lamp to excite the laser medium to generate laser oscillation, and the laser output is used for excitation. It increases according to the power input.

[Problems to be Solved by the Invention] In conventional laser processing, processing is often performed with a constant laser output, and the requirements for processing accuracy are not so high. However, recently, the parts targeted for laser processing have become more complex and diverse, and processing accuracy of 0.05 mm or less has become required for CO lasers, so processing speed, laser output, etc. Automatically set the machining conditions to 0. “〒Control 0 precision! 112 lines'5!'5”'
”“°1. 'There is.

Figure 2 is a configuration diagram of a laser processing device that performs cutting using a laser beam, in which 1 is a laser oscillator, 2 is an excitation power source,
3 is a bend mirror, 4 is a processing lens, 5' is a workpiece, 6
is the sword pin, 7 is the XY table, and 8 is the output from the NC control device.

As shown in the figure, a laser beam output from a laser oscillator 1 is reflected by a pendulous mirror 3 and condensed by a processing lens 4 to focus on a workpiece 5, thereby cutting the workpiece 5. Note that the NC control device 8 moves the XY table 7 according to a program created in advance according to the machining shape.

In the case of cutting, laser processing does not use a mold, so it is often used to process sharp edges and irregular curves other than circles and corners. There are many cases where machining time is shortened, such as machining parts at high output and high speed, and machining minute parts at low output and low speed.

At this time, depending on the magnitude of the output, the optical axis of the laser beam output from the laser oscillator may change slightly (as shown in the figure).
θ−±0.5 mrad), the focal position of the laser beam on the workpiece is deviated by h shown in the following equation (1). Note that f is the focal length of the processing lens 4.

h-fθ ・・・・・・・・・・・・・・・・・・・・・
...(1) In equation (1), f is 5' (127
mm), the deviation measurement will be h 127 . As a result, it is necessary to modify and reprocess the Niprogram, which requires much more effort and time, which is a problem with conventional laser processing apparatuses.

The present invention has been made in order to solve the problems of the conventional device described above, and aims to provide a laser processing device that can perform high-precision processing at low cost while eliminating the trouble of modifying, reprocessing, and remeasuring the cannibal program. It is something to do.

[Means for solving the problem] In order to achieve the above object, in the present invention, the amount of deviation of the focal position of the laser beam on the workpiece corresponding to the laser excitation force or laser output is determined in advance, By inputting laser excitation input or laser output to the drive control device, the drive control device is configured to operate while correcting the amount of deviation of the focal position of the laser beam.

[Function] “Since the laser processing device is configured as described above, even if the laser beam optical axis is tilted due to changes in laser excitation input or laser output, and as a result, the focal position of the laser beam is shifted,
The drive control device operates by correcting accordingly. Therefore, machining results according to the program position command value can be obtained.
Even if the laser excitation input or laser output fluctuates, the processing accuracy will not decrease.

[Embodiment of the Invention] Fig. 1 is a configuration diagram of a laser processing device which is an embodiment of the present invention, in which 1 to 8 are the same parts as the conventional device, and 9 is the excitation input to the NC control device. It is an input.

In the present invention, the laser excitation force A of the laser oscillator 1 is
Measure in advance the inclination θ of the optical axis of the laser beam corresponding to
Relationship between A value and θ θ−F (A)・・・・・・・・・・・・・・・・・・
...When calculating (2), h from the above equations (1) and (2)
-fθ-fF(A) (3) is obtained.

That is, by measuring θ and using the relationship with the excitation force A at that time, the formula (2
), the deviation of the focal position of the laser beam mh
can be determined as a function of the excited human power A. Therefore, by inputting the excited human power A into the NC control device 8, calculating h by formula (3) within the device 8, and correcting the movement of the NC control device 8 by an amount corresponding to this h, the NC The control device 8 operates while correcting the program position command value by the focus position deviation zh. As a result, even if the laser beam optical axis has an inclination θ, a machining result in accordance with the program position command value can be obtained.

In this embodiment, the relationship between the laser excitation force A and the deviation ih is used, but the laser output may be used instead of the laser excitation input.

Furthermore, although this example uses a CO laser beam,
A YAG laser or other laser beam may also be used. Furthermore, although an XY table is used to move the workpiece, it may also be of a type that moves the beam, and other focusing systems such as a concave mirror can be used instead of the processing lens.

[Effects of the Invention] The present invention provides a laser processing device in which the deviation of the beam focal position corresponding to the laser excitation input or laser output of the laser oscillator is determined in advance, and the laser excitation input or laser output is input to the NC control device. By doing so, the control device is configured to operate while correcting the deviation amount of the focus position of the laser beam on the workpiece corresponding to the excitation input or output, so that the laser excitation input or laser output does not fluctuate. However, the laser beam was able to produce excellent effects in that it could perform processing according to predetermined program position commands and guarantee a predetermined processing accuracy.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a laser processing apparatus according to an embodiment of the present invention, and FIG. 2 is a block diagram of a conventional laser processing apparatus. In the figure, 1 is a laser oscillator, 2 is an excitation power source, 3 is a pend mirror, 4 is a processing lens, 5 is a workpiece, 7 is an XY table,
8 is an NC control device, and 9 is an input of excitation input to the NC device. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Scope of Claims] A device for condensing a laser beam output from a laser oscillator using a condensing means and irradiating it onto a workpiece, the laser beam or the workpiece being driven by an NC device. In a laser processing device for processing, the amount of deviation of the focal position of a laser beam on the workpiece corresponding to the laser excitation input or laser output of the laser oscillator is determined, and the laser excitation input or laser output is transmitted to the NC device. 1. A laser processing apparatus characterized in that the laser processing apparatus is configured to operate by correcting a predetermined drive command value by the amount of deviation corresponding to the laser excitation input or the laser output by inputting it.