JPS6326351A - Evaporating source device for vacuum deposition - Google Patents

Abstract

PURPOSE:To make a formed film homogeneous and to reduce the amount of ineffective vapor by dividing an evaporating source into plural sources in the lateral direction of a material to be treated and by making the sources movable in the lateral direction of the material. CONSTITUTION:Plural evaporating sources 1a-1c each contg. an evaporating substances for vacuum deposition are arranged in a treatment tank kept at a high degree of vacuum in the lateral direction of a material 2 introduced into the tank so that the sources 1a-1c can be rotated or moved in the lateral direction of the material 2 to be treated. Even when the material 2 is a long- sized material or undergoes a change in the lateral direction, a homogeneous film is obtd. and the amount of ineffective vapor is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an evaporation source device for vacuum evaporation, and in particular to a continuous vacuum evaporation process (including ion blating) on a long object such as a metal strip. It is suitable for use when applying the same).

(Prior Art) Recently, dry brating techniques such as vacuum evaporation, sputtering, ion blating, and chemical vapor deposition (CVD) have been used in various fields.

For example, in the field of steel, research is being actively conducted on vacuum bonding methods of different materials for the purpose of improving the surface properties, such as corrosion resistance and wear resistance, of metal slips.

There are many requirements for such vacuum evaporation, but from the standpoint of the material to be deposited, ensuring the uniform thickness of the deposited film is particularly important, while from the standpoint of equipment, it is especially important to reduce the amount of ineffective vapor. It is.

That is, the former improves properties by ensuring uniformity of the coating thickness, while the latter improves economic efficiency and production efficiency in continuous operation by reducing ineffective steam.

(Problems to be Solved by the Invention) However, the vacuum evaporation technique described above still has the following problems.

(1) When the surface to be deposited is relatively small, this is not a big problem; however, when the surface to be deposited becomes large, it is difficult to maintain the uniformity of the thickness of the deposited film.

(2) In the case of batch vapor deposition, the ineffective vapor is
However, in the case of continuous vapor deposition, the waste vapor deposited in the vacuum chamber cannot be easily removed, which has a significant adverse effect on operation.

(3) If the plate width changes, it cannot be dealt with appropriately.

The present invention advantageously solves the above-mentioned problems, and even when a long object such as a metal strip is continuously vapor-deposited, a uniform coating can be obtained, and less wasteful vapor is generated. Furthermore, it is an object of the present invention to propose an evaporation source device for vacuum evaporation that can appropriately cope with variations in plate width.

(Means for Solving the Problems) That is, the present invention provides a vacuum processing tank in which vacuum deposition is performed on a material to be processed introduced into the processing tank maintained at a high vacuum. An evaporation source device that accommodates evaporated substances of 1,000 yen, and is composed of a plurality of evaporation sources divided in the width direction of the material to be treated, and each evaporation source is movable and rotatable in the width direction of the material to be treated. This is an evaporation source device for vacuum evaporation.

(Embodiments) Hereinafter, preferred embodiments of the present invention will be specifically described in comparison with conventional examples with reference to the drawings.

1 and 2 show a preferred embodiment of the invention in plan and front view, and FIG. 3 shows a conventional evaporation source in plan.

In FIG. 3, the number 1 in the figure is an evaporation source that accommodates the evaporation substance, 2 is a metal strip that is a material to be treated, and 3 is an evaporation opening.

Conventionally, the size of the evaporation source 1 was designed based on the maximum width of the metal strip 2 to be processed, and therefore a relatively large one was installed.

Therefore, as shown in Fig. 3, when processing a strip 2 whose width is smaller than the length of the evaporation source 1, a part of the evaporated material becomes ineffective vapor and flows into the processing tank (not shown). accumulate. This tendency becomes more pronounced as the width of the strip becomes narrower.

However, if the evaporation opening 3 is made smaller in order to reduce the ineffective vapor, the thickness of the lIa becomes non-uniform between the center and the ends in the width direction of the strip.

Therefore, in this invention, the evaporation source is divided in the width direction of the strip, so that variations in the width of the strip can be appropriately dealt with.

That is, in Figures 1 and 2, Ia, lb, I
Each of c is an evaporation source that is divided in the width direction of the strip and has a rectangular evaporation opening that is long in the width direction.

All of these evaporators i1a~IC are on trolleys 48~4C.
It is installed so that it can be moved in the width direction of the strip by an electric motor 5a to 5C, and can be rotated by electric motors 5a to 5C.

(Function) The situation shown in Fig. 1 is when a relatively wide strip is processed. They should be placed in a straight line.

On the other hand, Fig. 4 shows a case where a relatively narrow strip is processed, and in such a case, generation of ineffective steam is prevented by rotating the evaporation sources 1a and Ic at both ends. It is.

In addition, if there is a possibility that the uniformity of the film thickness is impaired by rotating in this way, each evaporation source 1a to 1
The above-mentioned fear can be eliminated by appropriately adjusting the interval c. Of course, all the evaporation sources 18 to IC may be rotated.

(Effects of the Invention) Thus, according to the present invention, even when performing vacuum deposition on a long workpiece, a homogeneous film can be formed by effectively using ineffective vapor, regardless of the width variation of the workpiece. can be obtained under a significant reduction.

[Brief explanation of the drawing]

1 and 2 are a plan view and a front view of a preferred embodiment of the present invention, FIG. 3 is a plan view of a conventional evaporation source device, and FIG. 4 is an example of a mode of use of the evaporation source device according to the present invention. FIG. 18-1c... Evaporation source 2... Metal strip 3... Evaporation opening 48-4C... Cart 5
a~5c...Electric motor Fig. 1 Fig. 2fa"-□1c...LjlE&, 2=-
4Ms) l8, 7゛4α~4C・°・Dolly 5a~5
c・・Electric #3・Figure 3・・・Steamer opening rabbit・Figure 4

Claims (1)

[Claims] 1. In a vacuum processing tank in which vacuum evaporation is performed on a material to be processed led into the processing tank maintained at a high vacuum, an evaporator disposed inside the tank and containing an evaporation substance for vapor deposition. A vacuum evaporation source device comprising a plurality of evaporation sources divided in the width direction of the material to be processed, each evaporation source being movable and rotatable in the width direction of the material to be processed. Evaporation source device for use.