JPS63153814A - Adhesive sheet for sticking wafer - Google Patents

Adhesive sheet for sticking wafer

Info

Publication number
JPS63153814A
JPS63153814A JP62043744A JP4374487A JPS63153814A JP S63153814 A JPS63153814 A JP S63153814A JP 62043744 A JP62043744 A JP 62043744A JP 4374487 A JP4374487 A JP 4374487A JP S63153814 A JPS63153814 A JP S63153814A
Authority
JP
Japan
Prior art keywords
wafer
pressure sensitive
adhesive
water
sensitive adhesives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62043744A
Other languages
Japanese (ja)
Other versions
JPH0577284B2 (en
Inventor
Kazuyoshi Ebe
和義 江部
Hiroaki Narita
博昭 成田
Katsuhisa Taguchi
田口　克久
Yoshitaka Akeda
明田　好孝
Takanori Saito
斉藤　隆則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F S K KK
FSK Corp
Original Assignee
F S K KK
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F S K KK, FSK Corp filed Critical F S K KK
Priority to MYPI87000930A priority Critical patent/MY102454A/en
Priority to KR1019870007148A priority patent/KR910002826B1/en
Priority to DE87306075T priority patent/DE3787680T2/en
Priority to EP87306075A priority patent/EP0252739B1/en
Publication of JPS63153814A publication Critical patent/JPS63153814A/en
Priority to MYPI91001866A priority patent/MY109333A/en
Publication of JPH0577284B2 publication Critical patent/JPH0577284B2/ja
Priority to SG23494A priority patent/SG23494G/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To remove pressure sensitive adhesives adhering on the surface of a wafer through one process without a danger having an adverse effect on the human body by applying water-growth pressure sensitive adhesives onto the surface of a base material as a pressure sensitive adhesive layer. CONSTITUTION:Water-growth pressure sensitive adhesives are applied onto the surface of a base material 2 as a pressure sensitive adhesive layer 3. Pres sure sensitive adhesives, in which copolymers are mutually entangled and cross- linked and swollen finitely when they are brought into contact with water in a copolymer using a monomer such as a monomer containing an unsaturated carboxylic acid and a monomer such as an acrylic acid ester group monomer as units, are employed as the water-growth pressure sensitive adhesives. When a release sheet 4 is fitted, the sheet 4 is removed, and a wafer A, the rear of which must be polished and treated, is stuck onto the pressure sensitive adhesive layer 3. The wafer is stuck onto the pressure sensitive adhesive layer 3 so that the surface of the wafer to which a pattern 5 is shaped is brought into contact at that time. Since adhering pressure sensitive adhesives B have sufficient water-solubility, the adhering pressure sensitive adhesives can be easily washed away.

Description

【発明の詳細な説明】 １哩例技術分盟 本発明は半導体ウェハの裏面研摩用粘着シートに関し、
さらに詳しくは、エツチングなどにより表面にパターン
が形成された半導体ウェハの裏面を研摩する際に用いら
れるウェハ貼着用粘着シートに関する。[Detailed Description of the Invention] 1. Technical Field The present invention relates to an adhesive sheet for polishing the back surface of a semiconductor wafer.
More specifically, the present invention relates to a wafer adhesion adhesive sheet used for polishing the back surface of a semiconductor wafer whose surface has a pattern formed by etching or the like.

ａの　　　１単ｔらびに　のロ シリコン、ガリウムヒ素などの半導体ウェハの表面には
、エツチングあるいはリフトオフ法などによってパター
ンが形成される。次いで表面にパターンが形成されたウ
ェハは、通常、その表面に粘着シートが貼着された状態
で、その裏面にグラインダーなどにより研摩処理が加え
られる。パターンが形成されたウェハの裏面に研摩を加
える目的は、第１にエツチング工程時にウェハ表面に酸
化物皮膜が形成されることがあるため、この酸化物皮膜
を除去することにあり、第２にパターンが形成されたウ
ェハの厚みを調節することにある。A pattern is formed on the surface of a semiconductor wafer made of silicon, gallium arsenide, etc. by etching or a lift-off method. Next, the wafer with a pattern formed on its surface is usually polished with a grinder or the like on its back surface, with an adhesive sheet attached to the surface. The purpose of polishing the back surface of a wafer on which a pattern has been formed is, first, to remove an oxide film that may be formed on the wafer surface during the etching process, and second, to remove this oxide film. The purpose is to adjust the thickness of a wafer on which a pattern is formed.

ところで、表面にパターンが形成されたウェハの裏面に
研摩処理を加えるに際しては、生ずる研摩屑を除去する
ため、そして研摩時に発生する熱を除去するために、精
製水によりウェハ裏面を洗いなからウェハの裏面研摩処
理を行なっている。By the way, when polishing the back side of a wafer with a pattern formed on its front side, the back side of the wafer must be washed with purified water to remove polishing debris and heat generated during polishing. The back surface is polished.

したがってウェハの裏面研摩処理を行なうに際して、ウ
ェハ表面に形成されたパターンを保護するためにウェハ
表面に貼着される粘着シートは、耐水性を有している必
要がある。このような粘着シートでは、粘着剤として溶
剤型アクリル系粘着剤が広く用いられてきた。Therefore, when polishing the back surface of a wafer, the adhesive sheet that is attached to the wafer surface in order to protect the pattern formed on the wafer surface must have water resistance. In such pressure-sensitive adhesive sheets, solvent-based acrylic pressure-sensitive adhesives have been widely used as pressure-sensitive adhesives.

このようにしてウェハ表面の研摩処、理が終了した後、
粘着シートはウェハ表面から剥離されるが、この際どう
してもパターンが形成されたウェハ表面にアクリル系な
どの粘着剤が付着してしまうことがあった。このため、
ウェハ表面に付着した粘着剤を除去する必要があった。After polishing and processing the wafer surface in this way,
Although the adhesive sheet is peeled off from the wafer surface, an acrylic adhesive or the like inevitably adheres to the patterned wafer surface. For this reason,
It was necessary to remove the adhesive that had adhered to the wafer surface.

ウェハ表面に付着したアクリル系などの粘着剤の除去は
、従来、ウェハ表面を、トリクレンなどの含塩素系有機
溶剤で洗浄した後精製水で洗浄することによって行なわ
れてきた。ところがウェハ表面の洗浄に用いられるトリ
クレンなどの含塩素溶剤は、人体に対して悪影響を与え
る危険性が指摘されているため、その使用を控えること
が望まれている。また上記のようにウェハ表面の洗浄工
程は、トリクレンなどの有機溶剤で洗浄した後精製水で
洗浄するという２つの工程からなっているため、手間が
かかるという問題点があった。このため、トリクレンな
ど含塩素系有機溶剤に代わって、精製水によってウェハ
表面を洗浄してウェハ表面に付着した粘着剤を除去する
ことができれば、人体に対する危険性もなく、しかも１
つの工程でウェハ表面の洗浄工程が終了しうるという大
きな効果が得られる。ところが上述のように、ウェハ表
面の研摩工程は、ウェハ裏面を精製水により洗いながら
行なっているため、もし粘着シートの粘着剤として従来
から水溶性粘着剤として広く用いられる水溶性の粘着剤
を用いたのでは、上記の研摩工程中に粘着剤が溶解して
しまい、ウェハ表面と粘着シートとの間にウェハ研摩屑
が入り込んで、ウェハ表面に形成されたパターンが破壊
されてしまうという問題点が生じてしまう。Removal of adhesives such as acrylic adhesives adhering to the wafer surface has conventionally been carried out by cleaning the wafer surface with a chlorinated organic solvent such as trichloride, and then cleaning it with purified water. However, it is desirable to refrain from using chlorine-containing solvents such as trichlene, which are used to clean the wafer surface, because it has been pointed out that they may have an adverse effect on the human body. Further, as mentioned above, the process of cleaning the wafer surface consists of two processes: cleaning with an organic solvent such as trichlene and then cleaning with purified water, which poses the problem of being time-consuming. For this reason, if the wafer surface could be cleaned with purified water to remove the adhesive attached to the wafer surface instead of using chlorine-containing organic solvents such as trichlene, there would be no danger to the human body, and it would be possible to
A great effect can be obtained in that the wafer surface cleaning process can be completed in just one process. However, as mentioned above, the polishing process on the wafer surface is performed while washing the back side of the wafer with purified water. However, there is a problem in that the adhesive dissolves during the polishing process mentioned above, and wafer polishing debris gets between the wafer surface and the adhesive sheet, destroying the pattern formed on the wafer surface. It will happen.

■咀例貝拍 本発明は、上記のような従来技術に伴なう問題点を一挙
に解決しようとするものであって、表面にパターンが形
成されたウェハの裏面を研摩処理する際に、ウェハ表面
に貼着される粘着シートであって、研摩処理の終了後に
ウェハ表面に付着した粘着剤をトリクレンなどの有機溶
剤を用いずに水によって洗浄することによって除去する
ことができ、したがって人体に悪影響を与える危険性が
なく、しかもウェハ表面にけ着した粘着剤を１工程によ
って除去することができるような粘着シートを提供する
ことを目的としている。The present invention attempts to solve all of the problems associated with the above-mentioned conventional techniques at once. It is an adhesive sheet that is attached to the wafer surface, and after the polishing process is finished, the adhesive attached to the wafer surface can be removed by washing with water without using an organic solvent such as Triclean, and therefore it is not harmful to the human body. It is an object of the present invention to provide a pressure-sensitive adhesive sheet that does not pose a risk of adverse effects and can remove the pressure-sensitive adhesive adhering to the surface of a wafer in one step.

及哩り鳳！ 本発明に係るウェハ貼着用粘着シートは、表面にパター
ンが形成されたウェハの裏面を研摩処理する際にウェハ
表面に貼着される粘着シートであって、基材面上に、粘
着剤層として水膨潤性粘着剤が塗布されていることを特
徴としている。Reach out! The adhesive sheet for wafer adhesion according to the present invention is an adhesive sheet that is applied to the surface of a wafer when the back surface of the wafer having a pattern formed thereon is polished, and is applied as an adhesive layer on the base material surface. It is characterized by being coated with a water-swellable adhesive.

本発明に係るウェハ貼着用粘着シートは、表面にパター
ンが形成されたウェハの裏面を研摩処理する際にウェハ
表面に貼着されるシートであって、基材面上に、粘着剤
層として水膨潤性粘着剤が塗布されて形成されているな
め、ウェハ表面の研摩処理の終了後にウェハ表面から粘
着シートを剥離させた際にウェハ表面に粘着剤が付着し
ていても、トリクレンなどの有機溶剤を用いずに水によ
って洗浄すれば粘着剤を除去することができる。したが
って人体に悪影響を与える危険性がなく、しかもウェハ
表面に付着した粘着剤を１工程によって除去することが
できる。The adhesive sheet for wafer adhesion according to the present invention is a sheet that is applied to the surface of a wafer when the back surface of the wafer having a pattern formed thereon is polished, and is formed by applying water as an adhesive layer on the base material surface. Since the swellable adhesive is applied to the surface of the wafer, organic solvents such as trichlene may The adhesive can be removed by washing with water without using. Therefore, there is no risk of adversely affecting the human body, and the adhesive adhering to the wafer surface can be removed in one step.

ｌ呪ａ且体煎皿朋 以下本発明に係るウェハ貼着用粘着シートを具体的に説
明する。The adhesive sheet for attaching wafers according to the present invention will be specifically described below.

本発明に係るウェハ貼着用粘着シート１は、その断面図
が第１図に示されるように、基材２とこの表面に塗着さ
れた粘着剤層３とからなっており、使用前にはこの粘着
剤層３を保護するため、第２図に示すように粘着剤３の
上面に剥離性シート４を仮粘着しておくことが好ましい
。The adhesive sheet 1 for pasting wafers according to the present invention, as its cross-sectional view is shown in FIG. In order to protect this adhesive layer 3, it is preferable to temporarily adhere a releasable sheet 4 to the upper surface of the adhesive 3 as shown in FIG.

本発明に係るウェハ貼着用粘着シートの形状は、テープ
状、ラベル状などあらゆる形状をとりうる。The shape of the adhesive sheet for wafer adhesion according to the present invention can be any shape such as a tape shape or a label shape.

基材２としては、耐水性および耐熱性に優れているもの
が適し、特に合成樹脂フィルムが適する。As the base material 2, a material having excellent water resistance and heat resistance is suitable, and a synthetic resin film is particularly suitable.

このような基材２としては、具体的に、ポリエチレンフ
ィルム、ポリプロピレンフィルム、ポリ塩化ビニルフィ
ルム、ポリエチレンテレフタレートフィルム、ポリブチ
レンテレフタレートフィルム、ポリブテンフィルム、ポ
リブタジェンフィルム、ポリウレタンフィルム、ポリメ
チルペンテンフィルム、エチレン酸とフィルムなどが用
いられる。また基材２として、架橋ポリオレフィンある
いはエチレン−メタクリル酸共重合体フィルムを用いる
こともできる。Specific examples of such a base material 2 include polyethylene film, polypropylene film, polyvinyl chloride film, polyethylene terephthalate film, polybutylene terephthalate film, polybutene film, polybutadiene film, polyurethane film, polymethylpentene film, and ethylene film. Acid and film are used. Further, as the base material 2, a crosslinked polyolefin or an ethylene-methacrylic acid copolymer film can also be used.

本発明では、上記のような基材面上に、粘着剤層３とし
て水膨潤性粘着剤が塗布されている。In the present invention, a water-swellable adhesive is applied as the adhesive layer 3 on the base material surface as described above.

この水膨潤性粘着剤とは、不飽和カルボン酸含有モノマ
ーとアクリル酸エステル系モノマーを構成単位とする共
重合体において、その共重合体同士がからみ合ったり、
架橋していて、水と接触すると有限膨潤する粘着剤であ
る。また実用上、その粘着剤の水溶性あるいは粘着特性
を変化させる必要がある場合には、通常使用される親水
性可塑剤あるいは親水性エポキシ化合物を上記水膨潤性
粘着剤と組み合せて用いてもよい。This water-swellable adhesive is a copolymer whose constituent units are an unsaturated carboxylic acid-containing monomer and an acrylic acid ester monomer, and the copolymers are entangled with each other.
It is a cross-linked adhesive that swells finitely when it comes in contact with water. In addition, if it is necessary to change the water solubility or adhesive properties of the adhesive for practical purposes, a commonly used hydrophilic plasticizer or hydrophilic epoxy compound may be used in combination with the water-swellable adhesive. .

上記のような水膨潤性粘着剤としては、たとえば特公昭
４９−２３２９４号公報に記載されているような粘着剤
を用いることができる。As the above-mentioned water-swellable adhesive, for example, the adhesive described in Japanese Patent Publication No. 49-23294 can be used.

すなわち、（Ａ）エチレンオキシド基を親水性成分とす
る非イオン界面活性剤の１種または２種以上、および（
Ｂ＞−ｒｅ記式（Ｉ）で示される構成単位の１種または
２種以上４０〜９９モル％と、下記式（ＩＩ）で示され
る構成単位の１種または２種以上６０〜１モル％とで構
成される共重合体の１種または２種以上からなり、必要
に応じて、成分（Ｂ）の有するカルボキシル基を酢酸亜
鉛あるいは塩化マグネシウムなどのカルボキシル基と反
応する架橋剤で架橋させて得られる粘着剤を用いること
ができる。なお架橋剤による架橋時に水酸化ガリウムな
どのアルカリ性化合物を共存させでもよい。That is, (A) one or more nonionic surfactants having an ethylene oxide group as a hydrophilic component, and (
B>-re 40 to 99 mol% of one or more structural units represented by formula (I) and 60 to 1 mol% of one or more structural units represented by formula (II) below If necessary, the carboxyl group of component (B) is crosslinked with a crosslinking agent that reacts with the carboxyl group, such as zinc acetate or magnesium chloride. The resulting adhesive can be used. Note that an alkaline compound such as gallium hydroxide may be present during crosslinking using a crosslinking agent.

ＨＲ１ ＨＲ２ （式中Ｒ１は水素、塩素または低級アルキル基でＣＯＮ
　ＨＣＨ２０Ｈｌ　ＣＨ２０Ｈ，Ｃ２Ｈ４０Ｈ１−ＯＨ
１（さ　てあり、ここでＲ３は炭素数１〜８のアルキル
基である。）Ｘ　　　　　　Ｚ （ＩＩ）　　　−Ｃ−Ｃ− Ｙ　　　　　Ｃ００Ｈ （式中、ｘ、ｙ、ｚは、同一であっても互いに異なって
いてもよく、水素、塩素、低級アルキルまたは−ＣＯＯ
Ｒ４、−ＣＯＯＨｌ　ＣＨ２Ｃ００Ｈ１ＣＨ２Ｃ００Ｒ
４であり、ここでＲ４は炭素数１〜４のアルキル基であ
る。） 成分（Ａ＞であるエチレンオキシド基を親水性成分とす
る非イオン界面活性剤としては、具体的には下記のよう
なものが用いられる。HR1 HR2 (In the formula, R1 is hydrogen, chlorine, or a lower alkyl group, and CON
HCH20Hl CH20H, C2H40H1-OH
1 (here, R3 is an alkyl group having 1 to 8 carbon atoms) may be different from each other, hydrogen, chlorine, lower alkyl or -COO
R4, -COOHl CH2C00H1CH2C00R
4, where R4 is an alkyl group having 1 to 4 carbon atoms. ) Specifically, the following nonionic surfactants having an ethylene oxide group as a hydrophilic component, which is component (A>), are used.

（ｉ　）　ＯＨ（Ｃ２Ｈ４０）　ａ　（Ｃ３Ｈ６０）　
ｂ（Ｃ２Ｈ４０）、Ｈ （式中、ａ、ｂ、ｃは２０〜８０の整数である。）（ｉ
　）ＲＡ　＜Ｃ２Ｈ４０）。Ｈ （式中、Ｒは炭素数６〜１８のアルキル基、炭素数４〜
２０のアルキル基を有するアルキルフェニル基、または Ｈ（またはＣＨ３） Ａは酸素、硫黄または−Ｃ００ｌ−ＣＯＮＨ１ＣＯＮ（
Ｃ２Ｈ４０）。Ｈ，ＰＯ４Ｈ，ＰＯ４（Ｃ２Ｈ４０）、
Ｈであり、ｅは２〜８０の整数である。） ０（Ｃ２Ｈ４０）ｙＨ （式中、Ｒは炭素数６〜１８のアルキル基であり、ｘ、
　ｙ、　ｚは２〜４０の整数である。）上記のような（
Ａ）非イオン界面活性剤としては、具体的には、ポリエ
チレングリコールノニルフェニルエーテル、ポリエチレ
ングリコールソルビタンモノオレイルエステル、ポリエ
チレングリコールラウリルエーテル、ポリエチレングリ
コールとポリプロピレングリコールのブロックポリマー
、ポリエチレングリコールラウリルフェニルエーテル、
ポリエチレングリコールｔ−ブチルフェニルエーテルな
どが用いられる。(i) OH(C2H40) a (C3H60)
b(C2H40), H (wherein a, b, c are integers of 20 to 80) (i
)RA<C2H40). H (wherein R is an alkyl group having 6 to 18 carbon atoms, 4 to 18 carbon atoms,
Alkylphenyl group having 20 alkyl groups, or H (or CH3) A is oxygen, sulfur or -C00l-CONH1CON (
C2H40). H, PO4H, PO4 (C2H40),
H, and e is an integer from 2 to 80. ) 0(C2H40)yH (wherein, R is an alkyl group having 6 to 18 carbon atoms, x,
y and z are integers from 2 to 40. ) as above (
A) Nonionic surfactants include polyethylene glycol nonylphenyl ether, polyethylene glycol sorbitan monooleyl ester, polyethylene glycol lauryl ether, block polymers of polyethylene glycol and polypropylene glycol, polyethylene glycol lauryl phenyl ether,
Polyethylene glycol t-butylphenyl ether and the like are used.

成分（Ｂ）における上記式＜Ｉ）で示される構成単位は
、たとえば酢酸ビニルなどのビニルエステル、アクリル
酸エチルなどのアクリル酸エステル、メタクリル酸エチ
ルなどのメタクリル酸エステル、エチレン、スチレン、
メチルビニルエーテル、塩化ビニル、アクリロニトリル
などのモノマーから導入される。また成分（Ｂ）におけ
る上記式（ｎ）で示される構成単位は、カルボキシル基
を有するモノマー、たとえばアクリル酸、メタクリル酸
、クロトン酸、イタコン酸、マレイン酸、フマル酸、ア
コニット酸、モノアルキルマレイン酸、モノアルキルフ
マル酸、モノアルキルイタコン酸などから導入される。The structural unit represented by the above formula <I) in component (B) is, for example, a vinyl ester such as vinyl acetate, an acrylic ester such as ethyl acrylate, a methacrylic ester such as ethyl methacrylate, ethylene, styrene,
It is introduced from monomers such as methyl vinyl ether, vinyl chloride, and acrylonitrile. In addition, the structural unit represented by the above formula (n) in component (B) is a monomer having a carboxyl group, such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, aconitic acid, monoalkylmaleic acid. , monoalkyl fumaric acid, monoalkyl itaconic acid, etc.

上記成分＜Ａ）と成分（Ｂ）とは、相溶しなければなら
ず、しかも得られる粘着剤が水膨潤性でなければならな
い。このため、成分（Ａ＞と成分＜Ｂ）との量的な関係
が定められている。The above component <A) and component (B) must be compatible with each other, and the resulting adhesive must be water-swellable. For this reason, a quantitative relationship between component (A> and component <B) is determined.

また場合によっては、上記のような成分（Ａ）および成
分（Ａ）とともに、グリシジルエーテル系のエポキシ化
合物を用いることもできる。In some cases, a glycidyl ether-based epoxy compound can also be used together with component (A) and component (A) as described above.

また水膨潤性粘着剤として、特開昭５９−１５７１６２
号公報に記載されているような粘着剤を用いることもで
きる。Also, as a water-swellable adhesive, JP-A-59-157162
It is also possible to use an adhesive as described in the above publication.

すなわち、（Ａ）水溶性ポリマーと、（Ｂ）重合して得
られるポリマーが水溶性あるいは水膨潤性である（メタ
）アクリル酸エステルモノマーとからなる粘着剤を用い
ることができる。That is, an adhesive consisting of (A) a water-soluble polymer and (B) a (meth)acrylic acid ester monomer whose polymer obtained by polymerization is water-soluble or water-swellable can be used.

具体的には成分（Ａ）としては、式 ％式％ は炭素数２〜４のアルキレン基であり、Ｒ３は炭素数１
以上のアルキル基であり、ｎは１以上の整数である）で
表わされる（メタ）アクリル酸エステルモノマー、アク
リル酸、ビニルピロリドン、アクリルアミド、ジメチル
アミノエチル（メタ）アクリレート、ジエチルアミノエ
チル（メタ）アクリレート、ビニルメチルエーテルなど
が用いられる。また場合によっては、水溶性ポリマーと
して、上記のようなモノマーにアクリル酸エステル、酢
酸ビニル、スチレン等を３０重量部までの量で共重合さ
せて得られるポリマーも用いることができる。Specifically, as component (A), the formula % is an alkylene group having 2 to 4 carbon atoms, and R3 is an alkylene group having 1 carbon number.
(meth)acrylic acid ester monomers, acrylic acid, vinylpyrrolidone, acrylamide, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, Vinyl methyl ether and the like are used. In some cases, a polymer obtained by copolymerizing the above-mentioned monomers with an acrylic ester, vinyl acetate, styrene, etc. in an amount of up to 30 parts by weight may also be used as the water-soluble polymer.

また成分（Ｂ）としては、具体的には、（メタ）アクル
酸エステルモノマー、ジメチルアミンエチル（メタ）ア
クリレート、ジエチルアミノエチル（メタ）アクリレー
トが用いられる。Further, as component (B), specifically, (meth)acrylic acid ester monomer, dimethylamine ethyl (meth)acrylate, and diethylaminoethyl (meth)acrylate are used.

さらに水膨潤性粘着剤として、特開昭５６−７００７７
号公報に記載されているような粘着剤を用いることもで
きる。Furthermore, as a water-swellable adhesive, JP-A-56-70077
It is also possible to use an adhesive as described in the above publication.

すなわち、（Ａ＞カルボキシル基含有モノマー１０〜４
０モル％、アルキル基の炭素数が４以上である（メタ）
アクリル酸アルキルエステル６０〜９０モル％および上
記以外のとニルモノマー０〜２０モル％よりなる共重合
体中のカルボキシル基を中和した共重合体塩および（Ｂ
）式Ｒ１０（Ｒ２０）ｎＲ３（式中、Ｒ１は炭素数１〜
４のアルキル基であり、Ｒ２は炭素数２〜４のアルキレ
ン基であり、Ｒ３は水素、炭素数１〜４のアルキル基ま
たはアセチル基であり、ｎは１〜６の整数である）で表
わされる親水性化合物からなる水膨潤性粘着剤を用いる
ことができる。That is, (A>carboxyl group-containing monomer 10-4
0 mol%, the number of carbon atoms in the alkyl group is 4 or more (meta)
A copolymer salt obtained by neutralizing the carboxyl group in a copolymer consisting of 60 to 90 mol% of an acrylic acid alkyl ester and 0 to 20 mol% of a monomer other than the above, and (B
) Formula R10(R20)nR3 (wherein, R1 has 1 to 1 carbon atoms
R2 is an alkylene group having 2 to 4 carbon atoms, R3 is hydrogen, an alkyl group having 1 to 4 carbon atoms, or an acetyl group, and n is an integer of 1 to 6). A water-swellable adhesive consisting of a hydrophilic compound can be used.

このような粘着剤が塗布されてなる粘着シート１は、ウ
ェハＡの裏面を研摩する際には、ウェハに精製水が吹き
付けられた場合、含水後、膨潤平衡に達して、パターン
部分までの浸水を防ぐ効果により、ウェハ表面と粘着シ
ートとの間にウェハ研摩屑が入り込むことはなくウェハ
表面に形成されたパターンを十分保護しうる。When polishing the back surface of the wafer A, the adhesive sheet 1 coated with such an adhesive reaches a swelling equilibrium after absorbing water when purified water is sprayed onto the wafer, causing water to seep into the pattern area. This prevents wafer polishing debris from entering between the wafer surface and the adhesive sheet, and the pattern formed on the wafer surface can be sufficiently protected.

次に本発明に係るウェハ貼着用粘着シート１の使用方法
について説明する。Next, a method of using the adhesive sheet for wafer attachment 1 according to the present invention will be explained.

本発明に係るウェハ貼着用粘着シート１の上面に剥離性
シート４が設けられている場合には、該シート４を除去
し、次いでこの粘着剤層３に、裏面に研摩処理をすべき
ウェハＡを貼着する。この際粘着剤層３上に、第３図に
示すようにパターン５が形成されたウェハ表面が接する
ようにして貼着する。When a releasable sheet 4 is provided on the upper surface of the adhesive sheet 1 for attaching wafers according to the present invention, the sheet 4 is removed, and then the adhesive layer 3 is coated with a wafer A whose back surface is to be polished. Paste. At this time, the wafer surface on which the pattern 5 is formed is attached to the adhesive layer 3 so that it is in contact with the surface of the wafer, as shown in FIG.

このような状態で、ウェハ裏面６をグラインダー７など
によって研摩して、ウェハ裏面６に形成された酸化物皮
膜などを除去するとともに、ウェハＡの厚みを所望の厚
さに調節する。この際精製水をウェハＡに吹き付けるな
どしてウェハ研摩屑を洗い去るとともに、研摩時に発生
する熱を除去する。In this state, the wafer back surface 6 is polished by a grinder 7 or the like to remove the oxide film formed on the wafer back surface 6 and adjust the thickness of the wafer A to a desired thickness. At this time, purified water is sprayed onto the wafer A to wash away wafer polishing debris and remove heat generated during polishing.

次に研摩が終了した後に、ウェハＡから粘着シート１を
剥離する。この際ウェハＡのパターン５が形成された表
面に、水溶性粘着剤などが付着することもある。この付
着した粘着剤Ｂは、充分な水溶性を有しているため、こ
の付着した粘着剤は、精製水Ｃで簡単に洗い去ることが
できる。Next, after polishing is completed, the adhesive sheet 1 is peeled off from the wafer A. At this time, a water-soluble adhesive or the like may adhere to the surface of the wafer A on which the pattern 5 is formed. Since this adhered adhesive B has sufficient water solubility, this adhered adhesive can be easily washed away with purified water C.

このように本発明に係るウェハ貼着用粘着シート１では
、粘着剤として水膨潤性粘着剤が用いられているため、
たとえウェハ表面に粘着剤が付着しても、該粘着剤をト
リクレンなどの有機溶剤を用いずに精製水によって洗浄
することによって除去することができ、したがって、人
体に悪影響を与える危険性が全くない。しかも従来では
、粘着剤が付着したウェハ表面をトリクレンなどの有機
溶剤で洗浄した後精製水で洗浄するという２工程が必要
であったが、本発明では、粘着剤が付着したウェハ表面
を精製水で洗浄すればよいため、洗浄を１工程で行なう
ことができる。As described above, in the adhesive sheet 1 for attaching wafers according to the present invention, since a water-swellable adhesive is used as the adhesive,
Even if adhesive adheres to the wafer surface, it can be removed by cleaning it with purified water without using an organic solvent such as Triclean, and therefore there is no risk of adverse effects on the human body. . Moreover, in the past, two steps were required: cleaning the wafer surface with the adhesive with an organic solvent such as Triclean and then cleaning it with purified water, but with the present invention, the wafer surface with the adhesive attached is cleaned with purified water. The cleaning can be done in one step.

また本発明に係るウェハ貼着用粘着シート１は、ウェハ
Ａ真面の研摩時には、ウェハＡと充分な接着力を有して
貼着されているため、ウェハ表面と粘着シートとの間に
ウェハ研摩屑が入り込んでウェハ表面に形成されたパタ
ーンが破壊されることがない。Further, since the adhesive sheet 1 for attaching a wafer according to the present invention is attached to the wafer A with sufficient adhesive force when polishing the surface of the wafer A, there is a gap between the wafer surface and the adhesive sheet. The pattern formed on the wafer surface will not be destroyed due to debris entering.

及咀ムカユ 本発明に係るウェハ貼着用粘着シートは、表面にパター
ンが形成されたウェハの裏面を研摩処理する際にウェハ
表面に貼着されるシートであって、基材面上に、粘着剤
層として水膨潤性粘着剤が塗布されて形成されているた
め、ウェハ表面の研摩処理の終了後にウェハ表面から粘
着シートを剥離させた際にウェハ表面に粘着剤が付着し
ていても、トリクレンなどの有機溶剤を用いずに水によ
って洗浄することによって粘着剤を除去することができ
る。したがって人体に悪影響を与える危険性がなく、し
かもウェハ表面に付着した粘着剤を１工程によって除去
することができる。The adhesive sheet for attaching wafers according to the present invention is a sheet that is attached to the surface of a wafer when the back surface of the wafer having a pattern formed thereon is polished. Since it is formed by applying a water-swellable adhesive as a layer, even if the adhesive is attached to the wafer surface when the adhesive sheet is peeled off from the wafer surface after polishing the wafer surface, it will not be damaged by Triclean, etc. The adhesive can be removed by washing with water without using any organic solvent. Therefore, there is no risk of adversely affecting the human body, and the adhesive adhering to the wafer surface can be removed in one step.

大里透ユ （ｉ）アクリル酸エチルと酢酸ビニルとメタクリル酸と
の共重合体および（ｉ）ポリエチレングリコールラウリ
ルエーテルからなり、水酸化カリウムの存在下で酢酸亜
鉛により架橋してなるアクリル系水膨潤性粘着剤を５０
μｍ厚のポリエステルフィルム上に乾燥後の塗布量が４
０ｇ／ｒｒｒになるように塗布し、Ｊ　Ｉ　５Ｚ−０２
３７による１８０”接着力が９０ｇ／２５ａｗｎである
粘着シートを得た。Water-swellable acrylic water-swellable acrylic material consisting of Toyu Osato (i) a copolymer of ethyl acrylate, vinyl acetate, and methacrylic acid, and (i) polyethylene glycol lauryl ether, crosslinked with zinc acetate in the presence of potassium hydroxide. 50 adhesive
The coating amount after drying is 4 μm thick polyester film.
Apply to 0g/rrr, J I 5Z-02
A pressure-sensitive adhesive sheet having a 180" adhesive strength of 90 g/25 awn based on No. 37 was obtained.

この粘着シートの粘着剤面をパターン形成後のウェハ表
面に、荷重１眩の加圧ロールを用いて貼着した。この試
料をウェハ裏面が上となるようにグラインド装置に正確
に固定し、水圧３０ｋｇ／ａａ水噴霧下で５分間研磨し
た。The adhesive surface of this adhesive sheet was adhered to the surface of the wafer after pattern formation using a pressure roll with a load of 1 dazzle. This sample was accurately fixed in a grinding device so that the back surface of the wafer was facing upward, and polished for 5 minutes under a water pressure of 30 kg/aa water spray.

その後、粘着テープを剥離し、洗浄を行ない乾燥してか
ら、ウェハ表面を電子顕微鏡にて観察した。Thereafter, the adhesive tape was peeled off, washed and dried, and the wafer surface was observed using an electron microscope.

結果を表１に示す。The results are shown in Table 1.

止致■１ 溶剤型アクリル系粘着剤（ｎ−ブチルアクリレートと酢
酸ビニルとアクリル酸との共重合体、（分子量３０万＞
、１００重量部とイソシアネート硬化剤１０重量部とか
らなる）を実施例１と同様にポリエステルフィルム上に
塗布し、同じく１８０°接着力が８５ｇ／２５ｍｍであ
る粘着シートを得た。Attachment ■1 Solvent-type acrylic adhesive (copolymer of n-butyl acrylate, vinyl acetate, and acrylic acid, (molecular weight 300,000>
, and 10 parts by weight of an isocyanate curing agent) was applied onto a polyester film in the same manner as in Example 1 to obtain a pressure-sensitive adhesive sheet having a 180° adhesive strength of 85 g/25 mm.

この粘着シートをウェハ表面に貼着し、同様の試験を行
なった。This adhesive sheet was attached to the surface of a wafer and a similar test was conducted.

結果を表１に示す。The results are shown in Table 1.

去−１ ＊電子顕微鏡　倍率　５０００倍Leaving -1 *Electron microscope magnification 5000x

【図面の簡単な説明】[Brief explanation of the drawing]

第１図および第２図は、本発明に係る粘着シートの断面
図であり、第３図および第４図は本発明に係る粘着シー
トを用いてウェハ裏面を研摩する際の説明図である。1 and 2 are cross-sectional views of the adhesive sheet according to the present invention, and FIGS. 3 and 4 are explanatory views when polishing the back surface of a wafer using the adhesive sheet according to the present invention.

Claims (1)

【特許請求の範囲】[Claims] （１）表面にパターンが形成されたウェハの裏面を研摩
処理する際にウェハ表面に貼着される粘着シートであっ
て、基材面上に、粘着剤層として水膨潤性粘着剤が塗布
されていることを特徴とするウェハ貼着用粘着シート。(1) An adhesive sheet that is attached to the surface of a wafer when the back surface of the wafer with a pattern formed thereon is polished, and a water-swellable adhesive is applied as an adhesive layer on the base material surface. An adhesive sheet for attaching wafers.
JP62043744A 1986-07-09 1987-02-26 Adhesive sheet for sticking wafer Granted JPS63153814A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
MYPI87000930A MY102454A (en) 1986-07-09 1987-07-02 Adhesive sheets for sticking wafers thereto
KR1019870007148A KR910002826B1 (en) 1986-07-09 1987-07-04 Adhesive sheet for sticking afers
DE87306075T DE3787680T2 (en) 1986-07-09 1987-07-09 Adhesive strips for sticking platelets.
EP87306075A EP0252739B1 (en) 1986-07-09 1987-07-09 Adhesive sheets for sticking wafers thereto
MYPI91001866A MY109333A (en) 1986-07-09 1991-10-12 Adhesive sheets for sticking wafers thereto
SG23494A SG23494G (en) 1986-07-09 1994-02-07 Adhesive sheets for sticking wafers thereto.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61-161682 1986-07-09
JP16168286 1986-07-09

Publications (2)

Publication Number Publication Date
JPS63153814A true JPS63153814A (en) 1988-06-27
JPH0577284B2 JPH0577284B2 (en) 1993-10-26

Family

ID=15739841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62043744A Granted JPS63153814A (en) 1986-07-09 1987-02-26 Adhesive sheet for sticking wafer

Country Status (3)

Country Link
JP (1) JPS63153814A (en)
KR (1) KR910002826B1 (en)
MY (2) MY102454A (en)

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KR880002261A (en) 1988-04-30
MY102454A (en) 1992-06-30
MY109333A (en) 1997-01-31
JPH0577284B2 (en) 1993-10-26
KR910002826B1 (en) 1991-05-06

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