JPS6320140Y2 - - Google Patents

Info

Publication number
JPS6320140Y2
JPS6320140Y2 JP1981071108U JP7110881U JPS6320140Y2 JP S6320140 Y2 JPS6320140 Y2 JP S6320140Y2 JP 1981071108 U JP1981071108 U JP 1981071108U JP 7110881 U JP7110881 U JP 7110881U JP S6320140 Y2 JPS6320140 Y2 JP S6320140Y2
Authority
JP
Japan
Prior art keywords
conductor
wiring board
printed wiring
insulating substrate
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981071108U
Other languages
Japanese (ja)
Other versions
JPS57183768U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981071108U priority Critical patent/JPS6320140Y2/ja
Publication of JPS57183768U publication Critical patent/JPS57183768U/ja
Application granted granted Critical
Publication of JPS6320140Y2 publication Critical patent/JPS6320140Y2/ja
Expired legal-status Critical Current

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Landscapes

  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【考案の詳細な説明】 本考案はソルダーレジストの形状に特徴がある
印刷基板に関するものである。
[Detailed Description of the Invention] The present invention relates to a printed circuit board characterized by the shape of a solder resist.

印刷配線基板に電気部品を半田付けして取付け
る場合、各電気部品のリード端子を印刷配線基板
の部品取付孔に挿入して置き、これを一度にフロ
ーソルダ法等により半田付けしている。一枚の印
刷配線基板には非常に多くの抵抗,コンデンサ,
コイル,トランジスタ,端子類のリード端子の挿
入が行なわれ、導電体ランドに塗布されているレ
ジスト露出部で配線用導電体と接続される。半田
用ソルダーレジストの露出部の形状は半田付け精
算性向上や作図方法に起因してほとんど取付孔と
同心形状である。
When attaching electrical components to a printed wiring board by soldering, the lead terminals of each electrical component are inserted into the component mounting holes of the printed wiring board, and these are soldered all at once using a flow soldering method or the like. A single printed wiring board has a large number of resistors, capacitors,
Lead terminals for coils, transistors, and terminals are inserted, and connected to the wiring conductor at exposed portions of the resist coated on the conductor land. The shape of the exposed portion of the solder resist for soldering is almost concentric with the mounting hole due to improved soldering efficiency and the drawing method.

なお第1図において、Aは挿入孔径と銅箔の関
係を示すものであり、またBは箔切れを防止する
ために導電体ランド2と導電体パターン3との間
にアール(R)を設けることを示すものであり、
さらにCは径の大きな端子、角ピンには取付孔1
に対して導電体ランド2の径を大きくすることを
示すものである。
In Fig. 1, A indicates the relationship between the insertion hole diameter and the copper foil, and B indicates that an R is provided between the conductor land 2 and the conductor pattern 3 to prevent the foil from breaking. It shows that
Furthermore, C is a large diameter terminal, and the square pin has 1 mounting hole.
This indicates that the diameter of the conductive land 2 is increased relative to the diameter of the conductive land 2.

しかしながら印刷配線基板完成品を配線導電体
面から見た場合、複雑なパターン形状と非常に多
数のランド部から挿入されている電気部品の位置
を確認し判別することは困難であり、生産工程で
の点検や市場での修理等のサービスは大変な労力
を要していた。多くの場合、印刷配線基板自身に
前記問題解決のためサービスマツプの印刷を一工
程追加して実施していた。
However, when a finished printed wiring board is viewed from the wiring conductor surface, it is difficult to confirm and distinguish the position of the electrical components inserted due to the complex pattern shape and extremely large number of lands, making it difficult to identify the position of the electrical components inserted during the production process. Services such as inspections and repairs in the market required a great deal of effort. In many cases, an additional process of printing a service map on the printed circuit board itself has been carried out to solve the above problem.

本考案は上記欠点を解消する優れた印刷配線基
板を提供することを目的とする。
An object of the present invention is to provide an excellent printed wiring board that eliminates the above-mentioned drawbacks.

以下に本考案の一実施例のレジスト印刷工程で
判別マークを表示した印刷配線基板を第2図とと
もに説明する。従来は電気部品の取付孔41ごと
に同心円形状となつていたレジスト露出部を、こ
こでは電気部品の種類別に一組で形成し、一対の
導電体ランド42の各半田付け部44a,44
b,44c,44d,44e,44fとこの間に
連続する配列方向表示部45a,45b,45c
が判別マークとなるようにソルダーレジストを施
して形成するものである。
A printed wiring board on which a discrimination mark is displayed in the resist printing process according to an embodiment of the present invention will be described below with reference to FIG. 2. Conventionally, exposed resist portions were formed in concentric circles for each mounting hole 41 of an electrical component, but here they are formed as a set for each type of electrical component, and each soldering portion 44a, 44 of a pair of conductor lands 42 is formed as a set for each type of electrical component.
b, 44c, 44d, 44e, 44f and the consecutive arrangement direction display parts 45a, 45b, 45c therebetween.
It is formed by applying a solder resist so that it becomes a discrimination mark.

第2図において、Aは抵抗挿入用,Bはコンデ
ンサ挿入用,Cはコイル挿入用,Dはトランジス
タ挿入用,Eはメツキ線挿入用の具体例をおのお
の示す。これらの判別マークは、挿入電気部品の
種類単位に略円形(半田付け部)の外周に肉眼で
判別できる程度に凹凸部が形成されている。配列
方向表示部45a,45b,45cも肉眼で判別
できる最少限の幅とする。なお、42は導電体ラ
ンド、43は配線用導電体パターンである。
In FIG. 2, A shows a specific example for inserting a resistor, B for inserting a capacitor, C for inserting a coil, D for inserting a transistor, and E for inserting a plated wire. These discrimination marks have irregularities formed on the outer periphery of a substantially circular shape (soldering part) to the extent that they can be distinguished with the naked eye for each type of inserted electrical component. The arrangement direction display parts 45a, 45b, and 45c are also set to the minimum width that can be discerned with the naked eye. Note that 42 is a conductor land, and 43 is a conductor pattern for wiring.

第3図,第4図は上記した本実施例の断面図
で、第3図は第2図の−線によるもの,第4
図は第2図の′−′線によるものである。ここ
で40は絶縁基板である。
3 and 4 are cross-sectional views of the above-mentioned embodiment, and FIG. 3 is taken along the - line in FIG.
The figure is taken along the line '--' of FIG. Here, 40 is an insulating substrate.

以上のように構成された本実施例の印刷配線基
板によれば、レジスト露出部の形状を導電体の形
状より小さい径を有する同心円形状の外周部に挿
入部品により異なる連続した凹凸形状を形成した
ため、半田付性を低下することなく少ない半田で
半田付けでき、結果として配線板の軽量化がはか
れ、かつ連続した配列方向表示部により挿入部品
の判別が容易となり、配線方向が明確化するの
で、生産工程での点検や市場でのサービス性が向
上するものである。さらに印刷配線基板完成品で
他の回路に接続する場合、外部からの加圧でも箔
浮きが減少する効果を有するものである。
According to the printed wiring board of this example configured as described above, the shape of the resist exposed portion is formed on the outer periphery of a concentric circle having a smaller diameter than the shape of the conductor, so that a continuous uneven shape that varies depending on the inserted parts is formed. , it is possible to solder with less solder without reducing solderability, the weight of the wiring board is reduced as a result, and the continuous arrangement direction display makes it easy to identify the inserted parts and the wiring direction is clear. This will improve inspection in the production process and serviceability in the market. Furthermore, when the finished printed wiring board is connected to other circuits, it has the effect of reducing foil lifting even when external pressure is applied.

以上のように本考案によれば、少ない半田で半
田付性を低下させることなく半田付けができると
ともに、印刷配線基板の軽量化もはかれ、かつ、
連続した配列方向表示部により、複雑かつ細かく
小さい配線状態であつても、配列方向が明瞭に判
別できるとともに、もちろん、挿入部品の判別も
レジスト露出部の外周の凹凸形状により一目で判
別でき、印刷配線基板完成品を配線用導電体側か
ら見た場合の挿入電気部品の判別が容易となり、
生産工程での点検や市場でのサービス性が向上す
る。さらに従来品では、サービスマツプとして挿
入部品の配列を印刷配線基板の製造工程で一工程
かけ配線用導電体面に印刷していたものが、本考
案では省略でき、コストダウンを可能ならしめる
効果がある。
As described above, according to the present invention, soldering can be performed with a small amount of solder without reducing solderability, and the weight of the printed wiring board can also be reduced, and
The continuous array direction display section allows you to clearly identify the array direction even in complex, fine, and small wiring conditions, and of course, insert parts can also be identified at a glance by the uneven shape of the outer periphery of the resist exposed area. It is easier to identify the inserted electrical components when viewing the finished wiring board from the wiring conductor side.
Inspection during the production process and serviceability in the market will be improved. Furthermore, in conventional products, the arrangement of inserted parts is printed as a service map on the wiring conductor surface in one step during the manufacturing process of the printed wiring board, but this can be omitted with the present invention, which has the effect of reducing costs. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図A,B,Cは一般的な印刷配線板の設計
基準を示す図、第2図は本考案の一実施例の挿入
部品の判別マークをソルダーレジストの印刷面で
形成した印刷配線板の平面図、第3図は第2図の
−線による断面図、第4図は第2図の′−
′線による断面図である。 1,41……取付孔、2,32,42……導電
体ランド、3,43……配線用導電体パターン、
44a,44b,44c,44d,44e,44
f……ソルダーレジスト露出部、40……絶縁基
板、S……ソルダーレジスト。
Figures 1A, B, and C are diagrams showing design standards for general printed wiring boards, and Figure 2 is a printed wiring board in which identification marks for inserted parts according to an embodiment of the present invention are formed on the printed surface of solder resist. 3 is a sectional view taken along the - line in Fig. 2, and Fig. 4 is a sectional view taken along the - line in Fig. 2.
FIG. 1, 41... Mounting hole, 2, 32, 42... Conductor land, 3, 43... Conductor pattern for wiring,
44a, 44b, 44c, 44d, 44e, 44
f...Solder resist exposed portion, 40...Insulating substrate, S...Solder resist.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板と、この絶縁基板上に印刷配線され電
気回路網を構成する配線用導電体と、この導電体
の所定位置に上記絶縁基板を貫通するように穿設
され電気部品のリード端子が挿入される複数の取
付孔とを有し、上記複数の取付孔をそれぞれ取り
囲む上記導電体上に、ソルダーレジストが施され
て上記導電体の形状より小さい径を有する同心円
形状のレジスト露出部が形成され、かつ上記レジ
スト露出部の外周部に、挿入部品により異なる連
続した凹凸形状パターンが形成されて上記電気部
品の判別マークが形成されるとともに、上記導電
体の間に、1組の挿入される電気部品の配列方向
を示す配列方向表示部が連続して形成された印刷
配線基板。
An insulating substrate, a wiring conductor printed on the insulating substrate to form an electric circuit network, and a lead terminal for an electrical component inserted into a predetermined position of the conductor so as to penetrate through the insulating substrate. a plurality of attachment holes, and a solder resist is applied on the conductor surrounding each of the plurality of attachment holes to form a concentric resist exposed portion having a diameter smaller than the shape of the conductor; Further, on the outer periphery of the exposed resist portion, a continuous uneven pattern that differs depending on the inserted component is formed to form a discrimination mark for the electrical component, and a set of electrical components to be inserted is formed between the conductors. A printed wiring board in which an arrangement direction display section indicating an arrangement direction of the printed wiring board is continuously formed.
JP1981071108U 1981-05-15 1981-05-15 Expired JPS6320140Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981071108U JPS6320140Y2 (en) 1981-05-15 1981-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981071108U JPS6320140Y2 (en) 1981-05-15 1981-05-15

Publications (2)

Publication Number Publication Date
JPS57183768U JPS57183768U (en) 1982-11-20
JPS6320140Y2 true JPS6320140Y2 (en) 1988-06-03

Family

ID=29866906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981071108U Expired JPS6320140Y2 (en) 1981-05-15 1981-05-15

Country Status (1)

Country Link
JP (1) JPS6320140Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7279157B2 (en) * 2019-05-23 2023-05-22 株式会社ソニー・インタラクティブエンタテインメント Printed circuit board and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4019827Y1 (en) * 1963-12-23 1965-07-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4019827Y1 (en) * 1963-12-23 1965-07-10

Also Published As

Publication number Publication date
JPS57183768U (en) 1982-11-20

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