JPS63273391A - Coupling device for printed circuit board - Google Patents
Coupling device for printed circuit boardInfo
- Publication number
- JPS63273391A JPS63273391A JP10931587A JP10931587A JPS63273391A JP S63273391 A JPS63273391 A JP S63273391A JP 10931587 A JP10931587 A JP 10931587A JP 10931587 A JP10931587 A JP 10931587A JP S63273391 A JPS63273391 A JP S63273391A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- substrate
- conductor pattern
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 title abstract description 8
- 238000010168 coupling process Methods 0.000 title abstract description 8
- 238000005859 coupling reaction Methods 0.000 title abstract description 8
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000005476 soldering Methods 0.000 claims abstract description 5
- 230000000630 rising effect Effects 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、印刷配線板と別の印刷配線板との結合固定
及び電気的接続装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a device for coupling and fixing a printed wiring board to another printed wiring board and for electrically connecting the same.
第５図は従来の印刷配線板と別の印刷配線板との接続方
法を示す斜視図であり、第６図は印刷配線板同士が接続
された状態を示す結合部の断面図である。第５図、第６
図において、１は樹脂材料などからなる平板状の印刷配
線板、２はこの印刷配線板１上において平行に両端面近
くまで延設された導体パターン、３はこの導体パターン
２に対応し印刷配線板１の両端面にほぼ１列状に設けら
れたＬ字状の端子、４は導体パターン２と端子３とを接
続する半田である。FIG. 5 is a perspective view showing a method of connecting a conventional printed wiring board to another printed wiring board, and FIG. 6 is a sectional view of a connecting portion showing a state in which printed wiring boards are connected to each other. Figures 5 and 6
In the figure, 1 is a flat printed wiring board made of resin material, etc., 2 is a conductor pattern extending in parallel to near both end faces on this printed wiring board 1, and 3 is a printed wiring board corresponding to this conductor pattern 2. L-shaped terminals 4 are provided in a row on both end faces of the plate 1, and solder 4 connects the conductor pattern 2 and the terminals 3.
一方、５は樹脂材料などからなる平板状の他の印刷配線
板、６は上記端子３に対応して２列に印刷配線板５に穿
設された穴、７は印刷配線板５上において穴６に各々延
設された導体パターン、８は電気素子、９は半田である
。そして第６図のように端子３が穴６に挿入されてのち
、端子３と導体パターン７が半田９により接続されろこ
とにより、印刷配線板１と５が結合固定されると同時に
電気的に接続される。On the other hand, numeral 5 denotes another flat printed wiring board made of a resin material, etc., 6 holes are drilled in two rows in the printed wiring board 5 corresponding to the terminals 3, and 7 holes are formed on the printed wiring board 5. 6 are extended conductor patterns, 8 is an electric element, and 9 is solder. After the terminal 3 is inserted into the hole 6 as shown in FIG. 6, the terminal 3 and the conductor pattern 7 are connected with the solder 9, so that the printed wiring boards 1 and 5 are connected and fixed and electrically connected. Connected.
このような従来の方法で（よ、端子３の材料費と加工費
や、端子３と印刷配線板１上の導体パターン２との半田
付作業が必要で、部品点数及び工数が増えろという問題
点があった。With this conventional method, there are problems such as the material cost and processing cost of the terminal 3, and the need for soldering work between the terminal 3 and the conductor pattern 2 on the printed wiring board 1, which increases the number of parts and man-hours. There was a point.
この発明は上記のような問題点を解消するためになされ
たもので、部品点数及び工数を低減し、安価な印刷配線
板間の結合装置を提供することを目的とする。This invention was made to solve the above-mentioned problems, and aims to reduce the number of parts and man-hours and provide an inexpensive coupling device between printed wiring boards.
この考案に係る印刷配線板間の結合装置は、一方の印刷
配線板の基板材料を金属ベース基板とし、これを一体曲
げ加工して複数の立上り部を形成し、導体パターンを曲
げた基板の端部付近まで延設し、他方の印刷配線板に穴
を設けてこの穴に上記立上り端部を挿入結合するように
したものである。The coupling device between printed wiring boards according to this invention uses a metal base substrate as the substrate material of one printed wiring board, integrally bends this to form a plurality of rising parts, and bends the conductor pattern at the edge of the board. A hole is provided in the other printed wiring board, and the rising end portion is inserted into the hole and connected.
〔作用〕
この考案では、金属ベース基板でなる一方の印刷配線板
の複数の立上り部を、他方の印刷配線板に設けた対応す
る穴に各々嵌め込んで確固に結合してのち、両方の延設
された導体パターンを半田付けすることにより電気的に
接続するものであり、信頼性の高い結合及び接続が得ら
れる。[Operation] In this invention, the plurality of rising portions of one printed wiring board made of a metal base board are fitted into corresponding holes in the other printed wiring board to firmly connect them, and then both extensions are connected firmly. Electrical connections are made by soldering the provided conductor patterns, and highly reliable connections and connections can be obtained.
以下乙の発明の一実施例を図について説明する。 An embodiment of the invention of B will be described below with reference to the drawings.
第１図、第２図は上記第５図、第６図に対応する図であ
り、第１図、第２図において、１は金属ベース基板材料
からなる断面口状の印刷配線板であり、１０はこの印刷
配線板の平面部、１１はその両側の立上り部、１２はこ
の立上り部１１の端面の両端に設けた切欠ストッパ、２
は上記立上り部１１の端面付近まで延設された導体パタ
ーンである。一方５はｔＭｉ材料などからなる平板状の
印刷配線板であり、１３は上記立上り部１１に対応して
印刷配線板５の２ＷＩ所に設けられた穴、７は上記導体
パターン２に対応して穴１３の端部まで延設された導体
パターンである。そして第２図のように立上り部１１は
穴１３に挿入され、導体パターン２と７が半田９により
接続されろ。1 and 2 are diagrams corresponding to the above-mentioned FIGS. 5 and 6, and in FIGS. 1 and 2, 1 is a printed wiring board with a cross-sectional opening made of a metal base substrate material, 10 is a flat surface of this printed wiring board, 11 is a rising portion on both sides thereof, 12 is a notch stopper provided at both ends of the end face of this rising portion 11, and 2
is a conductor pattern extending to near the end face of the rising portion 11. On the other hand, 5 is a flat printed wiring board made of tMi material, etc., 13 is a hole provided at 2WI of the printed wiring board 5 corresponding to the above-mentioned rising portion 11, and 7 is a hole corresponding to the above-mentioned conductor pattern 2. This is a conductor pattern extending to the end of the hole 13. Then, as shown in FIG. 2, the rising portion 11 is inserted into the hole 13, and the conductor patterns 2 and 7 are connected by solder 9.
思上のような構成となっているので、印刷配線板１と５
は機械的強度の面で十分な結合固定がなされると共に電
気的に接続される。ここで、もし印刷配線板１の基板材
料が金属ベース基板ではなくフレキシブル基板ならば、
容易に口状に曲げることができるが、柔かいため機械的
強度の面で不十分であり、またこの印刷配線板１０基板
材料がガラスエポキシや紙フェノールのような固い樹脂
基板であるとロー１状に曲げることができない。このよ
うに印刷配線板１の基板材料が金属ベース基板であると
いうことは、本発明における必要な条件である。Since it has an imaginary configuration, printed wiring boards 1 and 5
are sufficiently bonded and fixed in terms of mechanical strength and electrically connected. Here, if the substrate material of the printed wiring board 1 is a flexible substrate instead of a metal base substrate,
Although it can be easily bent into a shape, it is soft and has insufficient mechanical strength, and if the substrate material of the printed wiring board 10 is a hard resin substrate such as glass epoxy or paper phenol, it will not be able to bend into a shape. cannot be bent. As described above, it is a necessary condition for the present invention that the substrate material of the printed wiring board 1 is a metal base substrate.
なお上記実施例では、印刷配線板５の上面に導体パター
ン７を設け、これと他方の導体パターン２とを半田付け
しているが、第３図の断面図に示すように印刷配線板５
の下面に導体パターン７を設けてこれと導体パターン２
とを半田付けするようにしてもよい。又、第４図に示す
ように、立上り部１１及びこれに対応する穴１３を２か
所以上（図では４か所）の多数箇所としてもよい。In the above embodiment, the conductive pattern 7 is provided on the upper surface of the printed wiring board 5, and this and the other conductive pattern 2 are soldered, but as shown in the cross-sectional view of FIG.
A conductor pattern 7 is provided on the lower surface of the conductor pattern 2.
They may also be soldered together. Further, as shown in FIG. 4, the rising portions 11 and the corresponding holes 13 may be provided at two or more locations (four locations in the figure).
以上のようにこの発明によれば、一方の印刷配線板の基
板材料を金属ベース基板とするとともにこれに立上り部
を設け、この立上り部を他方の印刷配線板に設けた穴に
押入結合するようにしたので、部品点数や工数も増える
ことなく、簡素で、より確実な印刷配線板間の結合固定
及び電気的接続が得られる効果がある。As described above, according to the present invention, the substrate material of one printed wiring board is a metal base substrate, a rising part is provided thereon, and this rising part is pressed into a hole provided in the other printed wiring board. Therefore, there is an effect that simple and more reliable coupling and fixing and electrical connection between printed wiring boards can be obtained without increasing the number of parts or the number of man-hours.
第１図はこの発明の一実施例による印刷配線板間の結合
装置を示す斜視図、第２図はその結合部の断面図、第３
図、第４図はこの発明の他の実施例を示す断面図と斜視
図、第５図は従来の印刷配線板間の結合方法を示す斜視
図、第６図はその結合部の断面図である。
図中、１．５は印刷配線板、２．７は導体パターン、１
１は立上り部、１２は切欠ストッパ、１３は穴である。
尚、図中同一符号は同−又は相当部分を示す。FIG. 1 is a perspective view showing a coupling device between printed wiring boards according to an embodiment of the present invention, FIG. 2 is a sectional view of the coupling portion, and FIG.
4 are a sectional view and a perspective view showing another embodiment of the present invention, FIG. 5 is a perspective view showing a conventional method of connecting printed wiring boards, and FIG. 6 is a sectional view of the connecting part. be. In the figure, 1.5 is a printed wiring board, 2.7 is a conductor pattern, 1
1 is a rising portion, 12 is a notch stopper, and 13 is a hole. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (2)
有し、該立上り部の面まで延設した導体パターンを備え
た金属ベース基板材料からなる印刷配線板と、上記立上
り部に対応した穴を備え、かつ上記立上り部の面にある
導体パターンに対応して上記穴付近まで延設した導体パ
ターンを備えた印刷配線板との組合せからなり、上記一
方の印刷配線板の立上り部を他方の印刷配線板の穴に嵌
挿し、両者の導体パターンを半田付してなる印刷配線板
の結合装置。(1) A printed wiring board made of a metal-based substrate material, which has a plurality of rising portions that are integrally bent into a substantially L-shape, and is provided with a conductor pattern that extends to the surface of the rising portion, and the rising portions. and a printed wiring board with a conductor pattern extending to the vicinity of the hole in correspondence with the conductor pattern on the surface of the rising part, and the rising part of one of the printed wiring boards A device for connecting printed wiring boards by inserting one part into a hole in the other printed wiring board and soldering the conductive patterns on both boards.
範囲第１項記載の印刷配線板の結合装置。(2) The printed wiring board joining device according to claim 1, wherein a notch stopper is provided in the rising portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10931587A JPS63273391A (en) | 1987-04-30 | 1987-04-30 | Coupling device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10931587A JPS63273391A (en) | 1987-04-30 | 1987-04-30 | Coupling device for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63273391A true JPS63273391A (en) | 1988-11-10 |
Family
ID=14507095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10931587A Pending JPS63273391A (en) | 1987-04-30 | 1987-04-30 | Coupling device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63273391A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4140010A1 (en) * | 1990-12-04 | 1992-06-11 | Mitsubishi Electric Corp | CIRCUIT BOARD AND METHOD FOR THEIR PRODUCTION |
-
1987
- 1987-04-30 JP JP10931587A patent/JPS63273391A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4140010A1 (en) * | 1990-12-04 | 1992-06-11 | Mitsubishi Electric Corp | CIRCUIT BOARD AND METHOD FOR THEIR PRODUCTION |
| US5290971A (en) * | 1990-12-04 | 1994-03-01 | Mitsubishi Denki Kabushiki Kaisha | Printed circuit board provided with a higher density of terminals for hybrid integrated circuit and method of fabricating the same |
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