JPS63203787A - Production of suspended metal mask plate - Google Patents

Production of suspended metal mask plate

Info

Publication number
JPS63203787A
JPS63203787A JP3567587A JP3567587A JPS63203787A JP S63203787 A JPS63203787 A JP S63203787A JP 3567587 A JP3567587 A JP 3567587A JP 3567587 A JP3567587 A JP 3567587A JP S63203787 A JPS63203787 A JP S63203787A
Authority
JP
Japan
Prior art keywords
nickel
image forming
copper
forming layer
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3567587A
Other languages
Japanese (ja)
Other versions
JP2678598B2 (en
Inventor
Yoshio Ono
義雄 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kenseido Kagaku Kogyo KK
Original Assignee
Kenseido Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kenseido Kagaku Kogyo KK filed Critical Kenseido Kagaku Kogyo KK
Priority to JP3567587A priority Critical patent/JP2678598B2/en
Publication of JPS63203787A publication Critical patent/JPS63203787A/en
Application granted granted Critical
Publication of JP2678598B2 publication Critical patent/JP2678598B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To facilitate the production of a plate by sticking a thin image forming layer formed on a copper supporting sheet to gauze and by perfectly removing the sheet with an etching soln. so as to faithfully form the image forming layer. CONSTITUTION:An image is printed on a resist 2 applied to one side of a copper supporting sheet 1 and only the image part of the resist 2 is removed to partially expose the copper of the sheet 1. The copper exposed part is plated with nickel 3 to form an image forming layer of nickel on the sheet 1. The image forming layer is stuck to one side of gauze 4 of reticulated stainless steel or the like and the whole surface of the gauze 4 is coated with nickel. The sheet 1 is then removed with an etching soln. which etches only copper and the remaining resist 2 is removed to outline the image forming layer of nickel.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は印刷用サスペンドメタルマスク版の製法に関す
る。サスペンドメタルマスク版とはある程度沖び縮みの
可能な紗と貫通画像孔を有する画像形成層とを張合わせ
たもので、画像形成層の一方の面からドクターやローラ
ー等で印刷インキを他方の面に押出し、被印刷体上に印
刷を行う為に用いるものであって、紗は画像形成層の支
持体として働くと共に、綺麗な印刷を行うべく被印剛体
と画像形成層との間に押しつけ時以外には僅かな空間を
保つように伸び縮み作用を与える。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a suspended metal mask plate for printing. A suspended metal mask plate is made by pasting together a gauze that can shrink to a certain extent and an image forming layer with through-holes, and the printing ink is applied from one side of the image forming layer to the other side using a doctor or roller. The gauze acts as a support for the image-forming layer and is used to extrude and print on the printing material.The gauze acts as a support for the image-forming layer and is also used when pressed between the rigid material to be printed and the image-forming layer in order to print beautifully. Other than that, it expands and contracts to maintain a small amount of space.

(従来の技術と発明が解決しようとする問題点)紗とl
i!i像形成層は何等かの手段で張合ノ)されたものと
しなければならないが、画像形成層はm細な画像を有す
るものであるからこれを達成するのは容易ではない。
(Problems to be solved by conventional technology and invention) Gauze and l
i! The image forming layer must be bonded by some means, but this is not easy to achieve since the image forming layer has a thin image.

従来は厚さ0.1w+s+の保護金属層としてのステン
レス(S、 U S )板表面に剥離層(例えば酸化銀
等)を設け、その上にニッケルメッキを行い、このニッ
ケル表面を紗張りされた枠に電気又は化学メッキ法で接
着し、ステンレスOi!謹金属層を剥ll11層を境に
して剥離し、次にニッケル表面にレジスト塗布後露光し
て画像部分以外にレジストが残るようにし、エツチング
を行い、画像孔を貫通させてメタルマスクスクリーンを
製作してきた。
Conventionally, a peeling layer (for example, silver oxide, etc.) was provided on the surface of a stainless steel (S, US) plate as a protective metal layer with a thickness of 0.1W+S+, nickel plating was applied on top of it, and this nickel surface was covered with gauze. Adhesive to the frame using electroplating or chemical plating, stainless steel Oi! Peel off the metal layer. Next, apply a resist to the nickel surface and expose to light so that the resist remains in areas other than the image area. Etch and pass through the image hole to create a metal mask screen. I've been doing it.

この方法ではエツチングを行うにあたって腐食液が紗の
側にまわらないように注意しなければならないが、画像
孔を貫通させるのであるからこれは困難である。
In this method, when performing etching, care must be taken to prevent the corrosive liquid from getting to the side of the gauze, but this is difficult because it penetrates the image hole.

一方先に画像を形成してから(エツチングの終わったも
のを)紗にはりつけようとする場合には保護金属層上に
メッキで画像を作フてこれを紗に転写しようとすると、
画像端部が保護金属層を剥離する時に脱落してしまって
巧くいかない、従って面倒であっても上記の方法を行う
ことを余儀なくされてきた。
On the other hand, if you want to form an image first and then attach it to the gauze (once the etching has been completed), create an image by plating on the protective metal layer and transfer it to the gauze.
The edges of the image fall off when the protective metal layer is peeled off, which is not successful, and therefore the above-mentioned method has been forced to be carried out even though it is troublesome.

(問題を解決する手段) 本発明者は薄い画像形成層を形成するときに必要となる
支持層(保護金属層)を、先行技術のように剥離するこ
とをしないで、支持板として銅を用い、画像形成層を紗
に張り付けた後、支持層を腐食液で完全に除去すること
によって上記の諸問題を解決出来ろことを発見し、本発
明を完成するに至った。
(Means for Solving the Problem) The present inventor used copper as a support plate for the support layer (protective metal layer) required when forming a thin image forming layer, instead of peeling it off as in the prior art. discovered that the above-mentioned problems could be solved by attaching the image forming layer to the gauze and then completely removing the support layer with a corrosive solution, leading to the completion of the present invention.

即ち本発明方法は以下の段階からなる。That is, the method of the present invention consists of the following steps.

薄い銅支持板の一方の面にレジストを付け、画像を焼付
けて像の部分だけレジストが除去されている銅露出面上
にニッケルメッキを行って銅支持層上のニッケルの画像
形成層を作成し、必要に応じて枠はりをした、ステンレ
スの網状体の紗又はポリエステル等の繊維の網状体全体
に金属を被覆した紗の一方の面と、上記レジストを付け
たままの銅支持層上のニッケル画像形成層とを、■支持
層側の面がメッキされないようにして両者をニッケルメ
ッキすることによりはり合わせると共に上記紗の表面全
部をニッケルで被覆し、銅を腐食するがニッケルは腐食
しない腐食液で銅支持層を完全に除去し、 残存するレジストを除去することによりニッケル画像形
成層の画像孔を貫通させる。
A resist is applied to one side of a thin copper support plate, an image is baked, and the resist is removed only in the image area, and nickel plating is performed on the exposed copper surface to create a nickel image forming layer on the copper support layer. , one side of a mesh of stainless steel or a mesh of fibers such as polyester coated with metal, with a frame if necessary, and nickel on the copper support layer with the resist still attached. The image forming layer is bonded to the image forming layer by nickel plating the two sides so that the surface on the support layer side is not plated, and the entire surface of the gauze is coated with nickel, and a corrosive liquid that corrodes copper but not nickel is applied. The copper support layer is completely removed and the remaining resist is removed to penetrate the image holes in the nickel imaging layer.

本発明で使用する上記の紗、レジスト、ニッケル及び銅
の腐食液、ニッケルメッキ方法等はそれ自体印刷技術で
広く用いられている周知のものであフて、本明細書では
特に記載しない。
The above-mentioned gauze, resist, nickel and copper etchant, nickel plating method, etc. used in the present invention are well-known and widely used in printing technology, and are not particularly described in this specification.

本発明で使用する銅支持板の厚さは0.03〜0.06
1のものが好ましい、厚すぎると腐食するのが大変にな
り、薄すぎれば支持体としての役目を果すことが出来な
い。
The thickness of the copper support plate used in the present invention is 0.03 to 0.06
1 is preferable; if it is too thick, it will be difficult to corrode, and if it is too thin, it will not be able to function as a support.

本発明で使用するニッケル画像形成層の厚さは0.01
on程度であり得る。
The thickness of the nickel imaging layer used in the present invention is 0.01
It may be about on.

以下図面を参照して本発明の詳細な説明する。The present invention will be described in detail below with reference to the drawings.

第1a〜lh図は本発明の方法の工程を示す。Figures 1a-1h illustrate the steps of the method of the invention.

第1a図は銅支持層lを示し、 第1b図は銅支持M1にレジスト2を付けたものを示し
、 第1c図は露光して画像部分のみにレジストが残ってい
る状態を示し、 第1dl!Iは銅の金属露出面(画像以外の部分)にニ
ッケルメッキ3を行った状態を示し、第1e図はステン
レス網状体の紗4.又はポリエステル等の繊維に金属を
被覆した紗4を枠5に張ったもの。
Fig. 1a shows the copper support layer l, Fig. 1b shows the copper support M1 with resist 2 attached, Fig. 1c shows the state where the resist remains only in the image area after exposure, and the 1dl ! I shows the state in which nickel plating 3 has been applied to the copper metal exposed surface (parts other than the image), and Fig. 1e shows the state in which the stainless steel mesh gauze 4. Alternatively, gauze 4 made of polyester or other fibers coated with metal is stretched over frame 5.

第1f図は枠5に張った紗4に第1dl!lに示される
胴支持M1上の画像形成層をニッケルメッキによって張
り付けた状態を示し、 第1g図は第1f[lの銅支持p!!lを腐食により完
全に除去した状態を示し、 第1h図は更にレジストを溶出させて画像孔を貫通させ
、本発明のサスペンドメタルマスクス版を完成した状態
を示す。
Figure 1f shows the 1st dl on the gauze 4 stretched over the frame 5! Figure 1g shows the state in which the image forming layer on the cylinder support M1 shown in Figure 1 is pasted by nickel plating, and Figure 1g shows the copper support p! ! Figure 1h shows the state in which the resist has been completely removed by corrosion, and the resist has been further eluted to penetrate the image hole, thus completing the suspended metal mask plate of the present invention.

(本発明の効果) 第2a−cQ!Iは従来の方法によるサスペンドメタル
マスク版の製法で支持Ni1i(画像形成層を保護する
Fl)を剥離する時に画像形成FJ13が薄い為に紗1
4が脱落15を生じる状態を示すものである。
(Effects of the present invention) 2nd a-cQ! I is gauze 1 because the image forming FJ13 is thin when the support Ni1i (Fl that protects the image forming layer) is peeled off in the conventional method of manufacturing a suspended metal mask plate.
4 indicates a state in which dropout 15 occurs.

本発明の方法によればこのような脱蓬は全く生じること
なく画像形成層が忠実に形成される。
According to the method of the present invention, such peeling does not occur at all and the image forming layer is faithfully formed.

また本発明では紗への張り付は後は腐食は銅を除く腐食
のみであり、画像形成層も紗も表面がニッケルとなって
いるから従来技術の様に裏側へのtαまわりによる事故
が生じろことなく、上程が簡素化され、版の製作コスト
を少なく出来る。
In addition, in the present invention, after sticking to the gauze, the only corrosion that occurs is corrosion excluding copper, and since both the image forming layer and the gauze have nickel on their surfaces, accidents due to tα rotation to the back side occur as in the prior art. This simplifies the process and reduces plate production costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1azlh図は本発明の方法の工程を示す。 第2a−c図は従来の方法によるサスペンドメタルマス
ク版の製法で支持層を剥離する時に紗が脱落する状態を
示す。
Figure 1 azlh shows the steps of the method of the invention. FIGS. 2a-2c show how the gauze falls off when the support layer is peeled off in a conventional method for manufacturing a suspended metal mask plate.

Claims (1)

【特許請求の範囲】 薄い銅支持板の一方の面にレジストを付け、画像を焼付
けて像の部分だけレジストが除去されている銅露出面上
にニッケルメッキを行って銅支持層上のニッケルの画像
形成層を作成し、 必要に応じて枠はりをした、ステンレスの網状体の紗又
はポリエステル等の繊維の網状体全体に金属を被覆した
紗の一方の面と、上記レジストを付けたままの銅支持層
上のニッケル画像形成層とを、銅支持層側の面がメッキ
されないようにして両者をニッケルメッキすることによ
りはり合わせると共に上記紗の表面全部をニッケルで被
覆し、銅を腐食するがニッケルは腐食しない腐食液で銅
支持層を完全に除去し、 残存するレジストを除去することによりニッケル画像形
成層の画像孔を貫通させることからなる、スクリーン印
刷用サスペンドメタルマスク版の製法。
[Claims] A resist is applied to one side of a thin copper support plate, an image is printed, and nickel plating is performed on the exposed copper surface from which the resist has been removed only in the image area, thereby removing the nickel on the copper support layer. An image forming layer is created, and one side of a mesh of stainless steel or a mesh of fibers such as polyester coated with metal is coated with a frame if necessary, and the above resist is attached. The nickel image forming layer on the copper support layer is bonded to the nickel image forming layer by nickel-plating them so that the surface on the copper support layer side is not plated, and the entire surface of the gauze is coated with nickel to prevent corrosion of the copper. A method for making suspended metal mask plates for screen printing, which consists of completely removing the copper support layer with a corrosive solution that does not corrode nickel, and then penetrating the image holes in the nickel image forming layer by removing the remaining resist.
JP3567587A 1987-02-20 1987-02-20 Manufacturing method of suspended metal mask plate Expired - Lifetime JP2678598B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3567587A JP2678598B2 (en) 1987-02-20 1987-02-20 Manufacturing method of suspended metal mask plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3567587A JP2678598B2 (en) 1987-02-20 1987-02-20 Manufacturing method of suspended metal mask plate

Publications (2)

Publication Number Publication Date
JPS63203787A true JPS63203787A (en) 1988-08-23
JP2678598B2 JP2678598B2 (en) 1997-11-17

Family

ID=12448454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3567587A Expired - Lifetime JP2678598B2 (en) 1987-02-20 1987-02-20 Manufacturing method of suspended metal mask plate

Country Status (1)

Country Link
JP (1) JP2678598B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005037883A (en) * 2003-06-30 2005-02-10 Kenseidou Kagaku Kogyo Kk Metal mask having mesh layer
JP2010042569A (en) * 2008-08-11 2010-02-25 Sonocom Co Ltd Method of manufacturing suspend metal mask, and suspend metal mask
JP2012111195A (en) * 2010-11-26 2012-06-14 Kyushu Hitachi Maxell Ltd Method of manufacturing metal mask, frame member, and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005037883A (en) * 2003-06-30 2005-02-10 Kenseidou Kagaku Kogyo Kk Metal mask having mesh layer
JP2010042569A (en) * 2008-08-11 2010-02-25 Sonocom Co Ltd Method of manufacturing suspend metal mask, and suspend metal mask
JP2012111195A (en) * 2010-11-26 2012-06-14 Kyushu Hitachi Maxell Ltd Method of manufacturing metal mask, frame member, and method of manufacturing the same

Also Published As

Publication number Publication date
JP2678598B2 (en) 1997-11-17

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