JPS63267155A - Polishing device - Google Patents

Abstract

PURPOSE:To finish a face to be polished to a prescribed shape and accuracy in a polishing device for a wafer, etc., by colliding fine particles against the face to be polished by the movement of a belt which is rotated while crossing at a right angle to the face being polishing in a polishing liquid. CONSTITUTION:A polishing device is filled with a polishing liquid 13, in which pulleys 8a, 8b, 8c which are connected by a belt 10 of polyurethane, etc. are immersed to cause the flowing movement of the liquid. Then, the form and set position of the pulley 8a is adjusted so as to obtain the desired shape of the face to be polished of a polished object 2. And, the belt 10 is moved on the pulley 8 causing the polishing liquid 13 to flow, and a rotary shaft 5 on which the polished object 2 is mounted is rotated at a very low speed by a motor 4. Thus, the fine particles in the polishing liquid 13 are continuously brought into contact with the whole area of the face to be polished of the polished object 2, to polish and finish the polished object 2 into a desired shape. In this case, as an up-down mechanism 6 installed on the rotary shaft 5 is adjusted by means of an up-down knob 7, the contact of the fine particles with the polished object 2 can be adjusted.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a polishing apparatus, and more particularly to a polishing apparatus suitable for precision polishing semiconductor components such as wafers and optical components such as laser mirrors and emitted light reflecting mirrors. .

[Conventional technology]

The present invention uses a polishing liquid and mainly consists of one or more pulleys connected by a belt and a rotary shaft that can move up and down or forward and backward to which a holder to which the object to be polished can be attached and detached is connected. Regarding conventional belt polishing machines (Japanese Patent Application Laid-open No. 4
7-22591) A device having a configuration as shown in FIG. 13 is known, and this method uses pulleys 8a and 8b connected for driving.
, 8c, the polishing belt 10 is rotated by the object 2 to be polished.
It was used for polishing specimens of metal materials etc. by contact friction with the polishing surface 40 of.

In the polishing of semiconductor wafers,
64) As shown in Fig. 8, polishing has been carried out by using a polishing liquid 13 in which an abrasive is suspended and in solid contact with a porous polyurethane polishing table 16, but in this method, abrasive particles are not deposited on the surface to be polished. There is a risk of forming a damaged layer due to scratches or friction with the polishing table. In addition, several methods have been proposed for polishing using a polishing liquid without any contact between the workpiece and the tool; for example, E E M (Elas
ticEmission Machining) (
Precision Machinery, 46-6), uses a continuously variable speed motor 20 to rotate a polyurethane ball 21 to bring the polishing liquid 13 into fluid contact with the object 2 to be polished, as shown in FIG.
The amount of machining at an arbitrary position is controlled by the feed rate or stop time of the table 22. but.

This method involves polishing at each point.

A device is required that can control the amount of processing at any point and scan the area of the polished surface with high precision. An example of this type of device is shown in FIG. 12 (Utility Model Publication No. 59-24448). In addition, a non-solid contact polishing method (precision machinery), which is a technology using EEM, is also available.

49-5), as shown in FIG. 9, a disk tool 17 having a radially inclined surface formed on the upper surface is rotated in a polishing liquid 13, and the polishing liquid 13 flows along the upper surface of the radial grooves. ,
The object 2 to be polished is floated, and the abrasive material in the polishing liquid collides with the lower surface of the object 2 to perform polishing. In the method called float polishing (optics, 13-6), the first
As shown in Figure 0, by rotating the tin wrap 18 with grooves cut and the object 2 to be polished at high speed, the polishing liquid 13 between them floats up, and the abrasive material contained in the polishing liquid 13 causes the object 2 to be polished. 0 and above, where the polishing of object 2 progresses, mainly introduces conventional techniques related to precision polishing techniques for flat surfaces.

On the other hand, as a conventional method for polishing curved surfaces of lenses, mirrors, etc., there is a method shown in Figs.
The structure of the object to be polished and the polishing machine shown in ) is well known, and polishing surfaces 38a and 38b having the same curvature as the curved surface to be obtained by polishing are prepared in advance, and the surfaces of the objects to be polished 2a and 2b are pressed and rotated. However, due to the unevenness of the polishing pressure and the amount of abrasive grains, the abrasive material differs for each part of the curved surface, making it difficult to perform high-precision polishing. Furthermore, Figures 16 and 17 (Unexamined Japanese Patent Publication No. 61-826
In method 9), a tool shaft to which a tool 47 with a spherical tip is attached is rotated at high speed with respect to the workpiece 2 whose shape is known in advance, and the workpiece is rotated at an angular position determined by the workpiece inclination angle detection device 45. It is possible to carry out a removal process at a different angular position, and then proceed to a removal process at another angular position in succession by means of the rotary oscillation function. However, in this method, the workpiece and the tool come into contact. When EEM is used for curved surface polishing, it is necessary to perform pre-processing in advance, measure the shape of the pre-process, control the amount of processing at any point, and scan the polished surface metal area with high precision. . As described above, in float polymerizing and non-solid contact polishing methods, it is difficult to polish curved surfaces due to limitations in the configuration of the equipment.

[Problem that the invention seeks to solve]

As described above, various polishing devices have been proposed, but in polishing where the workpiece and the tool come into contact, the occurrence of a damaged layer due to scratching of abrasive grains, polishing friction, etc. is unavoidable. On the other hand, in the method of polishing by flowing contact of the polishing liquid without any contact between the workpiece and the tool, it is possible to obtain a mirror surface without defects, but when applied to polishing a single curved surface, it is difficult to install a shape measuring device. In order to improve the accuracy of polished objects or tools, a device that can move them three-dimensionally is required.

An object of the present invention is to polish an object to be polished in a non-contact or quasi-contact state, that is, in a state where the object to be polished and the polishing tool are in partial contact with each other, by flowing a polishing liquid between the two, and to provide a shape measuring device. The present invention provides an apparatus that performs surface polishing without using a complicated moving mechanism or the like.

[Means for solving problems]

The above-mentioned problems are as follows: The workpiece holder holds the polished surface of the workpiece immersed in the polishing liquid and has a rotating shaft that is substantially orthogonal to the polished surface; and a drive that rotates the rotating shaft. A polishing device and/or comprising: a belt that moves while maintaining a predetermined distance from the surface to be polished; and a movement drive device for the belt.

a polishing object holder that holds a polished surface of the polished object in a state immersed in a polishing liquid and has a rotating shaft substantially perpendicular to the polished surface; a drive device that rotates the rotating shaft; The problem is solved by a polishing device comprising: a belt that moves while maintaining a predetermined distance from the surface to be polished; an adjustment device that adjusts the predetermined relative position; and a movement drive device for the belt.

[Effect]

The surface to be polished is rotated in the polishing liquid by a rotating shaft that is substantially orthogonal thereto, so that fine powder particles in the polishing liquid collide with the surface to be polished, and a belt provided under the surface to be polished is rotated. By moving.

The movement of the belt causes the fine particles in the accompanying flowing polishing liquid to collide, and the rotational speed of the rotating shaft, the distance between the belt and the surface to be polished, and the moving speed of the belt cause the fine particles to collide with the polishing liquid. The surface to be polished is polished to a predetermined shape and accuracy by adjusting the speed of collision with the surface, the angle of collision, the position where the fine powder particles collide with the surface to be polished with high frequency, etc.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. 1 and 2. The polishing apparatus A shown in FIG. 1 has a container 1 in which a suitable liquid such as water is placed, and the dispersibility and concentration of the liquid is determined.

A polishing liquid 13 in which fine particles selected in consideration of particle size, shape, affinity with the object 2 to be polished, etc. are suspended is filled, and in order to cause fluid movement in the polishing liquid 13, a first As shown in the figure, pulleys 8a, 8b, 8c tied together with a belt 10 made of polyurethane or the like are immersed in the solution, and the pulley 8a facing the object 2 is spun to match the surface to be polished that is to be obtained by polishing. The roller 8c can be adjusted to a conical or cylindrical shape, and the roller 8c is connected to a drive source 11 outside the container. It consists of something that can be attached and detached.

The shape and installation position of the opposing pulley 8a are adjusted so that the polishing surface of the object to be polished 2 has the desired shape, and the belt 10 moves on the pulley 8 to flow the polishing liquid 13, and By rotating the rotary shaft 5 to which the object to be polished 2 is attached using the rotary motor 4 at a slow speed that does not impede the fluid movement by the belt 10, the polished surface metal area of the object to be polished 2 is continuously rotated. The fine powder particles in the polishing liquid are brought into contact with each other,
The object to be polished 2 is polished into a desired shape.

At this time, by adjusting the vertical movement mechanism 6 attached to the rotating shaft 5 with the vertical movement knob 7, the contact angle and contact force of the fine powder particles with respect to the object to be polished can be adjusted. In short, this device is a polishing machine in which the rotating shaft to which the object to be polished is attached and the pulley are orthogonal to each other, but orthogonality is not necessarily an essential condition.

Other embodiments of the invention are shown in FIGS. 3-7. In FIG. 3, a drive source is directly connected to a pulley facing the object to be polished, and polishing is performed by causing the polishing liquid to flow as the pulley rotates. Figure 4 shows the case where the present invention is applied to a curved surface.
By adjusting the shape of the pulley facing the object to be polished (in FIG. 5, the object to be polished is finished into a concave surface), it is possible to continuously polish a curved surface. FIG. 6 shows the present invention with a left-right moving slide mechanism attached, which enables local polishing when used together with a rotating shaft to which an object to be polished is attached. FIG. 7 shows the shape of the pulley facing the object to be polished at that time.

According to this embodiment, (a) Addition of new functions The surface to be polished is polished by the shape of the roller facing the object to be polished, the rotation of the shaft to which the object to be polished is attached, and the flow of the polishing liquid accompanying the movement of the belt. Continuous polishing to achieve the desired shape 6 (b) Improving performance and efficiency In this embodiment, polishing is performed by rotating the pulley at a high speed, for example, at a circumferential speed of about 3I8. 11
．． By providing motor 12 outside the container and transmitting power to pulley 8b, the vibration of motor 11 is not directly transmitted to pulley 8a facing the object to be polished, so the flow of polishing liquid between the object to be polished and pulley 8a is reduced. It is possible to stabilize the situation.

(c) Economic efficiency: No complicated movement mechanism is required for the polished object or tool.

〔Effect of the invention〕

According to the present invention, the surface to be polished is rotated in a polishing liquid by a rotating shaft that is substantially orthogonal thereto, and the fine particles of the polishing liquid are transferred to the surface by rotating a belt provided under the surface to be polished. By colliding with a predetermined position at a predetermined speed and at a predetermined angle, there is an excellent effect that the surface to be polished can be finished into a desired shape and precision.

[Brief explanation of the drawing]

FIG. 1 is a side view showing a polishing device according to the present invention, FIG. 2 is a schematic diagram of a pulley, FIG. 3 is a side view of a polishing device using rotation of a pulley, and FIG. 4 is a curved surface polishing device. Fig. 5 is a schematic diagram of the pulley, Fig. 6 is a side view of the polishing device with a left-right moving slide attached, Fig. 7 is a schematic diagram of the pulley, and Fig. 8 is a schematic diagram of the polishing object and the tool. FIG. 9 is a cross-sectional view of non-solid contact polishing; FIG. 10 is a cross-sectional view of float polishing; FIG. 11 is a schematic EEM diagram; FIG. 13 is a schematic diagram of the polishing section of the submerged polishing device, and FIG. 13 is a schematic diagram of the belt polishing machine. FIG. 14 is a schematic diagram of concave polishing using a polishing plate, and the first
Fig. 5 is a schematic diagram of convex surface polishing using a polishing plate, Fig. 16 is a schematic diagram of a convex curved surface polishing machine equipped with a workpiece inclination angle detection device, and Fig. 17 is a schematic diagram of a convex curved surface polishing machine equipped with a workpiece inclination angle detection device. FIG. 2 is a schematic diagram of a concave curved surface polishing machine. 2... Object to be polished, 3... Holder, 4...
・Rotating motor, 5... Rotating shaft, 6... Vertical movement mechanism, 8... Pulley, 9... Pulley shaft, 10... Belt, 11... Drive motor, 13... Polishing liquid. Figure 1 Figure 3 Figure 5 b-----hrl) 1M1$ 14-----
-8JIJ11 Sura (1-"Figure 8Figure 10Figure 11Figure 12Figure 4--

Claims (5)

[Claims] (1) A polishing object holder that holds the polishing surface of the polishing object immersed in a polishing liquid and having a rotating shaft substantially perpendicular to the polishing surface; a drive device that rotates the rotating shaft; and; a belt that moves while maintaining a predetermined distance from the surface to be polished;
A polishing device comprising: a moving drive device for the belt; (2) a polishing object holder that holds the polishing surface of the polishing object immersed in a polishing liquid and having a rotating shaft substantially perpendicular to the polishing surface; a drive device that rotates the rotating shaft; and; a belt that moves while maintaining a predetermined distance from the surface to be polished;
A polishing device comprising: an adjustment device for adjusting the predetermined interval; and a movement drive device for the belt. (3) The device according to claim 1 or 2, characterized in that the surface of a cylinder forms the belt, and the moving drive device is a rotation device for the cylinder. (4) The apparatus according to claim 1 or 2, wherein the belt is hung around a drum-shaped pulley provided below the surface to be polished. (5) The apparatus according to claim 1 or 2, wherein the belt is hung around a cylindrical pulley provided below the surface to be polished.