JPS63200752A - Oral cavity mount substance - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to oral attachments, such as orthodontic bands and brackets, which effectively utilize the antibacterial properties of Cu ions.

[Prior Art] In the field of dentistry, so-called orthodontic treatment aimed at improving dentition and the like is widely practiced. Corrective bands, brackets, etc. are used for orthodontic treatment, but
Because these devices are attached closely to the teeth and gums, cleaning of the attachment area tends to be incomplete, and in the case of orthodontic treatment, the treatment period is often over a year. Therefore, oral bacteria (such as Streptococcus mutans) are likely to breed in and around the mounting area, leading to dental caries.

If dental caries is detected, treatment for the caries will need to be restarted after orthodontic treatment is completed, and even if the alignment of the teeth is improved, the health of the teeth (color, shape, etc.) will be affected.
In some cases, the patient is forced to wear a metal cast crown or other prosthetic treatment, resulting in a heavy mental and financial burden on the patient.

[Problems to be Solved by the Invention] The present invention has been made in consideration of these circumstances, and is intended to prevent the proliferation of the oral cavity, which causes the above-mentioned dental caries, during orthodontic treatment, etc., and to provide a long-term solution. It is an object of the present invention to provide an intraoral attachment that does not leave any harmful effects such as caries on the attachment part even if it is attached to the oral cavity.

[Means for Solving the Problems] In the oral attachment according to the present invention, the outermost surface of the oral attachment whose base material or base coating layer is a Cu-based metal is a Cr plating layer or a layer more precious than Cu. The main point is that it is coated with a metal plating layer.

[Effect] The present inventors have conducted various studies in order to prevent the harmful effects such as dental caries caused by the long-term use of oral appliances, and in particular have developed a method that does not cause any harmful effects to the human body even with long-term use, and that will reliably eliminate bacteria. We have conducted extensive research into metal materials that exhibit a reproductive suppression effect.

That is, the test metal materials were Au, Ni, and Cr.

Co, Ag, Cu, Fe, etc. were taken and placed on a culture medium inoculated with Streptococcus mutans, Bacillus aeruginosa, Candida, etc., and the effect of suppressing the growth of these bacteria was investigated.
, Co, was found to have an inhibitory effect on reproduction. The above-mentioned propagation inhibiting effect is thought to be due to Cu ions and Co ions eluted into the medium. Cu and Co are useful as materials for oral attachments because they have a sufficient effect of inhibiting bacterial growth and have sufficient physical properties in terms of strength.
A patent application was previously filed for an intraoral attachment having a Co coating layer.

On the other hand, Cu is a metal material that has a better bacterial growth inhibiting effect than CO, and is the most preferable material from this point of view, but it has the problem of being oxidized or sulfided and discolored when used in a humid environment such as the oral cavity. .

In view of these circumstances, the present invention has further researched an intraoral attachment that can effectively utilize the excellent bacterial growth inhibiting effect of Cu, and has provided an intraoral attachment having the above-mentioned configuration.

That is, by forming the base material or the base material coating layer with a Cu-based metal, the intraoral attachment according to the present invention systematically advances the continuous elution of small amounts of Cu ions into the oral cavity, thereby inducing caries. It is designed to prevent the growth of oral bacteria that can cause rashes, and to prevent harmful effects such as corrosion from remaining on the attachment part even if worn for a long period of time.

The intraoral attachment according to the present invention is formed using a Cu-based metal as a base material, or is made of a metal material other than a Cu-based metal (hereinafter also referred to as a core material) coated with a Cu-based metal. A specific coating layer is formed on top of the
In short, it is sufficient as long as the Cu-based metal is connected to the surface in a form that allows Cu ions to be eluted into the oral cavity (especially saliva), and metal materials other than the Cu-based metal are coated with the Cu-based metal. A typical coating formation method in this case is an electroplating method, but it is not limited to this, and in short, any coating can be applied as long as it has a form that can ensure an effective elution amount that can exhibit the above-mentioned bacterial growth inhibiting effect. Any form may be used, and there is no need to limit the entire surface coverage.
The u-based metal includes pure Cu as well as Cu-based alloys. Furthermore, depending on the material of the core metal material, the Cu-based metal coating layer may easily peel off from the core material (generally stainless steel and various types of Ni-Cr@, but not limited to this in the present invention). However, if there is such a possibility, N
It is recommended to provide an intermediate layer such as i (which is also advantageously formed by a plating method) to ensure adhesion of the Cu-based metal.

On the other hand, if the Cu-based metal is directly exposed to the oral cavity environment,
Since Cu-based metals are oxidized or sulfurized, causing discoloration in the oral cavity, in order to prevent this, the present invention uses Cu-based metals with a highly corrosion-resistant Cr plating layer or plating with a metal nobler than the Cu-based metals. It is coated with a layer to prevent oxidation of the Cu-based metal that is introduced into the oral cavity environment. Incidentally, the above plating coating can also provide the secondary effect of imparting decorative properties and corrosion resistance to the Cu-based metal. In other words, these plating coating layers prevent oxidation or sulfidation of Cu-based metals while ensuring appropriate elution of Cu ions, and are more noble than Cu.
When coating a U-based metal, it is necessary to pay sufficient attention to the porosity, thickness, etc. of the coating layer, as completely blocking the Cu-based metal will result in blocking the elution of Cu ions. Therefore, it is desirable to have a relatively thin porous plating layer. In addition, such metals more noble than Cu include Ag and Rh.
, Pd, Ir, Pt, Au, and alloys thereof, but are not particularly limited. On the other hand, although Cr is a metal less noble than Cu, the Cr-plated surface becomes passivated, so that Cu ions are eluted before Cr ions in terms of ion elution order. Therefore, when a Cu-based metal is coated with a Cr plating layer, Cu ions are preferentially eluted through the minute gaps in the plating, similar to when the Cu-based metal is coated with a plating layer of a metal nobler than Cu, and most of the Cu-based metal is It is covered with a coating layer and oxidation is suppressed.

By the way, the thickness of the coating layer is determined in order to maintain the discoloration resistance of the oral attachment and to measure the elution of Cu ions.

Although it is desirable to suitably design the porosity, etc., in the case of Cr plating, a coating layer that satisfies the above criteria can be obtained with a porosity of 15 to 70%, and a plating coating layer of a metal nobler than Cu can be obtained. In this case, the above criteria can be satisfied under the condition that the thickness is 1 to 0.1 μm. In addition, if an intermediate plating layer such as Ni is provided between the Cu-based metal and the plated coating layer as in the case of the base material and the Cu-based metal, the adhesion of the plated coating layer can be improved.

[Example] Four disk samples (No. 1 to 4) shown in Table 1 were prepared.

No. 1: Cu-plated stainless steel disc (
Thickness: 1mm, diameter: 10mm) No, 2: No,
Disc No. 1 with 5 μm thick porous chrome plating on disc No. 3: No. 1 with 0.5 μm thick Au on disc No.
Plated disk No. 4: No. 1 disk with a thickness of 0.25 μm N
i Disc sample with intermediate plating and 0.5 μm thick Au plating on top of the above disc sample (
Nos. 1 to 4), respectively, to microorganisms (Streptococcus minitans KIR).

IB, BHT, FAI, OMZl 78, etc.) were placed on an agar medium inoculated with bacteria, and the inhibition of the bacteria was observed, and the results shown in Table 1 were obtained.

Table 1 As shown in Table 1, No. 1 (comparative example: no plating coating) can sufficiently inhibit bacterial growth, but Cu
It was difficult to apply it to the oral cavity because it oxidized or sulfurized and changed color. On the other hand, no.

In Examples 2 to 4, the color fastness was good and N
It was confirmed that although it was inferior to No. 1 and No. 1, a sufficiently satisfactory effect of inhibiting bacterial growth was obtained.

[Effects of the Invention] The present invention is configured as described above, and is capable of suppressing oxidation or sulfidation of Cu-based metals even in a humid environment such as the oral cavity, and also ensures sufficient elution of Cu ions. be able to. In this way, the excellent bacterial growth inhibiting effect of the Cu-based metal can be exerted without any hindrance, preventing the growth of oral bacteria that can cause dental caries, and preventing caries from forming on the attachment area even after long-term wear. It was possible to provide an intraoral attachment that does not leave behind any adverse effects.

Claims (1)

[Claims] An intraoral attachment whose outermost surface is coated with a Cr plating layer or a plating layer of a metal nobler than Cu.