JPS63245968A - Optical coupler - Google Patents
Optical couplerInfo
- Publication number
- JPS63245968A JPS63245968A JP62081511A JP8151187A JPS63245968A JP S63245968 A JPS63245968 A JP S63245968A JP 62081511 A JP62081511 A JP 62081511A JP 8151187 A JP8151187 A JP 8151187A JP S63245968 A JPS63245968 A JP S63245968A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- light
- epoxy resin
- optical
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 230000008878 coupling Effects 0.000 claims abstract description 14
- 238000010168 coupling process Methods 0.000 claims abstract description 14
- 238000005859 coupling reaction Methods 0.000 claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 229920002050 silicone resin Polymers 0.000 claims abstract description 6
- 238000000149 argon plasma sintering Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract 1
- 239000002356 single layer Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、発光素子と受光素子とを光学的に連結して信
号を伝達する光結合装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an optical coupling device that optically couples a light emitting element and a light receiving element to transmit a signal.
光結合装置は、入力側（発光素子側）と出力側（受光素
子側）とを電気的に完全に分離できる利点がある為、テ
レビ等の電源部の入出力間に高い絶縁耐圧が要求される
箇所に用いられる。Optical coupling devices have the advantage of being able to completely electrically separate the input side (light emitting element side) and output side (light receiving element side), so high insulation voltage is required between the input and output of the power supply section of TVs, etc. It is used in places where
現在、光結合装置には同一平面上忙発光素子と受光素子
とを配置した第３図の断面に示すようなものがある。同
一平面上にそれぞれ素子載置部１ａ及び２ａを有する１
対のリード端子１と２の該素子載置部の上に、発光素子
３と受光素子４をそれぞれ配置し、透明樹脂９でそれら
を共拠覆い、その外側を表面反射率の高い樹脂１０で覆
い、更にその外側を樹脂１１でモールドした構造となっ
ている。Currently, there is an optical coupling device as shown in the cross section of FIG. 3 in which a light emitting element and a light receiving element are arranged on the same plane. 1 having element mounting portions 1a and 2a on the same plane, respectively;
A light-emitting element 3 and a light-receiving element 4 are respectively arranged on the element mounting portions of the pair of lead terminals 1 and 2, and a transparent resin 9 is used to cover them, and the outside thereof is covered with a resin 10 having a high surface reflectance. It has a structure in which it is covered and the outside is further molded with resin 11.
この構造での光伝達機能は、第３図に示す透明樹脂９と
表面反射率の高い樹脂１０との界面で発光素子３から発
せられた光を反射させることによって受光素子４に到達
させ、信号を伝達させる。The light transmission function in this structure is achieved by reflecting the light emitted from the light emitting element 3 at the interface between the transparent resin 9 and the resin 10 with high surface reflectance as shown in FIG. to communicate.
従って、光を反射させる樹脂界面ははがれが発生しない
様に透明樹脂９と表面反射率の高い樹脂１０には熱膨張
率の近いシリコン樹脂が用いられ、ボッティング等の方
法で樹脂を滴下し、キーアさせることによって光連結部
９が形成される。Therefore, silicone resins with similar coefficients of thermal expansion are used for the transparent resin 9 and the resin 10 with high surface reflectance to prevent peeling at the resin interface that reflects light, and the resin is dropped by a method such as botting. The optical connection portion 9 is formed by keering.
また外装樹脂１１には一般にエポキシ樹脂が用いられ、
トランスファ等の方法によって成形される。In addition, epoxy resin is generally used for the exterior resin 11,
It is molded by a method such as transfer.
光結合装置の重要な特性の１つに入出方間絶縁耐圧があ
るが、嬉３図に示す従来の光結合装置の場合、光連結部
を形成する樹脂と外装樹脂との熱膨張率の違いからその
界面にはがれが発生しやすく、そのはがれた界面を通し
て絶縁破壊が発生する。One of the important characteristics of an optical coupling device is the dielectric strength between input and output, but in the case of the conventional optical coupling device shown in Figure 3, there is a difference in the coefficient of thermal expansion between the resin forming the optical coupling part and the exterior resin. Therefore, peeling is likely to occur at the interface, and dielectric breakdown occurs through the peeled interface.
又、極端な場合には光連結部のシリコン樹脂の膨張によ
って外装樹脂が破裂することすらある。Furthermore, in extreme cases, the expansion of the silicone resin in the optical connection portion may even cause the exterior resin to rupture.
更に光連結部の構成は光透過性樹脂と光を反射させる樹
脂との二重となっており、コストも高くなる。Furthermore, the optical connection part has a double structure of a light-transmitting resin and a light-reflecting resin, which increases the cost.
本発明は、光連結部を一重にし外装樹脂と同系統のエポ
キシ樹脂で形成することにより、入力側導電部から出力
側導電部に至る樹脂の界面はがれを発生しにくくさせて
入出力間の絶縁耐圧を向上させ、更に構造を単純化する
ことで安価な光結合装置を提供するものである。The present invention makes it difficult for the interface between the input-side conductive part and the output-side conductive part to peel off by making the optical connection part single-layered and made of epoxy resin of the same type as the exterior resin, thereby insulating the input and output parts. By improving the withstand voltage and simplifying the structure, an inexpensive optical coupling device is provided.
次に本発明を実施例により説明する。 Next, the present invention will be explained by examples.
第１図は本発明の一実施例の断面図である。１及び２は
一対のリード端子であって、それぞれの素子載置部】ａ
及び２ａは同一平面上に並んでいる。FIG. 1 is a sectional view of an embodiment of the present invention. 1 and 2 are a pair of lead terminals, each having an element mounting portion] a
and 2a are arranged on the same plane.
そして素子載置部１ａにはＧ ａ Ａ ｓ赤外発光素子
３が、素子載置部２ａにはＳｉ受光素子４がそれぞれグ
イボンディングされた後、金線５でワイヤボンディング
が行なわれる。それから発光素子３と受光素子４とをシ
リコン樹脂と光散乱剤とを０．１チ〜１％含んだエポキ
シ樹脂７でボッティング等の方法で一体的にモールドし
、その外側を光不透過性エポキシ樹脂８でモールドして
完成品となる。After the GaAs infrared light emitting device 3 is bonded to the device mounting portion 1a and the Si light receiving device 4 is bonded to the device mounting portion 2a, wire bonding is performed using gold wires 5. Then, the light-emitting element 3 and the light-receiving element 4 are integrally molded with an epoxy resin 7 containing silicone resin and a light scattering agent at 0.1% to 1% by a method such as botting, and the outside thereof is made light-opaque. The finished product is molded with epoxy resin 8.
以上説明したよう如、本発明による光結合装置は光結合
部を形成する樹脂に、外装樹脂と同じエポキシ樹脂を用
いているので樹脂の膨張率は橙とんど同じヤ界面のはが
れはほとんどない。この為従来と比べて入出力間の絶縁
耐圧が高くなる。また光連結部を形成する樹脂に光散乱
剤を入れて光反射局を省略できているので安価となる。As explained above, since the optical coupling device according to the present invention uses the same epoxy resin as the exterior resin for the resin forming the optical coupling part, the expansion coefficient of the resin is almost the same, and there is almost no peeling at the interface. . For this reason, the insulation voltage between input and output is higher than that of the conventional method. Furthermore, since a light scattering agent is added to the resin forming the optical connection portion, the light reflection station can be omitted, resulting in low cost.
等の効果がある。There are other effects.
第１図は本発明の一実施例の断面図である。第２図は従
来の光結合装置の断面図である。
１．２・・・・・・リード端子、ｌａ、２ａ・・・・・
・素子載置部、３・・・・・・発光素子、４・・・・・
・受光素子、５・・・・・・金線、７・・・・・・シリ
コン樹脂と光散乱剤とを添加した光透過性エポキシ樹脂
、８・・・・・・光不透過性外装エポキシ樹脂、
をそれぞれ示す。
代理人 弁理士 内 原 晋
笑１図
２４／ａFIG. 1 is a sectional view of an embodiment of the present invention. FIG. 2 is a sectional view of a conventional optical coupling device. 1.2...Lead terminal, la, 2a...
・Element mounting part, 3...Light emitting element, 4...
- Light receiving element, 5...Gold wire, 7...Light transparent epoxy resin added with silicone resin and light scattering agent, 8...Light opaque exterior epoxy Resin and are shown respectively. Agent Patent Attorney Shinsho Uchihara 1 Figure 24/a
Claims (1)
素子載置部に配置した発光素子及び受光素子と、前記両
素子を共に包含し光学的に連結する樹脂と、その外側を
含む外装樹脂とから成る光結合装置において、前記光学
的に連結する樹脂にシリコン樹脂と光散乱剤とを添加し
た光透過性エポキシ樹脂を用い、かつ前記外装樹脂に光
不透過性エポキシ樹脂を用いたことを特徴とする光結合
装置。A pair of leads with an element mounting part provided on the same plane, a light emitting element and a light receiving element arranged in the element mounting part, a resin that includes both the elements and optically connects them, and the outside thereof. In the optical coupling device, a light-transmitting epoxy resin to which a silicone resin and a light scattering agent are added is used as the optically connecting resin, and a light-opaque epoxy resin is used as the outer resin. An optical coupling device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62081511A JPS63245968A (en) | 1987-04-01 | 1987-04-01 | Optical coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62081511A JPS63245968A (en) | 1987-04-01 | 1987-04-01 | Optical coupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63245968A true JPS63245968A (en) | 1988-10-13 |
Family
ID=13748378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62081511A Pending JPS63245968A (en) | 1987-04-01 | 1987-04-01 | Optical coupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63245968A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0701289A1 (en) * | 1994-09-08 | 1996-03-13 | Nec Corporation | Photocoupler |
| US5770867A (en) * | 1995-02-14 | 1998-06-23 | Sharp Kabushiki Kaisha | Photocoupler device with light-transmissive resin including fillers and a producing process thereof |
-
1987
- 1987-04-01 JP JP62081511A patent/JPS63245968A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0701289A1 (en) * | 1994-09-08 | 1996-03-13 | Nec Corporation | Photocoupler |
| US5665983A (en) * | 1994-09-08 | 1997-09-09 | Nec Corporation | Photocoupler device having light emitting device and photo detector |
| US5770867A (en) * | 1995-02-14 | 1998-06-23 | Sharp Kabushiki Kaisha | Photocoupler device with light-transmissive resin including fillers and a producing process thereof |
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