JPS63220214A - Electronic endoscope - Google Patents

Abstract

PURPOSE:To reduce the diameter of the insertion part of an endoscope by forming at least a part of the front end constituting part with a transparent member and burying a solid image device (SID) chip in this part. CONSTITUTION:An SID chip 9 arranged on an SID substrate of a first front end constituting part 1 by die bonding is buried in a second front end constituting part 2, which is formed by packing a light-transmissive transparent resin, between a third front end constituting part 3 and the first front end constituting part 1 so that the image pickup surface of the front of the chip 9 faces as objective optical system 4. The SID chip 9 buried in this manner is connected to an electric circuit board 12 arranged on the rear face of the first front end constituting part 1 through the first front end constituting part 1 consisting of the SID substrate by a bonding wire 11 consisting of platinum, gold, or the like. Since it is unnecessary to package and attach SID chips individually, the diameter of the front end part of an endoscope is narrowed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic endoscope, and more particularly to the configuration of an endoscope tip having a solid-state imaging device at the tip.

[Prior Art] A solid-state imaging device that photoelectrically converts an observation optical image formed by an objective optical system and extracts it as an electrical signal.
In electronic endoscopes in which an imaging device (hereinafter simply referred to as SID) is disposed within the distal end, conventionally, when fixing the SID within the distal end component, a fixing member is attached to the outer periphery of the SID package. The SID was fixed with a fixing member interposed therebetween.

In other words, SIDs such as CCDs (charge-coupled devices) are usually
As shown in FIG. 11, the CCD chip 100 is fixed in a package 102, and the terminals 101 and CC
In addition to wire bonding 103 to the D chip 100, the imaging surface of the CCD chip 100 is covered with a glass plate 104 mounted on the package 102, and signals are taken out from terminals 101 in the package with lead wires 105. . Therefore, the SID, which is packaged upfront in this way, is further disposed within the tip via an intermediate fixing member.

Furthermore, conventionally, the tip component is formed by molding synthetic resin, but when fixing the SID thereto, it is necessary to use a pre-packaged component as explained in FIG. 11 above. The SID was supposed to be fixed.

[Problems to be Solved by the Invention] Therefore, as described above, the conventional SID mounting structure is such that the SID chip is packaged in advance and is further mounted to the tip fixing part via the fixing member. Therefore, the diameter of the distal end of the endoscope becomes correspondingly large, which hinders the reduction in the diameter of the endoscope insertion section. Essentially, SID only requires the SID chip, and packaging it and attaching it using a fixing member only puts emphasis on protecting the SID, and from a functional standpoint, this packaging is also fixed. There is also a loss of space in terms of materials.

The present invention has been made with attention to such points, and the above-mentioned drawbacks of the conventional art are overcome by forming at least a part of the tip component with a transparent part and embedding the SID chip therein. An object of the present invention is to provide an electronic endoscope that removes

[Means and effects for solving the problems] In order to solve the above-mentioned problems, the present invention is arranged behind the objective optical system and photoelectrically converts a subject image formed by the objective optical system. In an electronic endoscope equipped with an SID, a transparent member that transmits light is constructed between at least the front of the SID and the objective optical system, and the SID is included in the transparent member.
It is characterized by being buried.

[Example] The present invention will be explained below with reference to illustrated embodiments.

FIG. 1.2 is a sectional view of a main part of an electronic endoscope showing a first embodiment of the present invention. In this embodiment, the distal end component 10 of the endoscope insertion section includes a first distal end component 1 which is disk-shaped and forms an SID substrate, and the front surface of the first distal end component 1 is filled and molded. A second tip component 2 made of a light-transmissive member and a third tip made of metal that is disposed on the front side of the second tip component 2 and supports the objective optical system 4 and the like. It is composed of a component 3.

In addition to supporting the objective optical system 4, the third tip component 3 includes a channel hole 5 for inserting a treatment instrument such as forceps, a light guide 6, the tip of an air/water supply vibrator 7 (see FIG. 2), etc. is provided, and its outer periphery is covered with a tip cover 8. Then, this third tip component 3 and the first
The second tip structure part 2 is formed by filling a transparent resin that transmits light between the tip structure part 1 and the first part.
An SID chip 9 is bonded and disposed on the SID substrate of the tip component 1, and is embedded with its front imaging surface facing the objective optical system 4. The SID chip 9 embedded in this way is connected to an electric circuit board 12 disposed on the back surface of the first tip component 1 made of a StD substrate by a bonding wire 11 made of platinum, gold, etc. ing. Electric circuit parts 13 such as capacitors, resistors, and ICs are attached to this electric circuit board 12J2, and a signal line cable 14 is connected to the output end of the electric circuit of the same board 12J2, and an output signal is taken out. It looks like this.

In addition, this first tip component 1 and the electric circuit board 1
2. The electric circuit component 13 and the like are disposed within the joint piece 15 at the tip of the curved part that is connected to the tip component 10, and the electric circuit board 12. The electric circuit component 13 and the end connection portion of the signal line cable 14 are hardened together with a filler 16 made of synthetic resin. A connecting channel pipe 17 is fixed to the first and second tip forming parts 1-2, and the connecting channel pipe 17 passes through both parts and communicates with the channel hole 5. Chi, Youb 1
8 are connected. A mantle tube 1 of the insertion portion is provided on the outer peripheral surface of the second distal end forming portion 2 and the joint piece 15.
9 is ItE! has been done.

In this embodiment configured in this way, the SID chip 9 is embedded in the second tip component 2 formed by filling with transparent resin, so a package, a fixing member, etc. are not necessary. That's how much space you can save,
The diameter of the tip can be reduced.

FIG. 3 shows a second embodiment of the present invention, showing only the essential parts of the distal end portion of the electronic endoscope. In this example
The second tip component 2 made of a light-transmitting member in the first embodiment is made of glass, for example, and mixed with a potassium solution to exchange potassium ions to form a gradient index lens. This is a second tip forming portion 22. In addition, in this second example, ion exchange was performed twice to form two refractive index distribution layers 20 and 21.
This may be a single layer or multiple layers.

The rest of the structure is the same as the first embodiment shown in FIG. 1.2.

According to the second embodiment configured in this way, a secondary effect can be obtained in that the optical path length of the objective optical system can be shortened.

Next, FIG. 4 is a sectional view of a main part of the distal end portion of an electronic endoscope showing a third embodiment of the present invention. This third embodiment integrates the second and third tip components 2.3 in the first embodiment (see Figures 1 and 2) and is made of a resin made of a light-transmitting member. In addition to the SID chip 9, there is also an objective optical system 4. The channel pipe 17 and the like are also buried. Therefore, in this third embodiment, the tip component 24 includes the SID, ! It is composed of a first tip component 1 that forms the Jlli 2 and a second tip component 23 that is made of a resin that transmits light, and the outer peripheral surface of the second tip component 23 prevents external light from entering. Black processing 25
is applied. The other configurations are the same as those of the first embodiment. Therefore, the same members are given the same reference numerals and their explanations will be omitted.

When configured as in the third embodiment, there is no need for an assembly process for connecting the third tip structure portion 3 (see FIG. 1), so that workability can be improved.

Next, FIG. 5 shows a fourth embodiment of the present invention, in which only the main parts of the tip structure are shown. This fourth
The example is the first example in the third example (see Fig. 4).
and the second tip component part 1.degree. 23 are integrated and formed of a resin made of a light-transmitting material, and the SID chip 9. Objective optical system 4. The channel pipe 19 and the like are buried. Therefore, the tip component 4'' in this fourth embodiment is composed only of a light-transmitting resin 29 whose outer peripheral surface has been blackened 27.

In addition, in the first to third embodiments described above, the SID chip 9 was firmly bonded to the SID substrate of the first tip component 1, or in this fourth embodiment, after being firmly bonded to the metal lead frame 28, The lead frame 28 is used for wire bonding and extends rearward.
An electric circuit board 12 is attached to. The rest of the structure is the same as that of the first to third embodiments, so the same members are given the same reference numerals and their explanations will be omitted.

With this configuration, the lead frame 28 of the SID chip 9 and the lead frame of the electrical component can be integrated as shown in the figure, making it possible to further reduce the size of the tip (1-layer structure) and to reduce the size of the 5IDJ, C Connection work such as connecting the temporary and mounting part substrates is no longer necessary, and work efficiency is improved.

Next, in Figures 6 to 10, the electrical circuit 71 (SID)
This is a combination of the manner in which signal line cables are connected to a large number of output bins of a chip, and how to reduce the number of signal line cables. That is, as shown in FIG. 6, in the insertion section 31 connected to the operating section main body 30 of the endoscope, the objective optical system 4 and the object imaged by it are installed in the distal end component. The SID chip 9 is provided for converting a photographic subject image into an electrical signal. This S
As is well known, the ID chip 9 has a large number of human output pins, for example, as many as 14 human output pins as shown in FIG. This pin and the signal line cable 32 are connected via a tip circuit 33 in this example. The signal line cable 32 is formed of a coaxial cable inserted into the endoscope insertion section, and the cable 32 passes through the operation section main body 30 and is connected to the video processor 3 by a connector 34.
It is designed to be connected to 5.

In the electric circuit shown in FIG.
is a circuit in which a preamplifier 36 for taking out video output, a capacitor C, and a resistor R are connected as shown in the figure, and connects the 14 human output bins of the SID chip 9 and the signal line cable 32. He is playing role 1. Note that the capacitance of the shield wire of the cable itself may be used as the capacitor co having a small capacitance. Further, within the video processor 35, a scope length correction circuit 37 is provided which detects the type of scope for each scope length based on the recognition signal of the electronic endoscope, so-called electronic scope, and compensates the drive signal.
The scope 4 signal can be emitted from the connector 34.

Further, the electric circuit shown in FIG. 8 has a pulse shaping IC 38 made of a C-MOS IC disposed within the tip circuit 33,
Three terminals for a reset pulse and a horizontal register clock are connected to this IC 38, and these are taken out through a single signal line. In this way, while there are 14 human output bins, the number of signal lines can be reduced to 12.

Next, the electric circuit shown in FIG. 9 uses the B1-IC for the regulator as the tip circuit 33A, which distributes the voltage between the output load transistor LG and the output gate OG. The number of signal lines can be set to twelve.

Moreover, the electric circuit shown in FIG. 1O is included in the tip circuit 33B.
Arrange IC39 for regulator and C40 for pulse shaping, connect both terminal pins of output load transistor LG and output gate OG to IC39 for regulator, connect reset pulse and wood register clock pin to 1C40 for pulse shaping. By doing this, the number of connection lines from the 14 human output pins can be reduced to 10.

[Effects of the Invention] As described above, according to the present invention, the tip (1"4 component) is formed of transparent resin, and the SID chip is directly embedded in it, which makes it possible to It is possible to provide an electronic endoscope in which there is no need to package and attach SID chips individually as in conventional electronic endoscopes, and the tip of the endoscope can be formed to have a smaller diameter accordingly, and the tip component can also be made smaller.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of the main parts of the distal end component of an electronic endoscope showing a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line ■-■ in FIG. 1, and FIG. 1 is a cross-sectional view of only the main parts of the electronic endoscope tip configuration section showing a second embodiment of the present invention, and FIGS. Figure 6 is a diagram showing the signal extraction path in the electronic endoscope. Figures 7 to 10 are the connections between the human output pin of the SID chip and the signal line cable. FIG. 11 is a sectional view showing an SID chip package.

Claims (2)

[Claims] (1) An electronic endoscope equipped with an illumination optical system, an objective optical system, and a solid-state imaging device that photoelectrically converts a subject image formed by the objective optical system, at least in front of the solid-state imaging device. An electronic endoscope characterized by comprising a transparent member that transmits light between the and the objective optical system. (2) The electronic endoscope according to claim 1, wherein a solid-state imaging device is embedded in the transparent member.