JPS63278983A - Organometallic ink - Google Patents
Organometallic inkInfo
- Publication number
- JPS63278983A JPS63278983A JP62113164A JP11316487A JPS63278983A JP S63278983 A JPS63278983 A JP S63278983A JP 62113164 A JP62113164 A JP 62113164A JP 11316487 A JP11316487 A JP 11316487A JP S63278983 A JPS63278983 A JP S63278983A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- organic
- solvent
- ink
- carboxylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000002524 organometallic group Chemical group 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003960 organic solvent Substances 0.000 claims abstract description 14
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 claims abstract description 10
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229940088601 alpha-terpineol Drugs 0.000 claims abstract description 10
- RQZVTOHLJOBKCW-UHFFFAOYSA-M silver;7,7-dimethyloctanoate Chemical compound [Ag+].CC(C)(C)CCCCCC([O-])=O RQZVTOHLJOBKCW-UHFFFAOYSA-M 0.000 claims abstract description 10
- 239000002904 solvent Substances 0.000 claims abstract description 9
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000012990 dithiocarbamate Substances 0.000 claims abstract description 4
- 125000000217 alkyl group Chemical group 0.000 claims abstract 2
- -1 copper carboxylate Chemical class 0.000 claims abstract 2
- 150000001732 carboxylic acid derivatives Chemical group 0.000 claims description 16
- 150000003839 salts Chemical class 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 13
- 239000003112 inhibitor Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000000935 solvent evaporation Methods 0.000 claims description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 30
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 9
- 230000007261 regionalization Effects 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 150000007942 carboxylates Chemical class 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000004973 liquid crystal related substance Substances 0.000 abstract 1
- 150000002902 organometallic compounds Chemical class 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 20
- 239000007788 liquid Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910001961 silver nitrate Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910052956 cinnabar Inorganic materials 0.000 description 1
- VNZQQAVATKSIBR-UHFFFAOYSA-L copper;octanoate Chemical compound [Cu+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O VNZQQAVATKSIBR-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000171 lavandula angustifolia l. flower oil Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000010668 rosemary oil Substances 0.000 description 1
- 229940058206 rosemary oil Drugs 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
【発明の詳細な説明】
発明の目的
（産業上の利用分野）
この発明は、例えばハイブリッドＩＣの回路パターン形
成に用いられる金属有機物インクに関するものである。DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to a metal-organic ink used, for example, in forming a circuit pattern of a hybrid IC.
（従来の技術）
本願出願人はハイブリッドＩＣの回路パターンを形成す
る方法としてインクジェット方式により回路パターンを
描画する方法を提案している。(Prior Art) The applicant of the present application has proposed a method of drawing a circuit pattern using an inkjet method as a method of forming a circuit pattern of a hybrid IC.
即ち、ハイブリッドＩＣ基板に対して回路要素形成物を
含むパターン形成液を液滴吐出器から噴出させてハイブ
リッドＩＣ基板上に所望の回路パターンを描画させる方
法である。この方法によれば基板上に回路パターンが作
成されたスクリーン・マスクを重ね合わせ、回路要素形
成物を含有したインクを塗布して回路パターンを形成す
る、いわゆるスクリーン印刷法に比較して高価な回路要
素形成物を無駄にすることがなく、安価に且つ短時間で
精度の高い回路パターンを形成出来るという利点がある
。That is, this is a method for drawing a desired circuit pattern on the hybrid IC substrate by ejecting a pattern forming liquid containing a circuit element formation material from a droplet ejector onto the hybrid IC substrate. This method is more expensive than the so-called screen printing method, in which a screen mask with a circuit pattern created on the board is overlaid and an ink containing circuit elements is applied to form a circuit pattern. This method has the advantage that a highly accurate circuit pattern can be formed at low cost and in a short time without wasting element formed products.
ところが、このインクジェット方式によれば、パターン
形成液を液滴吐出器から噴出させるという構成上、パタ
ーン形成液としては粘度の低いものが必要であるが、従
来は専用のパターン形成液がなかったために、回路要素
形成物としての金属を含有したスクリーン印刷用の金属
有機物ペーストを例えばα−テルピネオール、クロロホ
ルム等の有機溶剤で希釈して粘度を調整したものが用い
られていた。However, according to this inkjet method, because the pattern forming liquid is ejected from a droplet ejector, the pattern forming liquid must have a low viscosity, but in the past, there was no dedicated pattern forming liquid. A metal-organic paste for screen printing containing a metal as a circuit element forming material was diluted with an organic solvent such as α-terpineol or chloroform to adjust the viscosity.
（発明が解決しようとする問題点）
ところが、このようにして調整されたパターン形成液は
、スクリーン印刷用の金属有機物インクの粘度が１０万
〜２０万ＣＰＳ （センチボアーズ）と極めて高いこと
と、溶剤に対する溶解度の関係も相俟ってパターン形成
液中の回路要素形成物としての金属の含有率が低下し、
シート抵抗が大きくなるという問題点があった。(Problems to be Solved by the Invention) However, the pattern forming liquid prepared in this manner has an extremely high viscosity of 100,000 to 200,000 CPS (centibore) of the metal-organic ink for screen printing. Coupled with the relationship of solubility to the solvent, the content of metal as a circuit element forming material in the pattern forming liquid decreases,
There was a problem that sheet resistance increased.
さらに、金属有機物インクを希釈するのに用いられてい
る有機溶剤がパターン形成中に次第に揮発し、パターン
形成液の粘度が高（なって液滴吐出器から均一に噴出さ
れなかったり、目詰まりを起こしたりして基板上に形成
される回路パターンの精度が低下するという問題点があ
った。Furthermore, the organic solvent used to dilute the metal-organic ink gradually evaporates during pattern formation, resulting in a high viscosity of the pattern forming liquid (which may result in the droplet not being ejected uniformly from the droplet ejector or clogging). There is a problem in that the accuracy of the circuit pattern formed on the substrate is lowered due to the occurrence of problems.
この発明は上記の問題点に着目してなされたものであっ
て、第一発明の目的は、インクジェット方式の液滴吐出
器に遺した粘度を有し、長期間安定してその粘度を保つ
ことが出来ると共に、回路要素形成物としての金属の含
有率を高めたパターン形成液を提供することにある。This invention has been made by focusing on the above-mentioned problems, and the object of the first invention is to have the same viscosity as an inkjet type droplet ejector and to maintain that viscosity stably for a long period of time. It is an object of the present invention to provide a pattern forming liquid which can be used as a circuit element forming material and has an increased metal content.
又、第二発明の目的は、前記第一発明の目的に加えて、
基板との接着強度及びはんだ濡れ性を向上させると共に
、耐はんだ浸食性を低下させたパターン形成液を提供す
ることにある。Moreover, the object of the second invention is, in addition to the object of the first invention,
It is an object of the present invention to provide a pattern forming liquid that has improved adhesive strength with a substrate and solder wettability, and has reduced solder erosion resistance.
発明の構成
（問題点を解決するための手段）
上記第一発明の目的を達成するために、この第一発明に
おいては、三級カルボン酸金属塩と、芳香族炭化水素よ
りなる三級カルボン酸金属塩に対する有機溶媒と、溶媒
揮発防止剤とを混合して金属有機物インクを形成した。Structure of the Invention (Means for Solving the Problems) In order to achieve the object of the first invention, the first invention provides a tertiary carboxylic acid metal salt and a tertiary carboxylic acid consisting of an aromatic hydrocarbon. A metal-organic ink was formed by mixing an organic solvent for the metal salt and a solvent evaporation inhibitor.
又、上記第二発明の目的を達成するために、この第二発
明においては、三級カルボン酸金属塩と、芳香族炭化水
素よりなる三級カルボン酸金属塩に対する有機溶媒と、
溶媒揮発防止剤とを混合して形成した金属有機物インク
に前記三級カルボン酸金属塩と異なる金属有機物を添加
した。In addition, in order to achieve the object of the second invention, in this second invention, a tertiary carboxylic acid metal salt, an organic solvent for the tertiary carboxylic acid metal salt consisting of an aromatic hydrocarbon,
A metal organic substance different from the tertiary carboxylic acid metal salt was added to a metal organic ink formed by mixing with a solvent volatilization inhibitor.
（作用）
従って、第一発明の金属有機物インクにおいては三級カ
ルボン酸を用いたことにより金属含有率が高く、芳香族
炭化水素よりなる有機溶媒により所望の粘度に調整する
ことが出来ると共に、溶媒揮発防止剤によりその有機溶
媒の揮発が防止され長期間安定してその粘度を保つこと
が出来る。(Function) Therefore, in the metal-organic ink of the first invention, the metal content is high due to the use of the tertiary carboxylic acid, and the viscosity can be adjusted to a desired level with the organic solvent made of aromatic hydrocarbon. The volatilization inhibitor prevents the organic solvent from volatilizing and can maintain its viscosity stably for a long period of time.
又、第二発明の金属有機物インクにおいては、前記第一
発明の作用効果に加えて、添加した金属有機物により基
板との接着強度及びはんだ濡れ性が向上されると共に、
耐はんだ浸食性が低下される。Furthermore, in the metal-organic ink of the second invention, in addition to the effects of the first invention, the added metal-organic substance improves the adhesive strength and solder wettability with the substrate, and
Solder erosion resistance is reduced.
（実施例１） 以下、この発明を具体化した第一の実施例を説明する。(Example 1) A first embodiment embodying this invention will be described below.
この実施例においては、三級カルボン酸金属塩としてネ
オデカン酸銀、有機溶媒としてトルエン、溶媒揮発防止
剤としてα−テルピネオールが用いられて金属有機物イ
ンクが生成されている。In this example, a metal-organic ink is produced using silver neodecanoate as a tertiary carboxylic acid metal salt, toluene as an organic solvent, and α-terpineol as a solvent evaporation inhibitor.
まず初めに三級カルボン酸金属塩としてのネオデカン酸
銀の合成方法について説明する。First, a method for synthesizing silver neodecanoate as a tertiary carboxylic acid metal salt will be explained.
下式で表されるように、三級カルボン酸であるネオデカ
ン酸に水酸化ナトリウム水溶液を攪拌しながら少量ずつ
添加し、その液中に硝酸銀の水溶液を加えて攪拌するこ
とによりネオデカン酸銀が沈澱物として生成される。As shown in the formula below, an aqueous solution of sodium hydroxide is added little by little to neodecanoic acid, which is a tertiary carboxylic acid, while stirring, and silver nitrate is precipitated by adding an aqueous solution of silver nitrate to the solution and stirring. It is produced as a thing.
Ｈ３
■
Ｃａ Ｈｌａ−Ｃ−ＣＯＯＨ＋ＮａＯＨＨ３
Ｈ３
一−−Ｃ６Ｈｌａ−ＣＣＯＯＮａ ＋Ｈ２０Ｈ３
↓ヅ丁布ｂ
Ｈ３
■
Ｃ６Ｈｌａ−Ｃ−ＣＯＯＮａ＋ＡｇＮＯ３Ｈ３
そして、このようにして生成されたネオデカン酸銀の沈
澱は吸引濾過してエタノールで洗浄した後、真空デシケ
ータ中で十分乾燥させる。尚、この乾燥が不十分である
場合にはネオデカン酸銀を一旦少量のトルエンに熔かし
て水分を分離し、水分を除去した後トルエンを真空系で
除去する。H3 ■ Ca Hla-C-COOH+NaOHH3 H3 --C6Hla-CCOONa +H20H3 ↓ㅅchobu b H3 ■ C6Hla-C-COONa+AgNO3H3 Then, the silver neodecanoate precipitate thus generated was filtered with suction and washed with ethanol. After that, thoroughly dry it in a vacuum desiccator. If this drying is insufficient, the silver neodecanoate is once dissolved in a small amount of toluene to separate the moisture, and after the moisture is removed, the toluene is removed in a vacuum system.
このようにして得られたネオデカン酸銀の銀の含有率は
３８．７重量％である。The silver content of the silver neodecanoate thus obtained is 38.7% by weight.
そして、このようにして得られたネオデカン酸銀と、ト
ルエンと、α−テルピネオールとを次に示すような重量
％で三者が１００重量％になるように混合させる。Then, the silver neodecanoate thus obtained, toluene, and α-terpineol are mixed in the following weight percentages so that the three are 100 weight percent.
ネオデカン酸銀 ・・・４Ｑｗｔ％
トルエン ・・・２５〜３５ｗｔ％α−テルピ
ネオール・・・３５〜２５ｗｔ％このようにして得られ
た金属有機物インクは回路要素形成物としての銀の含有
率が極めて高いばかりでなく、粘度が約２３ＣＰＳ （
センチボアーズ）と極めて低く、インクジェット方式の
パターン形成液として最適の粘度を示した。尚、例えば
トルエンとα−テルピネオールとの混合比を前述した重
量％の範囲内においてトルエンを増加させてα−チルビ
オネールを減少させることにより金属有機物インクの粘
度を低くすることが出来、両者の混合比を変更すること
により生成される金属有機物インクを所望の粘度に調整
することが可能である。Silver neodecanoate: 4Qwt% Toluene: 25-35wt% α-terpineol: 35-25wt% The metal-organic ink thus obtained has an extremely high content of silver as a circuit element forming material. Not only that, but the viscosity is about 23CPS (
It has an extremely low viscosity (centibore), which is optimal for an inkjet pattern forming liquid. For example, the viscosity of the metal-organic ink can be lowered by increasing toluene and decreasing α-terpineol while keeping the mixing ratio of toluene and α-terpineol within the above-mentioned weight percent range. It is possible to adjust the produced metal-organic ink to a desired viscosity by changing the viscosity.
又、溶媒揮発防止剤として低蒸気圧のα−テルピネオー
ルを添加したことにより、溶媒としてのトルエンの揮発
が防止され、長期間に渡って一定の粘度を保つことが出
来るだけではなく、光の照射によって変質し易いネオデ
カン酸銀の変質を防止することが出来る。In addition, by adding α-terpineol, which has a low vapor pressure, as a solvent volatilization inhibitor, the volatilization of toluene as a solvent is prevented, and it is not only possible to maintain a constant viscosity over a long period of time, but also to prevent light irradiation. It is possible to prevent deterioration of silver neodecanoate, which is prone to deterioration.
（実施例２） 以下、この発明を具体化した第二の実施例を説明する。(Example 2) A second embodiment embodying this invention will be described below.
この実施例の金属有機物インクは前記第一実施例の金属
有機物インクにパラジウムの金属有機物であるジチオカ
ルバミン酸パラジウムを金属有機物インク１００に対し
て数％混入して形成されている。The metal-organic ink of this embodiment is formed by mixing palladium dithiocarbamate, which is a metal-organic substance of palladium, in the metal-organic ink of the first embodiment in an amount of several percent based on 100 parts of the metal-organic ink.
このようにして得られた金属有機物インクは前述した第
一実施例の効果に加えて、この金属有機物インクを液滴
吐出器から基板上に噴出させて回路パターンを描画し、
溶媒等を除去するために焼成した後の回路要素形成物と
しての銀の耐はんだ浸食性を向上させることが出来た。In addition to the effects of the first embodiment described above, the metal-organic ink thus obtained has the advantage that a circuit pattern can be drawn by ejecting the metal-organic ink onto a substrate from a droplet ejector.
It was possible to improve the solder corrosion resistance of silver as a circuit element formed product after baking to remove solvent and the like.
又、添加する金属を機物としてジチオカルバミン酸パラ
ジウムに代えて、銅の金属有機物であるオクタン酸銅を
数％添加することにより焼成後の回路要素形成物として
の銀と基板との接着強度を高めるという結果が得られた
。In addition, instead of palladium dithiocarbamate as the metal to be added, a few percent of copper octoate, which is a metal organic substance of copper, is added to increase the adhesive strength between silver as a circuit element formed product and the substrate after firing. The result was obtained.
なお、この発明は前記両実施例に床室されるものではな
く、例えば、次のように具体化することも可能である。It should be noted that the present invention is not limited to the above-mentioned embodiments, and can be embodied as follows, for example.
（１）前記実施例において銀基外の金属例えば銅の三級
カルボン酸金属塩を用いること。(1) In the above embodiments, a metal other than silver, such as a tertiary carboxylic acid metal salt of copper, is used.
（２）前記実施例においてトルエンに代えてベンゼン、
キシレン、スチレン等その他の芳香族炭化水素よりなる
有機溶媒を用いること。(2) Benzene instead of toluene in the above examples;
Use organic solvents made of other aromatic hydrocarbons such as xylene and styrene.
（３）前記実施例においてα−テルピネオールに代えて
ラベンダー油、ローズマリー油、珪皮油、サツサフラス
油等、その他の溶媒揮発防止剤を用いること。(3) In the above examples, other solvent evaporation inhibitors such as lavender oil, rosemary oil, cinnabar oil, and satsafras oil may be used in place of α-terpineol.
（４）前記実施例においてパラジウムの金属有機物、銅
の金属有機物に代えてビスマスの金属有機物を添加する
こと。(4) Adding a metal organic substance of bismuth in place of the metal organic substance of palladium and the metal organic substance of copper in the above embodiments.
（５）前記実施例の金属有機物インクの粘度を關整し、
スクリーン印刷用のインクとして用いること。(5) Adjusting the viscosity of the metal organic ink of the above example,
Use as ink for screen printing.
発明の効果
以上詳述したように、この第一発明によれば、インクジ
ェット方式の液滴吐出器に通した粘度を有し、長期間安
定してその粘度が保たれるパターン形成液を生成するこ
とが出来て精度の高い回路パターンを作成することが出
来ると共に、回路要素形成物としての金属の含有率を高
くすることが出来、スクリーン印刷用の金属有機物ペー
ストを希釈して粘度を開整していた従来のインクに比較
してシート抵抗を小さくすることが出来るという優れた
効果を有する。Effects of the Invention As detailed above, according to the first invention, a pattern forming liquid that has a viscosity that can be passed through an inkjet type droplet discharger and maintains that viscosity stably for a long period of time is generated. In addition to making it possible to create highly accurate circuit patterns, it is also possible to increase the metal content in the circuit element forming material, and to adjust the viscosity by diluting the metal-organic paste for screen printing. It has the excellent effect of reducing sheet resistance compared to conventional inks.
又、第二発明によれば、前記第一発明の効果に加えて、
回路要素形成物としての金属の基板との接着強度及びは
んだ濡れ性を向上させると共に、耐はんだ浸食性を低下
させたパターン形成液を生成することが出来るという優
れた効果を有する。Also, according to the second invention, in addition to the effects of the first invention,
It has the excellent effect of improving the adhesive strength and solder wettability with a metal substrate as a circuit element forming product, and also being able to generate a pattern forming liquid with reduced solder erosion resistance.
Claims (1)
化水素よりなる三級カルボン酸金属塩に対する有機溶媒
と、溶媒揮発防止剤とを混合したことを特徴とする金属
有機物インク。 ▲数式、化学式、表等があります▼ 但しＲ＿１〜Ｒ＿３：アルキル基 Ｍ＿１：金属原子 ２、前記三級カルボン酸金属塩はネオデカン酸銀である
特許請求の範囲第１項に記載の金属有機物インク。 ３、前記溶媒揮発防止剤はα−テルピネオールである特
許請求の範囲第１項又は第２項に記載の金属有機物イン
ク。 ４、三級カルボン酸金属塩と、芳香族炭化水素よりなる
三級カルボン酸金属塩に対する有機溶媒と、溶媒揮発防
止剤とを混合して形成した金属有機物インクに前記三級
カルボン酸金属塩と異なる金属有機物を添加したことを
特徴とする金属有機物インク。 ５、前記金属有機物は有機溶剤に溶けるパラジウムの金
属有機物（例えばジチオカルバミン酸パラジウム）であ
る特許請求の範囲第４項に記載の金属有機物インク。 ６、前記金属有機物は有機溶剤に溶ける銅の金属有機物
（例えばカルボン酸銅）である特許請求の範囲第４項に
記載の金属有機物インク。[Claims] 1. A tertiary carboxylic acid metal salt represented by the following formula, an organic solvent for the tertiary carboxylic acid metal salt made of an aromatic hydrocarbon, and a solvent evaporation inhibitor are mixed. metal-organic ink. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ However, R_1 to R_3: Alkyl group M_1: Metal atom 2, and the metal organic ink according to claim 1, wherein the tertiary carboxylic acid metal salt is silver neodecanoate. 3. The metal organic ink according to claim 1 or 2, wherein the solvent volatilization inhibitor is α-terpineol. 4. Adding the tertiary carboxylic acid metal salt to a metal organic ink formed by mixing a tertiary carboxylic acid metal salt, an organic solvent for the tertiary carboxylic acid metal salt consisting of an aromatic hydrocarbon, and a solvent volatilization inhibitor. A metal-organic ink characterized by adding different metal-organic substances. 5. The metal-organic ink according to claim 4, wherein the metal-organic substance is a palladium metal-organic substance (for example, palladium dithiocarbamate) that is soluble in an organic solvent. 6. The metal-organic ink according to claim 4, wherein the metal-organic substance is a copper metal-organic substance (for example, copper carboxylate) that is soluble in an organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62113164A JPS63278983A (en) | 1987-05-09 | 1987-05-09 | Organometallic ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62113164A JPS63278983A (en) | 1987-05-09 | 1987-05-09 | Organometallic ink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63278983A true JPS63278983A (en) | 1988-11-16 |
Family
ID=14605172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62113164A Pending JPS63278983A (en) | 1987-05-09 | 1987-05-09 | Organometallic ink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63278983A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003038838A1 (en) * | 2001-10-31 | 2003-05-08 | Fujikura Kasei Co., Ltd. | Ag COMPOUND PASTE |
| WO2003032084A3 (en) * | 2001-10-05 | 2003-08-21 | Superior Micropowders Llc | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| US7141185B2 (en) | 2003-01-29 | 2006-11-28 | Parelec, Inc. | High conductivity inks with low minimum curing temperatures |
| JP2006342378A (en) * | 2005-06-07 | 2006-12-21 | Ne Chemcat Corp | METHOD FOR PRODUCING Pd COLLOIDAL SOLUTION |
| WO2007029902A1 (en) * | 2005-09-07 | 2007-03-15 | Exax Inc. | Silver organo-sol ink for forming electrically conductive patterns |
| US7211205B2 (en) * | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
| WO2007094567A1 (en) * | 2006-02-13 | 2007-08-23 | Exax Inc. | Silver organo-sol ink for forming electrically conductive patterns |
| WO2019111795A1 (en) * | 2017-12-07 | 2019-06-13 | 株式会社ダイセル | Inkjet printing ink |
| JP2019102376A (en) * | 2017-12-07 | 2019-06-24 | 株式会社ダイセル | Ink for inkjet printing |
| JP2019099756A (en) * | 2017-12-07 | 2019-06-24 | 株式会社ダイセル | Ink for inkjet printing |
| US10883011B2 (en) | 2014-06-19 | 2021-01-05 | Groupe Graham International Inc. | Molecular inks |
| US11472980B2 (en) | 2017-02-08 | 2022-10-18 | National Research Council Of Canada | Molecular ink with improved thermal stability |
| US11746246B2 (en) | 2017-02-08 | 2023-09-05 | National Research Council Of Canada | Silver molecular ink with low viscosity and low processing temperature |
| US11873409B2 (en) | 2017-02-08 | 2024-01-16 | National Research Council Of Canada | Printable molecular ink |
-
1987
- 1987-05-09 JP JP62113164A patent/JPS63278983A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003032084A3 (en) * | 2001-10-05 | 2003-08-21 | Superior Micropowders Llc | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| US6942825B2 (en) | 2001-10-31 | 2005-09-13 | Fujikura Kasei Co., Ltd. | Silver compound paste |
| WO2003038838A1 (en) * | 2001-10-31 | 2003-05-08 | Fujikura Kasei Co., Ltd. | Ag COMPOUND PASTE |
| US7211205B2 (en) * | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
| US7141185B2 (en) | 2003-01-29 | 2006-11-28 | Parelec, Inc. | High conductivity inks with low minimum curing temperatures |
| JP4593374B2 (en) * | 2005-06-07 | 2010-12-08 | エヌ・イーケムキャット株式会社 | Method for producing Pd colloidal solution |
| JP2006342378A (en) * | 2005-06-07 | 2006-12-21 | Ne Chemcat Corp | METHOD FOR PRODUCING Pd COLLOIDAL SOLUTION |
| WO2007029902A1 (en) * | 2005-09-07 | 2007-03-15 | Exax Inc. | Silver organo-sol ink for forming electrically conductive patterns |
| US7976737B2 (en) | 2005-09-07 | 2011-07-12 | Exax Inc. | Silver organo-sol ink for forming electronically conductive patterns |
| WO2007094567A1 (en) * | 2006-02-13 | 2007-08-23 | Exax Inc. | Silver organo-sol ink for forming electrically conductive patterns |
| US10883011B2 (en) | 2014-06-19 | 2021-01-05 | Groupe Graham International Inc. | Molecular inks |
| US11525066B2 (en) | 2014-06-19 | 2022-12-13 | National Research Council Of Canada | Molecular inks |
| US11472980B2 (en) | 2017-02-08 | 2022-10-18 | National Research Council Of Canada | Molecular ink with improved thermal stability |
| US11746246B2 (en) | 2017-02-08 | 2023-09-05 | National Research Council Of Canada | Silver molecular ink with low viscosity and low processing temperature |
| US11873409B2 (en) | 2017-02-08 | 2024-01-16 | National Research Council Of Canada | Printable molecular ink |
| WO2019111795A1 (en) * | 2017-12-07 | 2019-06-13 | 株式会社ダイセル | Inkjet printing ink |
| JP2019102376A (en) * | 2017-12-07 | 2019-06-24 | 株式会社ダイセル | Ink for inkjet printing |
| JP2019099756A (en) * | 2017-12-07 | 2019-06-24 | 株式会社ダイセル | Ink for inkjet printing |
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