JPS63283001A - Chip electronic component - Google Patents
Chip electronic componentInfo
- Publication number
- JPS63283001A JPS63283001A JP11733487A JP11733487A JPS63283001A JP S63283001 A JPS63283001 A JP S63283001A JP 11733487 A JP11733487 A JP 11733487A JP 11733487 A JP11733487 A JP 11733487A JP S63283001 A JPS63283001 A JP S63283001A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- solder
- chip electronic
- resistor
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008018 melting Effects 0.000 claims abstract description 18
- 238000002844 melting Methods 0.000 claims abstract description 18
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000007769 metal material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000006071 cream Substances 0.000 abstract description 5
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 230000005496 eutectics Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 239000000155 melt Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000607598 Vibrio Species 0.000 description 1
- 206010047400 Vibrio infections Diseases 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は小型電子回路を構成する、例えばバイブリソ）
ＩＣや面実装等に使用するリードレス型のチップ電子部
品に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Use The present invention constitutes small electronic circuits, such as vibrios
It relates to leadless chip electronic components used for ICs, surface mounting, etc.
従来の技術
従来に於けるリードレス型チップ電子部品は、第４図に
示す様に、例えばチップ抵抗に於いて、本体角型状ベー
ス材１２の片面の中心部に、抵抗体１１を設けて、その
両端部に取付け・引出し用電極１３を設けた構造と成っ
ている。第５図は前記チップ抵抗の実装方法を示す例で
あり、本体基板１６の片面に配線・接続用導体の電極１
５が前２八−７
記チップ抵抗の電極１３と間隔を同じにして設けられ、
仮止メ用接着剤１７にて、ベース材１２の抵抗体１１の
無い面側と本体基板１６とを仮止メした後、各種のハン
ダ槽を通したり、あるいは、浸漬することにより接続用
ハンダ１３１Ｌにより、電極１３と電極１６を機械的・
電気的に固着および接続するのである。BACKGROUND ART Conventional leadless chip electronic components, as shown in FIG. , has a structure in which attachment/extracting electrodes 13 are provided at both ends thereof. FIG. 5 shows an example of the mounting method of the chip resistor, in which electrodes 1 of the wiring/connecting conductor are mounted on one side of the main body board 16.
5 is provided with the same spacing as the electrode 13 of the chip resistor described above in 28-7,
After temporarily fixing the side of the base material 12 without the resistor 11 and the main board 16 with the temporary fixing adhesive 17, connect solder by passing it through various solder baths or dipping it. 131L mechanically connects electrode 13 and electrode 16.
It is electrically fixed and connected.
発明が解決しようとする問題点
前記の構造・実装方法に於いては、仮止メのために接着
剤塗布および硬化が必要で、硬化後の補正が困難であり
、その接着剤量や位置ならびにチップ電子部品の実装位
置精度が厳しく必要である。Problems to be Solved by the Invention In the structure and mounting method described above, it is necessary to apply and cure adhesive for temporary fixing, and correction after curing is difficult. The mounting position accuracy of chip electronic components is strictly required.
又別の方法たる接着剤にょる仮止メを行うことなく、ク
リームハンダ等を印刷した後、チップ部品を搭載して赤
外線炉等のりフロー炉に通す実装方法に於いては、クリ
ームハンダ量・各々の電極状況・表面状態・熱分布等の
何らかの理由で第６図に示すＡ側とＢ側が同時にハンダ
が溶けずにアンバランスと成り、表面張力等によりＡ又
はＢに張力・吸引力が先に働き、チップ電子部品が立っ
て確実な実装が出来ないことがある。Another mounting method is to print cream solder, etc. without temporarily fixing with adhesive, and then mount the chip components and pass them through a glue flow furnace such as an infrared furnace. For some reason such as the condition of each electrode, surface condition, heat distribution, etc., the solder on the A side and B side shown in Figure 6 does not melt at the same time, resulting in an imbalance, and the tension/attraction force is applied first to A or B due to surface tension, etc. This may cause the chip electronic components to stand up, making it impossible to mount them reliably.
本発明はこのような問題点を解決するもので、確実な実
装が行えるようにすることを目的とする。The present invention solves these problems and aims to ensure reliable implementation.
問題点を解決するだめの手段
本発明はかかる問題点を解決するために、取付け・引出
用電極を、溶解温度の異なる少くとも２種類の金属ある
いは合金材により形成して設けたものである。Means for Solving the Problems In order to solve these problems, the present invention provides attachment and extraction electrodes made of at least two types of metals or alloys having different melting temperatures.
作用
溶解温度差の異なる電極材に於いて、リフロー炉を通す
と先に低温部が溶けて表面張力により、チップ電子部品
を正規の位置に補正かつ仮止メと同じ状態とし、しかる
後高温部が溶けて完全に固着・接続されるのである。When electrode materials with different melting temperatures are passed through a reflow oven, the low-temperature part melts first, and due to surface tension, the chip electronic components are corrected to the normal position and in the same state as the temporary fixing, and then the high-temperature part melts. are melted and completely fixed and connected.
実施例
本発明の構造と実装方法をチップ抵抗を例にして説明す
る。第１図ａ −Ｃに於いてアルミナ材等から成る角形
のベース基板２の片面中央部に、厚膜材等から成る抵抗
体１を印刷・焼成かつ修正して設け、その両端部での抵
抗体１の面側に低温溶解電極３を厚膜材の上に低温・・
ンダあるいは共晶点ハンダ等により設け、側端面には同
じく厚膜材の上に共晶点ハンダあるいは高温ハンダ等か
ら成る高温溶解電極４を設けた構造と成っている。次に
実装方法例を第２図〜第３図に示す。銅張積層板等から
成る本体基板６の片面に、配線・接続・固着用の銅ハク
から成る電極５が、前記チップ抵抗の低温溶解電極３と
間隔を同じにして設けられ、クリームハンダを電極５に
印刷した後、低温溶解電極３と電極５がクリームハンダ
を介して当接する様にチップ抵抗を搭載するのである。Embodiment The structure and mounting method of the present invention will be explained using a chip resistor as an example. In Figures 1a-C, a resistor 1 made of a thick film material or the like is printed, fired and modified in the center of one side of a rectangular base substrate 2 made of an alumina material or the like, and the resistance at both ends is A low-temperature melting electrode 3 is placed on the surface side of the body 1 on a thick film material.
It has a structure in which a high temperature melting electrode 4 made of eutectic point solder or high temperature solder is provided on a thick film material on the side end face. Next, examples of mounting methods are shown in FIGS. 2 and 3. Electrodes 5 made of copper foil for wiring, connection, and fixing are provided on one side of a main body substrate 6 made of a copper-clad laminate or the like at the same spacing as the low-temperature melting electrodes 3 of the chip resistor, and cream solder is applied to the electrodes. After printing on the electrode 5, a chip resistor is mounted so that the low-temperature melting electrode 3 and the electrode 5 come into contact with each other via cream solder.
そして所定の温度分布から成る赤外線炉等のりフロー炉
を通すのである。すると１ず低温溶解電極３が溶解する
。そして、クリーム・・ンダが溶けて低温溶解電極３部
分と電極５部分とが前記ハンダ３ａでの表面張力・吸引
力等により、正規の位置と成り、その結果チップ抵抗が
位置規制されかつ、仮止メ状態と成る。次にリフロー炉
内の位置を移動すると、より高温部に成り高温溶解電極
４が溶解して電極５とハンダ４ａにより固着・接続され
、実装が完成されるのである。Then, it is passed through a flow furnace such as an infrared furnace having a predetermined temperature distribution. Then, the low temperature melting electrode 3 first melts. Then, the cream solder melts and the low-temperature melting electrode 3 part and electrode 5 part are in the normal position due to the surface tension and suction force of the solder 3a, and as a result, the position of the chip resistance is regulated and the temporary It becomes a stopped state. Next, when the reflow oven is moved to a higher temperature area, the high-temperature melting electrode 4 is melted and fixed and connected to the electrode 5 by the solder 4a, completing the mounting.
５へ一／
前記の構造・実装方法により、各種のリードレスチップ
電子部品にも可能であり、例えば円筒形状に於いても対
応出来るし、又、低温溶解電極３をベース基板２の抵抗
体１と反対の面側に設けて、フェースアップの実装とし
ても良いことは言うまでもない。To 5/ The structure and mounting method described above makes it possible to manufacture various leadless chip electronic components, for example, in a cylindrical shape. Needless to say, it is also possible to install it on the opposite side for face-up mounting.
発明の効果
以上の様に本発明によれば、少なくとも溶解温度の異な
る２種類の金属又は合金から成る電極を持つ構造のチッ
プ電子部品を実装することにより、仮止メ用の接着剤が
不要で、チップ電子部品の実装搭載精度が厳しく無くて
も、リフロ一時に搭載位置の補正が行え、しかも溶解の
アンバランス等によるチップ電子部品が立つことによる
実装の不具合も無く、実用的にきわめて有用である。Effects of the Invention As described above, according to the present invention, by mounting a chip electronic component having a structure having electrodes made of at least two types of metals or alloys having different melting temperatures, adhesives for temporary fixing are not required. Even if the mounting accuracy of chip electronic components is not strict, the mounting position can be corrected during reflow, and there is no mounting problem caused by chip electronic components standing up due to unbalanced melting, etc., making it extremely useful in practice. be.
第１図ａ、ｂ、ｃは本発明の一実施例に於けるチップ電
子部品の上面図、正面図および側面図、第２図、第３図
は実装例に於ける側面図、第４図は従来例のチップ電子
部品としてのチップ抵抗の６′″′−７
斜視図、第５図は同じく実装例に於ける側面図である。
１・・・・・抵抗体、２ ・ベース基板、３・・・・・
低温溶解電極、４・・・・高温溶解電極。Figures 1a, b, and c are top, front, and side views of a chip electronic component according to an embodiment of the present invention, Figures 2 and 3 are side views of a mounting example, and Figure 4 is a 6''''-7 perspective view of a chip resistor as a conventional chip electronic component, and FIG. 5 is a side view of the same mounting example. 1... Resistor, 2 - Base board, 3...
Low-temperature melting electrode, 4...High-temperature melting electrode.
Claims (1)
合金材から成る接続・固着用電極を設けたチップ電子部
品。A chip electronic component equipped with connecting and fixing electrodes made of at least two or more types of metal or alloy materials with different melting temperatures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11733487A JPS63283001A (en) | 1987-05-14 | 1987-05-14 | Chip electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11733487A JPS63283001A (en) | 1987-05-14 | 1987-05-14 | Chip electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63283001A true JPS63283001A (en) | 1988-11-18 |
Family
ID=14709153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11733487A Pending JPS63283001A (en) | 1987-05-14 | 1987-05-14 | Chip electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63283001A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH057076A (en) * | 1991-06-27 | 1993-01-14 | Murata Mfg Co Ltd | Method of soldering chip type electronic part |
| US6636143B1 (en) * | 1997-07-03 | 2003-10-21 | Matsushita Electric Industrial Co., Ltd. | Resistor and method of manufacturing the same |
-
1987
- 1987-05-14 JP JP11733487A patent/JPS63283001A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH057076A (en) * | 1991-06-27 | 1993-01-14 | Murata Mfg Co Ltd | Method of soldering chip type electronic part |
| US6636143B1 (en) * | 1997-07-03 | 2003-10-21 | Matsushita Electric Industrial Co., Ltd. | Resistor and method of manufacturing the same |
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