JPS63253315A - Optical fiber module device - Google Patents
Optical fiber module deviceInfo
- Publication number
- JPS63253315A JPS63253315A JP8910787A JP8910787A JPS63253315A JP S63253315 A JPS63253315 A JP S63253315A JP 8910787 A JP8910787 A JP 8910787A JP 8910787 A JP8910787 A JP 8910787A JP S63253315 A JPS63253315 A JP S63253315A
- Authority
- JP
- Japan
- Prior art keywords
- optical fiber
- semiconductor laser
- chip
- module device
- notched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 title claims abstract description 51
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 239000000835 fiber Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 description 15
- 238000010168 coupling process Methods 0.000 description 15
- 238000005859 coupling reaction Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、光ファイバと半導体レーザとを結合するた
めの光ファイバモジュール装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an optical fiber module device for coupling an optical fiber and a semiconductor laser.
従来、光ファイバと半導体レーザとを結合するには、第
２図の結合例の模式断面図に示すように、銀ブロックＢ
の収容穴Ｂ、にサブマウントＭを介して装着された半導
体レーザチップ６をステムＳ上に設置した後、先端を直
角に切断した光ファイバ１を、その端面を前記レーザチ
ップ６に対向させてａ置し、該レーザチップ６から出射
されたレーザ光６２をレンズＬにより光ファイバｌの光
フアイバ素線２に集光してから両者６゜ｌを結合する。Conventionally, in order to couple an optical fiber and a semiconductor laser, a silver block B is used as shown in the schematic cross-sectional view of a coupling example in FIG.
After installing the semiconductor laser chip 6 attached to the accommodation hole B via the submount M on the stem S, the optical fiber 1 whose tip was cut at a right angle was placed with its end face facing the laser chip 6. The laser beam 62 emitted from the laser chip 6 is focused onto the optical fiber strand 2 of the optical fiber 1 by the lens L, and then the two are coupled at 6°.
発振後のレーザ光６Ｉｔは、半導体レーザチップ６のへ
テロ接合面に対して横方向と縦方向とで違った角度の広
がり角を有する出射先である。そこで１通常、レンズＬ
で光を集光し結合するのであるが、レンズＬは、半導体
レーザチップ６のパッケージ（図示省略）か、あるいは
、光ファイバ１の先端に取り付けられる。レーザ光６１
を集光した後、ビーム径の最も小さくなる位置で最小錯
乱円の中心と光フアイバ素線２のコア３径中心とが一致
するように結合することにより、結合効率最大の状態で
結合したモジュール装置としている。The laser beam 6It after oscillation has a different spread angle in the horizontal and vertical directions with respect to the heterojunction surface of the semiconductor laser chip 6. Therefore, 1. Usually, lens L
The lens L is attached to the package of the semiconductor laser chip 6 (not shown) or to the tip of the optical fiber 1. Laser light 61
After condensing the beam, the center of the circle of least confusion is aligned with the center of the diameter of the core 3 of the optical fiber 2 at the position where the beam diameter is the smallest, thereby creating a module that maximizes the coupling efficiency. It is used as a device.
（発明が解決しようとする間屈点）
従来の光ファイバモジュール装置は、以上のように構成
されているので、半導体レーザと光ファィバどの結合に
おいて、アライメント（芯合せ）が極めて困難であるば
かりか、多大の時間を要するという無駄があり、さらに
高結合効率を得るために半導体レーザの高出力化が要求
されるなどの問題点があった。(Point to be solved by the invention) Since the conventional optical fiber module device is configured as described above, it is not only extremely difficult to align the semiconductor laser and the optical fiber when coupling the semiconductor laser to the optical fiber. However, there are problems in that it requires a large amount of time and is wasteful, and that a high output semiconductor laser is required in order to obtain high coupling efficiency.
この発明は、上記のような問題点を解消するためになさ
れたもので、アライノ・ントに要する許容範囲を広くす
るとともに、高結合効率で半導体レーザと光ファイバと
を結合し、半導体レーザの出力定格を従来よりも低い値
で許容することのできる光ファイバモジュール装置を得
ることを目的とする。 ・
〔問題点を解決するための手段）
この発明に係る光ファイバモジュール装置は、光ファイ
バのコアと半導体レーザの発光点とが一致するように、
光ファイバの先端をＬ型に切欠するとともに、該切断部
の外殻フェルールに形成した段部上に半導体レーザをボ
ンディングしたものである。This invention was made to solve the above-mentioned problems, and it widens the tolerance range required for aligners, couples a semiconductor laser and an optical fiber with high coupling efficiency, and increases the output of the semiconductor laser. It is an object of the present invention to obtain an optical fiber module device that can allow a rating lower than conventional values. - [Means for Solving the Problems] The optical fiber module device according to the present invention is configured so that the core of the optical fiber and the light emitting point of the semiconductor laser coincide with each other.
The tip of the optical fiber is cut into an L-shape, and a semiconductor laser is bonded onto the stepped portion formed on the outer ferrule of the cut portion.
この発明のモジュール装置は、半導体レーザと光ファイ
バとの結合が高結合効率で、しかもアライメントも簡単
に行うことができ、なお、光ファイバの切欠部を無反射
コーティングすることにより、結合効率がさらに高めら
れる。The module device of the present invention has high coupling efficiency between the semiconductor laser and the optical fiber, and can be easily aligned. Furthermore, by coating the notch of the optical fiber with an anti-reflection coating, the coupling efficiency is further improved. be enhanced.
（実施例）
以下、この発明の一実施例を第１図に基づいて説明する
。(Example) Hereinafter, an example of the present invention will be described based on FIG. 1.
光ファイバモジュール装置の縦断側面図を示す同図工及
び同じく正面図を示す同図Ｈにおいて、１は、光フアイ
バ素線２を光フアイバ外殻フェルール５により被覆され
てなる光ファイバである。光フアイバ素線２は、高屈折
率のコア３に低屈折率のクラッド４をかぶせてなる単一
のものである。In the same figure showing a longitudinal side view of the optical fiber module device and in the same figure H showing a front view, reference numeral 1 denotes an optical fiber formed by covering an optical fiber strand 2 with an optical fiber outer shell ferrule 5. The optical fiber 2 is a single fiber having a core 3 having a high refractive index covered with a cladding 4 having a low refractive index.
６は、前記光ファイバ１の先端を前記素線２とともにＬ
型に切欠して外殻フェルール５に形成された段部５ｄに
載設され、その前端面６ｆで素線２のコア３に当接して
いる半導体レーザチップ、７は、光ファイバ１の外殻フ
ェルール５に外嵌する頂板部７を付き円筒状のバラゲー
ジで、結合部保護用のものである。6, the tip of the optical fiber 1 is connected to the L along with the strand 2.
The semiconductor laser chip 7, which is mounted on a stepped portion 5d cut out in the mold and formed in the outer shell ferrule 5, and whose front end face 6f is in contact with the core 3 of the strand 2, is the outer shell of the optical fiber 1. This is a cylindrical balage gauge with a top plate 7 that fits over the ferrule 5, and is used to protect the joint.
８は、頂板部フｔに貫設された半導体レーザ駆動用電極
で、ＬＤカソード又はアノード端子、９は、同じく貫設
された半導体レーザのカソード又はアノード端子駆動用
電極、モニタＰＤアノード又はカソード端子、１０は、
同じく貫設されたモニタＰＤカソード又はアノード端子
の電極、１１は、■板部７ｔの円面に貼着されたモニタ
ＰＤで、前記電極９と結合し、電極！０と結線されてい
る。Reference numeral 8 denotes an electrode for driving a semiconductor laser, which is provided through the top plate part t, and is an LD cathode or anode terminal. Reference numeral 9 is an electrode for driving the cathode or anode terminal of the semiconductor laser, which is also provided through the top plate, and an anode or cathode terminal of the monitor PD. , 10 is
The electrode 11 of the cathode or anode terminal of the monitor PD which is also provided through is a monitor PD stuck to the circular surface of the plate portion 7t, and is connected to the electrode 9, and the electrode! It is connected to 0.
また、電極８は、半導体レーザチップ６の上面と、電極
９は、該チップ６の後端面６ｂの下端にそれぞれ結線さ
れている。Further, the electrode 8 is connected to the upper surface of the semiconductor laser chip 6, and the electrode 9 is connected to the lower end of the rear end surface 6b of the chip 6.
叙上の構成となっているが、光ファイバ１と半導体レー
ザチップ６との結合において、両者の距離を密接させる
ことで光出力の損失を最小限に抑えることができ、さら
に光ファイバ１からの反射を最小限にするために、光フ
ァイバｌの先端面を無反射コーティングしておく。Although the configuration is as described above, in coupling the optical fiber 1 and the semiconductor laser chip 6, the loss of optical output can be minimized by keeping the distance between them close, and furthermore, the loss of optical output from the optical fiber 1 can be minimized. In order to minimize reflection, the end face of the optical fiber l is coated with an anti-reflection coating.
次いで、結合に際しては、光ファイバ１のコア３と半導
体レーザチップ６の発光点のそれぞれの中心を一致させ
る必要がある。−例をあげると、該チップ６の接合面を
上部に組み立てる場合、チップ６の底面から発光点まで
の距離を光ファイバ１を切断しチップボンディングでき
るように外殻フェルール５を更にＬ型に切り欠く。この
切欠の精度を出していれば、光ファイバ１と半導体レー
ザとの結合時には横方向の精度さえ出していると可能で
、高結合効率の光ファイバモジュール装置が得られる。Next, upon coupling, it is necessary to align the centers of the core 3 of the optical fiber 1 and the light emitting points of the semiconductor laser chip 6. - For example, when assembling the bonding surface of the chip 6 on the top, cut the optical fiber 1 at a distance from the bottom of the chip 6 to the light emitting point, and then cut the outer shell ferrule 5 into an L-shape for chip bonding. lack If the precision of this notch is achieved, it is possible to couple the optical fiber 1 and the semiconductor laser with precision in the lateral direction, and an optical fiber module device with high coupling efficiency can be obtained.
なお、上記実施例では、半導体レーザのアノード又はカ
ソード端子−とモニタＰＤＩＩのアノード又はカソード
端子とが共通となった電極９としたものを示したが、モ
ニタＰＤＩＩの電極をフローティングにして、更に１本
電極を設けてもよい。In the above embodiment, the anode or cathode terminal of the semiconductor laser and the anode or cathode terminal of the monitor PDII are used as a common electrode 9, but the electrode of the monitor PDII is made floating and This electrode may also be provided.
また、上記実施例では、半導体レーザと光ファイバ１と
の結合について説明したが、端面発光のＬＥＤ （発光
ダイオード）と光ファイバ１との結合による光ファイバ
モジュール装置であってもよく、同様の効果が得られる
。Further, in the above embodiment, the coupling between the semiconductor laser and the optical fiber 1 has been described, but an optical fiber module device may be formed by coupling an edge-emitting LED (light emitting diode) and the optical fiber 1, and similar effects can be obtained. is obtained.
（発明の効果〕
以上説明したようにこの発明は、光ファイバの先端をＬ
型に切欠し、該切欠部に直接、半導体レーザをボンディ
ングする構成としたため、結合が極めて容易迅速にでき
るばかりか、結合効率が高められ、しかも安価な装置が
得られるという効果がある。(Effects of the Invention) As explained above, the present invention allows the tip of the optical fiber to be
Since the mold is cut out and the semiconductor laser is directly bonded to the cutout, the bonding can be performed extremely easily and quickly, and the bonding efficiency can be increased and an inexpensive device can be obtained.
第１図は、この発明の一実施例を示す図で、同図工は、
光ファイバモジュール装置にあける光ファイバと半導体
レーザとの結合状態を示す縦断側面図、同図■は、同じ
く正面図、第２図は、従来の光ファイバと半導体レーザ
との結合例を示す模式断面図である。
！−・−光ファイバ
５・−一外殻フエルール
５ｄ−−−一段部
６−−−−半導体レーザチップ
第２図FIG. 1 is a diagram showing an embodiment of the present invention, and the artist is:
A longitudinal side view showing the state of coupling between an optical fiber and a semiconductor laser formed in an optical fiber module device, ■ in the same figure is a front view, and Fig. 2 is a schematic cross section showing an example of a conventional coupling between an optical fiber and a semiconductor laser. It is a diagram. ! --- Optical fiber 5 --- One outer shell ferrule 5 d --- One step part 6 --- Semiconductor laser chip Fig. 2
Claims (1)
した段部に半導体レーザを、光ファイバ先端に当接して
載設することにより、半導体レーザと光ファイバとを結
合することを特徴とした光ファイバモジュール装置。The semiconductor laser and the optical fiber are coupled by placing the semiconductor laser in contact with the tip of the optical fiber on a step formed by cutting the tip of the outer ferrule of the optical fiber into an L shape. Fiber optic module equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8910787A JPS63253315A (en) | 1987-04-09 | 1987-04-09 | Optical fiber module device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8910787A JPS63253315A (en) | 1987-04-09 | 1987-04-09 | Optical fiber module device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63253315A true JPS63253315A (en) | 1988-10-20 |
Family
ID=13961668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8910787A Pending JPS63253315A (en) | 1987-04-09 | 1987-04-09 | Optical fiber module device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63253315A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05134151A (en) * | 1991-11-15 | 1993-05-28 | Sharp Corp | Optically coupled optical device |
| EP0874258A1 (en) * | 1997-04-23 | 1998-10-28 | Fujitsu Limited | Connection of an optoelectronic element or to a waveguide with an optical fibre ferrule |
| US6568862B2 (en) | 2000-12-20 | 2003-05-27 | Infineon Technologies Ag | Coupling device for connecting an optical fiber to an optical transmitting or receiving unit and transmitting or receiving device having a coupling device |
| KR100403813B1 (en) * | 2001-06-30 | 2003-10-30 | 삼성전자주식회사 | Oprical module |
| US6944377B2 (en) | 2002-03-15 | 2005-09-13 | Hitachi Maxell, Ltd. | Optical communication device and laminated optical communication module |
-
1987
- 1987-04-09 JP JP8910787A patent/JPS63253315A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05134151A (en) * | 1991-11-15 | 1993-05-28 | Sharp Corp | Optically coupled optical device |
| EP0874258A1 (en) * | 1997-04-23 | 1998-10-28 | Fujitsu Limited | Connection of an optoelectronic element or to a waveguide with an optical fibre ferrule |
| US6217231B1 (en) | 1997-04-23 | 2001-04-17 | Fujitsu Limited | Optical fiber assembly, optical module including an optical fiber assembly, and a manufacturing process thereof |
| US6568862B2 (en) | 2000-12-20 | 2003-05-27 | Infineon Technologies Ag | Coupling device for connecting an optical fiber to an optical transmitting or receiving unit and transmitting or receiving device having a coupling device |
| KR100403813B1 (en) * | 2001-06-30 | 2003-10-30 | 삼성전자주식회사 | Oprical module |
| US6944377B2 (en) | 2002-03-15 | 2005-09-13 | Hitachi Maxell, Ltd. | Optical communication device and laminated optical communication module |
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